HUFA75645P3, HUFA75645S3S
Data Sheet
December 2001
75A, 100V, 0.014 Ohm, N-Channel,
UltraFET® Power MOSFETs
Packaging
JEDEC TO-220AB
JEDEC TO-263AB
Features
DRAIN
(FLANGE)
SOURCE
DRAIN
GATE
GATE
SOURCE
DRAIN
(FLANGE)
HUFA75645P3
HUFA75645S3S
• Ultra Low On-Resistance
- rDS(ON) = 0.014Ω, VGS = 10V
• Simulation Models
- Temperature Compensated PSPICE® and SABER™
Electrical Models
- Spice and Saber Thermal Impedance Models
- www.fairchild.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
Symbol
D
Ordering Information
PART NUMBER
G
S
Absolute Maximum Ratings
PACKAGE
BRAND
HUFA75645P3
TO-220AB
75645P
HUFA75645S3S
TO-263AB
75645S
NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the variant in tape and reel, e.g., HUFA75645S3ST.
TC = 25oC, Unless Otherwise Specified
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
Drain Current
Continuous (TC = 25oC, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
Continuous (TC = 100oC, VGS = 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IDM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .UIS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TL
Package Body for 10s, See Techbrief TB334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
NOTES:
HUFA75645P3, HUFA75645S3S
100
100
±20
UNITS
V
V
V
75
65
Figure 4
Figures 6, 14, 15
A
A
310
2.07
-55 to 175
W
W/oC
oC
300
260
oC
oC
1. TJ = 25oC to 150oC.
CAUTION: Stresses above those listed in “Absol24ute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy
of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be found at: http://www.mtp.fairchild.com/automotive.html.
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
©2001 Fairchild Semiconductor Corporation
HUFA75645P3, HUFA75645S3S Rev. B
HUFA75645P3, HUFA75645S3S
Electrical Specifications
TC = 25oC, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
100
-
-
V
VDS = 95V, VGS = 0V
-
-
1
µA
VDS = 90V, VGS = 0V, TC = 150oC
-
-
250
µA
VGS = ±20V
-
-
±100
nA
OFF STATE SPECIFICATIONS
Drain to Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
BVDSS
IDSS
IGSS
ID = 250µA, VGS = 0V (Figure 11)
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage
VGS(TH)
VGS = VDS, ID = 250µA (Figure 10)
2
-
4
V
Drain to Source On Resistance
rDS(ON)
ID = 75A, VGS = 10V (Figure 9)
-
0.0115
0.014
Ω
TO-220 and TO-263
-
-
0.48
oC/W
-
-
62
oC/W
-
-
197
ns
-
14
-
ns
-
117
-
ns
td(OFF)
-
41
-
ns
tf
-
97
-
ns
tOFF
-
-
207
ns
-
198
238
nC
-
106
127
nC
-
6.8
8.2
nC
THERMAL SPECIFICATIONS
Thermal Resistance Junction to Case
RθJC
Thermal Resistance Junction to
Ambient
RθJA
SWITCHING SPECIFICATIONS (VGS = 10V)
Turn-On Time
Turn-On Delay Time
Rise Time
tON
td(ON)
tr
Turn-Off Delay Time
Fall Time
Turn-Off Time
VDD = 50V, ID = 75A
VGS = 10V,
RGS = 2.5Ω
(Figures 18, 19)
GATE CHARGE SPECIFICATIONS
Total Gate Charge
Qg(TOT)
VGS = 0V to 20V
Gate Charge at 10V
Qg(10)
VGS = 0V to 10V
Threshold Gate Charge
Qg(TH)
VGS = 0V to 2V
VDD = 50V,
ID = 75A,
Ig(REF) = 1.0mA
(Figures 13, 16, 17)
Gate to Source Gate Charge
Qgs
-
14
-
nC
Gate to Drain “Miller” Charge
Qgd
-
41
-
nC
-
3790
-
pF
-
810
-
pF
-
230
-
pF
MIN
TYP
MAX
UNITS
ISD = 75A
-
-
1.25
V
ISD = 35A
-
-
1.00
V
trr
ISD = 75A, dISD/dt = 100A/µs
-
-
145
ns
QRR
ISD = 75A, dISD/dt = 100A/µs
-
-
360
nC
CAPACITANCE SPECIFICATIONS
Input Capacitance
CISS
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
VDS = 25V, VGS = 0V,
f = 1MHz
(Figure 12)
Source to Drain Diode Specifications
PARAMETER
Source to Drain Diode Voltage
Reverse Recovery Time
Reverse Recovered Charge
©2001 Fairchild Semiconductor Corporation
SYMBOL
VSD
TEST CONDITIONS
HUFA75645P3, HUFA75645S3S Rev. B
HUFA75645P3, HUFA75645S3S
Typical Performance Curves
80
1.0
ID, DRAIN CURRENT (A)
POWER DISSIPATION MULTIPLIER
1.2
0.8
0.6
0.4
60
VGS = 10V
40
20
0.2
0
0
25
50
75
100
150
125
0
175
25
50
75
TC , CASE TEMPERATURE (oC)
100
125
150
175
TC, CASE TEMPERATURE (oC)
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
2
ZθJC, NORMALIZED
THERMAL IMPEDANCE
1
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.02
0.01
PDM
0.1
t1
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJC x RθJC + TC
SINGLE PULSE
0.01
10-5
10-4
10-3
10-2
10-1
100
101
t, RECTANGULAR PULSE DURATION (s)
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
IDM, PEAK CURRENT (A)
2000
TC = 25oC
FOR TEMPERATURES
ABOVE 25oC DERATE PEAK
CURRENT AS FOLLOWS:
1000
175 - TC
I = I25
150
VGS = 10V
100
50
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
10-5
10-4
10-3
10-2
10-1
100
101
t, PULSE WIDTH (s)
FIGURE 4. PEAK CURRENT CAPABILITY
©2001 Fairchild Semiconductor Corporation
HUFA75645P3, HUFA75645S3S Rev. B
HUFA75645P3, HUFA75645S3S
Typical Performance Curves
(Continued)
500
100
100µs
10
10ms
SINGLE PULSE
TJ = MAX RATED
TC = 25oC
1
1
100
10
STARTING TJ = 25oC
100
1ms
OPERATION IN THIS
AREA MAY BE
LIMITED BY rDS(ON)
If R = 0
tAV = (L)(IAS)/(1.3*RATED BVDSS - VDD)
If R ≠ 0
tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1]
IAS, AVALANCHE CURRENT (A)
ID, DRAIN CURRENT (A)
600
STARTING TJ = 150oC
10
0.001
300
0.01
0.1
1
tAV, TIME IN AVALANCHE (ms)
VDS, DRAIN TO SOURCE VOLTAGE (V)
NOTE: Refer to Fairchild Application Notes AN9321 and AN9322.
FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING
CAPABILITY
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
150
120
90
60
TJ = 175oC
TJ = -55oC
30
VGS = 7V
VGS = 6V
VGS = 20V
VGS = 10V
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
VDD = 15V
ID, DRAIN CURRENT (A)
ID, DRAIN CURRENT (A)
150
120
VGS =5V
90
60
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
TC = 25oC
30
TJ = 25oC
0
0
2
3
4
5
VGS, GATE TO SOURCE VOLTAGE (V)
0
6
FIGURE 7. TRANSFER CHARACTERISTICS
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
4
FIGURE 8. SATURATION CHARACTERISTICS
1.2
VGS = 10V, ID = 75A
VGS = VDS, ID = 250µA
2.5
NORMALIZED GATE
THRESHOLD VOLTAGE
NORMALIZED DRAIN TO SOURCE
ON RESISTANCE
3.0
1
2
3
VDS, DRAIN TO SOURCE VOLTAGE (V)
2.0
1.5
1.0
0.8
0.6
1.0
0.4
0.5
-80
-40
0
40
80
120
TJ, JUNCTION TEMPERATURE (oC)
160
FIGURE 9. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
©2001 Fairchild Semiconductor Corporation
200
-80
-40
0
40
80
120
160
200
TJ, JUNCTION TEMPERATURE (oC)
FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGE vs
JUNCTION TEMPERATURE
HUFA75645P3, HUFA75645S3S Rev. B
HUFA75645P3, HUFA75645S3S
Typical Performance Curves
(Continued)
20000
VGS = 0V, f = 1MHz
ID = 250µA
10000
C, CAPACITANCE (pF)
NORMALIZED DRAIN TO SOURCE
BREAKDOWN VOLTAGE
1.2
1.1
1.0
CISS = CGS + CGD
1000
COSS ≅ CDS + CGD
CRSS = CGD
100
0.9
-80
-40
0
40
80
120
160
200
50
0.1
TJ , JUNCTION TEMPERATURE (oC)
1.0
10
100
VDS , DRAIN TO SOURCE VOLTAGE (V)
FIGURE 11. NORMALIZED DRAIN TO SOURCE BREAKDOWN
VOLTAGE vs JUNCTION TEMPERATURE
FIGURE 12. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
VGS , GATE TO SOURCE VOLTAGE (V)
10
VDD = 50V
8
6
4
WAVEFORMS IN
DESCENDING ORDER:
ID = 75A
ID = 50A
ID = 25A
2
0
0
30
60
90
Qg, GATE CHARGE (nC)
120
NOTE: Refer to Fairchild Application Notes AN7254 and AN7260.
FIGURE 13. GATE CHARGE WAVEFORMS FOR CONSTANT GATE CURRENT
©2001 Fairchild Semiconductor Corporation
HUFA75645P3, HUFA75645S3S Rev. B
HUFA75645P3, HUFA75645S3S
Test Circuits and Waveforms
VDS
BVDSS
L
tP
VARY tP TO OBTAIN
REQUIRED PEAK IAS
IAS
+
RG
VDS
VDD
VDD
-
VGS
DUT
tP
0V
IAS
0
0.01Ω
tAV
FIGURE 14. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 15. UNCLAMPED ENERGY WAVEFORMS
VDS
VDD
RL
Qg(TOT)
VDS
VGS = 20V
VGS
Qg(10)
+
VDD
VGS = 10V
VGS
DUT
VGS = 2V
Ig(REF)
0
Qg(TH)
Qgs
Qgd
Ig(REF)
0
FIGURE 16. GATE CHARGE TEST CIRCUIT
FIGURE 17. GATE CHARGE WAVEFORMS
VDS
tON
tOFF
td(ON)
td(OFF)
tr
RL
VDS
tf
90%
90%
+
VGS
VDD
-
10%
10%
0
DUT
90%
RGS
VGS
VGS
0
FIGURE 18. SWITCHING TIME TEST CIRCUIT
©2001 Fairchild Semiconductor Corporation
10%
50%
50%
PULSE WIDTH
FIGURE 19. SWITCHING TIME WAVEFORM
HUFA75645P3, HUFA75645S3S Rev. B
HUFA75645P3, HUFA75645S3S
PSPICE Electrical Model
.SUBCKT HUFA75645 2 1 3 ;
rev 21 May 1999
CA 12 8 5.31e-9
CB 15 14 5.31e-9
CIN 6 8 3.56e-9
DBODY 7 5 DBODYMOD
DBREAK 5 11 DBREAKMOD
DPLCAP 10 5 DPLCAPMOD
LDRAIN
DPLCAP
DRAIN
2
5
10
5
51
ESLC
11
-
RDRAIN
6
8
EVTHRES
+ 19 8
+
LGATE
GATE
1
MMED 16 6 8 8 MMEDMOD
MSTRO 16 6 8 8 MSTROMOD
MWEAK 16 21 8 8 MWEAKMOD
+
17
EBREAK 18
50
ESG
EVTEMP
RGATE +
18 22
9
20
21
DBODY
-
16
MWEAK
6
MMED
MSTRO
RLGATE
LSOURCE
CIN
8
SOURCE
3
7
RSOURCE
RBREAK 17 18 RBREAKMOD 1
RDRAIN 50 16 RDRAINMOD 7.80e-3
RGATE 9 20 0.83
RLDRAIN 2 5 10
RLGATE 1 9 26
RLSOURCE 3 7 11
RSLC1 5 51 RSLCMOD 1e-6
RSLC2 5 50 1e3
RSOURCE 8 7 RSOURCEMOD 1.65e-3
RVTHRES 22 8 RVTHRESMOD 1
RVTEMP 18 19 RVTEMPMOD 1
S1A
S1B
S2A
S2B
DBREAK
+
RSLC2
IT 8 17 1
LDRAIN 2 5 1.0e-9
LGATE 1 9 5.1e-9
LSOURCE 3 7 4.4e-9
RLDRAIN
RSLC1
51
EBREAK 11 7 17 18 115.5
EDS 14 8 5 8 1
EGS 13 8 6 8 1
ESG 6 10 6 8 1
EVTHRES 6 21 19 8 1
EVTEMP 20 6 18 22 1
RLSOURCE
S1A
12
S2A
S1B
CA
17
18
RVTEMP
S2B
13
CB
6
8
EGS
19
VBAT
5
8
EDS
-
-
IT
14
+
+
6 12 13 8 S1AMOD
13 12 13 8 S1BMOD
6 15 14 13 S2AMOD
13 15 14 13 S2BMOD
RBREAK
15
14
13
13
8
-
+
8
22
RVTHRES
VBAT 22 19 DC 1
ESLC 51 50 VALUE={(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*205),3.5))}
.MODEL DBODYMOD D (IS = 3.00e-12 IKF = 19 RS = 1.78e-3 XTI = 5 TRS1 = 2.25e-3 TRS2 = 1.00e-5 CJO = 5.32e-9 TT = 7.4e-8 M = 0.68)
.MODEL DBREAKMOD D (RS = 2.15e-1 IKF = 1 TRS1 = 8e-4 TRS2 = 3e-6)
.MODEL DPLCAPMOD D (CJO = 5.55e-9 IS = 1e-30 M = 0.98)
.MODEL MMEDMOD NMOS (VTO = 3.13 KP = 10 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 0.83)
.MODEL MSTROMOD NMOS (VTO = 3.51 KP = 93 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u)
.MODEL MWEAKMOD NMOS (VTO = 2.65 KP = 0.11 IS = 1e-30 N = 10 TOX = 1 L = 1u W = 1u RG = 8.33 )
.MODEL RBREAKMOD RES (TC1 = 9.9e-4 TC2 = -1.3e-6)
.MODEL RDRAINMOD RES (TC1 = 9.40e-3 TC2 = 2.93e-5)
.MODEL RSLCMOD RES (TC1 = 2.63e-3 TC2 = 1.05e-6)
.MODEL RSOURCEMOD RES (TC1 = 1e-3 TC2 = 1e-6)
.MODEL RVTHRESMOD RES (TC1 = -2.57e-3 TC2 = -7.05e-6)
.MODEL RVTEMPMOD RES (TC1 = -2.87e-3 TC2 = -2.21e-6)
.MODEL S1AMOD VSWITCH (RON = 1e-5
.MODEL S1BMOD VSWITCH (RON = 1e-5
.MODEL S2AMOD VSWITCH (RON = 1e-5
.MODEL S2BMOD VSWITCH (RON = 1e-5
ROFF = 0.1
ROFF = 0.1
ROFF = 0.1
ROFF = 0.1
VON = -6.2 VOFF= -2.4)
VON = -2.4 VOFF= -6.2)
VON = -1.8 VOFF= 0.5)
VON = 0.5 VOFF= -1.8)
.ENDS
NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global
Temperature Options; IEEE Power Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley.
©2001 Fairchild Semiconductor Corporation
HUFA75645P3, HUFA75645S3S Rev. B
HUFA75645P3, HUFA75645S3S
SABER Electrical Model
REV 21 May 1999
template ta75645 n2,n1,n3
electrical n2,n1,n3
{
var i iscl
d..model dbodymod = (is = 3.00e-12, cjo = 5.32e-9, tt = 7.4e-8, xti = 5, m = 0.68)
d..model dbreakmod = ()
d..model dplcapmod = (cjo = 5.55e-9, is = 1e-30, vj=1.0, m = 0.8)
m..model mmedmod = (type=_n, vto = 3.13, kp = 10, is = 1e-30, tox = 1)
m..model mstrongmod = (type=_n, vto = 3.51, kp = 93, is = 1e-30, tox = 1)
m..model mweakmod = (type=_n, vto = 2.65, kp = 0.11, is = 1e-30, tox = 1)
sw_vcsp..model s1amod = (ron = 1e-5, roff = 0.1, von = -6.2, voff = -2.4)
DPLCAP
sw_vcsp..model s1bmod = (ron =1e-5, roff = 0.1, von = -2.4, voff = -6.2)
10
sw_vcsp..model s2amod = (ron = 1e-5, roff = 0.1, von = -1.8, voff = 0.5)
sw_vcsp..model s2bmod = (ron = 1e-5, roff = 0.1, von = 0.5, voff = -1.8)
c.ca n12 n8 = 5.31e-9
c.cb n15 n14 = 5.31e-9
c.cin n6 n8 = 3.56e-9
DRAIN
2
RSLC1
51
RLDRAIN
RDBREAK
RSLC2
72
ISCL
RDRAIN
6
8
ESG
EVTHRES
+ 19 8
+
i.it n8 n17 = 1
LGATE
GATE
1
EVTEMP
RGATE + 18 22
9
20
MWEAK
MSTRO
CIN
DBODY
EBREAK
+
17
18
MMED
m.mmed n16 n6 n8 n8 = model=mmedmod, l=1u, w=1u
m.mstrong n16 n6 n8 n8 = model=mstrongmod, l=1u, w=1u
m.mweak n16 n21 n8 n8 = model=mweakmod, l=1u, w=1u
71
11
16
6
RLGATE
res.rbreak n17 n18 = 1, tc1 = 9.9e-4, tc2 = -1.3e-6
res.rdbody n71 n5 = 1.78e-3, tc1 = 2.25e-3, tc2 = 1.e-5
res.rdbreak n72 n5 = 2.15e-1, tc1 = 8e-4, tc2 = 3e-6
res.rdrain n50 n16 = 7.8e-3, tc1 = 9.4e-3, tc2 = 2.93e-5
res.rgate n9 n20 = 0.83
res.rldrain n2 n5 = 10
res.rlgate n1 n9 = 26
res.rlsource n3 n7 = 11
res.rslc1 n5 n51 = 1e-6, tc1 = 2.63e-3, tc2 = 1.05e-6
res.rslc2 n5 n50 = 1e3
res.rsource n8 n7 = 1.65e-3, tc1 = 1e-3, tc2 = 1e-6
res.rvtemp n18 n19 = 1, tc1 = -2.87e-3, tc2 = -2.21e-6
res.rvthres n22 n8 = 1, tc1 = -2.57e-3, tc2 = -7.05e-6
21
RDBODY
DBREAK
50
-
d.dbody n7 n71 = model=dbodymod
d.dbreak n72 n11 = model=dbreakmod
d.dplcap n10 n5 = model=dplcapmod
l.ldrain n2 n5 = 1e-9
l.lgate n1 n9 = 5.1e-9
l.lsource n3 n7 = 4.4e-9
LDRAIN
5
-
8
LSOURCE
7
SOURCE
3
RSOURCE
RLSOURCE
S1A
12
S2A
13
8
14
13
S1B
CA
RBREAK
15
17
18
RVTEMP
S2B
13
CB
6
8
EGS
19
-
-
IT
14
+
+
VBAT
5
8
EDS
-
+
8
22
RVTHRES
spe.ebreak n11 n7 n17 n18 = 115.5
spe.eds n14 n8 n5 n8 = 1
spe.egs n13 n8 n6 n8 = 1
spe.esg n6 n10 n6 n8 = 1
spe.evtemp n20 n6 n18 n22 = 1
spe.evthres n6 n21 n19 n8 = 1
sw_vcsp.s1a n6 n12 n13 n8 = model=s1amod
sw_vcsp.s1b n13 n12 n13 n8 = model=s1bmod
sw_vcsp.s2a n6 n15 n14 n13 = model=s2amod
sw_vcsp.s2b n13 n15 n14 n13 = model=s2bmod
v.vbat n22 n19 = dc=1
equations {
i (n51->n50) +=iscl
iscl: v(n51,n50) = ((v(n5,n51)/(1e-9+abs(v(n5,n51))))*((abs(v(n5,n51)*1e6/205))** 3.5))
}
}
©2001 Fairchild Semiconductor Corporation
HUFA75645P3, HUFA75645S3S Rev. B
HUFA75645P3, HUFA75645S3S
SPICE Thermal Model
th
JUNCTION
REV 28 July 1999
HUFA75645T
CTHERM1 th 6 8.80e-3
CTHERM2 6 5 2.50e-2
CTHERM3 5 4 2.70e-2
CTHERM4 4 3 3.70e-2
CTHERM5 3 2 4.40e-2
CTHERM6 2 tl 3.40e-1
RTHERM1
RTHERM1 th 6 1.20e-2
RTHERM2 6 5 3.00e-2
RTHERM3 5 4 4.30e-2
RTHERM4 4 3 8.80e-2
RTHERM5 3 2 9.90e-2
RTHERM6 2 tl 1.10e-1
RTHERM2
CTHERM1
6
CTHERM2
5
RTHERM3
CTHERM3
SABER Thermal Model
SABER thermal model HUFA75645T
template thermal_model th tl
thermal_c th, tl
{
ctherm.ctherm1 th 6 = 8.80e-3
ctherm.ctherm2 6 5 = 2.50e-2
ctherm.ctherm3 5 4 = 2.70e-2
ctherm.ctherm4 4 3 = 3.70e-2
ctherm.ctherm5 3 2 = 4.40e-2
ctherm.ctherm6 2 tl = 3.40e-1
rtherm.rtherm1 th 6 = 1.20e-2
rtherm.rtherm2 6 5 = 3.00e-2
rtherm.rtherm3 5 4 = 4.30e-2
rtherm.rtherm4 4 3 = 8.80e-2
rtherm.rtherm5 3 2 = 9.90e-2
rtherm.rtherm6 2 tl = 1.10e-1
}
4
RTHERM4
CTHERM4
3
RTHERM5
CTHERM5
2
RTHERM6
CTHERM6
tl
©2001 Fairchild Semiconductor Corporation
CASE
HUFA75645P3, HUFA75645S3S Rev. B
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Rev. H4