ON NUP1105LT3 Single line can/lin bus protector Datasheet

NUP1105L
Advance Information
Single Line CAN/LIN
Bus Protector
The NUP1105L has been designed to protect LIN and single line
CAN transceivers from ESD and other harmful transient voltage
events. This device provides bidirectional protection for the data line
with a single SOT−23 package, giving the system designer a low cost
option for improving system reliability and meeting stringent EMI
requirements.
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SOT−23 BIDIRECTIONAL
VOLTAGE SUPPRESSOR
350 W PEAK POWER
Features
•
•
•
•
•
•
•
•
SOT−23 Package Allows One Separate Bidirectional Configuration
350 W Peak Power Dissipation per Line (8 x 20 sec Waveform)
Low Reverse Leakage Current (< 100 nA)
IEC Compatibility: − IEC 61000−4−2 (ESD): Level 4
− IEC 61000−4−4 (EFT): 40 A – 5/50 ns
− IEC 61000−4−5 (Lighting) 8.0 A (8/20 s)
ISO 7637−1, Nonrepetitive EMI Surge Pulse TBD
ISO 7637−3, Repetitive Electrical Fast Transient (EFT) TBD
EMI Surge Pulses
Flammability Rating UL 94 V−0
Pb−Free Packages are Available
1
3
2
PIN 1. ANODE
2. ANODE
3. CATHODE
MARKING
DIAGRAM
27DM
Applications
1
• Automotive Electronics
SOT−23
CASE 318
STYLE 27
♦
•
LIN Bus
♦ Single Line CAN
Industrial Control Networks
♦ Smart Distribution Systems (SDS)
♦ DeviceNet
27D
M
= Device Code
= Date Code
ORDERING INFORMATION
Device
NUP1105LT1
NUP1105LT1G
NUP1105LT3
NUP1105LT3G
Package
Shipping†
SOT−23
3000/Tape & Reel
SOT−23
(Pb−Free)
3000/Tape & Reel
SOT−23
10000/Tape & Reel
SOT−23
(Pb−Free)
10000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
 Semiconductor Components Industries, LLC, 2004
September, 2004 − Rev. P0
1
Publication Order Number:
NUP1105L/D
NUP1105L
MAXIMUM RATINGS (TJ = 25°C, unless otherwise specified)
Symbol
PPK
Rating
Value
Peak Power Dissipation
8 x 20s Double Exponential Waveform (Note 1)
Unit
W
350
TJ
Operating Junction Temperature Range
−40 to 125
°C
TJ
Storage Temperature Range
−55 to 150
°C
TL
Lead Solder Temperature (10 s)
260
°C
Human Body model (HBM)
Machine Model (MM)
IEC 61000−4−2 Specification (Contact)
16
400
30
kV
V
kV
ESD
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. Nonrepetitive current pulse per Figure 1.
ELECTRICAL CHARACTERISTICS (TJ = 25°C, unless otherwise specified)
Symbol
VRWM
Parameter
Test Conditions
Reverse Working Voltage
(Note 2)
Breakdown Voltage
IT = 1 mA (Note 3)
IR
Reverse Leakage Current
VRWM = 24 V
VC
Clamping Voltage
VC
VBR
Min
Typ
Max
24
Unit
V
25.7
28.4
V
100
nA
IPP = 5 A (8 x 20 s Waveform) (Note 4)
40
V
Clamping Voltage
IPP = 8 A (8 x 20 s Waveform) (Note 4)
44
V
IPP
Maximum Peak Pulse Current
8 x 20 s Waveform (Note 4)
8.0
A
CJ
Capacitance
VR = 0 V, f = 1 MHz (Anode to GND)
VR = 0 V, f = 1 MHz (Anode to Anode)
60
30
pF
15
2. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC
or continuous peak operating voltage level.
3. VBR is measured at pulse test current IT.
4. Pulse waveform per Figure 1.
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2
NUP1105L
TYPICAL PERFORMANCE CURVES
(TJ = 25°C unless otherwise noted)
12.0
IPP, PEAK PULSE CURRENT (A)
% OF PEAK PULSE CURRENT
110
WAVEFORM
PARAMETERS
tr = 8 s
td = 20 s
100
90
80
c−t
70
60
td = IPP/2
50
40
30
20
PULSE WAVEFORM
8 x 20 s per Figure 1
10.0
8.0
6.0
4.0
2.0
10
0
0
10
5
20
15
0.0
30
25
25
30
35
40
45
50
VC, CLAMPING VOLTAGE (V)
t, TIME (s)
Figure 1. Pulse Waveform, 8 × 20 s
Figure 2. Clamping Voltage vs Peak Pulse Current
30
45
40
29
35
28
VZ, (V)
25
20
VZ
27
26
15
10
25
5
0
−60
−10
40
90
140
24
−60
190
−10
40
90
140
190
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 3. Typical Leakage vs. Temperature
Figure 4. Typical VZ @ 1.0 mA vs. Temperature
60
25°C
50
CAPACITANCE (pF)
IR, (A)
30
40
30
20
10
0
0
5
10
15
20
VBIAS
Figure 5. Capacitance vs. VBIAS
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3
25
NUP1105L
APPLICATIONS SECTION
The NUP1105L provides a transient voltage suppression
solution for the LIN data communication bus. The
NUP1105L is a dual bidirectional TVS device in a compact
SOT−23 package. This device is based on Zener technology
that optimizes the active area of a PN junction to provide
robust protection against transient EMI surge voltage and
ESD. The NUP1105L has been tested to EMI and ESD
levels that exceed the specifications of popular high speed
LIN networks.
VBattery =
8 to 18 V
Voltage
Regulator
Receiver
The NUP1105L device can be used to provide transcient
voltage suppression for a single data line CAN system.
Figure 7 provides an example of a single data line CAN
protection circuit.
CAN
Transceiver
NUP1105L
Figure 7. High−Speed and Fault Tolerant CAN TVS
Protection Circuit
VOUT = 5 V
LIN Bus
Transmitter
LIN Transceiver
CAN_Data_Line
NUP1105L
Figure 6. LIN Transceiver
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4
NUP1105L
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AK
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
A
L
3
1
V
B S
2
DIM
A
B
C
D
G
H
J
K
L
S
V
G
C
D
H
J
K
INCHES
MIN
MAX
0.1102
0.1197
0.0472
0.0551
0.0350
0.0440
0.0150
0.0200
0.0701
0.0807
0.0005
0.0040
0.0034
0.0070
0.0140
0.0285
0.0350
0.0401
0.0830
0.1039
0.0177
0.0236
STYLE 27:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
SCALE 10:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MILLIMETERS
MIN
MAX
2.80
3.04
1.20
1.40
0.89
1.11
0.37
0.50
1.78
2.04
0.013
0.100
0.085
0.177
0.35
0.69
0.89
1.02
2.10
2.64
0.45
0.60
NUP1105L
SDS is a registered trademark of Honeywell International Inc.
DeviceNet is a trademark of Rockwell Automation.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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6
For additional information, please contact your
local Sales Representative.
NUP1105L/D
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