bq3285 Real-Time Clock (RTC) Features ➤ Direct clock/calendar replacement for IBM® AT-compatible computers and other applications ➤ Functionally compatible with the DS1285 - Closely matches MC146818A pin configuration ➤ 114 bytes of general nonvolatile storage ➤ 160ns cycle time allows fast bus operation ➤ Calendar in day of the week, day of the month, months, and years, with automatic leap-year adjustment ➤ Time of day in seconds, minutes, and hours - 12- or 24-hour format Optional daylight saving adjustment ➤ Programmable square wave output ➤ Three individually maskable interrupt event flags: ➤ Selectable Intel or Motorola bus timing - Periodic rates from 122µs to 500ms ➤ Less than 0.5µA load under battery operation - Time-of-day alarm once per second to once per day - End-of-clock update cycle ➤ 14 bytes for clock/calendar and control General Description The CMOS bq3285 is a low-power microprocessor peripheral providing a time-of-day clock and 100-year calendar with alarm features and battery operation. Other features include three maskable interrupt sources, square wave output, and 114 bytes of general nonvolatile storage. The bq3285 write-protects the clock, calendar, and storage registers during power failure. A backup battery then maintains data and operates the clock and calendar. The bq3285 is a fully compatible real-time clock for IBM AT compatible computers and other applications. The only external components are a 32.768kHz crystal and a backup battery ➤ 24-pin plastic DIP or SOIC ➤ BCD or binary format for clock and calendar data Pin Names Pin Connections MOT X1 X2 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 VSS 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 VCC SQW NC RCL BC INT RST DS VSS R/W AS CS 28-Pin PLCC No longer available 24-Pin DIP or SOIC PN328501.eps SLUS028A - JUNE 1991 - REVISED - MAY 2004 1 AD0–AD7 Multiplexed address/data input/output MOT Bus type select input CS Chip select input AS Address strobe input DS Data strobe input R/W Read/write input INT Interrupt request output RST Reset input SQW Square wave output RCL RAM clear input BC 3V backup cell input X1–X2 Crystal inputs NC No connect VCC +5V supply VSS Ground bq3285 Block Diagram AD0–AD7 Pin Descriptions MOT Bus type select input The bq3285 bus cycle consists of two phases: the address phase and the datatransfer phase. The address phase precedes the data-transfer phase. During the address phase, an address placed on AD0–AD7 is latched into the bq3285 on the falling edge of the AS signal. During the data-transfer phase of the bus cycle, the AD0–AD7 pins serve as a bidirectional data bus. MOT selects bus timing for either Motorola or Intel architecture. This pin should be tied to VCC for Motorola timing or to VSS for Intel timing (see Table 1). The setting should not be changed during system operation. MOT is internally pulled low by a 30KΩ resistor. Table 1. Bus Setup AS Bus Type MOT DS R/W AS Level Equivalent Equivalent Equivalent Motorola VCC DS, E, or Φ2 R/W Intel VSS RD, MEMR, or I/OR WR, MEMW, or ALE I/OW Multiplexed address/data input/ output Address strobe input AS serves to demultiplex the address/data bus. The falling edge of AS latches the address on AD0–AD7. This demultiplexing process is independent of the CS signal. For DIP a n d SOIC packages with MOT = VCC, the AS input is provided a signal similar to ALE in an Intel-based system. AS 2 bq3285 DS RCL Data strobe input When MOT = VCC, DS controls data transfer during a bq3285 bus cycle. During a read cycle, the bq3285 drives the bus after the rising edge on DS. During a write cycle, the falling edge on DS is used to latch write data into the chip. A low level on the RCL pin causes the contents of each of the 114 storage bytes to be set to FF(hex). The contents of the clock and control registers are unaffected. This pin should be used as a user-interface input (pushbutton to ground) and not connected to the output of any active component. RCL input is only recognized when held low for at least 125ms in the presence of VCC when the oscillator is running. Using RAM clear does not affect the battery load. This pin is connected internally to a 30KΩ pull-up resistor. When MOT = VSS, the DS input is provided a signal similar to RD, MEMR, or I/OR in an Intel-based system. The falling edge on DS is used to enable the outputs during a read cycle. R/W Read/write input BC When MOT = VCC, the level on R/W identifies the direction of data transfer. A high level on R/W indicates a read bus cycle, whereas a low on this pin indicates a write bus cycle. Upon power-up, a voltage within the VBC range must be present on the BC pin for the oscillator to start up. Chip select input CS should be driven low and held stable during the data-transfer phase of a bus cycle accessing the bq3285. INT RST Reset input The bq3285 is reset when RST is pulled low. When reset, INT becomes high-impedance, and the bq3285 is not accessible. Table 4 in the Control/Status Registers section lists the register bits that are cleared by a reset. Interrupt request output INT is an open-drain output. INT is asserted low when any event flag is set and the corresponding event enable bit is also set. INT becomes high-impedance whenever register C is read (see the Control/Status Registers section). SQW 3V backup cell input BC should be connected to a 3V backup cell for RTC operation and storage register nonvolatility in the absence of power. When VCC slews down past VBC (3V typical), the integral control circuitry switches the power source to BC. When VCC returns above VBC, the power source is switched to VCC. When MOT = VSS, R/W is provided a signal similar to WR, MEMW, or I/OW in an Intelbased system. The rising edge on R/W latches data into the bq3285. CS RAM clear input Reset may be disabled by connecting RST to VCC. This allows the control bits to reta i n th e i r s ta te s th ro u g h p o w erdown/power-up cycles. Square-wave output X1–X2 SQW may output a programmable frequency square-wave signal during normal (VCC valid) system operation. Any one of the 13 specific frequencies may be selected through register A. This pin is held low when the square-wave enable bit (SQWE) in register B is 0 (see the Control/Status Registers section). Crystal inputs The X1–X2 inputs are provided for an external 32.768Khz quartz crystal, Daiwa DT-26 or equivalent, with 6pF load capacitance. A trimming capacitor may be necessary for extremely precise time-base generation. In the absence of a crystal, an oscillated output of 32.768kHz can be fed into the X1 input. 3 bq3285 Functional Description date period (see Figure 2). The alarm flag bit may also be set during the update cycle. Address Map The bq3285 copies the local register updates into the user buffer accessed by the host processor. When a 1 is written to the update transfer inhibit bit (UTI) in register B, the user copy of the clock and calendar bytes remains unchanged, while the local copy of the same bytes continues to be updated every second. The bq3285 provides 14 bytes of clock and control/status registers and 114 bytes of general nonvolatile storage. Figure 1 illustrates the address map for the bq3285. The update-in-progress bit (UIP) in register A is set tBUC time before the beginning of an update cycle (see Figure 2). This bit is cleared and the update-complete flag (UF) is set at the end of the update cycle. Update Period The update period for the bq3285 is one second. The bq3285 updates the contents of the clock and calendar locations during the update cycle at the end of each up- 0 14 Bytes 13 14 114 Bytes 0 Seconds 00 1 Seconds Alarm 01 0D 2 Minutes 02 0E 3 Minutes Alarm 03 00 Clock and Control Status Registers Storage Registers 127 7F 4 Hours 04 5 Hours Alarm 05 6 Day of Week 06 7 Day of Month 07 8 Month 08 9 Year 09 10 Register A 0A 11 Register B 0B 12 Register C 0C 13 Register D 0D BCD or Binary Format Figure 1. Address Map Update Period (1s) UIP tUC (Update Cycle) tBUC Figure 2. Update Period Timing and UIP 4 bq3285 c. Programming the RTC Write the appropriate value to the hour format (HF) bit. The time-of-day, alarm, and calendar bytes can be written in either the BCD or binary format (see Table 2). 2. Write new values to all the time, alarm, and calendar locations. These steps may be followed to program the time, alarm, and calendar: 3. Clear the UTI bit to allow update transfers. 1. On the next update cycle, the RTC updates all 10 bytes in the selected format. Modify the contents of register B: a. Write a 1 to the UTI bit to prevent transfers between RTC bytes and user buffer. b. Write the appropriate value to the data format (DF) bit to select BCD or binary format for all time, alarm, and calendar bytes. Table 2. Time, Alarm, and Calendar Formats Range Address RTC Bytes Decimal Binary Binary-Coded Decimal 0 Seconds 0–59 00H–3BH 00H–59H 1 Seconds alarm 0–59 00H–3BH 00H–59H 2 Minutes 0–59 00H–3BH 00H–59H 3 Minutes alarm 0–59 00H–3BH 00H–59H Hours, 12-hour format 1–12 01H–OCH AM; 81H–8CH PM 01H–12H AM; 81H–92H PM Hours, 24-hour format 0–23 00H–17H 00H–23H Hours alarm, 12-hour format 1–12 01H–OCH AM; 81H–8CH PM 01H–12H AM; 81H–92H PM Hours alarm, 24-hour format 0–23 00H–17H 00H–23H 6 Day of week (1=Sunday) 1–7 01H–07H 01H–07H 7 Day of month 1–31 01H–1FH 01H–31H 8 Month 1–12 01H–0CH 01H–12H 9 Year 0–99 00H–63H 00H–99H 4 5 5 bq3285 The update-ended interrupt, which occurs at the end of each update cycle Square-Wave Output n The bq3285 divides the 32.768kHz oscillator frequency to produce the 1Hz update frequency for the clock and calendar. Thirteen taps from the frequency divider are fed to a 16:1 multiplexer circuit. The output of this mux is fed to the SQW output and periodic interrupt generation circuitry. The four least-significant bits of register A, RS0–RS3, select among the 13 taps (see Table 3). The square-wave output is enabled by writing a 1 to the square-wave enable bit (SQWE) in register B. Each of the three interrupt events is enabled by an individual interrupt-enable bit in register B. When an event occurs, its event flag bit in register C is set. If the corresponding event enable bit is also set, then an interrupt request is generated. The interrupt request flag bit (INTF) of register C is set with every interrupt request. Reading register C clears all flag bits, including INTF, and makes INT high-impedance. Two methods can be used to process bq3285 interrupt events: Interrupts n The bq3285 allows three individually selected interrupt events to generate an interrupt request. These three interrupt events are: n n n The periodic interrupt, programmable to occur once every 122µs to 500ms Enable interrupt events and use the interrupt request output to invoke an interrupt service routine. Do not enable the interrupts and use a polling routine to periodically check the status of the flag bits. The individual interrupt sources are described in detail in the following sections. The alarm interrupt, programmable to occur once per second to once per day Table 3. Square-Wave Frequency/Periodic Interrupt Rate Register A Bits Square Wave RS3 RS2 RS1 RS0 Frequency 0 0 0 0 None 0 0 0 1 256 Hz 3.90625 ms 0 0 1 0 128 Hz 7.8125 ms 0 0 1 1 8.192 kHz 122.070 µs 0 1 0 0 4.096 kHz 244.141 µs 0 1 0 1 2.048 kHz 488.281 µs 0 1 1 0 1.024 kHz 976.5625 0 1 1 1 512 Hz 1.95315 ms 1 0 0 0 256 Hz 3.90625 ms 1 0 0 1 128 Hz 7.8125 ms 1 0 1 0 64 Hz 15.625 ms 1 0 1 1 32 Hz 31.25 ms 1 1 0 0 16 Hz 62.5 ms 1 1 0 1 8 Hz 125 ms 1 1 1 0 4 Hz 250 ms 1 1 1 1 2 Hz 500 ms 6 Units Periodic Interrupt Period Units None µs bq3285 Periodic Interrupt Update Cycle Interrupt The mux output used to drive the SQW output also drives the interrupt-generation circuitry. If the periodic interrupt event is enabled by writing a 1 to the periodic interrupt enable bit (PIE) in register C, an interrupt request is generated once every 122µs to 500ms. The period between interrupts is selected by the same bits in register A that select the square wave frequency (see Table 3). The update cycle ended flag bit (UF) in register C is set to a 1 at the end of an update cycle. If the update interrupt enable bit (UIE) of register B is 1, and the update transfer inhibit bit (UTI) in register B is 0, then an interrupt request is generated at the end of each update cycle. Accessing RTC bytes Alarm Interrupt Time and calendar bytes read during an update cycle may be in error. Three methods to access the time and calendar bytes without ambiguity are: During each update cycle, the RTC compares the hours, minutes, and seconds bytes with the three corresponding alarm bytes. If a match of all bytes is found, the alarm interrupt event flag bit, AF in register C, is set to 1. If the alarm event is enabled, an interrupt request is generated. n An alarm byte may be removed from the comparison by setting it to a “don’t care” state. An alarm byte is set to a “don’t care” state by writing a 1 to each of its two most-significant bits. A “don’t care” state may be used to select the frequency of alarm interrupt events as follows: n n n n n n If none of the three alarm bytes is “don’t care,” the frequency is once per day, when hours, minutes, and seconds match. If only the hour alarm byte is “don’t care,” the frequency is once per hour, when minutes and seconds match. Enable the update interrupt event to generate interrupt requests at the end of the update cycle. The interrupt handler has a maximum of 999ms to access the clock bytes before the next update cycle begins (see Figure 3). Poll the update-in-progress bit (UIP) in register A. If UIP = 0, the polling routine has a minimum of tBUC time to access the clock bytes (see Figure 3). Use the periodic interrupt event to generate interrupt requests every tPI time, such that UIP = 1 always occurs between the periodic interrupts. The interrupt handler has a minimum of tPI/2 + tBUC time to access the clock bytes (see Figure 3). Oscillator Control If only the hour and minute alarm bytes are “don’t care,” the frequency is once per minute, when seconds match. When power is first applied to the bq3285 and VCC is above VPFD, the internal oscillator and frequency divider are turned on by writing a 010 pattern to bits 4 through 6 of register A. A pattern of 11X turns the oscillator on, but keeps the frequency divider disabled. Any other pattern to these bits keeps the oscillator off. If the hour, minute, and second alarm bytes are “don’t care,” the frequency is once per second. Figure 3. Update-Ended/Periodic Interrupt Relationship 7 bq3285 RS0–RS3 - Frequency Select Power-Down/Power-Up Cycle 7 - The bq3285 continuously monitors V CC for out-oftolerance. During a power failure, when VCC falls below VPFD (4.17V typical), the bq3285 write-protects the clock and storage registers. When VCC is below VBC (3V typical), the power source is switched to BC. RTC operation and storage data are sustained by a valid backup energy source. When VCC is above VBC, the power source is VCC. Write-protection continues for tCSR time after VCC rises above VPFD. 7 - 2 RS2 1 RS1 0 RS0 6 OS2 5 OS1 4 OS0 3 - 2 - 1 - 0 - UIP - Update Cycle Status Register A Bits 5 4 3 2 OS1 OS0 RS3 RS2 1 RS1 0 RS0 7 UIP Register A programs: n 3 RS3 These three bits control the state of the oscillator and divider stages. A pattern of 010 enables RTC operation by turning on the oscillator and enabling the frequency divider. A pattern of 11X turns the oscillator on, but keeps the frequency divider disabled. When 010 is written, the RTC begins its first update after 500ms. Register A n 4 - OS0–OS2 - Oscillator Control The four control/status registers of the bq3285 are accessible regardless of the status of the update cycle (see Table 4). 6 OS2 5 - These bits select one of the 13 frequencies for the SQW output and the periodic interrupt rate, as shown in Table 3. Control/Status Registers 7 UIP 6 - 6 - 5 - 4 - 3 - 2 - 1 - 0 - This read-only bit is set prior to the update cycle. When UIP equals 1, an RTC update cycle may be in progress. UIP is cleared at the end of each update cycle. This bit is also cleared when the update transfer inhibit (UTI) bit in register B is 1. The frequency of the square-wave and the periodic event rate. Oscillator operation. Register A provides: n Status of the update cycle. Table 4. Control/Status Registers Reg. Loc. (Hex) Read Write Bit Name and State on Reset 7 (MSB) 6 5 4 3 1 UIP na OS2 na OS1 na OS0 na 2 1 0 (LSB) A 0A Yes Yes B 0B Yes Yes UTI na PIE 0 AIE 0 UIE 0 SQWE 0 DF na HF na C 0C Yes No INTF 0 PF 0 AF 0 UF 0 - 0 - 0 - 0 - 0 D 0D Yes No VRT na - 0 - 0 - 0 - 0 - 0 - 0 - 0 Notes: 1. Except bit 7. 2. na = not affected 8 RS3 na RS2 na RS1 na RS0 na DSE na bq3285 SQWE - Square-Wave Enable Register B 7 UTI 6 PIE 5 AIE Register B Bits 4 3 2 UIE SQWE DF 1 HF 7 - 0 DSE 6 - 5 - 4 - 3 SQWE 2 - 1 - 0 - 1 - 0 - This bit enables the square-wave output: 1 = Enabled Register B enables: n Update cycle transfer operation n Square-wave output n Interrupt events n Daylight saving adjustment 0 = Disabled and held low UIE - Update Cycle Interrupt Enable 7 - Register B selects: n 6 - All bits of register B are read/write. 1 = Enabled DSE - Daylight Saving Enable 0 = Disabled 6 - 5 - 4 - 3 - 4 UIE 3 - 2 - This bit enables an interrupt request due to an update ended interrupt event: Clock and calendar data formats 7 - 5 - 2 - 1 - The UIE bit is automatically cleared when the UTI bit equals 1. 0 DSE AIE - Alarm Interrupt Enable This bit enables daylight-saving time adjustments when written to 1: n n This bit enables an interrupt request due to an alarm 7 6 5 4 3 2 1 0 AIE - On the last Sunday in October, the first time the bq3285 increments past 1:59:59 AM, the time falls back to 1:00:00 AM. interrupt event: On the first Sunday in April, the time springs forward from 2:00:00 AM to 3:00:00 AM. 1 = Enabled 0 = Disabled HF - Hour Format 7 - 6 - 5 - 4 - 3 - 2 - 1 HF PIE - Periodic Interrupt Enable 0 - This bit enables an interrupt request due to a periodic 7 - This bit selects the time-of-day and alarm hour format: 6 PIE 1 = 24-hour format 0 = 12-hour format interrupt event: 1 = Enabled DF - Data Format 7 - 6 - 5 - 4 - 3 - 2 DF 1 - 0 = Disabled 0 - This bit selects the numeric format in which the time, alarm, and calendar bytes are represented: 1 = Binary 0 = BCD 9 5 - 4 - 3 - 2 - 1 - 0 - bq3285 This bit is set to a 1 every tPI time, where tPI is the time period selected by the settings of RS0–RS3 in register A. Reading register C clears this bit. UTI - Update Transfer Inhibit 7 UTI 6 - 5 - 4 - 3 - 2 - 1 - 0 - INTF - Interrupt Request Flag 7 INTF This bit inhibits the transfer of RTC bytes to the user buffer: 1 = Inhibits transfer and clears UIE Register C Bits 5 4 3 AF UF 0 2 - 1 - 0 - UIE = 1 and UF = 1 2 0 1 0 Reading register C clears this bit. 0 0 Register D 7 VRT Bits 0–3 - Unused Bits 6 - 3 - PIE = 1 and PF = 1 Register C is the read-only event status register. 7 - 4 - AIE = 1 and AF = 1 Register C 6 PF 5 - This flag is set to a 1 when any of the following is true: 0 = Allows transfer 7 INTF 6 - 5 - 4 - 3 0 2 0 1 0 6 - 5 - 4 - 3 - 2 - 1 - 0 - Register D is the read-only data integrity status register. 0 0 Bits 0–6 - Unused Bits These bits are always set to 0. 7 - UF - Update Event Flag 7 - 6 - 5 - 4 UF 3 - 2 - 1 - 0 - AF - Alarm Event Flag 6 - 5 AF 4 - 3 - 2 - 1 - 0 - 5 - 4 - 3 - 2 - 1 - 3 0 2 0 1 0 0 0 6 0 5 0 Register D Bits 4 3 0 0 2 0 1 0 0 0 1 = Valid backup energy source 0 = Backup energy source is depleted When the backup energy source is depleted (VRT = 0), data integrity of the RTC and storage registers is not guaranteed. PF - Periodic Event Flag 6 PF 4 0 VRT - Valid RAM and Time 7 VRT This bit is set to a 1 when an alarm event occurs. Reading register C clears this bit. 7 - 5 0 These bits are always set to 0. This bit is set to a 1 at the end of the update cycle. Reading register C clears this bit. 7 - 6 0 0 - 10 bq3285 Absolute Maximum Ratings Symbol Parameter Value Unit Conditions VCC DC voltage applied on VCC relative to VSS -0.3 to 7.0 V VT DC voltage applied on any pin excluding VCC relative to VSS -0.3 to 7.0 V VT ≤ VCC + 0.3 TOPR Operating temperature 0 to +70 °C Commercial TSTG Storage temperature -55 to +125 °C TBIAS Temperature under bias -40 to +85 °C TSOLDER Soldering temperature 260 °C Note: For 10 seconds Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to conditions beyond the operational limits for extended periods of time may affect device reliability. Recommended DC Operating Conditions (TA = TOPR) Symbol Parameter Minimum Typical Maximum Unit VCC Supply voltage 4.5 5.0 5.5 V VSS Supply voltage 0 0 0 V VIL Input low voltage -0.3 - 0.8 V VIH Input high voltage 2.2 - VCC + 0.3 V VBC Backup cell voltage 2.5 - 4.0 V Note: Typical values indicate operation at TA = 25°C. 11 bq3285 DC Electrical Characteristics (TA = TOPR, VCC = 5V ± 10%) Symbol Parameter Minimum Typical Maximum Unit Conditions/Notes ILI Input leakage current - - ±1 µA VIN = VSS to VCC ILO Output leakage current - - ±1 µA AD0–AD7, INT, and SQW in high impedance, VOUT = VSS to VCC VOH Output high voltage 2.4 - - V IOH = -2.0 mA VOL Output low voltage - - 0.4 V IOL = 4.0 mA ICC Operating supply current - 7 15 mA VSO Supply switch-over voltage - VBC - V ICCB Battery operation current - 0.3 0.5 µA VPFD Power-fail-detect voltage 4.0 4.17 4.35 V IRCL Input current when RCL = VSS. - - 185 µA Internal 30K pull-up IMOTH Input current when MOT = VCC - - -185 µA Internal 30K pull-down Notes: Min. cycle, duty = 100%, IOH = 0mA, IOL = 0mA VBC = 3V, TA = 25°C Typical values indicate operation at TA = 25°C, VCC = 5V or VBC = 3V. Crystal Specifications (DT-26 or Equivalent) Symbol Parameter Minimum Typical Maximum Unit fO Oscillation frequency - 32.768 - kHz CL Load capacitance - 6 - pF TP Temperature turnover point 20 25 30 °C k Parabolic curvature constant - - -0.042 ppm/°C Q Quality factor 40,000 70,000 - R1 Series resistance - - 45 KΩ C0 Shunt capacitance - 1.1 1.8 pF C0/C1 Capacitance ratio - 430 600 DL Drive level - - 1 µW ∆f/fO Aging (first year at 25°C) - 1 - ppm 12 bq3285 Capacitance (TA = 25°C, F = 1MHz, VCC = 5.0V) Symbol Parameter Minimum Typical Maximum Unit Conditions CI/O Input/output capacitance - - 7 pF VOUT = 0V CIN Input capacitance - - 5 pF VIN = 0V AC Test Conditions Parameter Test Conditions Input pulse levels 0 to 3.0 V Input rise and fall times 5 ns Input and output timing reference levels 1.5 V (unless otherwise specified) Output load (including scope and jig) See Figures 4 and 5 Figure 4. Output Load A Figure 5. Output Load B 13 bq3285 Read/Write Timing (TA = TOPR, VCC = 5V ± 10%) Symbol Parameter Minimum Typical Maximum Unit tCYC Cycle time 160 - - ns tDSL DS low or RD/WR high time 80 - - ns tDSH DS high or RD/WR low time 55 - - ns tRWH R/W hold time 0 - - ns tRWS R/W setup time 10 - - ns tCS Chip select setup time 5 - - ns tCH Chip select hold time 0 - - ns tDHR Read data hold time 0 - 25 ns tDHW Write data hold time 0 - - ns tAS Address setup time 20 - - ns tAH Address hold time 5 - - ns tDAS Delay time, DS to AS rise 10 - - ns tASW Pulse width, AS high 30 - - ns tASD Delay time, AS to DS rise (RD/WR fall) 35 - - ns tOD Output data delay time from DS rise (RD fall) - - 50 ns tDW Write data setup time 30 - - ns tBUC Delay time before update cycle - 244 - µs tPI Periodic interrupt time interval - - - - tUC Time of update cycle - 1 - µs 14 Notes See Table 3 bq3285 Motorola Bus Read/Write Timing 15 bq3285 Intel Bus Read Timing Intel Bus Write Timing 16 bq3285 Power-Down/Power-Up Timing (TA = TOPR) Minimum Typical Maximum Unit tF Symbol VCC slew from 4.5V to 0V Parameter 300 - - µs tR VCC slew from 0V to 4.5V 100 - - µs tCSR CS at VIH after power-up 20 - 200 ms Power-Down/Power-Up Timing 17 Conditions Internal write-protection period after VCC passes VPFD on power-up. bq3285 Interrupt Delay Timing (TA = TOPR) Symbol Parameter Minimum Typical Maximum Unit tRSW Reset pulse width 5 - - µs tIRR INT release from RST - - 2 µs tIRD INT release from DS (RD) - - 2 µs Interrupt Delay Timing 18 bq3285 24-Pin DIP (P) 24-Pin DIP (P) Dimension A A1 B B1 C D E E1 e G L S Minimum 0.160 0.015 0.015 0.045 0.008 1.240 0.600 0.530 0.600 0.090 0.115 0.070 Maximum 0.190 0.040 0.022 0.065 0.013 1.280 0.625 0.570 0.670 0.110 0.150 0.090 All dimensions are in inches. 24-Pin SOIC (S) 24-Pin SOIC (S) Dimension A A1 B C D E e H L Minimum 0.095 0.004 0.013 0.008 0.600 0.290 0.045 0.395 0.020 All dimensions are in inches. 19 Maximum 0.105 0.012 0.020 0.013 0.615 0.305 0.055 0.415 0.040 bq3285 Data Sheet Revision History Change No. Page No. Description Nature of Change 1 2 Address strobe input Clarification 1 11 Backup cell voltage VBC Was 2.0 min; is 2.5 min 1 12 Was 4.1 min, 4.25 max; in 4.0 mi, 4.35 max 2 3, 12 Power-fail detect voltage VPFD crystal type Daiwa DT - 26 (not DT-26S) 3 12 Changed value in first table IRCL max. was 275; is now 185 3 12 Changed value in first table IMOTH max. was - 275; is now - 185 3 12 Changed values for conditions of IRCL, IMOTH Was 20K; is now 30K 4 1, 8, 20 PLCC last time buy and Reg A update Reg A labeling corrected 5 1, 8, 20 PLCC package option removed PLCC reached end of Last Time Buy Note: Clarification Change 1 = Nov. 1992 B changes from June 1991 A. Change 2 = Nov. 1993 C changes from Nov. 1992 B Change 3 = Sept. 1996 D changes from Nov. 1993 C Change 4 = Jan. 1999 E changes from Sept. 1996 D Change 5 = May 2004 (SLUS028A) changes from Jan. 1999 E 20 bq3285 Ordering Information bq3285 Temperature: blank = Commercial (0 to +70°C) Package Option: P = 24-pin plastic DIP (0.600) S = 24-pin SOIC (0.300) Device: bq3285 Real-Time Clock with 114 bytes of general storage 21 MECHANICAL DATA MPDI008 – OCTOBER 1994 N (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE 24 PIN SHOWN A 24 13 0.560 (14,22) 0.520 (13,21) 1 12 0.060 (1,52) TYP 0.200 (5,08) MAX 0.610 (15,49) 0.590 (14,99) 0.020 (0,51) MIN Seating Plane 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.125 (3,18) MIN 0.010 (0,25) M PINS ** 0°– 15° 0.010 (0,25) NOM 24 28 32 40 48 52 A MAX 1.270 (32,26) 1.450 (36,83) 1.650 (41,91) 2.090 (53,09) 2.450 (62,23) 2.650 (67,31) A MIN 1.230 (31,24) 1.410 (35,81) 1.610 (40,89) 2.040 (51,82) 2.390 (60,71) 2.590 (65,79) DIM 4040053 / B 04/95 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Falls within JEDEC MS-011 Falls within JEDEC MS-015 (32 pin only) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 19-May-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) BQ3285P-SB2 ACTIVE PDIP N 24 15 Pb-Free (RoHS) A42 SN N / A for Pkg Type 0 to 70 3285P -SB2 BQ3285P-SB2E3 ACTIVE PDIP N 24 15 Pb-Free (RoHS) A42 SN N / A for Pkg Type 0 to 70 3285P -SB2 BQ3285S-SB2 ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 3285S -SB2 BQ3285S-SB2TR OBSOLETE SOIC DW 24 TBD Call TI Call TI 0 to 70 3285S -SB2 BQ3285S-SB2TRG4 OBSOLETE SOIC DW 24 TBD Call TI Call TI 0 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 19-May-2015 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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