3.2 mm x 5.0 mm Ceramic Package SMD VCXO, TTL / HC-MOS Product Features: Applications: Small Surface Mount Package CMOS/TTL Compatible Logic Levels Compatible with Leadfree Processing SD/HD Video Sonet /SDH VoIP T1/E1, T3/E3 Wireless Base Station Frequency 1.000 MHz to 77.760 MHz (Fund.) Output Level (HCMOS) VOH = 90% VDD Min. VOL = 10% VDD Max. Duty Cycle 50% ±10% Std.(5% optional) Rise / Fall Time 1.0 MHz to 20.0 MHz : 10.0 nS Max. 20.1 MHz to 40.0 MHz : 8.0 nS Max. 40.0 MHz to 77.76 MHz : 5.0 nS Max. Output Load 15pF Frequency Stability See Table Below Start-up Time 10 mS Max. Supply Voltage See Input Voltage Table, tolerance ±5 % Control Voltage 1.25 VDC ±1.05 VDC for 2.5 VDC, 1.65 VDC ±1.35 VDC for 3.3 VDC, 2.5 VDC ±2.0 VDC for 5.0 VDC Pull Range ±100 ppm min. (Std). See Table Below. Current 1.0 MHz to 20.0 MHz : 10.0 mA Max. 20.1 MHz to 40.0 MHz : 15.0 mA Max.(2.5V/3.3V) 20.1 MHz to 40.0 MHz : 20.0 mA Max.(5.0V) 40.0 MHz to 77.76 MHz : 25.0 mA Max.(2.5V/3.3V) 40.0 MHz to 77.76 MHz : 30.0 mA Max.(5.0V) Enable/Disable(Pin 2 or Pin 5) 70% VDD Min. / 30%VDD Max. Linearity 10% Aging ±5ppm/year Max. (±3ppm optional) Phase Jitter (12kHz to 20kHz) 1.0 pS Max. Period Jitter (PK-PK) 100pS Max. Temperature Operating Storage See Below -55 C to +125 C Part Number Guide Package I603 - I603 Series Operating Temperature Recommended Pad Layout Pin Connection 1 V Control 2 E/D(N.C.) 3 GND 4 Output 5 N.C.(E/D) 6 VDD Dimension Units: mm Sample Part Number: I603-1BC3H2-20.000 Stability Pullability (in ppm) Supply Voltage Enable / Disable Frequency - 20.000 MHz 1 = 0 C to +70 C F = 20 B = 50 PPM Min. 5 = 5.0 VDC H2 = Enable(pin 2) 2 = -40 C to +85 C A = 25 C = 100 PPM Min.* 3 = 3.3 VDC H5 = Enable(pin 5) B = 50 K = 150 PPM Min.* 6 = 2.5 VDC NOTE: A 0.01 µF bypass capacitor is recommended between Vcc (pin 6) and GND (pin 3) to minimize power supply noise. * Not available at all voltages. ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 08/11 Specifications subject to change without notice Page 1 I603 Series 3.2 mm x 5.0 mm Ceramic Package SMD VCXO, TTL / HC-MOS Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per Reel A B C D E F 1000 16 +/-.3 8 +/-.2 7.5 +/-.2 17.5 +/-1 50 / 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: ILSI and Date Code Line 2: Frequency ILSI America Phone: 775-851-8880 • Fax: 775-851-8882• e-mail: [email protected] • www.ilsiamerica.com 08/11 Specifications subject to change without notice Page 2