IRF IRG8P08N120KDPBF Insulated gate bipolar transistor with ultrafast soft recovery diode Datasheet

IRG8B08N120KDPbF
IRG8P08N120KDPbF
IRG8P08N120KD-EPbF
Insulated Gate Bipolar Transistor with Ultrafast Soft Recovery Diode
VCES = 1200V
C
IC = 8A, TC =100°C
tSC 10µs, TJ(max) = 150°C
G
VCE(ON) typ. = 1.7V @ IC = 5A
G
E
Applications
• Industrial Motor Drive
• UPS
• Solar Inverters
• Welding
C
E
G
G
Gate
G
TO-247AC
IRG8P08N120KDPbF
TO-220AB
IRG8B08N120KDPbF
n-channel
CE
E
TO-247AD
IRG8P08N120KD-EPbF
C
Collector
Features
C
E
Emitter
Benefits
Benchmark Low VCE(ON)
High Efficiency in a Motor Drive Applications
10μs Short Circuit SOA
Increases margin for short circuit protection scheme
Positive VCE(ON) Temperature Coefficient
Excellent Current Sharing in Parallel Operation
Square RBSOA and high ILM- rating
Rugged Transient Performance
Lead-Free, RoHS compliant
Environmentally friendly
Base part number
Package Type
IRG8P08N120KDPbF
IRG8P08N120KD-EPbF
IRG8B08N120KDPbF
TO-247AC
TO-247AD
TO-220AB
Standard Pack
Form
Quantity
Tube
25
Tube
25
Tube
50
Orderable Part Number
IRG8P08N120KDPbF
IRG8P08N120KD-EPbF
IRG8B08N120KDPbF
Absolute Maximum Ratings
VCES
IC @ TC = 25°C
IC @ TC = 100°C
ICM
ILM
IF @ TC = 25°C
IF @ TC = 100°C
VGE
Parameter
Collector-to-Emitter Voltage
Continuous Collector Current (Silicon Limited)
Continuous Collector Current
Pulse Collector Current (see fig. 2)
Clamped Inductive Load Current (see fig. 3)
Diode Continuous Forward Current
Diode Continuous Forward Current
Continuous Gate-to-Emitter Voltage
IFM
Diode Maximum Forward Current 
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
Mounting Torque, 6-32 or M3 Screw
Max.
1200
15
8
15
20
11
6
±30
20
89
36
-40 to +150
Units
V
A
V
W
C
300 (0.063 in. (1.6mm) from case)
10 lbf·in (1.1 N·m)
Thermal Resistance
RJC
RJC
RJC
RJC
RCS
RJA
RCS
RJA
1
(IGBT)
(Diode)
(IGBT)
(Diode)
Parameter
Thermal Resistance Junction-to-Case-(each IGBT) TO-220AB
Thermal Resistance Junction-to-Case-(each Diode) TO-220AB
Thermal Resistance Junction-to-Case-(each IGBT) TO-247
Thermal Resistance Junction-to-Case-(each Diode) TO-247
Thermal Resistance, Case-to-Sink (flat, greased surface)TO-220AB
Thermal Resistance, Junction-to-Ambient (typical socket mount)TO-220AB
Thermal Resistance, Case-to-Sink (flat, greased surface)TO-247
Thermal Resistance, Junction-to-Ambient (typical socket mount)TO-247
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Typ.
–––
–––
–––
–––
0.50
–––
0.24
–––
Max.
1.3
2.6
1.4
2.6
–––
62
–––
40
Units
°C/W
December 12, 2014
IRG8B08N120KDPbF/IRG8P08N120KDPbF/IRG8P08N120KD-EPbF
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
V(BR)CES
V(BR)CES/TJ
Parameter
Collector-to-Emitter Breakdown Voltage
Temperature Coeff. of Breakdown Voltage
Min.
1200
—
Typ.
—
1.2
—
1.7
—
2.1
Gate Threshold Voltage
5.0
—
VGE(th)
Threshold Voltage Temperature Coeff.
—
-14
VGE(th)/TJ
gfe
Forward Transconductance
—
2.9
—
1.0
ICES
Collector-to-Emitter Leakage Current
—
1.0
Gate-to-Emitter Leakage Current
IGES
—
—
—
2.3
VF
Diode Forward Voltage Drop
—
2.5
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Max.
—
—
Units
Conditions
V
VGE = 0V, IC = 250µA 
V/°C VGE = 0V, IC = 1mA (25°C-150°C)
2.0
IC = 5A, VGE = 15V, TJ = 25°C
V
—
IC = 5A, VGE = 15V, TJ = 150°C
6.5
V
VCE = VGE, IC = 200µA
—
mV/°C VCE = VGE, IC = 200µA(25°C-150°C)
—
S
VCE = 50V, IC = 5A, PW = 20µs
35
µA VGE = 0V, VCE = 1200V
—
mA VGE = 0V, VCE = 1200V, TJ = 150°C
±100
nA VGE = ±30V
2.7
IF = 5A
V
—
IF = 5A, TJ = 150°C
VCE(on)
Collector-to-Emitter Saturation Voltage
Qg
Qge
Qgc
Eon
Eoff
Etotal
td(on)
tr
td(off)
tf
Eon
Parameter
Total Gate Charge (turn-on)
Gate-to-Emitter Charge (turn-on)
Gate-to-Collector Charge (turn-on)
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On delay time
Rise time
Turn-Off delay time
Fall time
Turn-On Switching Loss
Eoff
Etotal
td(on)
tr
td(off)
tf
Cies
Coes
Cres
Turn-Off Switching Loss
Total Switching Loss
Turn-On delay time
Rise time
Turn-Off delay time
Fall time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
RBSOA
Reverse Bias Safe Operating Area
SCSOA
Short Circuit Safe Operating Area
10
—
—
µs
Erec
trr
Irr
Reverse Recovery Energy of the Diode
Diode Reverse Recovery Time
Peak Reverse Recovery Current
—
—
—
240
50
11
—
—
—
µJ
ns
A
Min.
—
—
—
—
—
—
—
—
—
—
—
Typ.
30
1.1
20
0.3
0.3
0.6
20
20
160
240
0.5
—
—
—
—
—
—
—
—
—
0.5
1.0
20
20
300
290
720
30
15
Max Units
Conditions
45
IC = 5A
nC VGE = 15V
1.7
VCC = 600V
—
—
—
mJ
IC = 5A, VCC = 600V, VGE=15V
—
RG = 47, TJ = 25°C
—
Energy losses include tail & diode
—
ns reverse recovery 
—
—
—
—
—
—
—
—
—
—
—
—
mJ
ns
pF
FULL SQUARE
IC = 5A, VCC = 600V, VGE=15V
RG = 47, TJ = 150°C
Energy losses include tail & diode
reverse recovery 
VGE = 0V
VCC = 30V
f = 1.0Mhz
TJ = 150°C, IC = 20A
VCC = 960V, Vp ≤ 1200V
VGE = +20V to 0V
TJ = 150°C,VCC = 600V, Vp ≤ 1200V
VGE = +15V to 0V
TJ = 150°C
VCC = 600V, IF = 5A
VGE = 15V, Rg = 47
Notes:






VCC = 80% (VCES), VGE = 20V.
R is measured at TJ of approximately 90°C.
Refer to AN-1086 for guidelines for measuring V(BR)CES safely.
Maximum limits are based on statistical sample size characterization.
Pulse width limited by max. junction temperature.
Values influenced by parasitic L and C in measurement.
2
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For both:
Duty cycle : 50%
Tj = 150°C
Tcase = 100°C
Gate drive as specified
Power Dissipation = 36W
14
Load Current ( A )
12
10
8
Square Wave:
6
VCC
4
I
2
Diode as specified
0
0.1
1
10
100
f , Frequency ( kHz )
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
100
100
10
1
IC (A)
IC (A)
10µsec
100µsec
10
1msec
0.1
DC
Tc = 25°C
Tj = 150°C
Single Pulse
1
0.01
1
10
100
1000
10
10000
100
10000
VCE (V)
VCE (V)
Fig. 3 - Reverse Bias SOA
TJ = 150°C; VGE = 20V
Fig. 2 - Forward SOA
TC = 25°C; TJ ≤ 150°C; VGE = 15V
100
10
10
ICE (A)
ICE (A)
100
0.1
0.1
0
2
4
6
8
10
V CE (V)
Fig. 4 - Typ. IGBT Output Characteristics
TJ = 25°C; tp = 20µs
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Tc = -40°C
Tc = 25°C
Tc = 150°C
1
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
1.0
3
1000
© 2014 International Rectifier
0
2
4
6
8
V CE (V)
Fig. 5 - Typ. IGBT Saturation Voltage
VGE = 15V; tp = 20µs
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IRG8B08N120KDPbF/IRG8P08N120KDPbF/IRG8P08N120KD-EPbF
16
VGE, Gate-to-Emitter Voltage (V)
100
ICE (A)
10
1
TJ = -40°C
TJ = 25°C
TJ = 150°C
14
VCES = 600V
VCES = 400V
12
10
8
6
4
2
0
0.1
4
6
8
10
12
14
0
16
5
10
20
25
30
35
V GE (V)
Q G, Total Gate Charge (nC)
Fig. 6 - Typ. Transfer Characteristics
VCE = 50V; tp = 20µs
Fig. 7 - Typical Gate Charge vs. VGE
ICE = 5A
1000
1.2
tdOFF
EOFF @ Tj = 150°C
EON @ Tj = 150°C
1.0
Swiching Time (ns)
ERR @ Tj = 150°C
0.8
Energy (mJ)
15
EOFF @ Tj = 25°C
0.6
EON @ Tj = 25°C
ERR @ Tj = 25°C
0.4
tF
100
tdON
tR
10
0.2
1
0.0
0
1
2
3
4
5
6
7
8
9
4
6
8
10
IC (A)
IC (A)
Fig. 9 - Typ. Switching Time vs. IC
TJ = 150°C; VCE = 600V, RG = 47; VGE = 15V
Fig. 8 - Typ. Energy Loss vs. IC
VCE = 600V, RG = 47; VGE = 15V
1.2
2
10
10000
EON @ Tj = 150°C
EOFF @ Tj = 150°C
ERR @ Tj = 150°C
1000
0.6
Swiching Time (ns)
Energy (mJ)
0.9
EON @ Tj = 25°C
EOFF @ Tj = 25°C
ERR @ Tj = 25°C
tF
100
tdON
tR
10
0.3
1
0.0
40
60
80 100 120 140 160 180 200 220
Rg ()
Fig. 10 - Typ. Energy Loss vs. RG
VCE = 600V, ICE = 5A; VGE = 15V
4
tdOFF
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40
60
80 100 120 140 160 180 200 220
RG ( )
Fig. 11 - Typ. Switching Time vs. RG
TJ = 150°C; VCE = 600V, ICE = 5A; VGE = 15V
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IRG8B08N120KDPbF/IRG8P08N120KDPbF/IRG8P08N120KD-EPbF
500
11.0
VCC = 600V
10.5
RG = 47
RG = 100
RG = 148
R G = 47 
Tj = 150°C
VGE = 15V
400
Energy (µJ)
IRR (A)
IF = 5A
10.0
R G = 
R G = 148 
9.5
RG = 220
300
200
R G = 220 
100
9.0
0
8.5
350
400
450
500
550
0
600
2
4
6
8
10
IF (A)
diF /dt (A/µs)
Fig. 12 - Fig. 12 - Typ. IRR vs. di/dt
Fig. 13 - Typ. Diode ERR vs. IF
TJ = 150°C
100
IF (A)
10
-40°C
25°C
150°C
1
0.1
0.0
1.0
2.0
3.0
4.0
5.0
6.0
V F (V)
Fig. 14 - Typ. Diode Forward Voltage Drop
Characteristics
5
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IRG8B08N120KDPbF/IRG8P08N120KDPbF/IRG8P08N120KD-EPbF
Thermal Response ( ZthJC )
10
1
D = 0.50
0.20
0.05
0.1
0.10
J
0.02
0.01
R1
R1
J
1
R2
R2
R3
R3
R4
R4
C
2
1
3
2
3
4
4
Ci= iRi
Ci= iRi
0.01
1E-005
0.0001
i (sec)
0.12192
0.000058
0.48468
0.000092
0.51027
0.001541
0.28298
0.011665
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
C
Ri (°C/W)
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 15 - Maximum Transient Thermal Impedance, Junction-to-Case (IGBT) TO-247
Thermal Response ( ZthJC )
10
1
D = 0.50
0.20
0.10
0.05
0.1
J
0.02
0.01
R1
R1
J
1
R2
R2
R3
R3
R4
R4
C
2
1
2
3
3
4
4
Ci= iRi
Ci= iRi
0.01
1E-005
0.0001
i (sec)
0.07490
0.000029
1.19683
0.000184
0.93086
0.002329
0.39894
0.01613
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
C
Ri (°C/W)
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 16 - Maximum Transient Thermal Impedance, Junction-to-Case (DIODE) TO-247
6
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IRG8B08N120KDPbF/IRG8P08N120KDPbF/IRG8P08N120KD-EPbF
Thermal Response ( ZthJC )
10
1
D = 0.50
0.20
0.05
0.1
0.10
J
0.02
0.01
R1
R1
J
1
R2
R2
R3
R3
C
2
1
3
2
4
3
1E-005
0.0001
0.000014
0.51536
0.000089
0.50866
0.001767
C
0.24474
0.01039
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
i (sec)
0.03109
4
Ci= iRi
Ci= iRi
0.01
Ri (°C/W)
R4
R4
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 17 - Maximum Transient Thermal Impedance, Junction-to-Case (IGBT) TO-220AB
Thermal Response ( ZthJC )
10
1
D = 0.50
0.20
0.10
0.1
0.05
0.02
J
0.01
R1
R1
J
1
R2
R2
R3
R3
R4
R4
C
2
1
2
3
4
3
Ci= iRi
Ci= iRi
0.01
1E-005
0.0001
i (sec)
0.03331
0.000013
1.22958
0.000240
0.94175
0.002513
0.39481
0.015930
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
4
C
Ri (°C/W)
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 18 - Maximum Transient Thermal Impedance, Junction-to-Case (DIODE) TO-220AB
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IRG8B08N120KDPbF/IRG8P08N120KDPbF/IRG8P08N120KD-EPbF
L
L
VCC
DUT
0
80 V +
-
DUT
1K
VCC
Rg
Fig.C.T.1 - Gate Charge Circuit (turn-off)
Fig.C.T.2 - RBSOA Circuit
diode clamp /
DUT
L
4X
DC
VCC
-5V
DUT /
DRIVER
DUT
VCC
Rg
RSH
Fig.C.T.3 - S.C. SOA Circuit
Fig.C.T.4 - Switching Loss Circuit
(Board Stray Inductance 180nH)
C force
100K
D1
22K
C sense
G force
DUT
0.0075µF
E sense
E force
Fig.C.T.5 - BVCES Filter Circuit
8
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IRG8B08N120KDPbF/IRG8P08N120KDPbF/IRG8P08N120KD-EPbF
40
800
35
600
30
500
25
400
Vce (V)
VCE
300
20
ICE
15
200
10
100
5
0
0
-100
-10.0 -5.0 0.0
Ice (A)
700
-5
5.0 10.0 15.0 20.0
Time (uS)
Fig. WF1 - Typ. S.C. Waveform
@ TJ = 150°C using Fig. CT.3
9
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IRG8B08N120KDPbF/IRG8P08N120KDPbF/IRG8P08N120KD-EPbF
TO-220AB Package Outline (Dimensions are shown in millimeters (inches))
TO-220AB Part Marking Information
EXAM PLE:
T H IS IS A N IR F 1 0 1 0
LO T C O D E 1789
ASSEM BLED O N W W 19, 2000
IN T H E A S S E M B L Y L IN E "C "
N o t e : "P " in a s s e m b ly lin e p o s it io n
in d ic a t e s "L e a d - F r e e "
IN T E R N A T IO N A L
R E C T IF IE R
LO G O
ASSEM BLY
LO T C O D E
PART NUM BER
D ATE C O D E
YEA R 0 = 2000
W EEK 19
L IN E C
TO-220AB packages are not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
10
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IRG8B08N120KDPbF/IRG8P08N120KDPbF/IRG8P08N120KD-EPbF
TO-247AC Package Outline
Dimensions are shown in millimeters (inches)
TO-247AC Part Marking Information
Notes: This part marking information applies to devices produced after 02/26/2001
EXAMPLE: THIS IS AN IRFPE30
WITH ASSEMBLY
LOT CODE 5657
ASSEMBLED ON WW 35, 2001
IN THE ASSEMBLY LINE "H"
Note: "P" in assembly line position
indicates "Lead-Free"
INTERNATIONAL
RECTIFIER
LOGO
PART NUMBER
IRFPE30
56
135H
57
ASSEMBLY
LOT CODE
DATE CODE
YEAR 1 = 2001
WEEK 35
LINE H
TO-247AC package is not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
11
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IRG8B08N120KDPbF/IRG8P08N120KDPbF/IRG8P08N120KD-EPbF
TO-247AD Package Outline
Dimensions are shown in millimeters (inches)
TO-247AD Part Marking Information
E X A M P L E : T H IS IS A N IR G P 3 0 B 1 2 0 K D - E
W IT H A S S E M B L Y
LO T C O D E 5657
ASSEM B LED O N W W 35, 2000
IN T H E A S S E M B L Y L IN E "H "
N o te : "P " in a s s e m b ly lin e p o s itio n
in d ic a te s "L e a d - F re e "
PART N U M BER
IN T E R N A T IO N A L
R E C T IF IE R
LO G O
56
035H
57
ASSEM B LY
LO T C O D E
D A TE C O D E
YE A R 0 = 2 0 0 0
W EEK 35
L IN E H
TO-247AD package is not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
12
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IRG8B08N120KDPbF/IRG8P08N120KDPbF/IRG8P08N120KD-EPbF
Qualification Information†
Industrial†
Qualification Level
(per JEDEC JESD47F) ††
TO-220
TO-247AC
Moisture Sensitivity Level
N/A
TO-247AD
Yes
RoHS Compliant
†
Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability/
††
Applicable version of JEDEC standard at the time of product release.
Revision History
Date
Comments
12/12/2014

Added TO-220 package in the datasheet.
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA
To contact International Rectifier, please visit http://www.irf.com/whoto-call/
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