AD AD9608BCPZRL7-105 1.8 v dual analog-to-digital converter (adc) Datasheet

10-Bit, 125/105 MSPS, 1.8 V Dual
Analog-to-Digital Converter (ADC)
AD9608
FEATURES
FUNCTIONAL BLOCK DIAGRAM
1.8 V analog supply operation
1.8 V CMOS or 1.8 V LVDS output
SNR = 61.7 dBFS at 70 MHz
SFDR = 85 dBc at 70 MHz
Low power: 95 mW/channel at 125 MSPS
Differential analog input with 650 MHz bandwidth
IF sampling frequencies to 200 MHz
On-chip voltage reference and sample-and-hold circuit
2 V p-p differential analog input
DNL = ±0.13 LSB
Serial port control options
Offset binary, Gray code, or twos complement data format
Optional clock duty cycle stabilizer
Integer 1-to-8 input clock divider
Data output multiplex option
Built-in selectable digital test pattern generation
Energy-saving power-down modes
Data clock out with programmable clock and data
alignment
AVDD
PROGRAMMING DATA
VIN+A
ADC
VREF
SENSE
AD9608
REF
SELECT
RBIAS
VIN–B
ADC
VIN+B
CLK+ CLK–
ORA
D9A
D0A
DCOA
DRVDD
CMOS/LVDS
OUTPUT BUFFER
VCM
MUX OPTION
VIN–A
CMOS/LVDS
OUTPUT BUFFER
SPI
DIVIDE
1 TO 8
DUTY CYCLE
STABILIZER
MODE
CONTROLS
SYNC
DCS
PDWN DFS OEB
ORB
D9B
D0B
DCOB
NOTES
1. PIN NAMES ARE FOR THE CMOS PIN CONFIGURATION ONLY;
SEE FIGURE 7 FOR LVDS PIN NAMES.
APPLICATIONS
Communications
Diversity radio systems
I/Q demodulation systems
Broadband data applications
Battery-powered instruments
Handheld scope meters
Portable medical imaging
Ultrasound
Figure 1.
PRODUCT HIGHLIGHTS
1.
2.
3.
4.
Rev. C
SDIO SCLK CSB
AGND
Operates from a single 1.8 V analog power supply and
features a separate digital output driver supply to
accommodate 1.8 V CMOS or 1.8 V LVDS logic families.
The patented sample-and-hold circuit maintains excellent
performance for input frequencies up to 200 MHz and is
designed for low cost, low power, and ease of use.
Includes a standard serial port interface that supports various
product features and functions, such as data output formatting, internal clock divider, power-down, DCO/data timing,
and offset adjustments.
Packaged in a 64-lead, RoHS-compliant LFCSP that is pin
compatible with the AD9650, AD9269, and AD9268 16-bit
ADCs, the AD9258 and AD9648 14-bit ADCs, the AD9628
and AD9231 12-bit ADCs, and the AD9204 10-bit ADC,
enabling a simple migration path between 10-bit and 16-bit
converters sampling from 20 MSPS to 125 MSPS.
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09977-001
Data Sheet
AD9608* PRODUCT PAGE QUICK LINKS
Last Content Update: 02/23/2017
COMPARABLE PARTS
TOOLS AND SIMULATIONS
View a parametric search of comparable parts.
• Visual Analog
• AD9608 IBIS Model
EVALUATION KITS
• AD9648/AD9628/AD9608 S-Parameters
• AD9608 Evaluation Board
REFERENCE MATERIALS
DOCUMENTATION
Product Selection Guide
Application Notes
• RF Source Booklet
• AN-1142: Techniques for High Speed ADC PCB Layout
Technical Articles
• AN-282: Fundamentals of Sampled Data Systems
• MS-2210: Designing Power Supplies for High Speed ADC
• AN-737: How ADIsimADC Models an ADC
• AN-742: Frequency Domain Response of SwitchedCapacitor ADCs
DESIGN RESOURCES
• AN-756: Sampled Systems and the Effects of Clock Phase
Noise and Jitter
• PCN-PDN Information
• AN-803: Pin Compatible High Speed ADCs Simplify Design
Tasks
• Symbols and Footprints
• AN-807: Multicarrier WCDMA Feasibility
• AN-808: Multicarrier CDMA2000 Feasibility
• AN-827: A Resonant Approach to Interfacing Amplifiers to
Switched-Capacitor ADCs
• AN-835: Understanding High Speed ADC Testing and
Evaluation
• AD9608 Material Declaration
• Quality And Reliability
DISCUSSIONS
View all AD9608 EngineerZone Discussions.
SAMPLE AND BUY
Visit the product page to see pricing options.
• AN-878: High Speed ADC SPI Control Software
• AN-905: Visual Analog Converter Evaluation Tool Version
1.0 User Manual
• AN-935: Designing an ADC Transformer-Coupled Front
End
TECHNICAL SUPPORT
Submit a technical question or find your regional support
number.
Data Sheet
DOCUMENT FEEDBACK
• AD9608: 10-Bit, 125/105 MSPS, 1.8 V Dual Analog-toDigital Converter (ADC) Data Sheet
Submit feedback for this data sheet.
User Guides
• UG-003: Evaluating the AD9650/AD9268/AD9258/
AD9251/AD9231/AD9204 Analog-to-Digital Converters
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AD9608
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Voltage Reference ....................................................................... 25
Applications ....................................................................................... 1
Clock Input Considerations ...................................................... 26
Functional Block Diagram .............................................................. 1
Channel/Chip Synchronization ................................................ 28
Product Highlights ........................................................................... 1
Power Dissipation and Standby Mode .................................... 28
Revision History ............................................................................... 2
Digital Outputs ........................................................................... 29
General Description ......................................................................... 3
Timing ......................................................................................... 29
Specifications..................................................................................... 4
Output Test ...................................................................................... 30
DC Specifications ........................................................................... 4
Output Test Modes ..................................................................... 30
AC Specifications ........................................................................... 5
Serial Port Interface (SPI) .............................................................. 31
Digital Specifications ................................................................... 6
Configuration Using the SPI ..................................................... 31
Switching Specifications ................................................................ 7
Hardware Interface ......................................................................... 32
Timing Specifications .................................................................. 8
Configuration Without the SPI ................................................ 32
Absolute Maximum Ratings.......................................................... 10
SPI Accessible Features .............................................................. 32
Thermal Characteristics ............................................................ 10
Memory Map .................................................................................. 33
ESD Caution ................................................................................ 10
Reading the Memory Map Register Table............................... 33
Pin Configurations and Function Descriptions ......................... 11
Memory Map Register Table ..................................................... 34
Typical Performance Characteristics ........................................... 17
Memory Map Register Descriptions ........................................ 37
AD9608-125 ................................................................................ 17
Applications Information .............................................................. 39
AD9608-105 ................................................................................ 20
Design Guidelines ...................................................................... 39
Equivalent Circuits ......................................................................... 22
Outline Dimensions ....................................................................... 40
Theory of Operation ...................................................................... 23
Ordering Guide .......................................................................... 40
ADC Architecture ...................................................................... 23
Analog Input Considerations.................................................... 23
REVISION HISTORY
11/15—Rev. B to Rev. C
Changed AD9516 to AD9516-0/AD9516-1/AD9516-2/
AD9516-3/AD9516-4/AD9516-5, and AD9517 to AD9517-0/
AD9517-1/AD9517-2/AD9517-3/AD9517-4 ............ Throughout
Change to Figure 3 ........................................................................... 8
8/15—Rev. A to Rev. B
Changes to Features Section and Product Highlights Section ... 1
Changes to General Description Section ...................................... 3
Changes to Aperture Uncertainly (Jitter, tJ) Parameter,
Table 4 ................................................................................................ 7
Changes to Table 6 .......................................................................... 10
Changes to Table 7 .......................................................................... 10
Changes to RBIAS Pin Description and OEB Pin Description,
Table 8 .............................................................................................. 11
Changes to RBIAS Pin Description and OEB Pin Description,
Table 9 .............................................................................................. 13
Changes to RBIAS Pin Description and OEB Pin Description,
Table 10 ............................................................................................ 15
Changes to Figure 35...................................................................... 22
Changes to Differential Input Configurations Section ............. 25
Deleted Figure 48; Renumbered Sequentially ............................ 25
Change to Clock Input Options Section ..................................... 26
Changed Built-In Self-Test (BIST) and Output Test Mode
Section to Output Test Section ..................................................... 30
Deleted Built-In Self-Test (BIST) Section ................................... 30
Change to Configuration Without the SPI Section ................... 32
Changes to Channel-Specific Registers Section ......................... 33
Changes to Table 18 ....................................................................... 35
Changes to Bit 7—OEB Pin Enable Section................................ 38
Added Clock Stability Considerations Section........................... 39
Updated Outline Dimensions ....................................................... 40
11/14—Rev. 0 to Rev. A
Changes to Pin 31 Description, Table 10 .................................... 16
Update Outline Dimensions ......................................................... 40
7/11—Revision 0: Initial Version
Rev. C | Page 2 of 40
Data Sheet
AD9608
GENERAL DESCRIPTION
The AD9608 is a monolithic, dual-channel, 1.8 V supply, 10-bit,
105 MSPS/125 MSPS analog-to-digital converter (ADC) that
features a high performance sample-and-hold circuit and an
on-chip voltage reference.
A differential clock input controls all internal conversion cycles.
An optional duty cycle stabilizer (DCS) compensates for wide
variations in the clock duty cycle while maintaining excellent
overall ADC performance.
The product uses multistage differential pipeline architecture
with output error correction logic to provide 10-bit accuracy at
125 MSPS data rates and to guarantee no missing codes over the
full operating temperature range.
The digital output data is presented in offset binary, Gray code, or
twos complement format. A data output clock (DCO) is provided
for each ADC channel to ensure proper latch timing with receiving
logic. Logic levels of 1.8 V CMOS and 1.8 V LVDS are supported.
Output data can also be multiplexed onto a single output bus.
The ADC contains several features designed to maximize
flexibility and minimize system cost, such as programmable
clock and data alignment and programmable digital test pattern
generation. The available digital test patterns include built-in
deterministic and pseudorandom patterns, along with custom
user-defined test patterns entered via the serial port interface (SPI).
The AD9608 is available in a 64-lead RoHS-compliant LFCSP
and is specified over the industrial temperature range (−40°C to
+85°C).
Rev. C | Page 3 of 40
AD9608
Data Sheet
SPECIFICATIONS
DC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS enabled, unless
otherwise noted.
Table 1.
Parameter
RESOLUTION
ACCURACY
No Missing Codes
Offset Error
Gain Error
Differential Nonlinearity (DNL) 1
Integral Nonlinearity (INL)1
MATCHING CHARACTERISTIC
Offset Error
Gain Error
TEMPERATURE DRIFT
Offset Error
Gain Error
INTERNAL VOLTAGE REFERENCE
Output Voltage (1 V Mode)
Load Regulation Error at 1.0 mA
INPUT REFERRED NOISE
VREF = 1.0 V
ANALOG INPUT
Input Span, VREF = 1.0 V
Input Capacitance 2
Input Resistance (Differential)
Input Common-Mode Voltage
Input Common-Mode Range
POWER SUPPLIES
Supply Voltage
AVDD
DRVDD
Supply Current
IAVDD1
IDRVDD1 (1.8 V CMOS)
IDRVDD1 (1.8 V LVDS)
POWER CONSUMPTION
DC Input
Sine Wave Input1 (DRVDD = 1.8 V CMOS Output Mode)
Sine Wave Input1 (DRVDD = 1.8 V LVDS Output Mode)
Standby Power 3
Power-Down Power
1
2
3
Temp
Full
Full
Full
Full
Full
25°C
Full
25°C
Min
10
−1.0
−2.8
AD9608-105
Typ
Max
Guaranteed
−0.3
+0.4
±1.5
+9.0
±0.35
±0.12
±0.40
±0.14
Full
Full
±0.1
±0.5
Full
Full
±2
±50
Full
Full
0.98
1.00
2
Min
10
−1.0
−2.8
AD9608-125
Typ
Max
Guaranteed
−0.3
±1.5
+0.4
+9.0
±0.35
±0.13
±0.40
±0.14
±1.0
±6.5
±0.1
±0.5
±1.0
±6.5
±2
±50
1.02
0.98
1.00
2
Unit
Bits
% FSR
% FSR
LSB
LSB
LSB
LSB
% FSR
% FSR
ppm/°C
ppm/°C
1.02
V
mV
25°C
0.08
0.08
LSB rms
Full
Full
Full
Full
Full
2
5
7.5
0.9
2
5
7.5
0.9
0.5
1.3
V p-p
pF
kΩ
V
V
Full
Full
1.7
1.7
1.8
1.8
1.9
1.9
V
V
87.7
17.4
49.7
93.0
mA
mA
mA
1.3
0.5
1.8
1.8
1.9
1.9
1.7
1.7
Full
Full
Full
76.8
14.7
48.5
82.0
Full
Full
Full
Full
Full
125
165
226
174
108
2.0
Measured with a low input frequency, full-scale sine wave, with approximately 5 pF loading on each output bit.
Input capacitance refers to the effective capacitance between one differential input pin and AGND.
Standby power is measured with a dc input and with the CLK± pins active (1.8 V CMOS mode).
Rev. C | Page 4 of 40
141
189
247
120
2.0
199
mW
mW
mW
mW
mW
Data Sheet
AD9608
AC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS enabled, unless
otherwise noted.
Table 2.
Parameter 1
SIGNAL-TO-NOISE-RATIO (SNR)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 200 MHz
SIGNAL-TO-NOISE AND DISTORTION (SINAD)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 200 MHz
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 200 MHz
WORST SECOND OR THIRD HARMONIC
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 200 MHz
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 200 MHz
WORST OTHER (HARMONIC OR SPUR)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
fIN = 100 MHz
fIN = 200 MHz
TWO-TONE SFDR
fIN = 29 MHz (−7 dBFS ), 32 MHz (−7 dBFS )
CROSSTALK 2
ANALOG INPUT BANDWIDTH
1
2
Temp
25°C
25°C
25°C
Full
25°C
25°C
25°C
25°C
25°C
Full
25°C
25°C
Min
AD9608-105
Typ
Max
Min
61.7
61.7
61.7
AD9608-125
Typ
Max
61.7
61.7
61.7
61.3
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
61.3
61.6
61.4
61.6
61.4
61.6
61.6
61.6
61.6
61.6
61.6
Unit
61.5
61.3
61.5
61.3
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
25°C
25°C
25°C
25°C
25°C
9.9
9.9
9.9
9.9
9.9
9.9
9.9
9.9
9.9
9.9
Bits
Bits
Bits
Bits
Bits
25°C
25°C
25°C
Full
25°C
25°C
−90
−89
−89
−90
−89
−89
−89
−84
−89
−84
dBc
dBc
dBc
dBc
dBc
dBc
25°C
25°C
25°C
Full
25°C
25°C
85
85
85
85
85
85
61.1
61.1
−75
75
−75
dBc
dBc
dBc
dBc
dBc
dBc
75
85
84
85
84
25°C
25°C
25°C
Full
25°C
25°C
−85
−85
−85
−85
−85
−85
−85
−85
−85
−85
dBc
dBc
dBc
dBc
dBc
dBc
25°C
Full
25°C
82
−95
650
82
−95
650
dBc
dB
MHz
−75
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions.
Crosstalk is measured at 100 MHz with −1.0 dBFS on one channel and no input on the alternate channel.
Rev. C | Page 5 of 40
−75
AD9608
Data Sheet
DIGITAL SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, and DCS enabled, unless
otherwise noted.
Table 3.
Parameter
DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−)
Logic Compliance
Internal Common-Mode Bias
Differential Input Voltage
Input Voltage Range
Input Common-Mode Range
High Level Input Current
Low Level Input Current
Input Capacitance
Input Resistance
LOGIC INPUT (CSB) 1
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
Input Capacitance
LOGIC INPUT (SCLK/DFS/SYNC) 2
High Level Input Voltage
Low Level Input Voltage
High Level Input Current (VIN = 1.8 V)
Low Level Input Current
Input Resistance
Input Capacitance
LOGIC INPUT/OUTPUT (SDIO/DCS)1
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
Input Capacitance
LOGIC INPUTS (OEB, PDWN)2
High Level Input Voltage
Low Level Input Voltage
High Level Input Current (VIN = 1.8 V)
Low Level Input Current
Input Resistance
Input Capacitance
DIGITAL OUTPUTS
CMOS Mode—DRVDD = 1.8 V
High Level Output Voltage
IOH = 50 µA
IOH = 0.5 mA
Low Level Output Voltage
IOL = 1.6 mA
IOL = 50 µA
Temp
Full
Full
Full
Full
Full
Full
Full
Full
Min
0.3
AGND − 0.3
0.9
−10
−10
8
Full
Full
Full
Full
Full
Full
1.22
0
−10
40
Full
Full
Full
Full
Full
Full
1.22
0
−92
−10
Full
Full
Full
Full
Full
Full
1.22
0
−10
38
Full
Full
Full
Full
Full
Full
1.22
0
−90
−10
Full
Full
1.79
1.75
Typ
Max
CMOS/LVDS/LVPECL
0.9
3.6
AVDD + 0.2
1.4
+10
+10
4
10
12
V
V
µA
µA
kΩ
pF
DRVDD + 0.2
0.6
−135
+10
V
V
µA
µA
kΩ
pF
DRVDD + 0.2
0.6
+10
128
V
V
µA
µA
kΩ
pF
DRVDD + 0.2
0.6
−134
+10
V
V
µA
µA
kΩ
pF
26
2
26
5
26
5
Rev. C | Page 6 of 40
V
V p-p
V
V
µA
µA
pF
kΩ
DRVDD + 0.2
0.6
+10
132
26
2
Full
Full
Unit
V
V
0.2
0.05
V
V
Data Sheet
AD9608
Parameter
LVDS Mode—DRVDD = 1.8 V
Differential Output Voltage (VOD), ANSI Mode
Output Offset Voltage (VOS), ANSI Mode
Differential Output Voltage (VOD), Reduced Swing Mode
Output Offset Voltage (VOS), Reduced Swing Mode
1
2
Temp
Min
Typ
Max
Unit
Full
Full
Full
Full
290
1.15
160
1.15
345
1.25
200
1.25
400
1.35
230
1.35
mV
V
mV
V
Pull up.
Pull down.
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, and DCS enabled, unless
otherwise noted.
Table 4.
Parameter
CLOCK INPUT PARAMETERS
Input Clock Rate
Conversion Rate 1
DCS Enabled
DCS Disabled
CLK Period—Divide-by-1 Mode (tCLK)
CLK Pulse Width High (tCH)
Aperture Delay (tA)
Aperture Uncertainty (Jitter, tJ)
DATA OUTPUT PARAMETERS
CMOS Mode
CMOS Mode (DRVDD = 1.8 V)
Data Propagation Delay (tPD)
DCO Propagation Delay (tDCO) 2
DCO to Data Skew (tSKEW)
LVDS Mode (DRVDD = 1.8 V)
Data Propagation Delay (tPD)
DCO Propagation Delay (tDCO)2
DCO to Data Skew (tSKEW)
CMOS Mode Pipeline Delay (Latency)
LVDS Mode Pipeline Delay (Latency)
Channel A/Channel B
Wake-Up Time (Power-Down) 3
Wake-Up Time (Standby)
Out-of-Range Recovery Time
1
2
3
Temp
Min
AD9608-105
Typ
Max
Full
20
10
Full
Full
Full
1.8
2.0
−1.2
Full
Full
Full
AD9608-125
Typ
Max
Unit
1000
MHz
125
125
MSPS
MSPS
ns
ns
ns
ps rms
4.4
4.4
+1.0
ns
ns
ns
+0.5
ns
ns
ns
Cycles
Cycles
1000
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Min
105
105
20
10
9.52
4.76
1.0
0.137
−0.1
2.9
3.1
−0.1
8
4
1.0
0.137
4.4
4.4
+1.0
1.8
2.0
−1.2
2.9
3.1
−0.1
2.4
2.4
4.4
4.4
+0.2
16
16/16.5
+0.5
350
250
2
Conversion rate is the clock rate after the divider.
Additional DCO delay can be added by writing to Bits[2:0] in SPI Register 0x17 (see Table 18).
Wake-up time is defined as the time required to return to normal operation from power-down mode.
Rev. C | Page 7 of 40
−0.1
+0.2
16
16/16.5
350
250
2
µs
ns
Cycles
AD9608
Data Sheet
TIMING SPECIFICATIONS
Table 5.
Parameter
SYNC TIMING REQUIREMENTS
tSSYNC
tHSYNC
SPI TIMING REQUIREMENTS
tDS
tDH
tCLK
tS
tH
tHIGH
tLOW
tEN_SDIO
tDIS_SDIO
Descriptions
Limit
SYNC to rising edge of CLK+ setup time
SYNC to rising edge of CLK+ hold time
0.24 ns typ
0.40 ns typ
Setup time between the data and the rising edge of SCLK
Hold time between the data and the rising edge of SCLK
Period of the SCLK
Setup time between CSB and SCLK
Hold time between CSB and SCLK
SCLK pulse width high
SCLK pulse width low
Time required for the SDIO pin to switch from an input to an output relative to the
SCLK falling edge
Time required for the SDIO pin to switch from an output to an input relative to the
SCLK rising edge
2 ns min
40 ns min
2 ns min
2 ns min
10 ns min
10 ns min
10 ns min
10 ns min
2 ns min
Timing Diagrams
N–1
N+4
tA
N+5
N
N+3
VIN
N+1
tCH
N+2
tCLK
CLK+
CLK–
tDCO
DCOA/DCOB
tSKEW
N – 17
N – 16
N – 15
N – 14
N – 13
N – 12
09977-002
CH A/CH B DATA
tPD
Figure 2. CMOS Default Output Mode Data Output Timing
N–1
N+4
tA
N+5
N
N+3
VIN
N+1
tCH
N+2
tCLK
CLK+
CLK–
tDCO
DCOA/DCOB
CH A DATA
CH B CH A CH B
CH A CH B
CH A
N – 15 N – 14 N – 14 N – 13 N – 13 N – 12
CH B
CH A CH B
N – 16 N – 16 N – 15
CH A CH B
CH A CH B
CH A CH B
N – 15 N – 14 N – 14 N – 13 N – 13 N – 12
tPD
CH B DATA
Figure 3. CMOS Interleaved Output Mode Data Output Timing
Rev. C | Page 8 of 40
09977-003
tSKEW
CH A CH B CH A
N – 16 N – 16 N – 15
Data Sheet
AD9608
N–1
N+4
tA
N+5
N
N+3
VIN
N+1
tCH
N+2
tCLK
CLK+
CLK–
tDCO
DCO–
DCO+
tSKEW
D0+ (LSB)
PARALLEL
INTERLEAVED
MODE
D0– (LSB)
D9+ (MSB)
D9– (MSB)
D1+/D0+ (LSB)
CHANNEL
MULTIPLEXED
MODE
D1–/D0– (LSB)
CHANNEL A
D9+/D8+ (MSB)
D9–/D8– (MSB)
D1+/D0+ (LSB)
CHANNEL
MULTIPLEXED
MODE
D1–/D0– (LSB)
CHANNEL B
D9+/D8+ (MSB)
D9–/D8– (MSB)
CH A
N – 16
CH B
N – 16
CH A
N – 15
CH B
N – 15
CH A
N – 14
CH B
N – 14
CH A
N – 13
CH B
N – 13
CH A
N – 12
CH A
N – 16
CH B
N – 16
CH A
N – 15
CH B
N – 15
CH A
N – 14
CH B
N – 14
CH A
N – 13
CH B
N – 13
CH A
N – 12
CH A0
N – 16
CH A1
N – 16
CH A0
N – 15
CH A1
N – 15
CH A0
N – 14
CH A1
N – 14
CH A0
N – 13
CH A1
N – 13
CH A0
N – 12
CH A8
N – 16
CH A9
N – 16
CH A8
N – 15
CH A9
N – 15
CH A8
N – 14
CH A9
N – 14
CH A8
N – 13
CH A9
N – 13
CH A8
N – 12
CH B0
N – 16
CH B1
N – 16
CH B0
N – 15
CH B1
N – 15
CH B0
N – 14
CH B1
N – 14
CH B0
N – 13
CH B1
N – 13
CH B0
N – 12
CH B8
N – 16
CH B9
N – 16
CH B8
N – 15
CH B9
N – 15
CH B8
N – 14
CH B9
N – 14
CH B8
N – 13
CH B9
N – 13
CH B8
N – 12
Figure 4. LVDS Modes for Data Output Timing
CLK+
tHSYNC
09977-005
tSSYNC
SYNC
Figure 5. SYNC Input Timing Requirements
Rev. C | Page 9 of 40
09977-004
tPD
AD9608
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 6.
Parameter
Electrical
AVDD to AGND
DRVDD to AGND
VIN+A/VIN+B, VIN−A/VIN−B to AGND
CLK+, CLK− to AGND
SYNC to DRVDD
VCM to AGND
RBIAS to AGND
CSB to AGND
SCLK/DFS to AGND
SDIO/DCS to AGND
OEB
PDWN
D0A, D0B through D9A, D9B to AGND
DCOA, DCOB to AGND
Environmental
Operating Temperature Range
(Ambient)
Maximum Junction Temperature
Under Bias
Storage Temperature Range
(Ambient)
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
−0.3 V to DRVDD + 0.2 V
The exposed paddle must be soldered to the ground plane for
the LFCSP. Soldering the exposed paddle to the printed circuit
board (PCB) increases the reliability of the solder joints and
maximizes the thermal capability of the package.
Table 7. Thermal Resistance
Package
Type
64-Lead
LFCSP
9 mm × 9 mm
(CP-64-4)
Airflow
Velocity
(m/sec)
0
1.0
2.5
θJA1, 2
22.3
19.5
17.5
θJC1, 3
1.4
N/A5
N/A5
θJB1, 4
11.8
N/A5
N/A5
ΨJT1, 2
0.1
0.2
0.2
Unit
°C/W
°C/W
°C/W
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
5
N/A means not applicable.
1
2
3
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown Table 7, airflow improves heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes reduces θJA.
−40°C to +85°C
150°C
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
Rev. C | Page 10 of 40
Data Sheet
AD9608
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
AVDD
AVDD
VIN+B
VIN–B
AVDD
AVDD
RBIAS
VCM
SENSE
VREF
AVDD
AVDD
VIN–A
VIN+A
AVDD
AVDD
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PIN 1
INDICATOR
AD9608
PARALLEL CMOS
TOP VIEW
(Not to Scale)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PDWN
OEB
CSB
SCLK/DFS
SDIO/DCS
ORA
D9A (MSB)
D8A
D7A
D6A
D5A
DRVDD
D4A
D3A
D2A
D1A
NOTES
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.
2. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE PROVIDES
THE ANALOG GROUND FOR THE PART. THIS EXPOSED PAD MUST BE
CONNECTED TO GROUND FOR PROPER OPERATION.
09977-006
D6B
D7B
DRVDD
D8B
D9B (MSB)
ORB
DCOB
DCOA
NC
NC
NC
DRVDD
NC
NC
NC
D0A (LSB)
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
CLK+
CLK–
SYNC
NC
NC
NC
NC
NC
NC
DRVDD
D0B (LSB)
D1B
D2B
D3B
D4B
D5B
Figure 6. Parallel CMOS Pin Configuration (Top View)
Table 8. Pin Function Descriptions (Parallel CMOS Mode)
Pin No.
Mnemonic
ADC Power Supplies
10, 19, 28, 37
DRVDD
AVDD
49, 50, 53, 54,
59, 60, 63, 64
NC
4, 5, 6, 7, 8, 9,
25, 26, 27, 29,
30, 31
0
AGND,
Exposed Pad
ADC Analog
51
VIN+A
52
VIN−A
62
VIN+B
61
VIN−B
55
VREF
56
SENSE
58
RBIAS
57
VCM
1
CLK+
2
CLK−
Type
Description
Supply
Supply
Digital Output Driver Supply (1.8 V Nominal).
Analog Power Supply (1.8 V Nominal).
No Connect. Do not connect to this pin.
Ground
The exposed thermal pad on the bottom of the package provides the analog ground
for the part. This exposed pad must be connected to ground for proper operation.
Input
Input
Input
Input
Input/Output
Input
Input/Output
Output
Input
Input
Differential Analog Input Pin (+) for Channel A.
Differential Analog Input Pin (−) for Channel A.
Differential Analog Input Pin (+) for Channel B.
Differential Analog Input Pin (−) for Channel B.
Voltage Reference Input/Output.
Reference Mode Selection.
External Reference Bias Resistor. Connect to 10 kΩ (1% tolerance) resistor to ground.
Common-Mode Level Bias Output for Analog Inputs.
ADC Clock Input—True.
ADC Clock Input—Complement.
Rev. C | Page 11 of 40
AD9608
Pin No.
Mnemonic
Digital Input
3
SYNC
Digital Outputs
32
D0A (LSB)
33
D1A
34
D2A
35
D3A
36
D4A
38
D5A
39
D6A
40
D7A
41
D8A
42
D9A (MSB)
43
ORA
11
D0B (LSB)
12
D1B
13
D2B
14
D3B
15
D4B
16
D5B
17
D6B
18
D7B
20
D8B
21
D9B (MSB)
22
ORB
24
DCOA
23
DCOB
SPI Control
45
SCLK/DFS
44
SDIO/DCS
46
CSB
ADC Configuration
47
OEB
48
PDWN
Data Sheet
Type
Description
Input
Digital Synchronization Pin. Slave mode only.
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Channel A CMOS Output Data.
Channel A CMOS Output Data.
Channel A CMOS Output Data.
Channel A CMOS Output Data.
Channel A CMOS Output Data.
Channel A CMOS Output Data.
Channel A CMOS Output Data.
Channel A CMOS Output Data.
Channel A CMOS Output Data.
Channel A CMOS Output Data.
Channel A Overrange Output.
Channel B CMOS Output Data.
Channel B CMOS Output Data.
Channel B CMOS Output Data.
Channel B CMOS Output Data.
Channel B CMOS Output Data.
Channel B CMOS Output Data.
Channel B CMOS Output Data.
Channel B CMOS Output Data.
Channel B CMOS Output Data.
Channel B CMOS Output Data.
Channel B Overrange Output
Channel A Data Clock Output.
Channel B Data Clock Output.
Input
Input/Output
Input
SPI Serial Clock/Data Format Select Pin in External Pin Mode.
SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode.
SPI Chip Select (Active Low).
Input
Input
Output Enable Input (Active Low).
Power-Down Input in External Pin Mode. In SPI mode, this input can be configured
as power-down or standby.
Rev. C | Page 12 of 40
AD9608
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
AVDD
AVDD
VIN+B
VIN–B
AVDD
AVDD
RBIAS
VCM
SENSE
VREF
AVDD
AVDD
VIN–A
VIN+A
AVDD
AVDD
Data Sheet
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PIN 1
INDICATOR
AD9608
INTERLEAVED PARALLEL LVDS
TOP VIEW
(Not to Scale)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PDWN
OEB
CSB
SCLK/DFS
SDIO/DCS
OR+
OR–
D9+ (MSB)
D9– (MSB)
D8+
D8–
DRVDD
D7+
D7–
D6+
D6–
NOTES
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.
2. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE PROVIDES
THE ANALOG GROUND FOR THE PART. THIS EXPOSED PAD MUST BE
CONNECTED TO GROUND FOR PROPER OPERATION.
09977-007
D0– (LSB)
D0+ (LSB)
DRVDD
D1–
D1+
D2–
D2+
DCO–
DCO+
D3–
D3+
DRVDD
D4–
D4+
D5–
D5+
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
CLK+
CLK–
SYNC
NC
NC
NC
NC
NC
NC
DRVDD
NC
NC
NC
NC
NC
NC
Figure 7. Interleaved Parallel LVDS Pin Configuration (Top View)
Table 9. Pin Function Descriptions (Interleaved Parallel LVDS Mode)
Pin No.
Mnemonic
ADC Power Supplies
10, 19, 28, 37 DRVDD
49, 50, 53, 54, AVDD
59, 60, 63, 64
4, 5, 6, 7, 8, 9, NC
11, 12, 13, 14,
15, 16
0
AGND,
Exposed Pad
ADC Analog
51
VIN+A
52
VIN−A
62
VIN+B
61
VIN−B
55
VREF
56
SENSE
58
RBIAS
57
VCM
1
CLK+
2
CLK−
Digital Input
3
SYNC
Type
Description
Supply
Supply
Digital Output Driver Supply (1.8 V Nominal).
Analog Power Supply (1.8 V Nominal).
No Connect. Do not connect to this pin.
Ground
The exposed thermal pad on the bottom of the package provides the analog ground for
the part. This exposed pad must be connected to ground for proper operation.
Input
Input
Input
Input
Input/Output
Input
Input/Output
Output
Input
Input
Differential Analog Input Pin (+) for Channel A.
Differential Analog Input Pin (−) for Channel A.
Differential Analog Input Pin (+) for Channel B.
Differential Analog Input Pin (−) for Channel B.
Voltage Reference Input/Output.
Reference Mode Selection.
External Reference Bias Resistor. Connect to 10 kΩ (1% tolerance) resistor to ground.
Common-Mode Level Bias Output for Analog Inputs.
ADC Clock Input—True.
ADC Clock Input—Complement.
Input
Digital Synchronization Pin. Slave mode only.
Rev. C | Page 13 of 40
AD9608
Pin No.
Mnemonic
Digital Outputs
18
D0+ (LSB)
17
D0− (LSB)
21
D1+
20
D1−
23
D2+
22
D2−
27
D3+
26
D3−
30
D4+
29
D4−
32
D5+
31
D5−
34
D6+
33
D6−
36
D7+
35
D7−
39
D8+
38
D8−
41
D9+ (MSB)
40
D9− (MSB)
43
OR+
42
OR−
25
DCO+
24
DCO−
SPI Control
45
SCLK/DFS
44
SDIO/DCS
46
CSB
ADC Configuration
47
OEB
48
PDWN
Data Sheet
Type
Description
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Channel A/Channel B LVDS Output Data 0—True.
Channel A/Channel B LVDS Output Data 0—Complement.
Channel A/Channel B LVDS Output Data 1—True.
Channel A/Channel B LVDS Output Data 1—Complement.
Channel A/Channel B LVDS Output Data 2 —True.
Channel A/Channel B LVDS Output Data 2—Complement.
Channel A/Channel B LVDS Output Data 3—True.
Channel A/Channel B LVDS Output Data 3—Complement.
Channel A/Channel B LVDS Output Data 4—True.
Channel A/Channel B LVDS Output Data 4—Complement.
Channel A/Channel B LVDS Output Data 5—True.
Channel A/Channel B LVDS Output Data 5—Complement.
Channel A/Channel B LVDS Output Data 6—True.
Channel A/Channel B LVDS Output Data 6—Complement.
Channel A/Channel B LVDS Output Data 7—True.
Channel A/Channel B LVDS Output Data 7—Complement.
Channel A/Channel B LVDS Output Data 8—True.
Channel A/Channel B LVDS Output Data 8—Complement.
Channel A/Channel B LVDS Output Data 9—True.
Channel A/Channel B LVDS Output Data 9—Complement.
Channel A/Channel B LVDS Overrange Output—True.
Channel A/Channel B LVDS Overrange Output—Complement.
Channel A/Channel B LVDS Data Clock Output—True.
Channel A/Channel B LVDS Data Clock Output—Complement.
Input
Input/Output
Input
SPI Serial Clock/Data Format Select Pin in External Pin Mode.
SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode.
SPI Chip Select (Active Low).
Input
Input
Output Enable Input (Active Low).
Power-Down Input in External Pin Mode. In SPI mode, this input can be configured as
power-down or standby.
Rev. C | Page 14 of 40
AD9608
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
AVDD
AVDD
VIN+B
VIN–B
AVDD
AVDD
RBIAS
VCM
SENSE
VREF
AVDD
AVDD
VIN–A
VIN+A
AVDD
AVDD
Data Sheet
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PIN 1
INDICATOR
AD9608
CHANNEL MULTIPLEXED LVDS
TOP VIEW
(Not to Scale)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
PDWN
OEB
CSB
SCLK/DFS
SDIO/DCS
OR+
OR–
A D9+/D8+ (MSB)
A D9–/D8– (MSB)
A D7+/D6+
A D7–/D6–
DRVDD
A D5+/D4+
A D5–/D4–
A D3+/D2+
A D3–/D2–
NOTES
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.
2. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE PROVIDES
THE ANALOG GROUND FOR THE PART. THIS EXPOSED PAD MUST BE
CONNECTED TO GROUND FOR PROPER OPERATION.
09977-008
B D5–/D4–
B D5+/D4+
DRVDD
B D7–/D6–
B D7+/D6+
B D9–/D8– (MSB)
B D9+/D8+ (MSB)
DCO–
DCO+
NC
NC
DRVDD
NC
NC
A D1–/D0– (LSB)
A D1+/D0+ (LSB)
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
CLK+
CLK–
SYNC
NC
NC
NC
NC
NC
NC
DRVDD
NC
NC
B D1–/D0– (LSB)
B D1+/D0+ (LSB)
B D3–/D2–
B D3+/D2+
Figure 8. Channel Multiplexed LVDS Pin Configuration (Top View)
Table 10. Pin Function Descriptions (Channel Multiplexed Parallel LVDS Mode)
Pin No.
Mnemonic
ADC Power Supplies
10, 19, 28, 37
DRVDD
49, 50, 53, 54, AVDD
59, 60, 63, 64
NC
4, 5, 6, 7, 8, 9,
11, 12, 26, 27,
29, 30
0
AGND, Exposed Pad
ADC Analog
51
52
62
61
55
56
58
57
1
2
Digital Input
3
Type
Description
Supply
Supply
Digital Output Driver Supply (1.8 V Nominal).
Analog Power Supply (1.8 V Nominal).
No Connect. Do not connect to this pin.
Ground
The exposed thermal pad on the bottom of the package provides the
analog ground for the part. This exposed pad must be connected to ground
for proper operation.
VIN+A
VIN−A
VIN+B
VIN−B
VREF
SENSE
RBIAS
Input
Input
Input
Input
Input/Output
Input
Input/Output
VCM
CLK+
CLK−
Output
Input
Input
Differential Analog Input Pin (+) for Channel A.
Differential Analog Input Pin (−) for Channel A.
Differential Analog Input Pin (+) for Channel B.
Differential Analog Input Pin (−) for Channel B.
Voltage Reference Input/Output.
Reference Mode Selection.
External Reference Bias Resistor. Connect to 10 kΩ (1% tolerance) resistor to
ground.
Common-Mode Level Bias Output for Analog Inputs.
ADC Clock Input—True.
ADC Clock Input—Complement.
SYNC
Input
Digital Synchronization Pin. Slave mode only.
Rev. C | Page 15 of 40
AD9608
Pin No.
Mnemonic
Digital Outputs
14
B D1+/D0+ (LSB)
13
B D1−/D0− (LSB)
16
B D3+/D2+
15
B D3−/D2−
18
B D5+/D4+
17
B D5−/D4−
21
B D7+/D6+
20
B D7−/D6−
23
B D9+/D8+ (MSB)
22
B D9−/D8− (MSB)
32
A D1+/D0+ (LSB)
31
A D1−/D0− (LSB)
34
A D3+/D2+
33
A D3−/D2−
36
A D5+/D4+
35
A D5−/D4−
39
A D7+/D6+
38
A D7−/D6−
41
A D9+/D8+ (MSB)
40
A D9−/D8− (MSB)
43
OR+
42
OR−
25
DCO+
24
DCO−
SPI Control
45
SCLK/DFS
44
SDIO/DCS
46
CSB
ADC Configuration
47
OEB
48
PDWN
Data Sheet
Type
Description
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Output
Channel B LVDS Output Data 1/ Data 0—True.
Channel B LVDS Output Data 1/ Data 0—Complement.
Channel B LVDS Output Data 3/ Data 2—True.
Channel B LVDS Output Data 3/ Data 2—Complement.
Channel B LVDS Output Data 5/ Data 4—True.
Channel B LVDS Output Data 5/ Data 4—Complement.
Channel B LVDS Output Data 7/ Data 6—True.
Channel B LVDS Output Data 7/ Data 6—Complement.
Channel B LVDS Output Data 9/ Data 8—True.
Channel B LVDS Output Data 9/ Data 8—Complement.
Channel A LVDS Output Data 1/ Data 0—True.
Channel A LVDS Output Data 1/ Data 0—Complement.
Channel A LVDS Output Data 3/ Data 2—True.
Channel A LVDS Output Data 3/ Data 2—Complement.
Channel A LVDS Output Data 5/ Data 4—True.
Channel A LVDS Output Data 5/ Data 4—Complement.
Channel A LVDS Output Data 7/ Data 6—True.
Channel A LVDS Output Data 7/ Data 6—Complement.
Channel A LVDS Output Data 9/ Data 8—True.
Channel A LVDS Output Data 9/ Data 8—Complement.
Channel A/Channel B LVDS Overrange Output—True.
Channel A/Channel B LVDS Overrange Output—Complement.
Channel A/Channel B LVDS Data Clock Output—True.
Channel A/Channel B LVDS Data Clock Output—Complement.
Input
Input/Output
Input
SPI Serial Clock/Data Format Select Pin in External Pin Mode.
SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode.
SPI Chip Select (Active Low).
Input
Input
Output Enable Input (Active Low).
Power-Down Input in External Pin Mode. In SPI mode, this input can be
configured as power-down or standby.
Rev. C | Page 16 of 40
Data Sheet
AD9608
TYPICAL PERFORMANCE CHARACTERISTICS
AD9608-125
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, and DCS enabled, unless
otherwise noted.
0
0
125MSPS
9.7MHZ AT –1dBFS
SNR = 60.6dB (61.6dBFS)
SFDR = 85.4dBC
–20
AMPLITUDE (dBFS)
–40
–60
–80
–40
–60
–80
0
10
20
30
40
50
60
FREQUENCY (MHz)
–120
09977-009
–120
0
20
30
40
50
60
FREQUENCY (MHz)
Figure 9. Single-Tone FFT with fIN = 9.7 MHz
Figure 12. Single-Tone FFT with fIN = 100.5 MHz
0
0
125MSPS
30.5MHz AT –1dBFS
SNR = 60.7dB (61.7dBFS)
SFDR = 86.3dBc
125MSPS
200.5MHz AT –1dBFS
SNR = 60.3dB (61.3dBFS)
SFDR = 83.0dBc
–20
AMPLITUDE (dBFS)
–20
AMPLITUDE (dBFS)
10
–40
–60
–80
–40
–60
–80
–100
–100
0
10
20
30
40
50
60
FREQUENCY (MHz)
09977-010
–120
–120
Figure 10. Single-Tone FFT with fIN = 30.5 MHz
125MSPS
70.1MHz AT –1dBFS
SNR = 60.7dB (61.7dBFS)
SFDR = 86.5dBc
–20
–40
–60
–80
–120
10
20
30
40
50
FREQUENCY (MHz)
60
09977-011
–100
0
0
10
20
30
40
50
FREQUENCY (MHz)
Figure 13. Single-Tone FFT with fIN = 200.5 MHz
0
AMPLITUDE (dBFS)
09977-012
–100
–100
Figure 11. Single-Tone FFT with fIN = 70.1 MHz
Rev. C | Page 17 of 40
60
09977-013
AMPLITUDE (dBFS)
–20
125MSPS
100.5MHz AT –1dBFS
SNR = 60.6dB (61.6dBFS)
SFDR = 85.2dBc
AD9608
Data Sheet
AMPLITUDE (Hz)
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, and DCS enabled, unless
otherwise noted.
0
–2
–15
–12
–30
–22
–45
–32
–60
–42
–75
–52
SFDR(dBc)
IMD3 (dBc)
–90
2F2 – F1
2F1 + F2
2F1 – F2
–62
+
–105
–72
–120
–82
SFDR(dBFS)
24
36
30
42
FREQUENCY (MHz)
48
54
60
–92
–70
Figure 14. Two-Tone FFT with fIN1 = 29 MHz and fIN2 = 32 MHz
90
80
SNR/SFDR (dBc AND dBFS)
90
80
75
70
65
SNRFS
40
30
10
0
–60
09977-035
250
ANALOG INPUT FREQUENCY (MHz)
SNRFS
SFDR
SNR
SFDRFS
50
55
50
–50
–40
–30
–20
–10
0
INPUT AMPLITUDE (dBFS)
Figure 18. SNR/SFDR vs. Input Amplitude (AIN) with fIN = 9.7 MHz
Figure 15. SNR/SFDR vs. Input Frequency (AIN) with 2 V p-p Full Scale
120
120
100
100
SFDR (dBc)
SNR/SFDR (dBFS/dBc)
SFDR (dBc)
80
SNR (dBFS)
60
40
20
80
SNR (dBFS)
60
40
20
0
5
25
45
65
85
105
125
SAMPLE RATE (MSPS)
0
09977-031
SNR/SFDR (dBFS/dBc)
–10
60
20
200
–20
70
60
150
–30
5
25
45
65
85
105
SAMPLE RATE (MSPS)
Figure 16. SNR/SFDR vs. Sample Rate with AIN = 9.7 MHz
Figure 19. SNR/SFDR vs. Sample Rate with AIN = 70 MHz
Rev. C | Page 18 of 40
125
09977-032
SNR/SFDR (dBFS/dBc)
SFDR
85
100
–40
Figure 17. Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 29 MHz
and fIN2 = 32 MHz
95
50
–50
INPUT AMPLITUDE (dBFS)
100
0
–60
09977-022
18
09977-033
12
6
09977-067
–135
IMD3 (dBFS)
Data Sheet
AD9608
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, and DCS enabled, unless
otherwise noted.
1.0
2.0
1.5
1.0
INL ERROR (LSB)
DNL ERROR (LSB)
0.5
0
–0.5
0.5
0
–0.5
–1.0
0
500
1000
OUTPUT CODE
Figure 20. DNL Error with fIN = 9.7 MHz
800
600
400
200
0
N–1
N
N+1
N+2
OUTPUT CODE
N+3
09977-034
NUMBER OF HITS (Thousands)
1,000
N–2
0
200
400
600
800
OUTPUT CODE
Figure 22. INL Error with fIN = 9.7 MHz
1,200
N–3
–2.0
Figure 21. Shorted Input Histogram
Rev. C | Page 19 of 40
1000
09977-020
–1.0
09977-021
–1.5
AD9608
Data Sheet
AD9608-105
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, and DCS enabled, unless
otherwise noted.
0
0
105MSPS
9.7MHz AT –1dBFS
SNR = 60.7dB (61.7dBFS)
SFDR = 84.9dBc
–20
–40
AMPLITUDE (dBFS)
–60
–80
–100
–40
–60
–80
0
10
20
30
40
50
FREQUENCY (MHz)
–120
0
10
20
30
40
50
FREQUENCY (MHz)
Figure 26. Single-Tone FFT with fIN = 100.5 MHz
Figure 23. Single-Tone FFT with fIN = 9.7 MHz
0
0
105MSPS
200.5MHz AT –1dBFS
SNR = 60.3dB (61.3dBFS)
SFDR = 85.9dBc
–20
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
105MSPS
30.5MHz AT –1dBFS
SNR = 60.6dB (61.6dBFS)
–20 SFDR = 84.5dBc
–40
–60
–80
–100
–40
–60
–80
0
10
20
30
40
50
FREQUENCY (MHz)
09977-015
–100
–120
0
105MSPS
70.1MHz AT –1dBFS
SNR = 60.7dB (61.7dBFS)
SFDR = 86.8dBc
–20
–40
–60
–80
–120
10
20
30
40
FREQUENCY (MHz)
50
09977-016
–100
0
–120
0
10
20
30
40
FREQUENCY (MHz)
Figure 27. Single-Tone FFT with fIN = 200.5 MHz
Figure 24. Single-Tone FFT with fIN = 30.5 MHz
AMPLITUDE (dBFS)
09977-017
–120
09977-014
–100
Figure 25. Single-Tone FFT with fIN = 70.1 MHz
Rev. C | Page 20 of 40
50
09977-018
AMPLITUDE (dBFS)
–20
105MSPS
100.5MHz AT –1dBFS
SNR = 60.7dB (61.7dBFS)
SFDR = 85.9dBc
Data Sheet
AD9608
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, and DCS enabled, unless
otherwise noted.
100
90
95
80
SFDR
SNR/SFDR (dBc AND dBFS)
85
80
75
70
65
SNRFS
60
70
60
50
40
30
20
0
50
100
150
200
250
ANALOG INPUT FREQUENCY (MHz)
0
–60
09977-029
50
–50
–40
Figure 28. SNR/SFDR vs. Input Frequency (AIN) with 2 V p-p Full Scale
Figure 31. SNR/SFDR vs. Input Amplitude (AIN) with fIN = 9.7 MHz
120
120
100
100
SFDR (dBc)
SNR/SFDR (dBFS/dBc)
80
SNR (dBFS)
60
40
20
80
SNR (dBFS)
60
40
20
5
15
25
35
45
55
65
75
85
95
0
09977-026
0
105
SAMPLE RATE (MSPS)
5
15
25
35
45
55
65
75
85
95
105
SAMPLE RATE (MSPS)
Figure 29. SNR/SFDR vs. Sample Rate with AIN = 9.7 MHz
09977-027
SNR/SFDR (dBFS/dBc)
SFDR (dBc)
Figure 32. SNR/SFDR vs. Sample Rate with AIN = 70 MHz
1.0
0.5
0.5
INL ERROR (LSB)
1.0
0
0
–0.5
–0.5
–1.0
0
500
OUTPUT CODE
1000
–1.0
09977-019
DNLERROR (LSB)
0
–10
–20
–30
INPUT AMPLITUDE (dBFS)
09977-028
10
55
0
200
400
600
800
OUTPUT CODE
Figure 30. DNL Error with fIN = 9.7 MHz
Figure 33. INL Error with fIN = 9.7 MHz
Rev. C | Page 21 of 40
1000
09977-025
SNR/SFDR (dBFS/dBc)
90
SNRFS
SFDR
SNR
SFDRFS
AD9608
Data Sheet
EQUIVALENT CIRCUITS
DRVDD
AVDD
350Ω
SCLK/DFS, SYNC,
OEB, AND PDWN
30kΩ
09977-039
09977-045
VIN±x
Figure 34. Equivalent Analog Input Circuit
Figure 38. Equivalent SCLK/DFS, SYNC, OEB, and PDWN Input Circuit
5Ω
CLK+
15kΩ
AVDD
0.9V
15kΩ
375Ω
SENSE
09977-040
09977-043
5Ω
CLK–
Figure 39. Equivalent SENSE Circuit
Figure 35. Equivalent Clock Input Circuit
DRVDD
DRVDD
AVDD
PAD
350Ω
30kΩ
09977-044
09977-047
CSB
Figure 36. Equivalent Digital Output Circuit
Figure 40. Equivalent CSB Input Circuit
AVDD
DRVDD
30kΩ
30kΩ
375Ω
VREF
09977-042
7.5kΩ
Figure 37. Equivalent SDIO/DCS Input Circuit
Figure 41. Equivalent VREF Circuit
Rev. C | Page 22 of 40
09977-048
SDIO/DCS
AVDD
350Ω
Data Sheet
AD9608
THEORY OF OPERATION
ANALOG INPUT CONSIDERATIONS
The analog input to the AD9608 is a differential switchedcapacitor circuit designed for processing differential input
signals. This circuit can support a wide common-mode range
while maintaining excellent performance. By using an input
common-mode voltage of midsupply, users can minimize
signal-dependent errors and achieve optimum performance.
In nondiversity applications, the AD9608 can be used as a baseband or direct downconversion receiver, where one ADC is used
for I input data and the other is used for Q input data.
H
CPAR
H
VIN+x
CSAMPLE
Synchronization capability is provided to allow synchronized
timing between multiple channels or multiple devices.
S
S
S
S
CSAMPLE
Programming and control of the AD9608 is accomplished using
a 3-bit SPI-compatible serial interface.
VIN–x
H
CPAR
ADC ARCHITECTURE
H
The AD9608 architecture consists of a multistage, pipelined ADC.
Each stage provides sufficient overlap to correct for flash errors in
the preceding stage. The quantized outputs from each stage are
combined into a final 10-bit result in the digital correction logic.
The pipelined architecture permits the first stage to operate with
a new input sample while the remaining stages operate with
preceding samples. Sampling occurs on the rising edge of
the clock.
Each stage of the pipeline, excluding the last, consists of a low
resolution flash ADC connected to a switched-capacitor DAC
and an interstage residue amplifier (for example, a multiplying
digital-to-analog converter (MDAC)). The residue amplifier
magnifies the difference between the reconstructed DAC output
and the flash input for the next stage in the pipeline. One bit of
redundancy is used in each stage to facilitate digital correction
of flash errors. The last stage consists of a flash ADC.
The output staging block aligns the data, corrects errors, and
passes the data to the CMOS/LVDS output buffers. The output
buffers are powered from a separate (DRVDD) supply, allowing
digital output noise to be separated from the analog core. During
power-down, the output buffers go into a high impedance state.
09977-049
The AD9608 dual ADC design can be used for diversity reception
of signals, where the ADCs are operating identically on the same
carrier but from two separate antennae. The ADCs can also be
operated with independent analog inputs. The user can sample
any fS/2 frequency segment from dc to 200 MHz, using appropriate
low-pass or band-pass filtering at the ADC inputs with little loss
in ADC performance. Operation to 300 MHz analog input is
permitted but occurs at the expense of increased ADC noise
and distortion.
Figure 42. Switched-Capacitor Input Circuit
The clock signal alternately switches the input circuit between
sample-and-hold mode (see Figure 42). When the input circuit
is switched to sample mode, the signal source must be capable
of charging the sample capacitors and settling within one-half
of a clock cycle. A small resistor in series with each input can help
reduce the peak transient current injected from the output stage
of the driving source. In addition, low Q inductors or ferrite beads
can be placed on each leg of the input to reduce high differential
capacitance at the analog inputs and, therefore, achieve the
maximum bandwidth of the ADC. Such use of low Q inductors
or ferrite beads is required when driving the converter front end
at high IF frequencies. Either a shunt capacitor or two single-ended
capacitors can be placed on the inputs to provide a matching
passive network. This ultimately creates a low-pass filter at the
input to limit unwanted broadband noise. See the AN-742
Application Note, the AN-827 Application Note, and the Analog
Dialogue article “Transformer-Coupled Front-End for Wideband
A/D Converters” (Volume 39, April 2005) for more information.
In general, the precise values depend on the application.
Rev. C | Page 23 of 40
AD9608
Data Sheet
Input Common Mode
The output common-mode voltage of the ADA4938-2 is easily
set with the VCM pin of the AD9608 (see Figure 44), and the
driver can be configured in a Sallen-Key filter topology to
provide band limiting of the input signal.
The analog inputs of the AD9608 are not internally dc-biased.
Therefore, in ac-coupled applications, the user must provide
a dc bias externally. Setting the device so that VCM = AVDD/2
is recommended for optimum performance, but the device can
function over a wider range with reasonable performance, as
shown in Figure 43.
200Ω
VIN
AVDD
120Ω
33Ω
VIN+x
VCM
200Ω
09977-050
ADC
ADA4938 10pF
0.1µF
Figure 44. Differential Input Configuration Using the ADA4938-2
For baseband applications below ~10 MHz where SNR is a key
parameter, differential transformer coupling is the recommended
input configuration (see Figure 45). To bias the analog input,
the VCM voltage can be connected to the center tap of the
secondary winding of the transformer.
100
SFDR (dBc)
80
70
SNR (dBFS)
60
VIN+x
50
R
2V p-p
40
49.9Ω
ADC
C
30
R
VIN–x
VCM
20
0.1µF
10
Figure 45. Differential Transformer-Coupled Configuration
0.8
0.9
1.0
1.1
1.2
1.3
INPUT COMMON-MODE VOLTAGE (V)
The signal characteristics must be considered when selecting
a transformer. Most RF transformers saturate at frequencies that
are below a few megahertz (MHz). Excessive signal power can
also cause core saturation, which leads to distortion.
Figure 43. SNR/SFDR vs. Input Common-Mode Voltage,
fIN = 70 MHz, fS = 125 MSPS
Differential Input Configurations
At input frequencies in the second Nyquist zone and above, the
noise performance of most amplifiers is not adequate to achieve
the true SNR performance of theAD9608. For applications above
~10 MHz where SNR is a key parameter, differential double balun
coupling is the recommended input configuration (see Figure 46).
Optimum performance is achieved while driving the AD9608 in
a differential input configuration. For baseband applications,
the AD8138, ADA4937-2, and ADA4938-2 differential drivers
provide excellent performance and a flexible interface to the ADC.
An alternative to using a transformer-coupled input at frequencies
in the second Nyquist zone is to use the AD8352 differential driver
(see Figure 47). See the AD8352 data sheet for more information.
0.1µF
0.1µF
R
VIN+x
2V p-p
25Ω
PA
S
S
P
ADC
C
0.1µF
25Ω
0.1µF
R
VCM
VIN–x
09977-053
0.7
Figure 46. Differential Double Balun Input Configuration
VCC
0.1µF
ANALOG INPUT
0Ω
16
1
8, 13
11
0.1µF
2
CD
RD
RG
3
5
0.1µF 0Ω
R
VIN+x
200Ω
C
AD8352
10
4
ANALOG INPUT
0.1µF
0.1µF
ADC
200Ω
R
VIN–x
14
0.1µF
0.1µF
Figure 47. Differential Input Configuration Using the AD8352
Rev. C | Page 24 of 40
VCM
09977-054
0.6
09977-056
0
0.5
09977-051
SNR/SFDR (dBFS/dBc)
VIN–x
90Ω
An on-board, common-mode voltage reference is included in
the design and is available from the VCM pin. The VCM pin
must be decoupled to ground by a 0.1 µF capacitor, as described
in the Applications Information section.
90
33Ω
76.8Ω
Data Sheet
AD9608
In any configuration, the value of Shunt Capacitor C is dependent
on the input frequency and source impedance and may need to
be reduced or removed. Table 11 displays the suggested values to
set the RC network. However, these values are dependent on the
input signal and should be used only as a starting guide.
VIN+A/VIN+B
VIN–A/VIN–B
ADC
CORE
Table 11. Example RC Network
Frequency Range (MHz)
0 to 70
70 to 200
R Series
(Ω Each)
33
125
VREF
C Differential (pF)
22
Open
1.0µF
0.1µF
SELECT
LOGIC
SENSE
0.5V
09977-055
It is not recommended to drive the AD9608 inputs single-ended.
ADC
VOLTAGE REFERENCE
A stable and accurate 1.0 V voltage reference is built into the
AD9608. The VREF pin can be configured using either the internal
1.0 V reference or an externally applied 1.0 V reference voltage.
The various reference modes are summarized in the sections
that follow. The Reference Decoupling section describes the
best practices PCB layout of the reference.
Figure 48. Internal Reference Configuration
If the internal reference of the AD9608 is used to drive multiple
converters to improve gain matching, the loading of the reference
by the other converters must be considered. Figure 49 shows
how the internal reference voltage is affected by loading.
0
–0.5
–1.0
INTERNAL VREF = 1.00V
–1.5
–2.0
–2.5
–3.0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
LOAD CURRENT (mA)
Figure 49. VREF Accuracy vs. Load Current
Table 12. Reference Configuration Summary
Selected Mode
Fixed Internal Reference
Fixed External Reference
SENSE Voltage (V)
AGND to 0.2
AVDD
Resulting VREF (V)
1.0 internal
1.0 applied to external VREF pin
Rev. C | Page 25 of 40
Resulting Differential Span (V p-p)
2.0
2.0
09977-057
A comparator within the AD9608 detects the potential at the
SENSE pin and configures the reference into two possible modes,
which are summarized in Table 12. If SENSE is grounded, the
reference amplifier switch is connected to the internal resistor
divider (see Figure 48), setting VREF to 1.0 V.
REFERENCE VOLTAGE ERROR (%)
Internal Reference Connection
AD9608
Data Sheet
External Reference Operation
Clock Input Options
The use of an external reference may be necessary to enhance
the gain accuracy of the ADC or improve thermal drift characteristics. Figure 50 shows the typical drift characteristics of the
internal reference in 1.0 V mode.
The AD9608 has a very flexible clock input structure. The clock
input can be a CMOS, LVDS, LVPECL, or sine wave signal.
Regardless of the type of signal being used, clock source jitter is
of the most concern, as described in the Jitter Considerations
section.
4
Figure 52 and Figure 53 show two preferred methods for clocking the AD9608 (at clock rates up to 1 GHz prior to internal CLK
divider). A low jitter clock source is converted from a singleended signal to a differential signal using either an RF
transformer or an RF balun.
2
0
–1
–2
–3
–4
–6
–40
–20
0
40
20
TEMPERATURE (°C)
80
60
09977-066
–5
Figure 50. Typical VREF Drift
When the SENSE pin is tied to AVDD, the internal reference is
disabled, allowing the use of an external reference. An internal
reference buffer loads the external reference with an equivalent
7.5 kΩ load (see Figure 41). The internal buffer generates the
positive and negative full-scale references for the ADC core.
Therefore, the external reference must be limited to a maximum
of 1.0 V.
The RF balun configuration is recommended for clock frequencies
between 125 MHz and 1 GHz, and the RF transformer is recommended for clock frequencies from 10 MHz to 200 MHz. The
antiparallel Schottky diodes across the transformer/balun
secondary limit clock excursions into the AD9608 to approximately 0.8 V p-p differential.
This limit helps prevent the large voltage swings of the clock
from feeding through to other portions of the AD9608 while
preserving the fast rise and fall times of the signal that are critical
to a low jitter performance.
Mini-Circuits®
ADT1-1WT, 1:1 Z
0.1µF
CLOCK
INPUT
50Ω
XFMR
0.1µF
CLK+
100Ω
ADC
0.1µF
CLK–
CLOCK INPUT CONSIDERATIONS
SCHOTTKY
DIODES:
HSMS2822
0.1µF
For optimum performance, clock the AD9608 sample clock
inputs, CLK+ and CLK−, with a differential signal. The signal
is typically ac-coupled into the CLK+ and CLK− pins via a
transformer or capacitors. These pins are biased internally
(see Figure 51) and require no external bias.
Figure 52. Transformer-Coupled Differential Clock (Up to 200 MHz)
AVDD
1nF
CLOCK
INPUT
0.9V
0.1µF
CLK+
50Ω
ADC
0.1µF
CLK+
1nF
CLK–
SCHOTTKY
DIODES:
HSMS2822
2pF
Figure 53. Balun-Coupled Differential Clock (Up to 1 GHz)
09977-058
2pF
CLK–
Figure 51. Equivalent Clock Input Circuit
Rev. C | Page 26 of 40
09977-060
VREF ERROR (mV)
VREF ERROR (mV)
1
09977-059
3
Data Sheet
AD9608
Input Clock Divider
If a low jitter clock source is not available, another option is to
ac couple a differential PECL signal to the sample clock input
pins, as shown in Figure 54. The AD9510/AD9511/AD9512/
AD9513/AD9514/AD9515/AD9516-0/AD9516-1/AD9516-2/
AD9516-3/AD9516-4/AD9516-5/AD9517-0/AD9517-1/
AD9517-2/AD9517-3/AD9517-4 clock drivers offer excellent
jitter performance.
0.1µF
The AD9608 contains an input clock divider with the ability
to divide the input clock by integer values between 1 and 8.
The AD9608 clock divider can be synchronized using the
external SYNC input. Bit 1 and Bit 2 of Register 0x3A allow
the clock divider to be resynchronized on every SYNC signal
or only on the first SYNC signal after the register is written.
A valid SYNC causes the clock divider to reset to its initial state.
This synchronization feature allows multiple parts to have their
clock dividers aligned to guarantee simultaneous input sampling.
0.1µF
CLOCK
INPUT
CLK+
0.1µF
AD951x
PECL DRIVER
CLOCK
INPUT
100Ω
ADC
Clock Duty Cycle
0.1µF
50kΩ
240Ω
50kΩ
09977-061
CLK–
240Ω
Figure 54. Differential PECL Sample Clock (Up to 1 GHz)
A third option is to ac couple a differential LVDS signal to the
sample clock input pins, as shown in Figure 55. The AD9510/
AD9511/AD9512/AD9513/AD9514/AD9515/AD9516-0/
AD9516-1/AD9516-2/AD9516-3/AD9516-4/AD9516-5/
AD9517-0/AD9517-1/AD9517-2/AD9517-3/AD9517-4 clock
drivers offer excellent jitter performance.
0.1µF
The AD9608 contains a duty cycle stabilizer (DCS) that retimes
the nonsampling (falling) edge, providing an internal clock
signal with a nominal 50% duty cycle. This allows the user to
provide a wide range of clock input duty cycles without affecting
the performance of the AD9608. Noise and distortion performance are nearly flat for a wide range of duty cycles with the DCS
on, as shown in Figure 57.
0.1µF
CLOCK
INPUT
CLK+
0.1µF
AD951x
LVDS DRIVER
CLOCK
INPUT
100Ω
ADC
0.1µF
09977-062
CLK–
50kΩ
50kΩ
Typical high speed ADCs use both clock edges to generate
a variety of internal timing signals and, as a result, may be
sensitive to clock duty cycle. A ±5% tolerance is commonly
required on the clock duty cycle to maintain dynamic
performance characteristics.
Figure 55. Differential LVDS Sample Clock (Up to 1 GHz)
In some applications, it may be acceptable to drive the sample
clock inputs with a single-ended 1.8 V CMOS signal. In such
applications, drive the CLK+ pin directly from a CMOS gate, and
bypass the CLK− pin to ground with a 0.1 µF capacitor (see
Figure 56).
Jitter in the rising edge of the input is still of concern and is not
easily reduced by the internal stabilization circuit. The duty
cycle control loop does not function for clock rates less than
20 MHz, nominally. The loop has a time constant associated
with it that must be considered in applications in which the
clock rate can change dynamically. A wait time of 1.5 µs to 5 µs
is required after a dynamic clock frequency increase or decrease
before the DCS loop is relocked to the input signal.
70
65
DCS ON
VCC
AD951x
CMOS DRIVER
OPTIONAL
0.1µF
100Ω
1kΩ
CLK+
ADC
RESISTOR IS OPTIONAL.
09977-063
150Ω
DCS OFF
50
CLK–
0.1µF
55
Figure 56. Single-Ended 1.8 V CMOS Input Clock (Up to 200 MHz)
45
40
35
40
45
50
55
POSITIVE DUTY CYCLE (%)
Figure 57. SNR vs. DCS On/Off
Rev. C | Page 27 of 40
60
65
09977-036
50Ω1
1kΩ
SNR (dBFs)
0.1µF
CLOCK
INPUT
60
AD9608
Data Sheet
Jitter Considerations
The maximum DRVDD current (IDRVDD) can be calculated as
High speed, high resolution ADCs are sensitive to the quality
of the clock input. The degradation in SNR from the low frequency SNR (SNRLF) at a given input frequency (fINPUT) due to
jitter (tJRMS) can be calculated by
]
In the previous equation, the rms aperture jitter represents the
clock input jitter specification. IF undersampling applications
are particularly sensitive to jitter, as illustrated in Figure 58.
80
Reducing the capacitive load presented to the output drivers can
minimize digital power consumption. The data in Figure 59 was
taken in CMOS mode using the same operating conditions as those
used for the power supplies and power consumption parameters
in Table 1, with a 5 pF load on each output driver.
0.05ps
70
0.10
0.5ps
0.08
1.0ps
1.5ps
50
3.0ps
45
1
10
2.0ps
2.5ps
100
240
1k
FREQUENCY (MHz)
Figure 58. SNR vs. Input Frequency and Jitter
The clock input should be treated as an analog signal in cases
where aperture jitter may affect the dynamic range of the AD9608.
To avoid modulating the clock signal with digital noise, keep
power supplies for clock drivers separate from the ADC output
driver supplies. Low jitter, crystal-controlled oscillators make the
best clock sources. If the clock is generated from another type of
source (by gating, dividing, or another method), it should be
retimed by the original clock at the last step.
0.06
0.05
140
0.04
0.03
90
0.02
0.01
40
125
0
5
25
45
65
85
105
ENCODE RATE (Msps)
Figure 59. AD9608-125 Power and Current vs. Clock Rate
(1.8 V CMOS Output Mode)
For more information, see the AN-501 Application Note and the
AN-756 Application Note.
0.09
CHANNEL/CHIP SYNCHRONIZATION
0.07
IAVDD
IDRVDD
TOTAL POWER
0.08
SUPPLY CURRENT (mA)
The AD9608 has a SYNC input that offers the user flexible
synchronization options for synchronizing sample clocks
across multiple ADCs. The input clock divider can be enabled
to synchronize on a single occurrence of the SYNC signal or on
every occurrence. The SYNC input is internally synchronized
to the sample clock; however, to ensure that there is no timing
uncertainty between multiple parts, the SYNC input signal should
be externally synchronized to the input clock signal, meeting the
setup and hold times shown in Table 5. Drive the SYNC input
using a single-ended CMOS-type signal.
190
0.07
POWER (mW)
55
IAVDD
IDRVDD
TOTAL POWER
0.09
SUPPLY CURRENT (mA)
60
09977-065
SNR (dBFS)
0.2ps
65
09977-030
75
This maximum current occurs when every output bit switches
on every clock cycle, that is, a full-scale square wave at the Nyquist
frequency of fCLK/2. In practice, the DRVDD current is established by the average number of output bits switching, which
is determined by the sample rate and the characteristics of the
analog input signal.
240
190
0.06
0.05
140
0.04
POWER (mW)
( − SNRLF /10 )
where N is the number of output bits (22, in the case of the
AD9608).
0.03
90
0.02
0.01
POWER DISSIPATION AND STANDBY MODE
0
5
15
25
35
45
55
65
75
85
95
40
105
ENCODE RATE (Msps)
Figure 60. AD9608-105 Power and Current vs. Clock Rate
(1.8 V CMOS Output Mode)
As shown in Figure 59, the analog core power dissipated by
the AD9608 is proportional to its sample rate. The digital
power dissipation of the CMOS outputs are determined
primarily by the strength of the digital drivers and the load
on each output bit.
Rev. C | Page 28 of 40
09977-023
SNRHF = −10 log[(2π × fINPUT × tJRMS)2 + 10
IDRVDD = VDRVDD × CLOAD × fCLK × N
Data Sheet
AD9608
The AD9608 is placed in power-down mode either by the SPI
port or by asserting the PDWN pin high. In this state, the ADC
typically dissipates <2 mW. During power-down, the output
drivers are placed in a high impedance state. Asserting the
PDWN pin low returns the AD9608 to its normal operating
mode. Note that PDWN is referenced to the digital output driver
supply (DRVDD) and should not exceed that supply voltage.
Low power dissipation in power-down mode is achieved by
shutting down the reference, reference buffer, biasing networks,
and clock. Internal capacitors are discharged when entering powerdown mode and then must be recharged when returning to normal
operation. As a result, wake-up time is related to the time spent
in power-down mode, and shorter power-down cycles result in
proportionally shorter wake-up times.
When using the SPI port interface, the user can place the ADC
in power-down mode or standby mode. Standby mode allows
the user to keep the internal reference circuitry powered when
faster wake-up times are required. See the Memory Map section
for more details.
DIGITAL OUTPUTS
The AD9608 output drivers can be configured to interface with
either 1.8 V CMOS or 1.8 V LVDS logic families. The default
output mode is CMOS, with each channel output on separate
busses as shown in Figure 2.
In CMOS output mode, the CMOS output drivers are sized to
provide sufficient output current to drive a wide variety of logic
families. However, large drive currents tend to cause current
glitches on the supplies and may affect converter performance.
Applications requiring the ADC to drive large capacitive loads
or large fanouts may require external buffers or latches.
The CMOS output can also be configured for interleaved CMOS
output mode via the SPI port. In interleaved CMOS mode, the
data for both channels is output onto a single output bus to reduce
the total number of traces required. The timing diagram for
interleaved CMOS output mode is shown in Figure 3.
The interleaved CMOS output mode is enabled globally onto both
output channels via Bit 5 in Register 0x14. The unused channel
output can be disabled by selecting the appropriate bit (Bit 1 or
Bit 0) in Register 0x05 and then writing a 1 to the local (channelspecific) output port disable bit (Bit 4) in Register 0x14.
The output data format can be selected to be either offset binary
or twos complement by setting the SCLK/DFS pin when operating
in the external pin mode (see Table 13).
As detailed in the AN-877 Application Note, Interfacing to High
Speed ADCs via SPI, the data format can be selected for offset
binary, twos complement, or Gray code when using the SPI control.
Table 13. SCLK/DFS Mode Selection (External Pin Mode)
Voltage at Pin
AGND
DRVDD
SCLK/DFS
Offset binary (default)
Twos complement
SDIO/DCS
DCS disabled
DCS enabled (default)
Digital Output Enable Function (OEB)
The AD9608 has a flexible three-state ability for the digital output
pins. The three-state mode is enabled through the SPI interface
and can subsequently be controlled using the OEB pin or through
the SPI. Once enabled via the SPI (Bit 7) in Register 0x101 and
the OEB pin is low, the output data drivers and DCOs are enabled.
If the OEB pin is high, the output data drivers and DCOs are
placed in a high impedance state. This OEB function is not
intended for rapid access to the data bus. Note that OEB is
referenced to the digital output driver supply (DRVDD) and
should not exceed that supply voltage.
When using the SPI interface, the data outputs and DCO of
each channel can be independently three-stated by using the
output port disable bit (Bit 4) in Register 0x14.
TIMING
The AD9608 provides latched data with a pipeline delay of
16 clock cycles. Data outputs are available one propagation
delay (tPD) after the rising edge of the clock signal.
Minimize the length of the output data lines and loads placed
on them to reduce transients within the AD9608. These
transients can degrade converter dynamic performance.
The lowest typical conversion rate of the AD9608 is 10 MSPS.
At clock rates below 10 MSPS, dynamic performance can degrade.
Data Clock Output (DCO)
The AD9608 provides two data clock output (DCO) signals
intended for capturing the data in an external register. In CMOS
output mode, the data outputs are valid on the rising edge of DCO,
unless the DCO clock polarity has been changed via the SPI. In
LVDS output mode, the DCO and data output switching edges
are closely aligned. Additional delay can be added to the DCO
output using SPI Register 0x17 to increase the data setup time.
In this case, the Channel A output data is valid on the rising
edge of DCO, and the Channel B output data is valid on the
falling edge of DCO. See Figure 2, Figure 3, and Figure 4 for
a graphical timing description of the output modes.
Table 14. Output Data Format
Input (V)
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
Condition (V)
< −VREF − 0.5 LSB
= −VREF
=0
= +VREF − 1.0 LSB
> +VREF − 0.5 LSB
Offset Binary Output Mode
00 0000 0000
00 0000 0000
10 0000 0000
11 1111 1111
11 1111 1111
Rev. C | Page 29 of 40
Twos Complement Mode
10 0000 0000
10 0000 0000
00 0000 0000
01 1111 1111
01 1111 1111
OR
1
0
0
0
1
AD9608
Data Sheet
OUTPUT TEST
The AD9608 includes various output test options to place
predictable values on the outputs of theAD9608.
OUTPUT TEST MODES
The output test options are described in Table 18 at Address 0x0D.
When an output test mode is enabled, the analog section of the
ADC is disconnected from the digital back-end blocks and the
test pattern is run through the output formatting block. Some of
the test patterns are subject to output formatting, and some are
not. The PN generators from the PN sequence tests can be reset
by setting Bit 4 or Bit 5 of Register 0x0D. These tests can be
performed with or without an analog signal (if present, the
analog signal is ignored), but they do require an encode clock.
For more information, see the AN-877 Application Note,
Interfacing to High Speed ADCs via SPI.
Rev. C | Page 30 of 40
Data Sheet
AD9608
SERIAL PORT INTERFACE (SPI)
The AD9608 serial port interface (SPI) allows the user to configure
the converter for specific functions or operations through a
structured register space provided inside the ADC. The SPI
gives the user added flexibility and customization, depending on
the application. Addresses are accessed via the serial port and
can be written to or read from via the port. Memory is organized
into bytes that can be further divided into fields, which are documented in the Memory Map section. For detailed operational
information, see the AN-877 Application Note, Interfacing to
High Speed ADCs via SPI.
The falling edge of the CSB, in conjunction with the rising edge
of the SCLK, determines the start of the framing. An example of
the serial timing and its definitions can be found in Figure 61
and Table 5.
Other modes involving the CSB are available. The CSB can be
held low indefinitely, which permanently enables the device;
this is called streaming. The CSB can stall high between bytes to
allow for additional external timing. When CSB is tied high, SPI
functions are placed in high impedance mode. This mode turns
on any SPI pin secondary functions.
CONFIGURATION USING THE SPI
During an instruction phase, a 16-bit instruction is transmitted.
Data follows the instruction phase, and its length is determined
by the W0 and W1 bits.
Three pins define the SPI of this ADC: the SCLK/DFS pin, the
SDIO/DCS pin, and the CSB pin (see Table 15). The SCLK/DFS
(a serial clock) is used to synchronize the read and write data
presented from and to the ADC. The SDIO/DCS (serial data
input/output) is a dual-purpose pin that allows data to be sent
to and read from the internal ADC memory map registers. The
CSB (chip select bar) is an active low control that enables or
disables the read and write cycles.
In addition to word length, the instruction phase determines
whether the serial frame is a read or write operation, allowing
the serial port to be used both to program the chip and to read
the contents of the on-chip memory. The first bit of the first byte
in a multibyte serial data transfer frame indicates whether a read
command or a write command is issued. If the instruction is a
readback operation, performing a readback causes the serial
data input/output (SDIO) pin to change direction from an input
to an output at the appropriate point in the serial frame.
Table 15. Serial Port Interface Pins
Pin
SCLK
SDIO
CSB
Function
Serial clock. The serial shift clock input, which is used to
synchronize serial interface reads and writes.
Serial data input/output. A dual-purpose pin that typically
serves as an input or an output, depending on the
instruction being sent and the relative position in the
timing frame.
Chip select bar. An active low control that gates the read
and write cycles.
tHIGH
tDS
tS
tDH
All data is composed of 8-bit words. Data can be sent in MSBfirst mode or in LSB-first mode. MSB first is the default on
power-up and can be changed via the SPI port configuration
register. For more information about this and other features,
see the AN-877 Application Note, Interfacing to High Speed
ADCs via SPI.
tCLK
tH
tLOW
CSB
SDIO DON’T CARE
DON’T CARE
R/W
W1
W0
A12
A11
A10
A9
A8
A7
D5
Figure 61. Serial Port Interface Timing Diagram
Rev. C | Page 31 of 40
D4
D3
D2
D1
D0
DON’T CARE
09977-046
SCLK DON’T CARE
AD9608
Data Sheet
HARDWARE INTERFACE
The pins described in Table 15 comprise the physical interface
between the user programming device and the serial port of the
AD9608. The SCLK pin and the CSB pin function as inputs
when using the SPI interface. The SDIO pin is bidirectional,
functioning as an input during write phases and as an output
during readback.
The SPI interface is flexible enough to be controlled by either
FPGAs or microcontrollers. One method for SPI configuration
is described in detail in the AN-812 Application Note, Microcontroller-Based Serial Port Interface (SPI) Boot Circuit.
The SPI port should not be active during periods when the full
dynamic performance of the converter is required. Because the
SCLK signal, the CSB signal, and the SDIO signal are typically
asynchronous to the ADC clock, noise from these signals can
degrade converter performance. If the on-board SPI bus is used for
other devices, it may be necessary to provide buffers between
this bus and the AD9608 to prevent these signals from transitioning at the converter inputs during critical sampling periods.
When the device is in SPI mode, the PDWN and OEB pins (if
enabled) remain active. For SPI control of output enable and
power-down, the OEB and PDWN pins should be set to their
default states.
Table 16. Mode Selection
Pin
SDIO/DCS
SCLK/DFS
OEB
PDWN
External Voltage
DRVDD (default)
AGND
DRVDD
AGND (default)
DRVDD
AGND (default)
DRVDD
AGND (default)
Configuration
Duty cycle stabilizer enabled
Duty cycle stabilizer disabled
Twos complement enabled
Offset binary enabled
Outputs in high impedance
Outputs enabled
Chip in power-down or
standby
Normal operation
SPI ACCESSIBLE FEATURES
Some pins serve a dual function when the SPI interface is not
being used. When the pins are strapped to DRVDD or ground
during device power-on, they are associated with a specific
function. Table 16 describes the strappable functions supported
on the AD9608.
Table 17 provides a brief description of the general features that
are accessible via the SPI. These features are described in detail
in the AN-877 Application Note, Interfacing to High Speed ADCs
via SPI. The AD9608 part-specific features are described in detail
following Table 18, the external memory map register table (see the
Memory Map Register Descriptions section).
CONFIGURATION WITHOUT THE SPI
Table 17. Features Accessible Using the SPI
In applications that do not interface to the SPI control registers,
the SDIO/DCS pin, the SCLK/DFS pin, the OEB pin, and the
PDWN pin serve as standalone CMOS-compatible control pins.
When the device is powered up, it is assumed that the user intends
to use the pins as static control lines for the duty cycle stabilizer,
output data format, and power-down feature control. In this
mode, the CSB chip select bar should be connected to AVDD,
which disables the serial port interface.
Feature
Name
Mode
Clock
Offset
Test I/O
Output Mode
Output Phase
Output Delay
Rev. C | Page 32 of 40
Description
Allows user to set either power-down mode or
standby mode
Allows user to access the DCS, set the clock
divider, set the clock divider phase, and enable
the sync
Allows user to digitally adjust the converter offset
Allows user to set test modes to have known
data on output bits
Allows user to set the output mode, including LVDS
Allows user to set the output clock polarity
Allows user to vary the DCO delay
Data Sheet
AD9608
MEMORY MAP
READING THE MEMORY MAP REGISTER TABLE
Default Values
Each row in the memory map register table has eight bit locations.
The memory map is roughly divided into three sections: the chip
configuration registers (Address 0x00 to Address 0x02); the
channel index and transfer registers (Address 0x05 and
Address 0xFF) and the ADC functions registers, including setup,
control, and test (Address 0x08 to Address 0x102).
After the AD9608 is reset, critical registers are loaded with
default values. The default values for the registers are given in
the memory map register table, Table 18.
The memory map register table (see Table 18) lists the default
hexadecimal value for each hexadecimal address shown. The
column with the heading Bit 7 (MSB) is the start of the default
hexadecimal value given. For example, Address 0x05, the device
index register, has a hexadecimal default value of 0x03. This
means that in Address 0x05, Bits[7:2] = 0, and Bits[1:0] = 1.
This setting is the default channel index setting. The default
value results in both ADC channels receiving the next write
command. For more information about this function and others,
see the AN-877 Application Note, Interfacing to High Speed ADCs
via SPI. This application note details the functions controlled by
Register 0x00 to Register 0xFF. The remaining registers are
documented in the Memory Map Register Descriptions section.
Open Locations
All address and bit locations that are not included in Table 18
are not currently supported for this device. Unused bits of a
valid address location should be written with 0s. Writing to these
locations is required only when part of an address location is
open (for example, Address 0x05). If the entire address location
is open (for example, Address 0x13), this address location should
not be written to.
Logic Levels
An explanation of logic level terminology follows:
•
•
“Bit is set” is synonymous with “bit is set to Logic 1” or
“writing Logic 1 for the bit.”
“Clear a bit” is synonymous with “bit is set to Logic 0” or
“writing Logic 0 for the bit.”
Channel-Specific Registers
Some channel setup functions can be programmed for each
channel individually. In these cases, channel address locations
are internally duplicated for each channel. These registers and
bits are designated in Table 18 as local. These local registers and
bits can be accessed by setting the appropriate Channel A or
Channel B bits in Register 0x05. If both bits are set, the
subsequent write affects the registers of both channels. In a read
cycle, only Channel A or Channel B should be set to read one of
the two registers. If both bits are set during an SPI read cycle,
the part returns the value for Channel A. Registers and bits
designated as global in Table 18 affect the entire part or the
channel features for which independent settings are not allowed
between channels.
Rev. C | Page 33 of 40
AD9608
Data Sheet
MEMORY MAP REGISTER TABLE
All address and bit locations that are not included in Table 18 are not currently supported for this device.
Table 18. Memory Map Registers
Addr
Register
Bit 7
(Hex)
Name
(MSB)
Chip Configuration Registers
0x00
Open
SPI port
config
(global)
0x01
Chip ID
(global)
0x02
Chip
grade
(global)
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0 (LSB)
Default
Value
(Hex)
LSB first
Soft reset
1
1
Soft reset
LSB first
Open
0x18
8-bit chip ID, Bits[7:0]
AD9608 = 0x9C
Open
Speed grade ID
100 = 105 MSPS
101 = 125 MSPS
Read
only
Open
Open
Open
Open
Read
only
Channel Index and Transfer Registers
0x05
Open
Open
Device
index
(global)
Open
Open
Open
Open
Channel B
Channel A
0x03
0xFF
Transfer
0x00
Open
Open
Open
Open
Open
Open
Open
ADC Functions
0x08
Power
modes
(local)
Open
Open
Open
Open
Open
Internal power-down mode
00 = normal operation
01 = full power-down
10 = standby
11 = digital reset
0x00
0x09
Open
Open
External
powerdown pin
function
0 = PDWN
1 = standby
Open
Open
Open
Open
Open
0x01
Transfer
(global)
Global
clock
(global)
Rev. C | Page 34 of 40
Duty cycle
stabilizer
0 = disabled
1 = enabled
Comments
Nibbles are
mirrored so
LSB-first
mode or
MSB-first
mode
registers
correctly,
regardless
of shift
mode
Unique
chip ID
used to
differentiate
devices;
read only
Unique
speed
grade ID
used to
differentiate
devices;
read only
Bits are
set to
determine
which
device on
the chip
receives the
next write
command;
applies to
local
registers
only
Synchronous
transfer of
data from
the master
shift
register to
the slave
Determines
various
generic
modes of
chip
operation
Data Sheet
AD9608
Addr
(Hex)
0x0B
Register
Name
Clock
divide
(global)
Bit 7
(MSB)
Open
Bit 6
Open
Bit 5
Open
Bit 4
Open
Bit 3
Open
0x0C
Enhancement
control
(global)
Test
mode
(local)
Open
Open
Open
Open
Open
0x0D
0x10
0x14
Customer
offset
adjust
(local)
Output
mode
User test mode control
00 = single pattern
mode
01 = alternate
continuous/repeat
pattern mode
10 = single once
pattern mode
11 = alternate once
pattern mode
Output port logic
type (global)
00 = CMOS, 1.8 V
10 = LVDS, ANSI
11 = LVDS, reduced
range
Open
Open
Reset PN
long gen
Bit 2
Bit 1
Clock divide ratio
000 = divide by 1
001 = divide by 2
010 = divide by 3
011 = divide by 4
100 = divide by 5
101 = divide by 6
110 = divide by 7
111 = divide by 8
Chop mode Open
0 = disabled
1 = enabled
Open
0x00
Chop mode
enabled if
Bit 2 = 1
0x00
When this
register is
set, the test
data is
placed on
the output
pins in
place of
normal data
Output test mode
0000 = off (default)
0001 = midscale short
0010 = positive FS
0011 = negative FS
0100 = alternating checkerboard
0101 = PN long sequence
0110 = PN short sequence
0111 = one/zero word toggle
1000 = user test mode
1111 = ramp output
Offset adjust in LSBs from +127 to −128
(twos complement format)
Reset PN
short gen
Open
(global)
Output
invert
(local)
CMOS 1.8 V DCO drive
strength
00 = 1×
01 = 2×
10 = 3×
11 = 4×
Open
Open
Open
Open
Output
interleave
enable
(global)
Bit 0 (LSB)
Default
Value
(Hex)
0x00
Output
port disable
(local)
0x15
Output
adjust
0x16
Clock
phase
control
(global)
Invert
DCO
clock
0 = not
inverted
1=
inverted
Open
0x17
Output
delay
(global)
DCO
clock
delay
0=
disabled
1=
enabled
Open
Data delay
0 = disabled
1 = enabled
Open
Open
0x18
VREF
select
(global)
Open
Open
Open
Open
Open
Open
Rev. C | Page 35 of 40
Output format
00 = offset binary
01 = twos complement
10 = Gray code
Comments
The divide
ratio is
value plus 1
0x00
0x00
Configures
the outputs
and the
format of
the data
CMOS 1.8 V data
drive strength
00 = 1×
01 = 2×
10 = 3×
11 = 4×
Input clock divider phase adjust
relative to the encode clock
000 = no delay
001 = 1 input clock cycle
010 = 2 input clock cycles
011 = 3 input clock cycles
100 = 4 input clock cycles
101 = 5 input clock cycles
110 = 6 input clock cycles
111 = 7 input clock cycles
Delay selection
000 = 0.56 ns
001 = 1.12 ns
010 = 1.68 ns
011 = 2.24 ns
100 = 2.80 ns
101 = 3.36 ns
110 = 3.92 ns
111 = 4.48 ns
0x00
Determines
CMOS
output
drive
strength
properties
0x00
Allows
selection of
clock delays
into the
input clock
divider
0x00
Internal VREF digital adjustment
000 = 1.0 V p-p
001 = 1.14 V p-p
010 = 1.33 V p-p
011 = 1.6 V p-p
100 = 2.0 V p-p
0x04
This sets
the fine
output
delay of the
output
clock but
does not
change
internal
timing
Select
and/or
adjust VREF
AD9608
Data Sheet
Register
Name
User
Pattern 1,
LSB
(global)
User
Pattern 1,
MSB
(global)
User
Pattern 2,
LSB
(global)
User
Pattern 2,
MSB
Bit 7
(MSB)
B7
Bit 6
B6
Bit 5
B5
Bit 4
B4
Bit 3
B3
Bit 2
B2
Bit 1
B1
Bit 0 (LSB)
B0
Default
Value
(Hex)
0x00
B15
B14
B13
B12
B11
B10
B9
B8
0x00
B7
B6
B5
B4
B3
B2
B1
B0
0x00
B15
B14
B13
B12
B11
B10
B9
B8
0x00
0x2A
Overrange
control
(global)
Open
Open
Open
Open
Open
Open
Open
0x01
0x2E
Output
assign
(local)
Open
Open
Open
Open
Open
Open
Open
Overrange
output
0 = disabled
1 = enabled
0 = ADC A
1 = ADC B
(local)
0x3A
Sync
control
(global)
Open
Open
Open
Open
Open
Clock
divider
next sync
only
0x100
Sample
rate
override
Open
Sample
rate
override
enable
Open
Open
Open
0x101
User I/O
Control
Register 2
Open
Open
Open
Open
0x102
User I/O
Control
Register 3
Output
enable
bar
(OEB)
pin
enable
Open
Open
Open
Open
VCM
power-down
Addr
(Hex)
0x19
0x1A
0x1B
0x1C
Rev. C | Page 36 of 40
Open
Open
Clock
divider
sync
enable
Sample rate
011 = 80 MSPS
100 = 105 MSPS
101 = 125 MSPS
Open
Disable SDIO
pull-down
Open
0x00 =
ADC A
0x01 =
ADC B
0x00
Comments
UserDefined
Pattern 1,
LSB
UserDefined
Pattern 1,
MSB
UserDefined
Pattern 2,
LSB
UserDefined
Pattern 2,
MSBs
Overrange
control
settings
Assign an
ADC to an
output
channel
Sets the
global sync
options
0x00
0x80
0x00
OEB and
SDIO pin
controls
Data Sheet
AD9608
MEMORY MAP REGISTER DESCRIPTIONS
For additional information about functions controlled in
Register 0x00 to Register 0xFF, see the AN-877 Application Note,
Interfacing to High Speed ADCs via SPI.
Power Modes (Register 0x08)
Bits[7:6]—Open
Bit 5—External Power-Down Pin Function
If set, the external PDWN pin initiates power-down mode.
If clear, the external PDWN pin initiates standby mode.
Bits[4:2]—Open
Bits[1:0]—Internal Power-Down Mode
In normal operation (Bits[1:0] = 00), both ADC channels are
active.
interleaving feature. Channel A is sent on least significant bits
(LSBs), and Channel B is sent on most significant bits (MSBs).
The even bits are sent coincident with a high DCO clock, and
the odd bits are sent coincident with a low DCO clock.
For CMOS outputs, setting Bit 5 enables interleaving in CMOS
DDR mode. On ADC Output Port A, Channel A is sent coincident
with a low DCO clock, and Channel B is coincident with a high
DCO clock. On ADC Output Port B, Channel B is sent coincident
with a low DCO clock, and Channel A is coincident with a high
DCO clock. Clearing Bit 5 disables the interleaving feature, and
data is output in CMOS SDR mode. Channel A is sent to Port A,
and Channel B is sent to Port B.
Bit 4—Output Port Disable
Setting Bit 4 high disables the output port for the channels
selected in Bits[1:0] of the device index register (Register 0x05).
In power-down mode (Bits[1:0] = 01), the digital data path clocks
are disabled while the digital data path is reset. Outputs are
disabled.
Bit 2—Output Invert
In standby mode (Bits[1:0] = 10), the digital data path clocks
and the outputs are disabled.
Setting Bit 2 high inverts the output port data for the channels
selected in Bits[1:0] of the device index register (Register 0x05).
During a digital reset (Bits[1:0] = 11), the digital data path clocks
are disabled while the digital data path is held in reset. The outputs
are enabled in this state. For optimum performance, it is recommended that both ADC channels be reset simultaneously. This
is accomplished by ensuring that both channels are selected via
Register 0x05 prior to issuing the digital reset instruction.
Bits[1:0]—Output Format
Enhancement Control (Register 0x0C)
Bits[7:3]—Open
Bit 3—Open
00 = offset binary
01 = twos complement
10 = Gray code
Sync Control (Register 0x3A)
Bits[7:3]—Open
Bit 2—Clock Divider Next Sync Only
Bit 2—Chop Mode
For applications that are sensitive to offset voltages and other
low frequency noise, such as homodyne or direct-conversion
receivers, chopping in the first stage of the AD9628 is a feature
that can be enabled by setting Bit 2. In the frequency domain,
chopping translates offsets and other low frequency noise to
fCLK/2 where it can be filtered.
If the clock divider sync enable bit (Address 0x3A, Bit 1) is high,
Bit 2 allows the clock divider to sync to the first sync pulse it
receives and to ignore the rest. The clock divider sync enable bit
resets after it syncs.
Bit 1—Clock Divider Sync Enable
Bit 1 gates the sync pulse to the clock divider. The sync signal is
enabled when Bit 1 is high. This is continuous sync mode.
Bits[1:0]—Open
Bit 0—Open
Output Mode (Register 0x14)
Bits[7:6]—Output Port Logic Type
Transfer (Register 0xFF)
All registers except Register 0x100 are updated the moment they
are written. Setting Bit 0 of this transfer register high initializes the
settings in the ADC sample rate override register (Address 0x100).
00 = CMOS, 1.8 V
10 = LVDS, ANSI
11 = LVDS, reduced range
Sample Rate Override (Register 0x100)
Bit 5—Output Interleave Enable
For LVDS outputs, setting Bit 5 enables interleaving. Channel A
is sent coincident with a high DCO clock, and Channel B is
coincident with a low DCO clock. Clearing Bit 5 disables the
This register is designed to allow the user to downgrade the device.
Any attempt to upgrade the default speed grade results in a chip
power-down. Settings in this register are not initialized until Bit 0
of the transfer register (Register 0xFF) is written high.
Rev. C | Page 37 of 40
AD9608
Data Sheet
User I/O Control 2 (Register 0x101)
Bit 7—OEB Pin Enable
User I/O Control 3 (Register 0x102)
Bits[7:4]—Open
If the OEB pin enable bit (Bit 7) is set (default), the OEB pin is
enabled. If Bit 7 is clear, the OEB pin is disabled.
Bit 3—VCM Power-Down
Bits[6:1]—Open
Bit 0—SDIO Pull-Down
Bit 0 can be set to disable the internal 30 kΩ pull-down on the
SDIO pin, which can be used to limit the loading when many
devices are connected to the SPI bus.
Bit 3 can be set high to power down the internal VCM
generator. This feature is used when applying an external
reference.
Bits[2:0]—Open
Rev. C | Page 38 of 40
Data Sheet
AD9608
APPLICATIONS INFORMATION
DESIGN GUIDELINES
Before starting design and layout of the AD9608 as a system,
it is recommended that the designer become familiar with these
guidelines, which discuss the special circuit connections and
layout requirements that are needed for certain pins.
Power and Ground Recommendations
When connecting power to the AD9608, it is recommended that
two separate 1.8 V supplies be used. Use one supply for analog
(AVDD); use a separate supply for the digital outputs (DRVDD).
For both AVDD and DRVDD, several different decoupling capacitors should be used to cover both high and low frequencies.
Place these capacitors close to the point of entry at the PCB level
and close to the pins of the part, with minimal trace length.
A single PCB ground plane should be sufficient when using the
AD9608. With proper decoupling and smart partitioning of the
PCB analog, digital, and clock sections, optimum performance
is easily achieved.
LVDS Operation
The AD9608 defaults to CMOS output mode on power-up.
If LVDS operation is desired, this mode must be programmed,
using the SPI configuration registers after power-up. When the
AD9608 powers up in CMOS mode with LVDS termination
resistors (100 Ω) on the outputs, the DRVDD current can be
higher than the typical value until the part is placed in LVDS
mode. This additional DRVDD current does not cause damage
to the AD9608, but it should be taken into account when considering the maximum DRVDD current for the part.
To avoid this additional DRVDD current, the AD9608 outputs
can be disabled at power-up by taking the PDWN pin high.
After the part is placed into LVDS mode via the SPI port, the
PDWN pin can be taken low to enable the outputs.
Clock Stability Considerations
When powered on, the AD9608 enters an initialization phase
during which an internal state machine sets up the biases and
the registers for proper operation. During the initialization
process, the AD9608 needs a stable clock. If the ADC clock
source is not present or not stable during ADC power-up, it
disrupts the state machine and causes the ADC to start up in an
unknown state. To correct this, an initialization sequence must
be reinvoked after the ADC clock is stable by issuing a digital
reset via Register 0x08. In the default configuration (internal
VREF, ac-coupled input) where VREF and VCM are supplied by the
ADC itself, a stable clock during power-up is sufficient. In the
case where VREF and/or VCM are supplied by an external source,
these, too, must be stable at power-up; otherwise, a subsequent
digital reset via Register 0x08 is needed. Interruption of the
sample clock during operation and changes in sample rate also
necessitate a digital reset.
The pseudo code sequence for a digital reset is as follows:
SPI_Write (0x08, 0x03);
# Digital Reset
SPI_Write (0x08, 0x00);
# Can be asserted
as soon as the next SPI cycle, normal
operation resumes after 2.9e6 sample clock
cycles, ADC outputs 0s until the reset is
complete.
Exposed Paddle Thermal Heat Slug Recommendations
It is mandatory that the exposed paddle on the underside of the
ADC be connected to analog ground (AGND) to achieve the
best electrical and thermal performance. A continuous, exposed
(no solder mask) copper plane on the PCB should mate to the
AD9608 exposed paddle, Pin 0.
The copper plane should have several vias to achieve the lowest
possible resistive thermal path for heat dissipation to flow
through the bottom of the PCB. These vias should be filled or
plugged to prevent solder wicking through the vias, which can
compromise the connection.
To maximize the coverage and adhesion between the ADC and
the PCB, a silkscreen should be overlaid to partition the continuous
plane on the PCB into several uniform sections. This provides
several tie points between the ADC and the PCB during the reflow
process. Using one continuous plane with no partitions guarantees
only one tie point between the ADC and the PCB. For detailed
information about packaging and PCB layout of chip scale
packages, see the AN-772 Application Note, A Design and
Manufacturing Guide for the Lead Frame Chip Scale Package
(LFCSP).
VCM
The VCM pin should be decoupled to ground with a 0.1 μF
capacitor.
Reference Decoupling
The VREF pin should be externally decoupled to ground with
a low ESR, 1.0 μF capacitor in parallel with a low ESR, 0.1 μF
ceramic capacitor.
SPI Port
The SPI port should not be active during periods when the full
dynamic performance of the converter is required. Because the
SCLK, CSB, and SDIO signals are typically asynchronous to the
ADC clock, noise from these signals can degrade converter
performance. If the on-board SPI bus is used for other devices,
it may be necessary to provide buffers between this bus and the
AD9608 to keep these signals from transitioning at the converter
inputs during critical sampling periods.
Rev. C | Page 39 of 40
AD9608
Data Sheet
OUTLINE DIMENSIONS
9.10
9.00 SQ
8.90
0.60
0.42
0.24
0.60
0.42
0.24
0.30
0.23
0.18
64 1
49
48
PIN 1
INDICATOR
PIN 1
INDICATOR
8.85
8.75 SQ
8.65
0.50
BSC
0.50
0.40
0.30
33
32
PKG-1184
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
01-22-2015-D
0.05 MAX
0.02 NOM
SEATING
PLANE
0.25 MIN
7.50 REF
0.80 MAX
0.65 NOM
12° MAX
16
17
BOTTOM VIEW
TOP VIEW
1.00
0.85
0.80
6.35
6.20 SQ
6.05
EXPOSED
PAD
Figure 62. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
AD9608BCPZ-105
AD9608BCPZ-125
AD9608BCPZRL7-105
AD9608BCPZRL7-125
AD9608-125EBZ
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
Z = RoHS Compliant Part.
©2011–2015 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D09977-0-11/15(C)
Rev. C | Page 40 of 40
Package Option
CP-64-4
CP-64-4
CP-64-4
CP-64-4