ON MC10175FN Quint latch Datasheet

MC10175
Quint Latch
The MC10175 is a high speed, low power quint latch. It features five
D type latches with common reset and a common two–input clock.
Data is transferred on the negative edge of the clock and latched on the
positive edge. The two clock inputs are “OR”ed together.
Any change on the data input will be reflected at the outputs while
the clock is low. The outputs are latched on the positive transition of
the clock. While the clock is in the high state, a change in the
information present at the data inputs will not affect the output
information. The reset input is enabled only when the clock is in the
high state.
• PD = 400 mW typ/pkg (No Load)
• tpd = 2.5 ns typ (Data to Output)
• tr, tf = 2.0 ns typ (20%–80%)
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MARKING
DIAGRAMS
16
CDIP–16
L SUFFIX
CASE 620
1
16
PDIP–16
P SUFFIX
CASE 648
LOGIC DIAGRAM
D0 10
D
Q
MC10175L
AWLYYWW
14 Q0
MC10175P
AWLYYWW
1
C R
D1 12
D
Q
PLCC–20
FN SUFFIX
CASE 775
15 Q1
C R
D2 13
D
Q
2
Q2
Q
3
Q3
A
WL
YY
WW
C R
1
10175
AWLYYWW
= Assembly Location
= Wafer Lot
= Year
= Work Week
DIP PIN ASSIGNMENT
D3
9
D
C R
D4 5
C0 6
C1 7
RESET 11
D
Q
4
C R
VCC1
1
16
VCC2
Q2
2
15
Q1
Q3
3
14
Q0
Q4
4
13
D2
D4
5
12
D1
C0
6
11
RESET
C1
7
10
D0
VEE
8
9
D3
Q4
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
TRUTH TABLE
D
C0
C1
Reset
Qn+1
L
H
X
X
X
X
L
L
H
X
H
X
L
L
X
H
X
H
X
X
L
L
H
H
L
H
Qn
Qn
L
L
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion Tables
on page 18 of the ON Semiconductor MECL Data Book
(DL122/D).
ORDERING INFORMATION
Device
 Semiconductor Components Industries, LLC, 2002
January, 2002 – Rev. 7
1
Package
Shipping
MC10175L
CDIP–16
25 Units / Rail
MC10175P
PDIP–16
25 Units / Rail
MC10175FN
PLCC–20
46 Units / Rail
Publication Order Number:
MC10175/D
MC10175
ELECTRICAL CHARACTERISTICS
Test Limits
Characteristic
Symbol
Pin
Under
Test
Power Supply Drain Current
IE
8
107
IinH
6
7
10
11
460
460
460
1000
IinL
All
0.5
Input Current
–30°C
Min
+25°C
Max
Min
+85°C
Typ
Max
Max
Unit
78
97
107
mAdc
290
290
290
650
290
290
290
650
µAdc
0.5
Min
µAdc
0.3
Output Voltage
Logic 1
VOH
14
15
–1.060
–1.060
–0.890
–0.890
–0.960
–0.960
–0.810
–0.810
–0.890
–0.890
–0.700
–0.700
Vdc
Output Voltage
Logic 0
VOL
14
15
–1.890
–1.890
–1.675
–1.675
–1.850
–1.850
–1.650
–1.650
–1.825
–1.825
–1.615
–1.615
Vdc
Threshold Voltage
Logic 1
VOHA
14
15
–1.080
–1.080
Threshold Voltage
Logic 0
VOLA
14
15
–0.980
–0.980
–1.655
–1.655
–0.910
–0.910
–1.630
–1.630
Vdc
–1.595
–1.595
Switching Times (50Ω Load)
ns
Data Input
t10+14+
t10–14–
14
14
1.0
1.0
3.6
3.6
1.0
1.0
3.5
3.5
1.0
1.0
3.6
3.6
Clock Input
t6–14+
t6–14–
14
14
1.0
1.0
4.7
4.7
1.0
1.0
4.3
4.3
1.0
1.0
4.4
4.4
Reset Input
t11+4–
t11+14–
4
14
1.0
1.0
4.0
4.0
1.0
1.0
3.9
3.9
1.0
1.0
4.2
4.2
tsetup
thold
14
14
2.5
1.5
Setup TIme
Hold Time
Vdc
2.5
1.5
2.5
1.5
Rise Time
(20 to 80%)
t+
14
1.0
3.6
1.1
3.5
1.1
3.7
Fall Time
(20 to 80%)
t–
14
1.0
3.6
1.1
3.5
1.1
3.7
1. Individually test each input; apply VILmin to pin under test.
2. Output latched to high logic state prior to test.
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2
MC10175
ELECTRICAL CHARACTERISTICS (continued)
TEST VOLTAGE VALUES (Volts)
Characteristic
Power Supply Drain Current
Input Current
@ Test Temperature
VIHmax
VILmin
VIHAmin
VILAmax
VEE
–30°C
–0.890
–1.890
–1.205
–1.500
–5.2
+25°C
–0.810
–1.850
–1.105
–1.475
–5.2
+85°C
–0.700
–1.825
–1.035
–1.440
–5.2
Symbol
Pin
Under
Test
IE
8
IinH
6
7
10
11
IinL
All
TEST VOLTAGE APPLIED TO PINS LISTED BELOW
VIHmax
VEE
(VCC)
Gnd
8
1, 16
8
8
8
8
1, 16
1, 16
1, 16
1, 16
Note 1.
8
1, 16
6
6
8
8
1, 16
1, 16
8
8
1, 16
1, 16
8
8
1, 16
1, 16
10
12
8
8
1, 16
1, 16
VILmin
VILAmax
6
7
10
11
Output Voltage
Logic 1
VOH
14
15
Output Voltage
Logic 0
VOL
14
15
6, 10
6, 12
Threshold Voltage
Logic 1
VOHA
14
15
6
6
Threshold Voltage
Logic 0
VOLA
14
15
6
6
Switching Times
VIHAmin
10
12
(50Ω Load)
+1.11V
10
12
+0.31V
Pulse In
Pulse Out
–3.2 V
+2.0 V
Data Input
t10+14+
t10–14–
14
14
6, 7
6, 7
10
10
14
14
8
8
1, 16
1, 16
Clock Input
t6–14+
t6–14–
14
14
7
7
10, 6
10, 6
14
14
8
8
1, 16
1, 16
Reset Input
t11+4–
t11+14–
4
14
6
6
7, 11
7, 11
4 (2.)
14 (2.)
8
8
1, 16
1, 16
tsetup
thold
14
14
7
7
6, 10
6, 10
14
14
8
8
1, 16
1, 16
Setup TIme
Hold Time
5
10
Rise Time
(20 to 80%)
t+
14
6, 7
10
14
8
1, 16
Fall Time
(20 to 80%)
t–
14
6, 7
10
14
8
1, 16
1. Individually test each input; apply V ILmin to pin under test.
2. Output latched to high logic state prior to test.
Each MECL 10,000 series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is maintained.
Outputs are terminated through a 50–ohm resistor to –2.0 volts. Test procedures are shown for only one gate. The other gates are tested in the
same manner.
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3
MC10175
PACKAGE DIMENSIONS
PLCC–20
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180)
B
Y BRK
–N–
M
T L-M
0.007 (0.180)
U
M
N
S
T L-M
S
G1
0.010 (0.250)
S
N
S
D
–L–
–M–
Z
W
20
D
1
X
V
S
T L-M
S
N
S
VIEW D–D
A
0.007 (0.180)
M
T L-M
S
N
S
R
0.007 (0.180)
M
T L-M
S
N
S
Z
0.007 (0.180)
H
M
T L-M
S
N
S
K1
K
C
E
F
0.004 (0.100)
G
J
–T–
VIEW S
G1
0.010 (0.250) S T L-M
S
N
S
0.007 (0.180)
M
T L-M
S
VIEW S
SEATING
PLANE
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM -T-, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
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4
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
--0.025
--0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
--0.020
2
10 0.310
0.330
0.040
---
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
--0.64
--8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
--0.50
2
10 7.88
8.38
1.02
---
N
S
MC10175
PACKAGE DIMENSIONS
–A–
16
9
1
8
–B–
CDIP–16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE T
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
16 PL
0.25 (0.010)
16 PL
0.25 (0.010)
M
T A
T B
M
S
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
–A–
16
9
1
8
B
F
C
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
S
T A
M
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5
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
--0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0
15 0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
--5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0
15 0.51
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0
10 0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0
10 0.51
1.01
MC10175
Notes
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6
MC10175
Notes
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7
MC10175
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
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8
MC10175/D
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