Dynex MP04HB910-24 Dual rectifier diode module preliminary information Datasheet

MP04HB910
MP04HB910
Dual Rectifier Diode Module
Preliminary Information
DS5425-1.2 February 2001
FEATURES
KEY PARAMETERS
VRRM
3000V
915A
IF(AV)
20000A
IFSM (per arm)
1440A
IF(RMS)
3000V
Visol
■ Dual Device Module
■ Electrically Isolated Package
■ Pressure Contact Construction
■ International Standard Footprint
■ Alumina (Non-toxic) Isolation Medium
APPLICATIONS
■ Power Supplies
■ Large IGBT Circuit 'Front Ends'
■ Rectifiers
■ Battery Chargers
1
2
3
VOLTAGE RATINGS
Type Number
MP04HB910-30
MP04HB910-28
MP04HB910-26
MP04HB910-24
Repetitive Peak
Voltages
VDRM VRRM
V
3000
2800
2600
2400
Conditions
Tvj = –40˚ to 150˚C,
Fig.1 HB circuit configuration
VRSM = VRRM + 100V
Lower voltage grades available
ORDERING INFORMATION
Order As:
MP04HB910-XX
XX shown in the part number about represents VRRM/100
selection required.
Note: When ordering, please use the complete part number.
Please quote full part number in all correspondance.
Outline type code: MP04
(See package details for further information)
Fig. 2 Electrical connections - (not to scale)
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MP04HB910
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability.
Symbol
IF(AV)
IF(RMS)
IFSM
I2t
IFSM
I2t
Visol
Max.
Units
Tcase = 75oC
915
A
Tcase = 85oC
830
A
Tcase = 100oC
695
A
Tcase = 75oC
1440
A
Tcase = 85oC
1305
A
Tcase = 100oC
1090
A
10ms half sine; Tj = 150oC
20
kA
VR = 0
2.0 x 106
A2s
10ms half sine; Tj = 150oC
16
kA
VR = 50% VRRM
1.28 x 106
A2s
Commoned terminals to base plate AC RMS, 1 min, 50Hz
3000
V
Parameter
Mean forward current
RMS value
Conditions
Half wave resistive load
Surge (non-repetitive) forward current
I2t for fusing
Surge (non-repetitive) forward current
I2t for fusing
Isolation voltage
THERMAL AND MECHANICAL DATA
Rth(j-c)
Thermal resistance - junction to case
(per diode)
Tvj
Virtual junction temperature
Tstg
Storage temperature range
-
Conditions
Min.
Max.
Units
dc
-
0.056
o
Halfwave
-
0.060
o
3 Phase
-
0.066
o
Reverse (blocking)
-
150
o
–40
150
o
6 (53)
-
Parameter
Symbol
Screw torque
Mounting
Electrical connections
-
Weight (nominal)
-
-
C/W
C/W
C/W
C
C
Nm (lb.ins)
12 (106) Nm (lb.ins)
1580
g
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MP04HB910
CHARACTERISTICS
Parameter
Symbol
Conditions
Min.
Max.
Units
IRRM
Peak reverse current
At VRRM, Tcase = 150oC
-
50
mA
QS
Total stored charge
IF = 1000A, dIRR/dt = 3A/µs
-
1600
µC
IRR
Peak recovery current
Tcase = 150˚C, VR = 100V
-
85
A
VTO
Threshold voltage. See Note 1.
At Tvj = 150˚C
-
0.7
V
Slope resistance. See Note 1.
At Tvj = 150˚C
-
0.29
mΩ
rT
Note 1: The data given in this datasheet with regard to forward voltage drop is the for the calculation of the power dissipation in
the semiconductor elements only. Forward voltage drops measured at the power terminals will be in excess of these figures due to
the impedance of the busbars from the terminals to the semiconductor.
CURVES
2500
2200
Instantaneous forward current IF - (A)
Measured under pulse
conditions
2000
1800
Power dissipation (Watts, per arm)
2000
1500
Tj = 150˚C
Tj = 25˚C
1000
500
1600
1400
1200
1000
800
600
30°
60°
90°
120°
180°
DC
400
200
0
0.5
0.75
1.0
1.25
Instantaneous forward voltage VF - (V)
Fig.3 Maximum (limit) forward characteristics
1.5
0
0
200 400 600 800 1000 1200 1400 1600 1800
Forward current, (Average, per arm) IF(AV) - (A)
Fig.4 Power dissipation curves
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MP04HB910
1000
Conditions:
Tj = 150˚C
VR = 100V
IF = 1000A
Conditions:
Tj = 175˚C
VR = 100V
IF = 1000A
Reverse current IRR - (A)
Stored charge QS - (µC)
10000
1000
100
IF
QS
dIF/dt
100
0.1
IRR
1.0
10
Rate of decay of on-state current dIF/dt - (A/µs)
10
100
1.0
10
Rate of decay of forward current dIF/dt - (A/µs)
100
Fig.6 Maximum reverse recovery current
Fig.5 Maximum stored charge
35
1.4
0.06
2
1.3
1.2
25
20
1.1
15
1.0
I2t
I2t value - (A2s x 106)
Peak half sine forward current - (kA)
30
10
0.9
5
0.8
0
1
10
1
ms
2 3
5
10 20
0.7
50
Cycles at 50Hz
Thermal resistance, Rth(j-c) - (°C/W)
I2t = Î2 x t
0.05
0.04
0.03
0.02
0.01
0
0.001
0.01
0.1
1
10
Time - (Seconds)
100
1000
Duration
Fig.7 Surge (non-repetitive) forward current vs time
(with 50% VRRM @ Tc - 150˚C)
Fig.8 Transient thermal impedance - dc
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MP04HB910
Maximum permissble case temperature - (°C)
90
30°
60°
90°
120°
180°
DC
80
70
60
50
40
30
20
10
0
200
400
600
800
1000 1200 1400
Forward current (Average, per arm), IF(AV) - (A)
1600
Fig.9 Maximum permissible case temperature vs forward
current per arm at various conduction angles, 50/60Hz
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MP04HB910
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws.
Nominal weight: 1580g
Module outline type code: MP04
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MP04HB910
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise
the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is
available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
http://www.dynexsemi.com
e-mail: [email protected]
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
CUSTOMER SERVICE CENTRES
Central Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Central Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS5425-1 Issue No. 1.2 February 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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