LM329 www.ti.com SNVS748F – MAY 2000 – REVISED APRIL 2013 LM329 Precision Reference Check for Samples: LM329 FEATURES DESCRIPTION • • • The LM329 is a precision multi-current temperaturecompensated 6.9V zener reference with dynamic impedance a factor of 10 to 100 less than discrete diodes. Constructed in a single silicon chip, the LM329 uses active circuitry to buffer the internal zener allowing the device to operate over a 0.5 mA to 15 mA range with virtually no change in performance. The LM329 is available with a temperature coefficients of 0.01%/°C. This reference also has excellent long term stability and low noise. 1 2 • • • • • 0.6 mA to 15 mA Operating Current 0.8Ω Dynamic Impedance at Any Current Available With Temperature Coefficient of 0.01%/°C 7μV Wideband Noise 5% Initial Tolerance 0.002% Long Term Stability Low Cost Subsurface Zener A new subsurface breakdown zener used in the LM329 gives lower noise and better long-term stability than conventional IC zeners. Further the zener and temperature compensating transistor are made by a planar process so they are immune to problems that plague ordinary zeners. For example, there is virtually no voltage shift in zener voltage due to temperature cycling and the device is insensitive to stress on the leads. The LM329 can be used in place of conventional zeners with improved performance. The low dynamic impedance simplifies biasing and the wide operating current allows the replacement of many zener types. The LM329 for operation over 0°C to 70°C is available in a TO-92 epoxy package. Connection Diagram Typical Application 9V TO 40V RS LM329 6.9V Figure 1. Bottom View Plastic Package (TO-92) See Package LP Figure 2. Simple Reference 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated LM329 SNVS748F – MAY 2000 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) Reverse Breakdown Current 30 mA Forward Current 2 mA Operating Temperature Range LM329 0°C to +70°C −55°C to +150°C Storage Temperature Range Soldering Information (1) TO-92 package: 10 sec. 260°C “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics (1) Parameter Conditions Min Typ Max 6.6 Units Reverse Breakdown Voltage TA = 25°C, 0.6 mA ≤ IR ≤ 15 mA 6.9 7.25 V Reverse Breakdown Change TA = 25°C, with Current (2) 0.6 mA ≤ IR ≤ 15 mA 9 20 mV Reverse Dynamic Impedance (2) TA = 25°C, IR = 1 mA 0.8 2 Ω RMS Noise TA = 25°C, 10 Hz ≤ F ≤ 10 kHz 7 100 μV Long Term Stability (1000 hours) TA = 45°C ± 0.1°C, IR = 1 mA ± 0.3% 20 Temperature Coefficient IR = 1 mA 50 Change In Reverse Breakdown Temperature Coefficient 1 mA ≤ IR ≤ 15 mA 1 ppm/°C Reverse Breakdown Change with Current 1 mA ≤ IR ≤ 15 mA 12 mV Reverse Dynamic Impedance 1 mA ≤ IR ≤ 15 mA 1 Ω (1) (2) ppm 100 ppm/°C These specifications apply for 0°C ≤ TA ≤ +70°C for the LM329 unless otherwise specified. The maximum junction temperature for a LM329 is 100°C. For operating at elevated temperature. The TO-92 package, the derating is based on 180°C/W junction to ambient with 0.4″ leads from a PC board and 160°C/W junction to ambient with 0.125″ lead length to a PC board. These changes are tested on a pulsed basis with a low duty-cycle. For changes versus temperature, compute in terms of tempco. Typical Applications Figure 3. Low Cost 0–25V Regulator 2 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM329 LM329 www.ti.com SNVS748F – MAY 2000 – REVISED APRIL 2013 Figure 4. Adjustable Bipolar Output Reference +15V 50k +15V 7.5k 50k 2 7 - 3 50k LM329 6.9V 10 TURN OUTPUT ADJUST OUTPUT -6.9 d VOUT 6 LM308A 1 + d 6.9 8 4 30 pF -15V Figure 5. 0V to 20V Power Reference 25V TO 40V 6k 2 7 - 6 LM308A 5k LM329 6.9V 2k 3 + 20k LM395 10k 8 4 38k 0V TO 20V 1A 1 PF MYLAR 20k 100 pF 1k -5V Figure 6. External Reference for Temperature Transducer 15V 1k 3 2 OUTPUT 10 mV/oK OUTPUT LM329 6.9V LM3911H 1 INPUT 4 1N457 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM329 3 LM329 SNVS748F – MAY 2000 – REVISED APRIL 2013 www.ti.com Figure 7. Positive Current Source 10V TO 40V 350 0.1% 20k 0.1% 2 7 - 6 LM308A 3 LM329 6.9V + 8 2N2219 4 10k 20k 0.1% 100 pF OUTPUT 10 mA 4.3k Figure 8. Buffered Reference with Single Supply +15V 9k 7.5k 2 7 - 6 LM308A 3 LM329 6.9V + 4 20k 1% 10V 8 100 pF Schematic Diagram 4 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM329 LM329 www.ti.com SNVS748F – MAY 2000 – REVISED APRIL 2013 Typical Performance Characteristics Reverse Characteristics Reverse Voltage Change Figure 9. Figure 10. Forward Characteristics Response Time Figure 11. Figure 12. Dynamic Impedance Figure 13. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM329 5 LM329 SNVS748F – MAY 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) 6 Zener Noise Voltage Low Frequency Noise Voltage Figure 14. Figure 15. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM329 LM329 www.ti.com SNVS748F – MAY 2000 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision E (April 2013) to Revision F • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 6 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM329 7 PACKAGE OPTION ADDENDUM www.ti.com 6-Jul-2014 PACKAGING INFORMATION Orderable Device Status (1) LM329DZ/NOPB ACTIVE Package Type Package Pins Package Drawing Qty TO-92 LP 3 1800 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type Op Temp (°C) Device Marking (4/5) 0 to 70 LM329 DZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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