TI1 LM5050-1 High side or-ing fet controller Datasheet

LM5050-1, LM5050-1-Q1
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SNVS629D – MAY 2011 – REVISED JUNE 2013
LM5050-1/LM5050-1-Q1 High Side OR-ing FET Controller
Check for Samples: LM5050-1, LM5050-1-Q1
FEATURES
DESCRIPTION
•
The LM5050-1 High Side OR-ing FET Controller
operates in conjunction with an external MOSFET as
an ideal diode rectifier when connected in series with
a power source. This ORing controller allows
MOSFETs to replace diode rectifiers in power
distribution networks thus reducing both power loss
and voltage drops.
1
2
•
•
•
•
•
•
•
Available in Standard and AEC-Q100 Qualified
Versions LM5050Q0MK-1 (up to 150°C TJ) and
LM5050Q1MK-1 (up to 125°C TJ)
Wide Operating Input Voltage Range, VIN: 5V to
75V
+100 Volt Transient Capability
Charge Pump Gate Driver for External NChannel MOSFET
Fast 50ns Response to Current Reversal
2A Peak Gate Turn-Off Current
Minimum VDS Clamp for Faster Turn-Off
Package: SOT-6 (Thin SOT-23-6)
The LM5050-1 controller provides charge pump gate
drive for an external N-Channel MOSFET and a fast
response comparator to turn off the FET when
current flows in the reverse direction. The LM5050-1
can connect power supplies ranging from +5V to
+75V and can withstand transients up to +100V.
APPLICATIONS
•
Active OR-ing of Redundant (N+1) Power
Supplies
Typical Application Circuits
VIN
VOUT
+5.0V to +75V
100:
IN
OUT
GATE
VS
LM5050-1
Shutdown
Low= FET On, High= FET Off
OFF
0.1 PF
GND
GND
GND
Figure 1. Full Application
PS1
IN
GATE OUT
LM5050-1 VS
GND
CLOAD
PS2
IN
RLOAD
GATE OUT
LM5050-1 VS
GND
Figure 2. Typical Redundant Supply Configuration
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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Connection Diagram
GND 2
OFF 3
LM5050MK-1
VS 1
6 OUT
5 GATE
4 IN
Figure 3. LM5050MK-1
Top View
SOT-6 Package
Package Number DDC0006A
PIN DESCRIPTIONS
2
Pin No.
Name
Function
1
VS
The main supply pin for all internal biasing and an auxiliary supply for the internal gate drive charge
pump. Typically connected to either VOUT or VIN, a separate supply can also be used.
2
GND
Ground return for the controller
3
OFF
A logic high state at the OFF pin will pull the GATE pin low and turn off the external MOSFET.
4
IN
5
GATE
Connection to the external MOSFET Gate.
6
OUT
Voltage sense connection to the external MOSFET Drain pin.
Voltage sense connection to the external MOSFET Source pin.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS (1)
IN, OUT Pins to Ground (2)
-0.3V to 100V
GATE Pin to Ground (2)
-0.3V to 100V
VS Pin to Ground
-0.3V to 100V
OFF Pin to Ground
-0.3V to 7V
−65°C to 150°C
Storage Temperature Range
HBM (3)
ESD
MM
2 kV
(4)
150V
Peak Reflow Temperature (5)
(1)
(2)
(3)
(4)
(5)
260°C, 30sec
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including in-operability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. Operating Range conditions indicate
the conditions at which the device is functional and the device should not be operated beyond such conditions. For ensured
specifications and conditions, see the Electrical Characteristics table.
The GATE pin voltage is typically 12V above the IN pin voltage when the LM5050-1 is enabled (i.e. OFF Pin is Open or Low, and VIN >
VOUT). Therefore, the Absolute Maximum Rating for the IN pin voltage applies only when the LM5050-1 is disabled (i.e. OFF Pin is logic
high), or for a momentary surge to that voltage since the Absolute Maximum Rating for the GATE pin is also 100V
The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. Applicable test standard is
JESD-22-A114-C.
The Machine Model (MM) is a 200 pF capacitor discharged through a 0Ω resistor (i.e. directly) into each pin. Applicable test standard is
JESD-A115-A.
For soldering specifications see the LM5050-1 Product Folder at www.ti.com, general information at www.ti.com/packaging, and reflow
information in literature number SNOA549.
OPERATING RATINGS (1)
IN, OUT, VS Pins
5.0V to 75V
OFF Pin
0.0V to 5.5V
Junction Temperature Range (TJ)
(1)
Standard Grade
−40°C to +125°C
LM5050Q0MK-1
−40°C to +150°C
LM5050Q1MK-1
−40°C to +125°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including in-operability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. Operating Range conditions indicate
the conditions at which the device is functional and the device should not be operated beyond such conditions. For ensured
specifications and conditions, see the Electrical Characteristics table.
ELECTRICAL CHARACTERISTICS
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the appropriate operating junction
temperature (TJ) range of -40°C to +125°C (LM5050MK-1, LM5050Q1MK-1) or -40°C to +150°C (LM5050Q0MK-1). Minimum
and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely
parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions
apply: VIN = 12.0V, VVS = VIN, VOUT = VIN, VOFF = 0.0V, CGATE= 47 nF, and TJ = 25°C.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
5.0
-
75.0
V
VVS= 5.0V, VIN = 5.0V
VOUT = VIN - 100 mV
-
75
105
VVS= 12.0V, VIN = 12.0V
VOUT = VIN - 100 mV
-
100
147
VVS= 75.0V, VIN = 75.0V
VOUT = VIN - 100 mV
-
130
288
5.0
-
75.0
VS Pin
VVS
IVS
Operating Supply Voltage
Range
-
Operating Supply Current
μA
IN Pin
VIN
Operating Input Voltage Range
-
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ELECTRICAL CHARACTERISTICS (continued)
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the appropriate operating junction
temperature (TJ) range of -40°C to +125°C (LM5050MK-1, LM5050Q1MK-1) or -40°C to +150°C (LM5050Q0MK-1). Minimum
and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely
parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions
apply: VIN = 12.0V, VVS = VIN, VOUT = VIN, VOFF = 0.0V, CGATE= 47 nF, and TJ = 25°C.
Symbol
IIN
Parameter
Conditions
Min
Typ
Max
32
190
305
LM5050MK-1,
LM5050Q1MK-1
233
320
400
LM5050Q0MK-1
233
320
475
5.0
-
75.0
V
µA
VIN = 5.0V
VVS= VIN
VOUT = VIN - 100 mV
GATE = Open
IN Pin current
VIN = 12.0V to 75.0V
VVS= VIN
VOUT = VIN - 100 mV
GATE = Open
Unit
μA
OUT Pin
VOUT
Operating Output Voltage
Range
-
IOUT
OUT Pin Current
VIN = 5.0V to 75.0V
VVS= VIN
VOUT = VIN - 100 mV
-
3.2
8
VIN = 5.0V
VVS = VIN
VGATE = VIN
VOUT = VIN - 175 mV
12
30
41
VIN = 12.0V to 75.0V
VVS = VIN
VGATE = VIN
VOUT = VIN - 175 mV
20
32
41
VIN = 5.0V
VVS = VIN
VOUT = VIN - 175 mV
4.0
7
9.0
VIN = 12.0V to 75.0V
VVS = VIN
VOUT = VIN - 175 mV
9.0
12
14.0
-
25
85
GATE Pin
IGATE(ON)
VGS
V
CGATE = 0 (2)
Gate Capacitance Discharge
Time at Forward to Reverse
Transition
See Figure 4
-
60
-
CGATE = 47 nF (2)
-
180
350
tGATE(OFF)
Gate Capacitance
DischargeTime at OFF pin Low
to High Transition
See Figure 5
CGATE = 47 nF (3)
-
486
-
ns
IGATE(OFF)
Gate Pin Sink Current
VGATE = VIN + 3V
VOUT > VIN + 100 mV
t ≤ 10ms
LM5050MK-1,
LM5050Q1MK-1
1.8
2.8
-
A
LM5050Q0MK-1
1.4
2.8
-41
-28
-16
mV
mV
VSD(REV)
Reverse VSD Threshold
VIN < VOUT
ΔVSD(REV)
Reverse VSD Hysteresis
VSD(REG)
4
VGATE - VIN in Forward
Operation (1)
µA
(2)
tGATE(REV)
(1)
(2)
(3)
Gate Pin Source Current
Regulated Forward VSD
Threshold
VIN > VOUT
CGATE = 10 nF
VIN - VOUT
-
10
-
VIN = 5.0V
VVS = VIN
VIN - VOUT
LM5050MK-1,
LM5050Q1MK-1
1
19
37
LM5050Q0MK-1
1
19
60
VIN = 12.0V
VVS = VIN
VIN - VOUT
LM5050MK-1,
LM5050Q1MK-1
4.4
22
37
LM5050Q0MK-1
4.4
22
60
ns
mV
Measurement of VGS voltage (i.e. VGATE - VIN) includes 1 MΩ in parallel with CGATE.
Time from VIN-VOUT voltage transition from 200 mV to -500 mV until GATE pin voltage falls to VIN + 1V. See Figure 4.
Time from VOFF voltage transition from 0.0V to 5.0V until GATE pin voltage falls to VIN + 1V. See Figure 5
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ELECTRICAL CHARACTERISTICS (continued)
Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the appropriate operating junction
temperature (TJ) range of -40°C to +125°C (LM5050MK-1, LM5050Q1MK-1) or -40°C to +150°C (LM5050Q0MK-1). Minimum
and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely
parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions
apply: VIN = 12.0V, VVS = VIN, VOUT = VIN, VOFF = 0.0V, CGATE= 47 nF, and TJ = 25°C.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
OFF Pin
VOFF(IH)
OFF Input High Threshold
Voltage
VOUT = VIN-500 mV
VOFF Rising
-
1.56
1.75
VOFF(IL)
OFF Input Low Threshold
Voltage
VOUT = VIN - 500 mV
VOFF Falling
1.10
1.40
-
ΔVOFF
OFF Threshold Voltage
Hysteresis
VOFF(IH) - VOFF(IL)
-
155
-
VOFF = 4.5V
3.0
5
7.0
VOFF = 5.0V
-
8
-
IOFF
OFF Pin Internal Pull-down
V
mV
µA
VIN - VOUT
200 mV
VSD(REG)
0 mV
VIN > VOUT
VSD(REV)
VIN < VOUT
-500 mV
VGATE - VIN
tGATE(OFF)
VGATE
1.0V
0.0V
Figure 4. Gate Off Timing for Forward to Reverse Transition
VOFF
5.0V
VOFF(IH)
VOFF(IL)
0.0V
VGATE - VIN
tGATE(OFF)
VGATE
1.0V
0.0V
Figure 5. Gate Off Timing for OFF pin Low to High Transition
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TYPICAL PERFORMANCE CHARACTERISTICS
Unless otherwise stated: VVS = 12V, VIN = 12V, VOFF = 0.0V, and TJ = 25°C
6
IIN vs VIN
IIN vs VIN
Figure 6.
Figure 7.
IOUT vs VOUT
IOUT vs VOUT
Figure 8.
Figure 9.
IVS vs VVS
IVS vs VVS
Figure 10.
Figure 11.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
(VGATE - VIN)
vs
VIN, VVS = VOUT
(VGATE - VIN)
vs
VIN, VVS = VOUT
Figure 12.
Figure 13.
Forward CGATE Charge Time, CGATE = 47 nF
26
Vin
Vout
24
Vgate
Reverse CGATE Discharge, CGATE = 47 nF
26
Vin
Vout
24
Vgate
22
22
20
VOLTS (V)
VOLTS (V)
Unless otherwise stated: VVS = 12V, VIN = 12V, VOFF = 0.0V, and TJ = 25°C
18
16
20
18
16
14
14
12
12
10
10
-5
0
5
10
15
20
TIME (5ms / DIV)
Figure 14.
25
30
-50
0
50
100 150
TIME (50ns / DIV)
Figure 15.
200
VGATE - VIN
vs
Temperature
tGATE(REV) vs Temperature
Figure 16.
Figure 17.
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250
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Unless otherwise stated: VVS = 12V, VIN = 12V, VOFF = 0.0V, and TJ = 25°C
8
OFF Pin Thresholds vs Temperature
OFF Pin Pull-Down vs Temperature
Figure 18.
Figure 19.
CGATE Charge and Discharge vs OFF Pin
OFF Pin, On to Off Transition
Figure 20.
Figure 21.
OFF Pin, Off to On Transition
GATE Pin
vs
(RDS(ON) x IDS)
Figure 22.
Figure 23.
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BLOCK DIAGRAM
INPUT
LOAD
IN
GATE
OUT
14V
30 µA
30 mV
+ -
35 µA
30 mV
-
+12V Charge
Pump
2A
MOSFET Off
Reverse
Comparator
+
Bias
Circuitry
VS
OFF
5 µA
+
1.5V
-
GND
LM5050- 1
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APPLICATIONS INFORMATION
FUNCTIONAL DESCRIPTION
Systems that require high availability often use multiple, parallel-connected redundant power supplies to improve
reliability. Schottky OR-ing diodes are typically used to connect these redundant power supplies to a common
point at the load. The disadvantage of using OR-ing diodes is the forward voltage drop, which reduces the
available voltage and the associated power losses as load currents increase. Using an N-channel MOSFET to
replace the OR-ing diode requires a small increase in the level of complexity, but reduces, or eliminates, the
need for diode heat sinks or large thermal copper area in circuit board layouts for high power applications.
PS1
CLOAD
RLOAD
PS2
Figure 24. OR-ing with Diodes
The LM5050-1 is a positive voltage (i.e. high-side) OR-ing controller that will drive an external N-channel
MOSFET to replace an OR-ing diode. The voltage across the MOSFET source and drain pins is monitored by
the LM5050-1 at the IN and OUT pins, while the GATE pin drives the MOSFET to control its operation based on
the monitored source-drain voltage. The resulting behavior is that of an ideal rectifier with source and drain pins
of the MOSFET acting as the anode and cathode pins of a diode respectively.
PS1
IN
GATE OUT
LM5050-1 VS
GND
CLOAD
PS2
IN
RLOAD
GATE OUT
LM5050-1 VS
GND
Figure 25. OR-ing with MOSFETs
IN, GATE AND OUT PINS
When power is initially applied, the load current will flow from source to drain through the body diode of the
MOSFET. The resulting voltage across the body diode will be detected at the LM5050-1 IN and OUT pins which
then begins charging the MOSFET gate through a 32 µA (typical) charge pump current source . In normal
operation, the gate of the MOSFET is charged until it reaches the clamping voltage of the 12V GATE to IN pin
zener diode internal to the LM5050-1.
The LM5050-1 is designed to regulate the MOSFET gate- to -source voltage if the voltage across the MOSFET
source and drain pins falls below the VSD(REG) voltage of 22 mV (typical).
10
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If the MOSFET current decreases to the point that the voltage across the MOSFET falls below the VSD(REG)
voltage regulation point of 27 mV (typical), the GATE pin voltage will be decreased until the voltage across the
MOSFET is regulated at 22 mV. If the drain-to-source voltage is greater than VSD(REG) voltage the gate-to-source
will increase, eventually reaching the 12V GATE to IN zener clamp level.
If the MOSFET current reverses, possibly due to failure of the input supply, such that the voltage across the
LM5050-1 IN and OUT pins is more negative than the VSD(REV) voltage of -28 mV (typical), the LM5050-1 will
quickly discharge the MOSFET gate through a strong GATE to IN pin discharge transistor.
If the input supply fails abruptly, as would occur if the supply was shorted directly to ground, a reverse current
will temporarily flow through the MOSFET until the gate can be fully discharged. This reverse current is sourced
from the load capacitance and from the parallel connected supplies. The LM5050-1 responds to a voltage
reversal condition typically within 25 ns. The actual time required to turn off the MOSFET will depend on the
charge held by gate capacitance of the MOSFET being used. A MOSFET with 47 nF of effective gate
capacitance can be turned off in typically 180 ns. This fast turn off time minimizes voltage disturbances at the
output, as well as the current transients from the redundant supplies.
VS PIN
The LM5050-1 VS pin is the main supply pin for all internal biasing and an auxiliary supply for the internal gate
drive charge pump.
For typical LM5050-1 applications, where the input voltage is above 5.0V, the VS pin can be connected directly
to the OUT pin. In situations where the input voltage is close to, but not less than, the 5.0V minimum, it may be
helpful to connect the VS pin to the OUT pin through an RC Low-Pass filter to reduce the possibility of erratic
behavior due to spurious voltage spikes that may appear on the OUT and IN pins. The series resistor value
should be low enough to keep the VS voltage drop at a minimum. A typical series resistor value is 100Ω. The
capacitor value should be the lowest value that produces acceptable filtering of the voltage noise.
Alternately, it is possible to operate the LM5050-1 with VIN values less than 1V if the VS pin is powered from a
separate supply. This separate VS supply must be between 5.0V and 75V. See Figure 28.
OFF PIN
The OFF pin is a logic level input pin that is used to control the gate drive to the external MOSFET. The
maximum operating voltage on this pin is 5.5V.
When the OFF pin is high, the MOSFET is turned off (independent of the sensed IN and OUT voltages). In this
mode, load current will flow through the body diode of the MOSFET. The voltage difference between the IN pin
and OUT pins will be approximately 700 mV if the MOSFET is operating normally through the body diode.
The OFF pin has an internal pull-down of 5 µA (typical). If the OFF function is not required the pin may be left
open or connected to ground.
CLOAD
PS1
IN
GATE OUT
RLOAD
LM5050-1
VS
GND
COUT
PS2
IN
GATE OUT
LM5050-1
VS
GND
Figure 26.
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SHORT CIRCUIT FAILURE OF AN INPUT SUPPLY
An abrupt zero ohm short circuit across the input supply will cause the highest possible reverse current to flow
while the internal LM5050-1 control circuitry discharges the gate of the MOSFET. During this time, the reverse
current is limited only by the RDS(ON) of the MOSFET, along with parasitic wiring resistances and inductances.
Worst case instantaneous reverse current would be limited to:
ID(REV) = (VOUT - VIN) / RDS(ON)
(1)
The internal Reverse Comparator will react, and will start the process of discharging the Gate, when the reverse
current reaches:
ID(REV) = VSD(REV) / RDS(ON)
(2)
When the MOSFET is finally switched off, the energy stored in the parasitic wiring inductances will be transferred
to the rest of the circuit. As a result, the LM5050-1 IN pin will see a negative voltage spike while the OUT pin will
see a positive voltage spike. The IN pin can be protected by diode clamping the pin to GND in the negative
direction. The OUT pin can be protected with a TVS protection diode, a local bypass capacitor, or both. In low
voltage applications, the MOSFET drainto- source breakdown voltage rating may be adequate to protect the
OUT pin (i.e. VIN + V(BR)DSS(MAX) < 75V ), but most MOSFET datasheets do not ensure the maximum breakdown
rating, so this method should be used with caution.
Parasitic
Inductance
Reverse Recovery Current
Parasitic
Inductance
COUT
IN
Shorted
Input
CLOAD
GATE OUT
LM5050-1
GND
VS
Figure 27.
MOSFET Selection
The important MOSFET electrical parameters are the maximum continuous Drain current ID, the maximum
Source current (i.e. body diode) IS, the maximum drain-to-source voltage VDS(MAX), the gate-to-source threshold
voltage VGS(TH), the drain-to-source reverse breakdown voltage V(BR)DSS, and the drain-to-source On resistance
RDS(ON).
The maximum continuous drain current, ID, rating must exceed the maximum continuous load current. The rating
for the maximum current through the body diode, IS, is typically rated the same as, or slightly higher than the
drain current, but body diode current only flows while the MOSFET gate is being charged to VGS(TH).
Gate Charge Time = Qg / IGATE(ON)
(3)
The maximum drain-to-source voltage, VDS(MAX), must be high enough to withstand the highest differential voltage
seen in the application. This would include any anticipated fault conditions.
The drain-to-source reverse breakdown voltage, V(BR)DSS, may provide some transient protection to the OUT pin
in low voltage applications by allowing conduction back to the IN pin during positive transients at the OUT pin.
The gate-to-source threshold voltage, VGS(TH), should be compatible with the LM5050-1 gate drive capabilities.
Logic level MOSFETs, with RDS(ON) rated at VGS(TH) at 5V, are recommended, but sub-Logic level MOSFETs
having RDS(ON) rated at VGS(TH) at 2.5V, can also be used. Standard level MOSFETs, with RDS(ON) rated at VGS(TH)
at 10V, are not recommended.
12
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The dominate MOSFET loss for the LM5050-1 active OR-ing controller is conduction loss due to source-to-drain
current to the output load, and the RDS(ON) of the MOSFET. This conduction loss could be reduced by using a
MOSFET with the lowest possible RDS(ON). However, contrary to popular belief, arbitrarily selecting a MOSFET
based solely on having low RDS(ON) may not always give desirable results for several reasons:
1. Reverse transition detection. Higher RDS(ON) will provide increased voltage information to the LM5050-1
Reverse Comparator at a lower reverse current level. This will give an earlier MOSFET turn-off condition
should the input voltage become shorted to ground. This will minimize any disturbance of the redundant bus.
2. Reverse current leakage. In cases where multiple input supplies are closely matched it may be possible for
some small current to flow continuously through the MOSFET drain to source (i.e. reverse) without activating
the LM5050-1 Reverse Comparator. Higher RDS(ON) will reduce this reverse current level.
3. Cost. Generally, as the RDS(ON) rating goes lower, the cost of the MOSFET goes higher.
Selecting a MOSFET with an RDS(ON) that is too large will result in excessive power dissipation. Additionally, the
MOSFET gate will be charged to the full value that the LM5050-1 can provide as it attempts to drive the Drain to
Source voltage down to the VSD(REG) of 22 mV typical. This increased Gate charge will require some finite
amount of additional discharge time when the MOSFET needs to be turned off.
As a guideline, it is suggest that RDS(ON) be selected to provide at least 22 mV, and no more than 100 mV, at the
nominal load current.
(22 mV / ID) ≤ RDS(ON) ≤ (100mV / ID)
(4)
The thermal resistance of the MOSFET package should also be considered against the anticipated dissipation in
the MOSFET in order to ensure that the junction temperature (TJ) is reasonably well controlled, since the RDS(ON)
of the MOSFET increases as the junction temperature increases.
PDISS = ID2 x (RDS(ON))
(5)
Operating with a maximum ambient temperature (TA(MAX)) of 35°C, a load current of 10A, and an RDS(ON) of 10
mΩ, and desiring to keep the junction temperature under 100°C, the maximum junction-to-ambient thermal
resistance rating (θJA) would need to be:
θJA ≤ (TJ(MAX) - TA(MAX))/(ID2 x RDS(ON))
θJA ≤ (100°C - 35°C)/(10A x 10A x 0.01Ω)
θJA ≤ 65°C/W
(6)
Typical Applications
VBIAS
5.0V to 75V
GND
Q1
VIN
VOUT
1V to 75V
C1
1.0 PF
100V
D1
IN
GATE
OUT
R1
100
VS
LM5050-1
Off/On
OFF
GND
C3
0.1 PF
100V
+
C2
22 PF
100V
D2
TVS
82V
GND
GND
Figure 28. Using a Separate VS Supply For Low Vin Operation
Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: LM5050-1 LM5050-1-Q1
Submit Documentation Feedback
13
LM5050-1, LM5050-1-Q1
SNVS629D – MAY 2011 – REVISED JUNE 2013
www.ti.com
Q1
SUM40N10-30
VIN
5.0V to 75V
S
CIN
1 PF
100V
VOUT
D
D1
B180-13-F
G
GATE
IN
OUT
VS
LM5050-1
OFF
OFF/ON
GND
GND
GND
Figure 29. Basic Application with Input Transient Protection
Q1
SUM40N10-30
VIN
48V
S
CIN
1 PF
75V
VOUT
D
D1
SS16T3
G
OUT
GATE
IN
R1
100:
VS
LM5050-1
D2
SMBJ60A
C1
0.1 PF
100V
OFF
OFF/ON
+ COUT
22 PF
63V
GND
GND
GND
Figure 30. Typical Application with Input and Output Transient Protection
Q1
SUM40N10-30
VIN
48V
S
CIN
1 PF
75V
D1
SS16T3
VOUT
D
G
IN
GATE
OUT
R1
100:
VS
LM5050-1
OFF
GND
+ COUT
22 PF
63V
D2
SMBJ60A
C1
0.1 PF
100V
D3
SS16T3
GND
GND
Figure 31. +48V Application with Reverse Input Voltage (VIN = -48V) Protection
14
Submit Documentation Feedback
Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: LM5050-1 LM5050-1-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Jun-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LM5050MK-1/NOPB
ACTIVE
SOT
DDC
6
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
SZHB
LM5050MKX-1/NOPB
ACTIVE
SOT
DDC
6
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
SZHB
LM5050Q0MK-1/NOPB
ACTIVE
SOT
DDC
6
1000
Green (RoHS
& no Sb/Br)
SN
Level-1-260C-UNLIM
-40 to 150
SL5B
LM5050Q0MKX-1/NOPB
ACTIVE
SOT
DDC
6
3000
Green (RoHS
& no Sb/Br)
SN
Level-1-260C-UNLIM
-40 to 150
SL5B
LM5050Q1MK-1/NOPB
ACTIVE
SOT
DDC
6
1000
Green (RoHS
& no Sb/Br)
SN
Level-1-260C-UNLIM
-40 to 125
SP3B
LM5050Q1MKX-1/NOPB
ACTIVE
SOT
DDC
6
3000
Green (RoHS
& no Sb/Br)
SN
Level-1-260C-UNLIM
-40 to 125
SP3B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
28-Jun-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM5050-1, LM5050-1-Q1 :
• Catalog: LM5050-1
• Automotive: LM5050-1-Q1
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jun-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM5050MK-1/NOPB
SOT
DDC
6
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LM5050MKX-1/NOPB
SOT
DDC
6
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LM5050Q0MK-1/NOPB
SOT
DDC
6
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LM5050Q0MKX-1/NOPB
SOT
DDC
6
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LM5050Q1MK-1/NOPB
SOT
DDC
6
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LM5050Q1MKX-1/NOPB
SOT
DDC
6
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jun-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM5050MK-1/NOPB
SOT
DDC
6
1000
210.0
185.0
35.0
LM5050MKX-1/NOPB
SOT
DDC
6
3000
210.0
185.0
35.0
LM5050Q0MK-1/NOPB
SOT
DDC
6
1000
210.0
185.0
35.0
LM5050Q0MKX-1/NOPB
SOT
DDC
6
3000
210.0
185.0
35.0
LM5050Q1MK-1/NOPB
SOT
DDC
6
1000
210.0
185.0
35.0
LM5050Q1MKX-1/NOPB
SOT
DDC
6
3000
210.0
185.0
35.0
Pack Materials-Page 2
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