Material Content Data Sheet Sales Product Name IPB80N08S2-07 MA# MA000275856 Package PG-TO263-3-2 Issued 29. August 2013 Weight* 1564.13 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 7723-14-0 7439-89-6 7440-50-8 12.294 0.79 0.304 0.02 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.79 7860 7860 195 0.091 0.01 304.026 19.44 19.47 194374 58 194627 5.424 0.35 0.35 3468 3468 10.140 0.65 6483 111.545 7.13 554.345 35.43 43.21 354410 432208 9.657 0.62 0.62 6174 6174 0.228 0.01 0.001 0.00 0.192 0.01 0.154 0.01 7.350 0.47 0.165 0.01 0.548 0.04 547.666 35.01 71314 146 0.01 1 98 0.49 4699 2. 3. 351 35.06 350141 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4920 105 Important Remarks: 1. 146 123 350597 1000000