TI LM331N Lm231a/lm231/lm331a/lm331 precision voltage-to-frequency converter Datasheet

LM231, LM331
www.ti.com
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
LM231A/LM231/LM331A/LM331 Precision Voltage-to-Frequency Converters
Check for Samples: LM231, LM331
FEATURES
DESCRIPTION
•
•
The LM231/LM331 family of voltage-to-frequency
converters are ideally suited for use in simple lowcost circuits for analog-to-digital conversion, precision
frequency-to-voltage
conversion,
long-term
integration,
linear
frequency
modulation
or
demodulation, and many other functions. The output
when used as a voltage-to-frequency converter is a
pulse train at a frequency precisely proportional to the
applied input voltage. Thus, it provides all the
inherent advantages of the voltage-to-frequency
conversion techniques, and is easy to apply in all
standard voltage-to-frequency converter applications.
Further, the LM231A/LM331A attain a new high level
of accuracy versus temperature which could only be
attained
with
expensive
voltage-to-frequency
modules. Additionally the LM231/331 are ideally
suited for use in digital systems at low power supply
voltages and can provide low-cost analog-to-digital
conversion in microprocessor-controlled systems.
And, the frequency from a battery powered voltageto-frequency converter can be easily channeled
through a simple photo isolator to provide isolation
against high common mode levels.
1
23
•
•
•
•
•
•
•
•
Ensured Linearity 0.01% max
Improved Performance in Existing Voltage-toFrequency Conversion Applications
Split or Single Supply Operation
Operates on Single 5V Supply
Pulse Output Compatible with All Logic Forms
Excellent Temperature Stability: ±50 ppm/°C
max
Low Power Consumption: 15 mW Typical at 5V
Wide Dynamic Range, 100 dB min at 10 kHz
Full Scale Frequency
Wide Range of Full Scale Frequency: 1 Hz to
100 kHz
Low Cost
The LM231/LM331 utilize a new temperaturecompensated band-gap reference circuit, to provide
excellent accuracy over the full operating temperature
range, at power supplies as low as 4.0V. The
precision timer circuit has low bias currents without
degrading the quick response necessary for 100 kHz
voltage-to-frequency conversion. And the output are
capable of driving 3 TTL loads, or a high voltage
output up to 40V, yet is short-circuit-proof against
VCC.
CONNECTION DIAGRAM
Figure 1. Plastic Dual-In-Line Package (PDIP)
See Package Number P (R-PDIP-T8)
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Teflon is a registered trademark of E.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM231, LM331
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2) (3)
Supply Voltage, VS
40V
Output Short Circuit to Ground
Continuous
Output Short Circuit to VCC
Continuous
−0.2V to +VS
Input Voltage
Package Dissipation at 25°C
1.25W
(4)
Lead Temperature (Soldering, 10 sec.)
PDIP
260°C
ESD Susceptibility
(1)
(2)
(3)
(4)
(5)
(5)
500V
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not
apply when operating the device beyond its specified operating conditions.
All voltages are measured with respect to GND = 0V, unless otherwise noted.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature TA, and can be calculated using the formula
PDmax = (TJmax - TA) / θJA. The values for maximum power dissipation will be reached only when the device is operated in a severe
fault condition (e.g., when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed).
Obviously, such conditions should always be avoided.
Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Operating Ratings
(1)
Operating Ambient Temperature
LM231, LM231A
−25°C to +85°C
LM331, LM331A
0°C to +70°C
Supply Voltage, VS
+4V to +40V
(1)
All voltages are measured with respect to GND = 0V, unless otherwise noted.
Package Thermal Resistance
Package
θJ-A
8-Lead PDIP
100°C/W
Electrical Characteristics
All specifications apply in the circuit of Figure 16, with 4.0V ≤ VS ≤ 40V, TA=25°C, unless otherwise specified.
Parameter
VFC Non-Linearity
(1)
VFC Non-Linearity in Circuit of Figure 15
Conditions
Min
Typ
Max
Units
4.5V ≤ VS ≤ 20V
±0.003
±0.01
% Full- Scale
TMIN ≤ TA ≤ TMAX
±0.006
±0.02
% Full- Scale
VS = 15V, f = 10 Hz to 11 kHz
±0.024
±0.14
%Full- Scale
0.95
1.00
1.05
kHz/V
0.90
1.00
1.10
kHz/V
±30
±150
ppm/°C
±20
±50
ppm/°C
0.01
0.1
%/V
0.006
0.06
%/V
Conversion Accuracy Scale Factor (Gain)
LM231, LM231A
VIN = −10V, RS = 14 kΩ
LM331, LM331A
Temperature Stability of Gain
LM231/LM331
TMIN ≤ TA ≤ TMAX, 4.5V ≤ VS ≤ 20V
LM231A/LM331A
Change of Gain with VS
4.5V ≤ VS ≤ 10V
10V ≤ VS ≤ 40V
Rated Full-Scale Frequency
VIN = −10V
Gain Stability vs. Time (1000 Hours)
TMIN ≤ TA ≤ TMAX
(1)
2
10.0
kHz
±0.02
% Full- Scale
Nonlinearity is defined as the deviation of fOUT from VIN × (10 kHz/−10 VDC) when the circuit has been trimmed for zero error at 10 Hz
and at 10 kHz, over the frequency range 1 Hz to 11 kHz. For the timing capacitor, CT, use NPO ceramic, Teflon®, or polystyrene.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
LM231, LM331
www.ti.com
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
Electrical Characteristics (continued)
All specifications apply in the circuit of Figure 16, with 4.0V ≤ VS ≤ 40V, TA=25°C, unless otherwise specified.
Parameter
Over Range (Beyond Full-Scale) Frequency
Conditions
VIN = −11V
Min
Typ
Max
10
Units
%
INPUT COMPARATOR
Offset Voltage
LM231/LM331
TMIN ≤ TA ≤ TMAX
LM231A/LM331A
TMIN ≤ TA ≤ TMAX
±3
±10
mV
±4
±14
mV
±3
±10
mV
Bias Current
−80
−300
nA
Offset Current
±8
±100
nA
VCC−2.
0
V
0.667
0.70
× VS
Common-Mode Range
TMIN ≤ TA ≤ TMAX
−0.2
TIMER
Timer Threshold Voltage, Pin 5
Input Bias Current, Pin 5
0.63
VS = 15V
All Devices
0V ≤ VPIN 5 ≤ 9.9V
±10
±100
nA
LM231/LM331
VPIN 5 = 10V
200
1000
nA
LM231A/LM331A
VPIN 5 = 10V
200
500
nA
I = 5 mA
0.22
0.5
V
126
135
144
μA
116
136
156
μA
0.2
1.0
μA
0.02
10.0
nA
2.0
50.0
nA
VSAT PIN 5 (Reset)
CURRENT SOURCE (Pin 1)
Output Current
LM231, LM231A
RS = 14 kΩ, VPIN 1 = 0
LM331, LM331A
Change with Voltage
0V ≤ VPIN 1 ≤ 10V
Current Source OFF Leakage
LM231, LM231A, LM331, LM331A
All Devices
TA = TMAX
Operating Range of Current (Typical)
μA
(10 to 500)
REFERENCE VOLTAGE (Pin 2)
LM231, LM231A
1.76
1.89
2.02
LM331, LM331A
1.70
1.89
2.08
VDC
VDC
Stability vs. Temperature
±60
ppm/°C
Stability vs. Time, 1000 Hours
±0.1
%
LOGIC OUTPUT (Pin 3)
VSAT
I = 5 mA
0.15
0.50
V
I = 3.2 mA (2 TTL Loads), TMIN ≤ TA ≤
TMAX
0.10
0.40
V
±0.05
1.0
μA
OFF Leakage
SUPPLY CURRENT
LM231, LM231A
LM331, LM331A
VS = 5V
2.0
3.0
4.0
mA
VS = 40V
2.5
4.0
6.0
mA
VS = 5V
1.5
3.0
6.0
mA
VS = 40V
2.0
4.0
8.0
mA
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
3
LM231, LM331
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
Pin numbers apply to 8-pin packages only.
4
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
LM231, LM331
www.ti.com
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
TYPICAL PERFORMANCE CHARACTERISTICS
(All electrical characteristics apply for the circuit of Figure 16, unless otherwise noted.)
Nonlinearity Error
as Precision V-to-F
Converter (Figure 16)
Nonlinearity Error
Figure 2.
Figure 3.
Nonlinearity Error
vs.
Power
Supply Voltage
Frequency
vs.
Temperature
Figure 4.
Figure 5.
VREF
vs.
Temperature
Output Frequency
vs.
VSUPPLY
Figure 6.
Figure 7.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
5
LM231, LM331
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
(All electrical characteristics apply for the circuit of Figure 16, unless otherwise noted.)
6
100 kHz Nonlinearity Error
(Figure 17)
Nonlinearity Error
(Figure 15)
Figure 8.
Figure 9.
Input Current (Pins 6,7) vs.
Temperature
Power Drain
vs.
VSUPPLY
Figure 10.
Figure 11.
Output Saturation Voltage vs.
IOUT (Pin 3)
Nonlinearity Error, Precision
F-to-V Converter (Figure 19)
Figure 12.
Figure 13.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
LM231, LM331
www.ti.com
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
APPLICATIONS INFORMATION
PRINCIPLES OF OPERATION
The LM231/331 are monolithic circuits designed for accuracy and versatile operation when applied as voltage-tofrequency (V-to-F) converters or as frequency-to-voltage (F-to-V) converters. A simplified block diagram of the
LM231/331 is shown in Figure 14 and consists of a switched current source, input comparator, and 1-shot timer.
Figure 14. Simplified Block Diagram of Stand-Alone
Voltage-to-Frequency Converter and
External Components
Simplified Voltage-to-Frequency Converter
The operation of these blocks is best understood by going through the operating cycle of the basic V-to-F
converter, Figure 14, which consists of the simplified block diagram of the LM231/331 and the various resistors
and capacitors connected to it.
The voltage comparator compares a positive input voltage, V1, at pin 7 to the voltage, Vx, at pin 6. If V1 is
greater, the comparator will trigger the 1-shot timer. The output of the timer will turn ON both the frequency
output transistor and the switched current source for a period t=1.1 RtCt. During this period, the current i will flow
out of the switched current source and provide a fixed amount of charge, Q = i × t, into the capacitor, CL. This will
normally charge Vx up to a higher level than V1. At the end of the timing period, the current i will turn OFF, and
the timer will reset itself.
Now there is no current flowing from pin 1, and the capacitor CL will be gradually discharged by RL until Vx falls
to the level of V1. Then the comparator will trigger the timer and start another cycle.
The current flowing into CL is exactly IAVE = i × (1.1×RtCt) × f, and the current flowing out of CL is exactly Vx/RL ≃
VIN/RL. If VIN is doubled, the frequency will double to maintain this balance. Even a simple V-to-F converter can
provide a frequency precisely proportional to its input voltage over a wide range of frequencies.
Detail of Operation, Functional Block Diagram
The block diagram (FUNCTIONAL BLOCK DIAGRAM) shows a band gap reference which provides a stable 1.9
VDC output. This 1.9 VDC is well regulated over a VS range of 3.9V to 40V. It also has a flat, low temperature
coefficient, and typically changes less than ½% over a 100°C temperature change.
The current pump circuit forces the voltage at pin 2 to be at 1.9V, and causes a current i=1.90V/RS to flow. For
Rs=14k, i=135 μA. The precision current reflector provides a current equal to i to the current switch. The current
switch switches the current to pin 1 or to ground, depending upon the state of the RS flip-flop.
The timing function consists of an RS flip-flop and a timer comparator connected to the external RtCt network.
When the input comparator detects a voltage at pin 7 higher than pin 6, it sets the RS flip-flop which turns ON the
current switch and the output driver transistor. When the voltage at pin 5 rises to ⅔ VCC, the timer comparator
causes the RS flip-flop to reset. The reset transistor is then turned ON and the current switch is turned OFF.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
7
LM231, LM331
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
www.ti.com
However, if the input comparator still detects pin 7 higher than pin 6 when pin 5 crosses ⅔ VCC, the flip-flop will
not be reset, and the current at pin 1 will continue to flow, trying to make the voltage at pin 6 higher than pin 7.
This condition will usually apply under start-up conditions or in the case of an overload voltage at signal input.
During this sort of overload the output frequency will be 0. As soon as the signal is restored to the working range,
the output frequency will be resumed.
The output driver transistor acts to saturate pin 3 with an ON resistance of about 50Ω. In case of over voltage,
the output current is actively limited to less than 50 mA.
The voltage at pin 2 is regulated at 1.90 VDC for all values of i between 10 μA to 500 μA. It can be used as a
voltage reference for other components, but care must be taken to ensure that current is not taken from it which
could reduce the accuracy of the converter.
Basic Voltage-to-Frequency Converter (Figure 15)
The simple stand-alone V-to-F converter shown in Figure 15 includes all the basic circuitry of Figure 14 plus a
few components for improved performance.
A resistor, RIN=100 kΩ ±10%, has been added in the path to pin 7, so that the bias current at pin 7 (−80 nA
typical) will cancel the effect of the bias current at pin 6 and help provide minimum frequency offset.
The resistance RS at pin 2 is made up of a 12 kΩ fixed resistor plus a 5 kΩ (cermet, preferably) gain adjust
rheostat. The function of this adjustment is to trim out the gain tolerance of the LM231/331, and the tolerance of
Rt, RL and Ct.
For best results, all the components should be stable low-temperature-coefficient components, such as metal-film
resistors. The capacitor should have low dielectric absorption; depending on the temperature characteristics
desired, NPO ceramic, polystyrene, Teflon or polypropylene are best suited.
A capacitor CIN is added from pin 7 to ground to act as a filter for VIN. A value of 0.01 μF to 0.1 μF will be
adequate in most cases; however, in cases where better filtering is required, a 1 μF capacitor can be used.
When the RC time constants are matched at pin 6 and pin 7, a voltage step at VIN will cause a step change in
fOUT. If CIN is much less than CL, a step at VIN may cause fOUT to stop momentarily.
A 47Ω resistor, in series with the 1 μF CL, provides hysteresis, which helps the input comparator provide the
excellent linearity.
*Use stable components with low temperature coefficients. See APPLICATIONS INFORMATION.
**0.1μF or 1μF, See PRINCIPLES OF OPERATION.
Figure 15. Simple Stand-Alone V-to-F Converter
with ±0.03% Typical Linearity (f = 10 Hz to 11 kHz)
8
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
LM231, LM331
www.ti.com
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
Details of Operation: Precision V-To-F Converter (Figure 16)
In this circuit, integration is performed by using a conventional operational amplifier and feedback capacitor, CF.
When the integrator's output crosses the nominal threshold level at pin 6 of the LM231/331, the timing cycle is
initiated.
The average current fed into the op-amp's summing point (pin 2) is i × (1.1 RtCt) × f which is perfectly balanced
with −VIN/RIN. In this circuit, the voltage offset of the LM231/331 input comparator does not affect the offset or
accuracy of the V-to-F converter as it does in the stand-alone V-to-F converter; nor does the LM231/331 bias
current or offset current. Instead, the offset voltage and offset current of the operational amplifier are the only
limits on how small the signal can be accurately converted. Since op-amps with voltage offset well below 1 mV
and offset currents well below 2 nA are available at low cost, this circuit is recommended for best accuracy for
small signals. This circuit also responds immediately to any change of input signal (which a stand-alone circuit
does not) so that the output frequency will be an accurate representation of VIN, as quickly as 2 output pulses'
spacing can be measured.
In the precision mode, excellent linearity is obtained because the current source (pin 1) is always at ground
potential and that voltage does not vary with VIN or fOUT. (In the stand-alone V-to-F converter, a major cause of
non-linearity is the output impedance at pin 1 which causes i to change as a function of VIN).
The circuit of Figure 17 operates in the same way as Figure 16, but with the necessary changes for high speed
operation.
*Use stable components with low temperature coefficients. See APPLICATIONS INFORMATION.
**This resistor can be 5 kΩ or 10 kΩ for VS=8V to 22V, but must be 10 kΩ for VS=4.5V to 8V.
***Use low offset voltage and low offset current op-amps for A1: recommended type LF411A
Figure 16. Standard Test Circuit and Applications Circuit, Precision Voltage-to-Frequency Converter
DETAILS OF OPERATION: F-to-V CONVERTERS
(Figure 18 and Figure 19)
In these applications, a pulse input at fIN is differentiated by a C-R network and the negative-going edge at pin 6
causes the input comparator to trigger the timer circuit. Just as with a V-to-F converter, the average current
flowing out of pin 1 is IAVERAGE = i × (1.1 RtCt) × f.
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
9
LM231, LM331
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
www.ti.com
In the simple circuit of Figure 18, this current is filtered in the network RL = 100 kΩ and 1 μF. The ripple will be
less than 10 mV peak, but the response will be slow, with a 0.1 second time constant, and settling of 0.7 second
to 0.1% accuracy.
In the precision circuit, an operational amplifier provides a buffered output and also acts as a 2-pole filter. The
ripple will be less than 5 mV peak for all frequencies above 1 kHz, and the response time will be much quicker
than in Figure 18. However, for input frequencies below 200 Hz, this circuit will have worse ripple than Figure 18.
The engineering of the filter time-constants to get adequate response and small enough ripple simply requires a
study of the compromises to be made. Inherently, V-to-F converter response can be fast, but F-to-V response
can not.
*Use stable components with low temperature coefficients.
See APPLICATIONS INFORMATION.
**This resistor can be 5 kΩ or 10 kΩ for VS=8V to 22V, but must be 10 kΩ for VS=4.5V to 8V.
***Use low offset voltage and low offset current op-amps for A1: recommended types LF411A or LF356.
Figure 17. Precision Voltage-to-Frequency Converter,
100 kHz Full-Scale, ±0.03% Non-Linearity
*Use stable components with low temperature coefficients.
Figure 18. Simple Frequency-to-Voltage Converter,
10 kHz Full-Scale, ±0.06% Non-Linearity
10
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
LM231, LM331
www.ti.com
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
*Use stable components with low temperature coefficients.
Figure 19. Precision Frequency-to-Voltage Converter,
10 kHz Full-Scale with 2-Pole Filter, ±0.01%
Non-Linearity Maximum
*L14F-1, L14G-1 or L14H-1, photo transistor (General Electric Co.) or similar
Figure 20. Light Intensity to Frequency Converter
Figure 21. Temperature to Frequency Converter
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
11
LM231, LM331
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
www.ti.com
Figure 22. Long-Term Digital Integrator Using VFC
Figure 23. Basic Analog-to-Digital Converter Using
Voltage-to-Frequency Converter
Figure 24. Analog-to-Digital Converter with Microprocessor
Figure 25. Remote Voltage-to-Frequency Converter with 2-Wire Transmitter and Receiver
12
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
LM231, LM331
www.ti.com
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
Figure 26. Voltage-to-Frequency Converter with Square-Wave Output Using ÷ 2 Flip-Flop
Figure 27. Voltage-to-Frequency Converter with Isolators
Figure 28. Voltage-to-Frequency Converter with Isolators
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
13
LM231, LM331
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
www.ti.com
Figure 29. Voltage-to-Frequency Converter with Isolators
Figure 30. Voltage-to-Frequency Converter with Isolators
14
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
LM231, LM331
www.ti.com
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
Schematic Diagram
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
15
LM231, LM331
SNOSBI2B – JUNE 1999 – REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Revision A (March 2013) to Revision B
•
16
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 15
Submit Documentation Feedback
Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM231 LM331
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LM231AN
NRND
PDIP
P
8
40
TBD
Call TI
Call TI
-25 to 85
LM
231AN
LM231AN/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-25 to 85
LM
231AN
LM231N
NRND
PDIP
P
8
40
TBD
Call TI
Call TI
-25 to 85
LM
231N
LM231N/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-NA-UNLIM
-25 to 85
LM
231N
LM331AN
NRND
PDIP
P
8
40
TBD
Call TI
Call TI
LM
331AN
LM331AN/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
LM
331AN
LM331N
NRND
PDIP
P
8
40
TBD
Call TI
Call TI
0 to 70
LM
331N
LM331N/NOPB
ACTIVE
PDIP
P
8
40
Green (RoHS
& no Sb/Br)
SN | CU SN
Level-1-NA-UNLIM
0 to 70
LM
331N
RC4151NB
NRND
PDIP
P
8
40
TBD
Call TI
Call TI
0 to 70
LM
331N
RV4151NB
NRND
PDIP
P
8
40
TBD
Call TI
Call TI
-25 to 85
LM
231N
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Nov-2013
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated