THICK FILM PRECISION CHIP RESISTORS MILITARY GRADE MCT SERIES RoHS Term.W is RoHS compliant & 260°C process compatible RESISTORSCAPACITORSCOILSDELAY LINES t L T t Choice of termination materials: 100% tin plated nickel barrier is standard (palladium silver, gold, or tin-lead solder is available) Wraparound termination is standard, single sided termination is available (Option ‘S’) Wide resistance range: 0.1Ω to 100MΩ 100% Group A screening per MIL-R-55342 available Wide design flexibility for use with hybrid or smd circuitry Custom sizes, high surge, untrimmed chips available Backside metalization available W Wraparound Termination (standard) Single Face Termination (Opt. S) Precision performance to 0.1% 50ppm/°C! RCD series MCT chip resistors are designed to meet applicable performance requirements of MIL-PRF-553421. Variety of sizes and termination materials allows wide design flexibility. Palladium silver terminations are recommended for use with conductive epoxy, gold is recommended for wire bonding, and tin plated nickel for soldering. SPECIFICATIONS RCD Type Wattage @ 70°C** Voltage Rating Resistance R an g e L* ±.008 [0.2] W ±.008 [0.2] MCT0402 50MW 30V 10Ω - 1M .039 [1.0] .020 [.51] MCT0505 100MW 50V 1Ω - 10M .050 [1.27] .050 [1.27] MCT0603 100MW 40V 0.1Ω - 100M .060 [1.53] .030 [.76] MCT0805 150MW 70V 0.1Ω - 100M .075 [1.91] .050 [1.27] MCT1005 200MW 100V 1Ω - 20M .100 [2.54] .050 [1.27] MCT1206 250MW 125V 0.1Ω - 100M .124 [3.15] .061 [1.55] MCT1505 250MW 125V 1Ω - 10M .150 [3.81] .050 [1.27] MCT1210 500MW 150V 0.1Ω - 100M .124 [3.15] .100 [2.54] MCT2010 800MW 150V 0.1Ω - 100M .196 [5.0] .100 [2.54] MCT2512 1000MW 200V 0.1Ω - 100M .248 [6.3] .125 [3.18] t2 T* .012±.005 [.3±.13] .014±.007 [.35±.18] .012±.006 [.3±.15] .016±.008 [.4±.2] .018±.008 [.45±.2] .020±.008 [.5±.2] .020±010 [.5±.25] .020±.010 [.5±.25] .020±.010 [.5±.25] .020±.010 [.5±.25] .014±.006 [.35±.15] .018±.006 [.45±.15] .018±.006 [.45±.15] .018±.006 [.50±.15] .020±.006 [.50±.15] .020±.006 [.50±.15] .020±.006 [.50±.15] .020±.006 [.50±.15] .020±.006 [.50±.15] .020±.006 [.50±.15] * Dimension given is for single face termination. Add .004” [.1mm] for wraparound termination. ** Wattage based on mounting to ceramic substrate, derate by 25% if mounted to a glass epoxy P.C.B. 1 Military p/n’s are given for reference only and do not imply qualification or exact interchangeability. 2 Dimension “t” (underside termination width) applies only to termination type W TYPICAL PERFORMANCE CHARACTERISTICS C haracteri sti c Temp. C oeffi ci ent Thermal Shock PART NUMBER DESIGNATION: 10Ω to 1MΩ range <10Ω,>1MΩ ±300 ppm ±100ppm ±50ppm ±400ppm (standard) (opt.) (opt.) (standard) 0.5% 0.5% 0.5% 0.75% Short Ti me Overload 0.5% 0.25% 0.25% 1% Hi gh Temp. Exposure 0.5% 0.5% 0.5% 0.75% Moi sture Resi stance 0.5% 0.5% 0.5% 1.5% Load Li fe 1.0% 0.5% 0.5% 1.5% - 1001 - F T 101 W RCD Type Options: S = single sided termination (leave blank for wraparound termination) Res. Value: 4 digit code if tol. is 0.1% to 1% (R100=0.1Ω, 1R00=1Ω, 10R0=10Ω, 1000=100Ω, 1001=1KΩ, 1002=10K, 1003=100K, 1004=1MΩ) 3 digit code if ≥2% (R10=0.1Ω, 1R0=1Ω, 100= 10Ω, 101=100Ω, 102=1KΩ, 103=10K, 104=100K,105=1MΩ) Tolerance Code: B=0.1%, C=0.25%, D=0.5%, F=1%, G=2%, J=5%, K=10%, M=20% DERATING % OF RATED POWER MCT0805 Packaging: B=bulk, T=tape&reel, W=waffle tray 100 Optional TC Characteristic: 50 = 50ppm, 101 = 100ppm, 201= 200ppm, etc. (leave blank if standard) 75 50 25 0 35 70 105 140 150 175 Termination Material: Standard = W (lead-free100% Tin with Nickel barrier). Optional = Q (Tin-Lead solder with Ni barrier), P= untinned Palladium Silver, G=Gold AMBIENT TEMPERATURE (°C) RCD Components Inc, 520 E.Industrial Park Dr, Manchester, NH, USA 03109 rcdcomponents.com Tel: 603-669-0054 Fax: 603-669-5455 Email:[email protected] FA045B 17 Sale of this product is in accordance with GF-061. Specifications subject to change without notice.