Sample & Buy Product Folder Tools & Software Technical Documents Support & Community LMR16030 SNVSAH9 – DECEMBER 2015 1 Features 3 Description • • • • • • • The LMR16030 is a 60 V, 3 A SIMPLE SWITCHER® step down regulator with an integrated high-side MOSFET. With a wide input range from 4.5 V to 60 V, it’s suitable for various applications from industrial to automotive for power conditioning from unregulated sources. The regulator’s quiescent current is 40 µA in Sleep-mode, which is suitable for battery powered systems. An ultra-low 1 μA current in shutdown mode can further prolong battery life. A wide adjustable switching frequency range allows either efficiency or external component size to be optimized. Internal loop compensation means that the user is free from the tedious task of loop compensation design. This also minimizes the external components of the device. A precision enable input allows simplification of regulator control and system power sequencing. The device also has built-in protection features such as cycle-by-cycle current limit, thermal sensing and shutdown due to excessive power dissipation, and output overvoltage protection. 1 • • • • • • • • 4.5 V to 60 V Input Range 3 A Continuous Output Current Ultra-low 40 µA Operating Quiescent Current 155 mΩ High-Side MOSFET Minimum Switch-On Time: 90 ns Current Mode Control Adjustable Switching Frequency from 200 kHz to 2.5 MHz Frequency Synchronization to External Clock Internal Compensation for Ease of Use High Duty Cycle Operation Supported Precision Enable Input 1 µA Shutdown Current External Soft-start Thermal, Overvoltage and Short Protection 8-Pin HSOIC with PowerPAD™ Package 2 Applications • • • • The LMR16030 is available in an 8-pin HSOIC package with exposed pad for low thermal resistance. Automotive Battery Regulation Industrial Power Supplies Telecom and Datacom Systems General Purpose Wide Vin Regulation space (1) Device Information PART NUMBER PACKAGE BODY SIZE (NOM) LMR16030PDDA (Power Good) HSOIC (8) 4.89 mm x 3.90 mm HSOIC (8) 4.89 mm x 3.90 mm LMR16030SDDA (Soft Start) (1) For all available packages, see the orderable addendum at the end of the datasheet. Simplified Schematic Efficiency vs Output Current Vout = 5 V, fs = 300 kHz VIN up to 60 V CIN 100 VIN BOOT EN CBOOT VOUT SW D RT RFBT COUT FB SS CSS GND RFBB Efficiency (%) RT/SYNC 90 L 80 70 60 50 VIN = 12 V VIN = 24 V 40 0.0001 0.001 0.01 IOUT (A) 0.1 1 3 D001 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice. PRODUCT PREVIEW LMR16030 SIMPLE SWITCHER® 60 V, 3 A Step-Down Converter LMR16030 SNVSAH9 – DECEMBER 2015 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Device and Documentation Support.................... 6.1 6.2 6.1 6.2 6.3 1 1 1 2 3 4 7 Device Support ........................................................ Community Resources.............................................. Trademarks ............................................................... Electrostatic Discharge Caution ................................ Glossary .................................................................... 4 4 5 5 5 Mechanical, Packaging, and Orderable Information ............................................................. 5 4 Revision History DATE REVISION NOTES December 2015 * Initial release. PRODUCT PREVIEW 2 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: LMR16030 LMR16030 www.ti.com SNVSAH9 – DECEMBER 2015 5 Pin Configuration and Functions DDA Package 8-Pin (HSOIC) Top View BOOT 1 VIN 2 EN 3 RT/SYNC 4 Thermal Pad (9) 8 SW 7 GND 6 SS or PGOOD 5 FB Pin Functions TYPE (1) DESCRIPTION NAME NO. BOOT 1 P Bootstrap capacitor connection for high-side MOSFET driver. Connect a high quality 0.1 μF capacitor from BOOT to SW. VIN 2 P Connect to power supply and bypass capacitors CIN. Path from VIN pin to high frequency bypass CIN and GND must be as short as possible. EN 3 I Enable pin, with internal pull-up current source. Pull below 1.2 V to disable. Float or connect to VIN to enable. Adjust the input under voltage lockout with two resistors. See the Enable and Adjusting Under voltage lockout section. RT/SYNC 4 I Resistor Timing or External Clock input. An internal amplifier holds this pin at a fixed voltage when using an external resistor to ground to set the switching frequency. If the pin is pulled above the PLL upper threshold, a mode change occurs and the pin becomes a synchronization input. The internal amplifier is disabled and the pin is a high impedance clock input to the internal PLL. If clocking edges stop, the internal amplifier is re-enabled and the operating mode returns to frequency programming by resistor. FB 5 I Feedback input pin, connect to the feedback divider to set VOUT. Do not short this pin to ground during operation. SS or PGOOD 6 O SS pin for soft-start version, connect to a capacitor to set soft-start time. PGOOD pin for Power Good version, open drain output for power-good flag, use a 10 kΩ to 100 kΩ pull-up resistor to logic rail or other DC voltage no higher than 7 V. GND 7 G System ground pin. SW 8 P Switching output of the regulator. Internally connected to high-side power MOSFET. Connect to power inductor. Thermal Pad 9 G Major heat dissipation path of the die. Must be connected to ground plane on PCB. (1) I = Input, O = Output, G = Ground, P = Power Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: LMR16030 3 PRODUCT PREVIEW PIN LMR16030 SNVSAH9 – DECEMBER 2015 www.ti.com 6 Device and Documentation Support 6.1 Device Support 6.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 6.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. PRODUCT PREVIEW 4 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: LMR16030 LMR16030 www.ti.com SNVSAH9 – DECEMBER 2015 6.1 Trademarks PowerPAD, E2E are trademarks of Texas Instruments. SIMPLE SWITCHER is a registered trademark of Texas Instruments. 6.2 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 6.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 7 Mechanical, Packaging, and Orderable Information PRODUCT PREVIEW The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: LMR16030 5 PACKAGE OPTION ADDENDUM www.ti.com 7-Jan-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMR16030PDDA PREVIEW SO PowerPAD DDA 8 75 TBD Call TI Call TI -40 to 125 LMR16030PDDAR PREVIEW SO PowerPAD DDA 8 2500 TBD Call TI Call TI -40 to 125 LMR16030SDDA PREVIEW SO PowerPAD DDA 8 75 TBD Call TI Call TI -40 to 125 LMR16030SDDAR PREVIEW SO PowerPAD DDA 8 2500 TBD Call TI Call TI -40 to 125 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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