Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LM285-1.2, LM385-1.2, LM385B-1.2 SLVS075J – APRIL 1989 – REVISED JANUARY 2015 LMx85-1.2, LM385B-1.2 Micropower Voltage References 1 Features 3 Description • These micropower, two-terminal, band-gap voltage references operate over a 10-μA to 20-mA current range and feature exceptionally low dynamic impedance and good temperature stability. On-chip trimming provides tight voltage tolerance. The bandgap reference for these devices has low noise and long-term stability. 1 • • • • Operating Current Range – LM285-1.2: 10 μA to 20 mA – LM385-1.2: 15 μA to 20 mA – LM385B-1.2: 15 μA to 20 mA 1% and 2% Initial Voltage Tolerance Reference Impedance – LM385-1.2: 1 Ω MAX at 25°C – All devices: 1.5 Ω MAX over Full Temperature Range Very Low Power Consumption Interchangeable with Industry Standard LM285-1.2 and LM385-1.2 2 Applications • • • • • Portable Meter References Portable Test Instruments Battery-Operated Systems Current-Loop Instrumentation Panel Meters The design makes these devices exceptionally tolerant of capacitive loading and, thus, easier to use in most reference applications. The wide dynamic operating temperature range accommodates varying current supplies, with excellent regulation. The extremely low power drain of this series makes them useful for micropower circuitry. These voltage references can be used to make portable meters, regulators, or general-purpose analog circuitry, with battery life approaching shelf life. The wide operating current range allows them to replace older references with tighter-tolerance parts. Device Information(1) PART NUMBER LMx85-1.2 PACKAGE (PIN) BODY SIZE (NOM) SOIC (8) 4.90 mm × 3.91 mm SOP (8) 6.20 mm × 5.30 mm TSSOP (8) 3.00 mm × 4.40 mm TO-226 (3) 4.30 mm × 4.30 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. 4 Simplified Schematic 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM285-1.2, LM385-1.2, LM385B-1.2 SLVS075J – APRIL 1989 – REVISED JANUARY 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Simplified Schematic............................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 1 2 3 4 7.1 7.2 7.3 7.4 7.5 7.6 4 4 4 4 5 5 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 7 8.1 Overview ................................................................... 7 8.2 Functional Block Diagram ......................................... 7 8.3 Feature Description................................................... 7 8.4 Device Functional Modes.......................................... 7 9 Application and Implementation .......................... 8 9.1 Application Information.............................................. 8 9.2 Typical Application ................................................... 8 9.3 System Examples ................................................... 10 10 Power Supply Recommendations ..................... 11 11 Layout................................................................... 11 11.1 Layout Guidelines ................................................. 11 11.2 Layout Example .................................................... 11 12 Device and Documentation Support ................. 12 12.1 12.2 12.3 12.4 Related Links ........................................................ Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 12 12 12 12 13 Mechanical, Packaging, and Orderable Information ........................................................... 12 5 Revision History Changes from Revision I (December 2005) to Revision J Page • Added Applications, Device Information table, Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1 • Deleted Ordering Information table. ....................................................................................................................................... 1 2 Submit Documentation Feedback Copyright © 1989–2015, Texas Instruments Incorporated Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2 LM285-1.2, LM385-1.2, LM385B-1.2 www.ti.com SLVS075J – APRIL 1989 – REVISED JANUARY 2015 6 Pin Configuration and Functions Pin Functions PIN NAME TYPE DESCRIPTION LP D, PS or PW ANODE 1 4 I Shunt Current/Voltage input CATHODE 2 8 O Common pin, normally connected to ground NC 3 1, 2, 3, 5, 6, 7 — No internal connection Copyright © 1989–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2 3 LM285-1.2, LM385-1.2, LM385B-1.2 SLVS075J – APRIL 1989 – REVISED JANUARY 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN IR Reverse Current IF Forward Current TJ Operating virtual junction temperature Tstg Storage temeprature (1) MAX –65 UNIT 30 mA 10 mA 150 °C 150 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1) ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2) ±1000 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) IZZ Reference current TA Operating free-air temperature MIN MAX 0.01 20 –40 85 0 70 LM285-1.2 LM385-1.2, LM385B-1.2 UNIT mA °C 7.4 Thermal Information LMx85-1.2 THERMAL METRIC (1) RθJA (1) 4 Junction-to-ambient thermal resistance D LP PS PW 8 PINS 3 PINS 8 PINS 8 PINS 97 140 95 149 UNIT °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 1989–2015, Texas Instruments Incorporated Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2 LM285-1.2, LM385-1.2, LM385B-1.2 www.ti.com SLVS075J – APRIL 1989 – REVISED JANUARY 2015 7.5 Electrical Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS TA (1) VZ Reference voltage IZ = I(min) to 20 mA (2) 25°C αVZ Average temperature coefficient of reference voltage (3) IZ = I(min) to 20 mA (2) Full Range LM285-1.2 Change in reference voltage with current ΔVZ IZ = I(min) to 20 mA ΔVZ/Δt Long-term change in reference voltage IZ(min) Minimum reference current ZZ Reference impedance IZ = 100 µA, f = 25 Hz Vn Broadband noise voltage IZ = 100 µA, f = 10 Hz to 10 kHz IZ = 100 µA MAX MIN TYP MAX MIN TYP MAX 1.223 1.235 1.247 1.21 1.235 1.26 1.223 1.235 1.247 ±20 ±20 1 1 1 1.5 1.5 1.5 25°C 12 20 20 Full Range 30 30 30 25°C Full Range ±20 10 8 15 8 15 0.2 0.6 0.4 1 0.4 1 1.5 1.5 60 60 V mV ppm/k hr ±20 8 Full Range 25°C ±20 UNIT ppm/° C ±20 Full Range 25°C (1) (2) (3) LM385B-1.2 TYP 25°C IZ = I(min) to 1 mA (2) LM385-1.2 MIN µA Ω 1.5 60 µV Full range is −40°C to 85°C for the LM285-1.2 and 0°C to 70°C for the LM385-1.2 and LM385B-1.2. I(min) = 10 μA for the LM285-1.2 and 15 μA for the LM385-1.2 and LM385B-1.2 The average temperature coefficient of reference voltage is defined as the total change in reference voltage divided by the specified temperature range. 7.6 Typical Characteristics Figure 1. Reverse Current vs Reverse Voltage Copyright © 1989–2015, Texas Instruments Incorporated Figure 2. Reference Voltage Change vs Reverse Current Submit Documentation Feedback Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2 5 LM285-1.2, LM385-1.2, LM385B-1.2 SLVS075J – APRIL 1989 – REVISED JANUARY 2015 www.ti.com Typical Characteristics (continued) Figure 3. Forward Voltage vs Forward Current Figure 4. Reference Voltage vs Free-Air Temperature Figure 5. Reference Impedance vs Reference Current Figure 6. Noise Voltage vs Frequency Figure 7. Output Noise Voltage vs Cutoff Frequency 6 Submit Documentation Feedback Copyright © 1989–2015, Texas Instruments Incorporated Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2 LM285-1.2, LM385-1.2, LM385B-1.2 www.ti.com SLVS075J – APRIL 1989 – REVISED JANUARY 2015 8 Detailed Description 8.1 Overview The LM285-1.2, LM385-1.2, and LM385-1.2 devices are micropower, two-terminal, band-gap voltage references which operate over a 10-μA to 20-mA current range. On-chip trimming provides tight voltage tolerance. The band-gap reference for these devices has low noise and long-term stability. The design makes these devices exceptionally tolerant of capacitive loading and, thus, easier to use in most reference applications. The wide dynamic operating temperature range accommodates varying current supplies, with excellent regulation. The extremely low power drain of this series makes them useful for micropower circuitry. These voltage references can be used to make portable meters, regulators, or general-purpose analog circuitry, with battery life approaching shelf life. 8.2 Functional Block Diagram A. Component values shown are nominal. 8.3 Feature Description A band gap voltage reference controls high gain amplifier and shunt pass element to maintain a nearly constant voltage between cathode and anode. Regulation occurs after a minimum current is provided to power the voltage divider and amplifier. Internal frequency compensation provides a stable loop for all capacitor loads. Floating shunt design is useful for both positive and negative regulation applications. 8.4 Device Functional Modes LM285-1.2, LM385-1.2, and LM385-1.2 devices will operate in one mode, which is as a fixed voltage reference that cannot be adjusted. In order for a proper Reverse Voltage to be developed, current must be sourced into the cathode of LM285. The minimum current needed for proper regulation is denoted in Electrical Characteristics as IZ,min. Copyright © 1989–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2 7 LM285-1.2, LM385-1.2, LM385B-1.2 SLVS075J – APRIL 1989 – REVISED JANUARY 2015 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The The LM285-1.2, LM385-1.2, and LM385-1.2 devices create a voltage reference for to be used for a variety of applications including amplifiers, power supplies, and current-sensing circuits. The following application shows how to use these devices to establish a voltage reference. 9.2 Typical Application 5V 36 k 1.2 V LM385-1.2 Figure 8. Generating Reference Voltage with a Resistive Current Source 9.2.1 Design Requirements The key design requirement when using this device as a voltage reference is to supply the LM385 with a minimum Cathode Current (IZ), as indicated in Electrical Characteristics. 9.2.2 Detailed Design Procedure In order to generate a constant and stable reference voltage, a current greater than IZ(MIN) must be sourced into the cathode of this device. This can be accomplished using a current regulating device such as LM334 or a simple resistor. For a resistor, its value should be equal to or greater than (Vsupply - Vreference) ÷ IZ(MIN) . 8 Submit Documentation Feedback Copyright © 1989–2015, Texas Instruments Incorporated Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2 LM285-1.2, LM385-1.2, LM385B-1.2 www.ti.com SLVS075J – APRIL 1989 – REVISED JANUARY 2015 Typical Application (continued) 9.2.3 Application Curves Figure 9. Transient Response Copyright © 1989–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2 9 LM285-1.2, LM385-1.2, LM385B-1.2 SLVS075J – APRIL 1989 – REVISED JANUARY 2015 www.ti.com 9.3 System Examples 9.3.1 Thermocouple Cold-Junction Compensator Figure 10. Thermocouple Cold-Junction Compensator 9.3.2 Generating Reference Voltage with a Constant Current Source Figure 11. Generating Reference Voltage with a Constant Current Source Device 10 Submit Documentation Feedback Copyright © 1989–2015, Texas Instruments Incorporated Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2 LM285-1.2, LM385-1.2, LM385B-1.2 www.ti.com SLVS075J – APRIL 1989 – REVISED JANUARY 2015 10 Power Supply Recommendations In order to not exceed the maximum cathode current, be sure that the supply voltage is current limited. For applications shunting high currents (30 mA max), pay attention to the cathode and anode trace lengths, adjusting the width of the traces to have the proper current density. 11 Layout 11.1 Layout Guidelines Figure 12 shows an example of a PCB layout of LMx85x-1.2. Some key Vref niose considerations are: • Connect a low-ESR, 0.1-μF (CL) ceramic bypass capacitor on the cathode pin node. • Decouple other active devices in the system per the device specifications. • Using a solid ground plane helps distribute heat and reduces electromagnetic interference (EMI) noise pickup. • Place the external components as close to the device as possible. This configuration prevents parasitic errors (such as the Seebeck effect) from occurring. • Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible and only make perpendicular crossings when absolutely necessary. 11.2 Layout Example Rsup NC 1 NC 2 NC 3 8 CATHODE 7 6 4 5 NC NC NC ANODE GND Vsup CL GND Figure 12. Layout Diagram Copyright © 1989–2015, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2 11 LM285-1.2, LM385-1.2, LM385B-1.2 SLVS075J – APRIL 1989 – REVISED JANUARY 2015 www.ti.com 12 Device and Documentation Support 12.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM285-1.2 Click here Click here Click here Click here Click here LM385-1.2 Click here Click here Click here Click here Click here LM385B-1.2 Click here Click here Click here Click here Click here 12.2 Trademarks All trademarks are the property of their respective owners. 12.3 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.4 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 12 Submit Documentation Feedback Copyright © 1989–2015, Texas Instruments Incorporated Product Folder Links: LM285-1.2 LM385-1.2 LM385B-1.2 PACKAGE OPTION ADDENDUM www.ti.com 18-Nov-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM285D-1-2 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 285-12 LM285DE4-1-2 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 285-12 LM285DG4-1-2 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 285-12 LM285DR-1-2 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 285-12 LM285DRE4-1-2 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 285-12 LM285DRG4-1-2 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 285-12 LM285LP-1-2 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type -40 to 85 285-12 LM285LPE3-1-2 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type -40 to 85 285-12 LM285LPRE3-1-2 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type -40 to 85 285-12 LM385BD-1-2 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385B12 LM385BDE4-1-2 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385B12 LM385BDG4-1-2 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385B12 LM385BDR-1-2 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385B12 LM385BDRG4-1-2 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385B12 LM385BLP-1-2 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 385B12 LM385BLPE3-1-2 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 385B12 LM385BLPR-1-2 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 385B12 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Nov-2014 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM385BLPRE3-1-2 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 385B12 LM385BPW-1-2 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385B12 LM385BPWR-1-2 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385B12 LM385D-1-2 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385-12 LM385DG4-1-2 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385-12 LM385DR-1-2 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385-12 LM385DRG4-1-2 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385-12 LM385LP-1-2 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 385-12 LM385LPE3-1-2 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 385-12 LM385LPR-1-2 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 385-12 LM385LPRE3-1-2 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 385-12 LM385PW-1-2 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385-12 LM385PWE4-1-2 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385-12 LM385PWR-1-2 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385-12 LM385PWRE4-1-2 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385-12 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Nov-2014 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 15-Sep-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM285DR-1-2 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM385BDR-1-2 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM385DR-1-2 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM385PWR-1-2 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 15-Sep-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM285DR-1-2 SOIC D 8 2500 340.5 338.1 20.6 LM385BDR-1-2 SOIC D 8 2500 340.5 338.1 20.6 LM385DR-1-2 SOIC D 8 2500 340.5 338.1 20.6 LM385PWR-1-2 TSSOP PW 8 2000 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE PW0008A TSSOP - 1.2 mm max height SCALE 2.800 SMALL OUTLINE PACKAGE C 6.6 TYP 6.2 SEATING PLANE PIN 1 ID AREA A 0.1 C 6X 0.65 8 1 3.1 2.9 NOTE 3 2X 1.95 4 5 B 4.5 4.3 NOTE 4 SEE DETAIL A 8X 0.30 0.19 0.1 C A 1.2 MAX B (0.15) TYP 0.25 GAGE PLANE 0 -8 0.15 0.05 0.75 0.50 DETAIL A TYPICAL 4221848/A 02/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. www.ti.com EXAMPLE BOARD LAYOUT PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) 8X (0.45) SYMM 1 8 (R0.05) TYP SYMM 6X (0.65) 5 4 (5.8) LAND PATTERN EXAMPLE SCALE:10X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.05 MAX ALL AROUND 0.05 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4221848/A 02/2015 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) 8X (0.45) SYMM (R0.05) TYP 1 8 SYMM 6X (0.65) 5 4 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X 4221848/A 02/2015 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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