Edge818 Octal 18V Pin Electronics Driver/window Comparator EDGE HIGH-PERFORMANCE PRODUCTS Description Features • • • • • • • The Edge818 is an octal pin electronics driver and window comparator fabricated in a wide voltage CMOS process. It is designed specifically for Test During Burn In (TDBI) applications, where cost, functional density, and power are all at a premium. The Edge818 incorporates eight channels of programmable drivers and window comparators into one 14 mm X 20 mm 100 pin MQFP package. Each channel has per pin driver levels, data, and high impedance control. In addition, each comparator has per pin high and low threshold levels. 18V I/O Range 50 MHz Operation Per Pin Flexibility Programmable Input Thresholds Flex In Digital Inputs Flex Out Digital Outputs Small footprint (100 pin MQFP) Applications The Edge818 uses "Flex In" and "Flex Out" digital inputs, and can therefore mate directly with any digital technology providing a minimum 2V swing. The digital outputs can mate directly with any digital technology. • Burn In ATE • Low Cost ATE • Instrumentation The 18V driver output and receiver input range allow the Edge818 to interface directly with TTL, ECL, CMOS (3V, 5V, and 7V), LVCMOS, and custom level circuitry, as well as the high voltage (Super Voltage) level required for many special test modes for Flash Devices. Functional Block Diagram VH VL DATA EN* QA 8 8 8 – + 8 COMP HIGH 8 8 DOUT CVA VINP COMP LOW QB Revision 1/ May 23, 2000 8 + – 1 8 CVB www.semtech.com Edge818 EDGE HIGH-PERFORMANCE PRODUCTS PIN Description Pin Name Pin Number DATA (0:7) 100, 4, 8, 12, 19, 23, 27, 31 Digital inputs which determine the high/low state of the driver, when it is enabled. EN* (0:7) 3, 7, 11, 15, 16, 20, 24, 28 Digital inputs wihch enable/disable the driver. QA (0:7) QB (0:7) 1, 5, 9, 13, 18, 22, 26, 30 2, 6, 10, 14, 17, 21, 25, 29 Comparator digital outputs. DOUT (0:7) 79, 75, 71, 67, 64, 60, 56, 52 Driver Outputs. VINP (0:7) 81, 77, 73, 69, 62, 58, 54, 50 Comparator Inputs. VH (0:7) 80, 76, 72, 68, 63, 59, 55, 51 Unbuffered analog inputs that set the driver "high" voltage level. VL (0:7) 78, 74, 70, 66, 65, 61, 57, 53 Unbuffered analog inputs that set the driver "low" voltage level. CVA (0:7) 97, 95, 89, 87, 44, 42, 36, 34 Analog inputs that set the threshold for the A comparators. CVB (0:7) 96, 94, 88, 86, 45, 43, 37, 35 Analog inputs that set the threshold for the B comparators. VBB 46, 85 Analog input voltage that sets the threshold for the digital inputs. COMP HIGH 33, 98 Unbuffered analog input that sets the high level of the comparator outputs. COMP LOW 32, 99 Unbuffered analog input that sets the low level of the comparator outputs. VCC 40, 41, 47, 49, 82, 84, 90, 91 Positive power supply. VEE 38, 39, 48, 83, 92, 93 Negative power supply. 2000 Semtech Corp. Description 2 www.semtech.com Edge818 VINP0 VCC VEE VCC VBB CVB3 CVA3 CVB2 CVA2 VCC VCC VEE VEE CVB1 CVA1 CVB0 CVA0 COMP HIGH COMP LOW DATA0 EDGE HIGH-PERFORMANCE PRODUCTS PIN Description (continued) 81 QA0 1 VH0 DOUT0 QB0 VL0 EN*0 VINP1 DATA1 QA1 VH1 QB1 DOUT1 VL1 EN*1 VINP2 DATA2 QA2 VH2 QB2 DOUT2 VL2 EN*2 VINP3 DATA3 QA3 VH3 QB3 DOUT3 EN*3 VL3 100 Lead - 14 x 20 MQFP EN*4 VL4 QB4 DOUT4 QA4 VH4 VINP4 DATA4 VL5 EN*5 QB5 DOUT5 QA5 VH5 VINP5 DATA5 VL6 EN*6 QB6 DOUT6 QA6 VH6 VINP6 DATA6 VL7 EN*7 DOUT7 QB7 51 QA7 VH7 3 VCC VINP7 VEE VBB VCC CVA4 CVB4 CVB5 VCC CVA5 VEE VCC VEE CVA6 CVB6 CVA7 CVB7 COMP HIGH DATA7 2000 Semtech Corp. COMP LOW 31 www.semtech.com Edge818 EDGE HIGH-PERFORMANCE PRODUCTS Circuit Description Driver Description VH The Edge818 supports programmable high and low levels and tristate per channel. There are no shared lines between any drivers. The EN* and DATA signals are wide voltage high impedance analog inputs capable of receiving digital signals over a wide common mode range. VBB is the high impedance analog input which sets the threshold for EN* and DATA. EN*, DATA > VBB < VBB Status "1" "0" VL Figure 3. Simplified Model of the Unbuffered Output Stage With EN* high, the driver goes into a high impedance state. With EN* low, DATA high forces the driver into a high state, and DATA low forces the driver into a low state. EN* 1 0 0 DATA X 1 0 DOUT HiZ VH VL Driver Output Protection In a functional testing environment, where a resistor is added in series with the driver output to create a 50Ω driver, the Edge818 can withstand a short to any legal voltage for an indefinite amount of time. In a low impedance application, with no additional output resistance, the system should be designed to check for a short circuit prior to connecting the driver, and tristate the driver if a short is detected. Drive High and Low VH and VL define the logical "1" and "0" levels of the driver, and can be adjusted anywhere over the range determined by VCC and VEE. There are no restrictions between VH and VL, other than they must remain within the power supply levels. VEE ≤ VH ≤ VCC VEE ≤ VL ≤ VCC The VH and VL inputs are unbuffered in that they also provide the driver output current (see Figure 3), so the source of VH and VL must have ample current drive capability. 2000 Semtech Corp. DUT 4 Receiver Description The Edge818 supports a window comparator with independent threshold levels per channel. There are no shared comparator lines between channels. CVA and CVB are high impedance analog voltage inputs which define the threshold voltages for comparators A and B. If VINP is more positive than CVA or CVB, QA and QB will be high. Otherwise, QA and QB will be low. VINP VINP > CVA VINP < CVA QA COMP HIGH COMP LOW VINP VINP > CVB VINP < CVB QB COMP HIGH COMP LOW www.semtech.com Edge818 EDGE HIGH-PERFORMANCE PRODUCTS Circuit Description (continued) The comparator outputs are "Flex Out". They are technology independent and may be adjusted over a wide voltage common mode range. COMP HIGH and COMP LOW are analog inputs which set the digital high and low levels (respectively) of QA and QB. COMP HIGH and COMP LOW are unbuffered inputs that provide the necessary drive current, so the sources for these levels must have adequate current capability. COMP HIGH QAX, QBX COMP LOW Figure 4. Simplified Model of the Unbuffered Comparator Output Stage Typically, COMP HIGH and COMP LOW will be connected to the digital power supplies of the chip receiving QA and QB. Receiver Headroom There is ~2V of headroom required between the comparator thresholds and both power supply levels. VEE + 2.0 ≤ CVA, CVB ≤ VCC – 2.0 2000 Semtech Corp. 5 www.semtech.com Edge818 EDGE HIGH-PERFORMANCE PRODUCTS Application Information Power Supply Decoupling VCC and VEE should be decoupled to GND with a .1 µF chip capacitor in parallel with a .001 µF chip capacitor. A VCC and VEE plane, or at least a solid power bus, is recommended for optimal performance. must always be positive (above ground), and VEE must always be negative (at or below ground). The three diode configuration shown in Figure 5 should be used on a once-per-board basis. VH and VL Decoupling As the VH and VL inputs are unbuffered and supply the driver output current, which can be quite large during edge transitions, decoupling capacitors for these inputs are recommended in proportion to the amount of output current requirements. VCC VDD For applications where VH and VL are shared over multiple channels, a solid power plane to distribute these levels is preferred. 1N5820 or Equivalent VBB The two VBB pins are connected together on-chip. Therefore, only one VBB needs to be connected to for proper 818 operation. The two pins may be used to daisy chain a VBB signal across a PC Board without having to route the actual signal underneath the 818. Latchup Protection The Edge818 has several power supply requirements to protect the part in power supply fault situations, as well as during power up and power down sequences. VCC must remain greater than or equal to VDD (external supply for the digital logic) at all times. Both VCC and VDD 2000 Semtech Corp. 6 VEE Figure 5. Power Supply Protection Scheme gure 5. Warning: It is extremely important that the voltage on any device pin does not exceed the range of VEE – 0.5V to VCC +0.5V at any time, either during power up, normal operation, or during power down. Failure to adhere to this requirement could result in latchup of the device, which could be destructive if the system power supplies are capable of supplying large amounts of current. Even if the device is not immediately destroyed, the cumulative damage caused by the stress of repeated latchup may affect device reliability. www.semtech.com Edge818 EDGE HIGH-PERFORMANCE PRODUCTS Package Information 100-Pin MQFP 14 mm x 20 mm 4 PIN Descriptions 0.25 4X C A–B D D D2 Z 3 D 3 –D– –A– –B– 3 E2 –E– 4 e Z SEE DETAIL "A" E TOP VIEW 2 4X 5 7 0.20 C A–B D 5 7 D1 7 E1 O O C 5 BOTTOM VIEW 2000 Semtech Corp. 7 www.semtech.com Edge818 EDGE HIGH-PERFORMANCE PRODUCTS Package Information (continued) 0.40 MIN. ˚ 0 MIN. e/2 A2 – 0.10 S 0.13 / 0.30 R. TYP. –A, B, D– 0.13 R. MIN. 3 GAGE PLANE C C A1 DETAIL "A" BASE PLANE 0.25 L ˚ 0–7 1.60 REF. SEATING PLANE DETAIL "B" ˚ 12 – 16 ccc 8 SEE DETAIL "B" A 1.28 REF. C A–B S D S WITH LEAD FINISH B –H– M 2 0.076 12 0.13 / 0.17 0.13 / 0.23 –C– ˚ 12 – 16 B 1 BASE METAL SECTION C–C Variations (all dimensions in millimeters) Notes: 1. All dimensions and tolerances conform to ANSI Y14.5-1982. 2. Datum plane -H- located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. 3. Datums A-B and -D- to be determined where centerline between leads exits plastic body at datum plane -H-. 4. To be determined at seating plane -C-. 5. Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.254 mm per side. Dimensions D1 and E1 do include mold mismatch and are determined at datum plane -H-. 6. “N” is the total # of terminals. 7. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. 8. Dimension B does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the dimension at maximum material condition. Dambar cannot be located on the lowerradius or the foot. 9. All dimensions are in millimeters. 10. Maximum allowable die thickness to be assembled in this package family is 0.635 millimeters. 11. This drawing conforms to JEDEC registered outlines MS-108 and MS-022. 12. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip. 2000 Semtech Corp. 8 Symbol Min A A1 0.25 A2 2.57 Nom Max 3.04 3.40 Note 0.33 2.71 Comments Height above PCB Gap above PCB 2.87 Body Thickness D 23.20 BSC 4 D1 20.00 BSC 5 D2 18.85 REF ZD 0.58 REF Body Dimension E 17.20 4 E1 14.00 BSC 5 Body Dimension E2 12.35 REF 6 Pin Count ZE L 0.83 REF 0.73 N 0.88 1.03 100 e 0.65 BSC B 0.22 B1 0.22 Lead Pitch 0.38 0.30 0.33 8 Pad Dimension Pad Dimension ccc 0.13 ND 30 Side Pin Count NE 20 Side Pin Count www.semtech.com Edge818 EDGE HIGH-PERFORMANCE PRODUCTS Recommended Operating Conditions Parameter Total Analog Supply Symbol Min VCC - VEE 12.0 Typ Max Units 18.0 V Ambient Operating Temperature TA +70 oC Junction Temperature TJ +125 oC Absolute Maximum Ratings Parameter Symbol Min Max Units Total Power Supply VCC - VEE -0.5 19.0 V Digital Input Voltages DATA, EN* VEE - .5 VCC + .5 V Analog Input Voltages VH, VL, CVA, CVB, VINP, VBB VEE - .5 VCC + .5 V DOUT, COMP HIGH, COMP LOW VEE - .5 VCC + .5 V Ambient Operating Temperature TA -50 +125 oC Storage Temperature TS -65 +150 oC Junction Temperature TJ +150 oC TSOL +260 Analog Output Voltages Soldering Temperature (5 seconds, .25" from the pin) oC Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these, or any other conditions beyond those listed, is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability. 2000 Semtech Corp. 9 www.semtech.com Edge818 EDGE HIGH-PERFORMANCE PRODUCTS DC Characteristics Parameter Symbol Min VH VL VH - VL Ileak Rout Iout DC Iout AC VEE VEE VEE -2.0 9.0 -125 -400 VINP CVA, CVB Vos Ibias VEE VEE + 3.0 -200 -10 COMP HIGH COMP LOW -2.0 -2.0 Rout 30 -50 EN*, DATA - VBB VBB - EN*, DATA Iin 1.0 1.0 -100 Typ Max Units VCC VCC VCC +2.0 15 +125 +400 V V V nA Ω mA mA VCC VCC - 3.0 +100 +10.0 V V mV nA +5.0 +5.0 V V 50 50 Ω mA +100 V V nA Driver High Voltage Low Voltage Output Swing HiZ Leakage Current Output Impedance DC Output Current (Note 1) AC Output Current (Note 2) 0 12 Receiver Input Voltage Range Threshold Voltage Range Offset Voltage (Note 3) Input Bias Current Output Voltage Range QA, QB Output Impedance DC Output Current Capability 0 40 Digital Inputs Input High Voltage Input Low Voltage Input Current 0 Power Supplies Positive Supply Level Negative Supply Level VCC VEE Positive Supply Current Negative Supply Current ICC IEE +15.0 -3.0 36 36 57 57 V V 78 78 mA mA Test conditions (unless otherwise specified): "Recommended Operating Conditions". Note 1: Note 2: Note 3: DC output current is specified per individual driver. Surge current capability for durations of < 2 seconds. Offset voltage is tested at CVA, CVB = 1.5V. 2000 Semtech Corp. 10 www.semtech.com Edge818 EDGE HIGH-PERFORMANCE PRODUCTS AC Characteristics Parameter Symbol Min Typ Max Units DATA to DOUT EN* to DOUT (Active to HiZ) (Note 1) EN* to DOUT (HiZ to Active) Tpd Tpd Tpd 9.5 10 11 14.5 20 16 19.5 30 21 ns ns ns Rise/Fall Times (Note 2) 1V Swing (20% - 80%) 3V Swing (10% - 90%) 5V Swing (10% - 90%) 10V Swing (10% - 90%) 15V Swing (10% - 90%) Tr/Tf Tr/Tf Tr/Tf Tr/Tf Tr/Tf Maximum Operating Frequency (Note 3) Fmax Driver 1.5 1.9 2.0 2.5 3.2 ns ns ns ns ns 50 Minimum Pulse Width MHz 8 11 ns 17.5 20.5 19.5 23.5 ns ns Receiver Comparator Tpd+ TpdMaximum Operating Frequency (Note 3) 700 ps 11.5 14.5 Fmax 50 Minimum Pulse Width MHz 10 15 ns Test conditions (unless otherwise specified): "Recommended Operating Conditions". Note 1: Note 2: Note 3: Load = 10 mA and measured when a 1V change at the output is detected. (VH = 3V, VL = 0V, VFLOAT = 1.5V, tested at 1V and 2V.) Into 18 cm of 50 Ω transmission line terminate with 1 KΩ, with proper series termination resistor.Guaranteed by characterization. This parameter is not tested in production. This parameter is production tested at 40 MHz. 2000 Semtech Corp. 11 www.semtech.com Edge818 EDGE HIGH-PERFORMANCE PRODUCTS Ordering Information Model Number Package E818AHF 100 Lead MQFP 14 mm x 20 mm Body Size w/Internal Heat Spreader EVM818AHF Edge818 Evaluation Board Contact Information Semtech Corporation Edge High-Performance Division 10021 Willow Creek Rd., San Diego, CA 92131 Phone: (858)695-1808 FAX (858)695-2633 2000 Semtech Corp. 12 www.semtech.com