IR2E46Y IR2E46Y ■Description IR2E46Y incorporates the illumination driver and the flash driver for an RGB-LED, and is equipped with the step-up DC/DC converter. This product is optimum for use as the RGB-LED driver IC for PDA and cellular phone applications, etc. Illumination and Flash RGB-LED Driver ■Agency approvals/Compliance 1. Compliant with RoHS directive(2002/95/EC) ■Applications ■Features 1.Power supply: 2.7 V to 4.5 V 2.Supports I2C-bus interface The I2C address extension function enables simultaneous controlling of four devices. 3.SCL pin and SDA pin are installed with noise filters. 4.Sink-type variable constant current driver for RGB-LED (maximum current 155mA x 3ch） Stroboscopic mode: 0mA to 155mA (32 steps per output, 5.0mA STEP) Illumination mode: 0mA to 31.5mA (64 steps per output, 0.5mA STEP) 5.VF control circuit embedded (VDD to 13V) 6.LED brightness adjustment circuit embedded (16 steps, PWM control) 7.Stroboscopic timer embedded 8.Independent RGB control output enable circuit embedded 9.Current slope control circuit embedded 10.Voltage/current PWM control type step-up DC/DC converter circuit embedded (oscillatory frequency 1.2 MHz) 11.Low ON resistance switch (0.2Ω TYP.) 12.SW transistor overcurrent protection circuit embedded 13.Voltage reference embedded 14.Stand-by circuit embedded 15.Power-on-reset circuit embedded 16.UVLO circuit embedded 17.Digital soft-start circuit embedded 18.Thermal shutdown circuit embedded 1.Torch light and illuminations (RGB LED) Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. Sheet No.: F1-A00301EN Date Dec.01.2006 ©SHARP Corporation IR2E46Y ■Block diagram L 2.2μH SBD CVOUT 2.2μF CVIN VBAT LED VBAT R2 39kΩ EI FB R1:50kΩ C1:8pF VREF ES E0 RCS 75mΩ LEDGND B G R R4 50kΩ Current Sense/Limit CS1 CS2 CS3 LX1 LX2 LX3 LX4 ERROR AMP IREF DRIVER PGND VDAC PWN COMP OSC CVIN SWGND CSS R3 700kΩ IREF RIREF 6.8kΩ C2 220pF DRV AGND VDD1 UVLO VDD2 TSD DC/DC Logic IDAC POR SCL I2C SDA Interface + ADD0 ADD1 Register LED LOGIC Logic XSTBY PGND ENR ENG ENB STRIG 1000pF Sheet No.: F1-A00301EN IR2E46Y ■Outline Dimensions (Unit : mm) (Note)It is those with an underline printing in a date code because of a LEAD-FREE type. INDEX(laser marking) B A TOP VIEW S 0.1 Φ0.28(TYP.) 3.57±0.05 D 3 4 5 6 3.57±0.05 2 P-0.5(TYP.) F 1 Φ0.29±0.05 D BOTTOM VIEW P-0.5(TYP.) C A B C D E S 0.08 0.17±0.03 S 0.82±0.08 SIDE VIEW 0.20 M S AB 0.10 M S CD Package name : WLP033-X-3636 Lead finish or Ball type : LEAD FREE TYPE (Sn-3Ag-0.5Cu) *Use of an "Under-fill" (Note) Body dimensions do not include burr of resin. *Use of an "Under-fill": Since the external terminals are arranged at intervals of 0.5mm, SHARP recommends use of appropriate "Under fill" to this product for high reliability. ■Markings. （1） （2） （3） （4） Product name ： IR2E46 Company name ： SHARP Date code ： （Example）YYWW XXXX YY → Denotes the production year. (Last two digits of the year.) WW → Denotes the production week.（01・02・～・52・53） XXXX → Denotes the production ref. code(3～4 digits). “JAPAN” indicates the country of origin. Sheet No.: F1-A00301EN IR2E46Y ■Terminal Name Description Non-connect. This terminal is connected pin No. F1(U1). Enable input terminal for G. Enable input terminal for B. SW Tr. drain terminal. SW Tr. drain terminal. Non-connect. This terminal is connected pin No. F6(U2). Constant current output terminal for red LED. Power supply terminal (digital). Pin No A1 A2 A3 A4 A5 A6 B1 B2 Pin name U1 ENG ENB LX1 LX2 U2 R VDD2 B3 B4 B5 ENR PGND CS1 B6 C1 C2 CS2 G B SW Tr. Source terminal. Constant current output terminal for green LED. Constant current output terminal for blue LED. C3 C5 NC CSS Non-connect. SW Tr. source terminal (current sense terminal). C6 D1 D2 D5 D6 E1 E2 E3 E4 E5 E6 F1 F2 F3 F4 F5 F6 SWGND LEDGND ADD1 EO AGND STRIG SDA XSTBY EI FB ES U1 ADD0 SCL IREF VDD1 U2 Enable input terminal for R. Power ground. SW Tr. Source terminal. SW Tr. source terminal (current sense terminal). LED ground. I2C address extension input terminal. Error amplifier output terminal. Analog ground. Stroboscopic timer trigger input terminal. I2C Data Input/Output. Stand-by input terminal. Error amplifier reference input terminal. Output voltage feedback input terminal. Error amplifier negative input terminal. Non-connect. This terminal is connected pin No. A1(U1). I2C address extension input terminal. I2C Clock. Resistor connection terminal for reference current setting. Power supply terminal (analog). Non-connect. This terminal is connected pin No. A6(U2). Sheet No.: F1-A00301EN IR2E46Y ■Pin Assignment 1 2 3 4 5 6 A U1 ENG ENB LX1 LX2 U2 B R VDD2 ENR PGND CS1 CS2 C G B NC CSS SWGND D LEDGND ADD1 EO AGND E STRIG SDA XSTBY EI FB ES F U1 ADD0 SCL IREF VDD1 U2 Note: Pins are located on the underside. Sheet No.: F1-A00301EN IR2E46Y ■Absolute Maximum Ratings Parameter Power supply Terminal voltage Symbol Rating Unit VDD1,VDD2 LX1,LX2,LX3,LX4 FB,G, B 6.0 V Conditions -0.3 to 22.0 V R -0.3 to 6.0 Others -0.3V to VDD+0.3 R,G,B Output current 155 x 3ch mA Pd Power dissipation 1667 mW Derating ratio ΔPd 16.67 mW/°C °C Operating temperature range Topr -30 to 85 °C Storage temperature range Tstg -55 to 125 Note1: Free convection,on-board,compiled with SEMI42-996 Ta≤25°C Note1 Ta>25°C Note1 ■Recommended Operating Condition Parameter Power supply Terminal voltage I2C communication frequency Switching frequency Symbol VDD1, VDD2 Value 2.7 to 4.5 LX1,LX2,LX3,LX4 FB,G, B 0 to 13 R Others fCLK fOSC 0 to 4.5 0 to VDD 3.4 1.2 Unit V Conditions V MHz MHz Sheet No.: F1-A00301EN IR2E46Y ■Electric Characteristics See the Block Diagram unless otherwise specified. VDD1=VDD2=3.6V, ENR=ENG=ENB=XSTBY=3.6V, ADD0=ADD1=STRIG=0V, R=G=B=1.0V, Ta=25°C I2C register setting: XSTB=1, BOOST=1 The current direction is regarded positive when entering the IC and negative when exiting. Current consumption Parameter Stand-by supply current Supply current Symbol ISS IDD Step-up DC/DC converter circuit Symbol Parameter Conversion efficiency PEff Switch ON resistance RDSON Switching frequency fOSC Maximum duty DT FET current limiting voltage SW Tr. OFF leak current VCL ILEAKSW Measurement condition XSTBY=0V or XSTB=0 BOOST=0 Measurement condition Voltage between CCS pin and SWGND pin VIH VIL IIH IIL Hysteresis voltage Vhys PWEN VOL SDA pin, SCL pin, ADD0 pin , ADD1 pin, and STRIG pin Duration when ENx is "H" or "L" IOL=3mA XSTBY pin Parameter Symbol Measurement condition High level input voltage Low level input voltage High level input current Low level input current VIH VIL IIH IIL UVLO circuit Parameter Symbol ENx pulse width SDA output terminal voltage UVLO threshold voltage UVLO hysteresis Thermal shutdown circuit Parameter Operation stop temperature Measurement condition TUTh UVHys Symbol TYP. 1 1.3 MAX. 3 1.8 Unit μA mA MIN. TYP. MAX. Unit 0.1 1.0 85 0.2 1.2 85 0.3 1.4 % Ω MHz % 84 120 156 mV 1 5 μA MIN. TYP. MAX. Unit 0.8VDD 0 -1 -1 - VDD 0.2VDD 1 1 V V μA μA XSTBY=0V or XSTB=0 LX1, LX2＝20V ENR pin, ENG pin, ENB pin, STRIG pin, SDA pin, SCL pin, ADD0 pin, ADD1 pin Symbol Measurement condition Parameter High level input voltage Low level input voltage High level input current Low level input current MIN. 0.8 Measurement condition V 0.05VDD 1.0 - 0.2 0.4 μs V MIN. TYP. MAX. Unit 1.44 0 -1 -1 25 - VDD 0.90 75 1 V V μA μA MIN. TYP. MAX. Unit 2.15 2.35 100 2.55 V mV MIN. TYP. MAX. Unit 150 °C Sheet No.: F1-A00301EN IR2E46Y Constant current driver circuit Parameter Symbol R output current (stroboscopic mode) IoRS R output current (illumination mode) IoRI G output current (stroboscopic mode) IoGS G output current (illumination mode) IoGI B output current (stroboscopic mode) IoBS B output current (illumination mode) IoBI R terminal leak current G terminal leak current B terminal leak current ILEAKR ILEAKG ILEAKB Measurement condition RSDUTY[00000], R=1, S/I=1 RSDUTY[00001], R=1, S/I=1 RSDUTY[00010], R=1, S/I=1 RSDUTY[00100], R=1, S/I=1 RSDUTY[01000], R=1, S/I=1 RSDUTY[10000], R=1, S/I=1 RSDUTY[11111], R=1, S/I=1 RIDUTY[000000], R=1 RIDUTY[000001], R=1 RIDUTY[000010], R=1 RIDUTY[000100], R=1 RIDUTY[001000], R=1 RIDUTY[010000], R=1 RIDUTY[100000], R=1 RIDUTY[111111], R=1 GSDUTY[00000], G=1, S/I=1 GSDUTY[00001], G=1, S/I=1 GSDUTY[00010], G=1, S/I=1 GSDUTY[00100], G=1, S/I=1 GSDUTY[01000], G=1, S/I=1 GSDUTY[10000], G=1, S/I=1 GSDUTY[11111], G=1, S/I=1 GIDUTY[000000], G=1 GIDUTY[000001], G=1 GIDUTY[000010], G=1 GIDUTY[000100], G=1 GIDUTY[001000], G=1 GIDUTY[010000], G=1 GIDUTY[100000], G=1 GIDUTY[111111], G=1 BSDUTY[00000], B=1, S/I=1 BSDUTY[00001], B=1, S/I=1 BSDUTY[00010], B=1, S/I=1 BSDUTY[00100], B=1, S/I=1 BSDUTY[01000], B=1, S/I=1 BSDUTY[10000], B=1, S/I=1 BSDUTY[11111], B=1, S/I=1 BIDUTY[000000], B=1 BIDUTY[000001], B=1 BIDUTY[000010], B=1 BIDUTY[000100], B=1 BIDUTY[001000], B=1 BIDUTY[010000], B=1 BIDUTY[100000], B=1 BIDUTY[111111], B=1 Terminal voltage =4.5V Terminal voltage =15V Terminal voltage =15V MIN. TYP. MAX. Unit 0.0 5.0 10.0 30.0 70.0 139.5 0.00 0.50 1.00 3.00 7.00 15.00 28.35 0.0 5.0 10.0 30.0 70.0 139.5 0.00 0.50 1.00 3.00 7.00 15.00 28.35 0.0 5.0 10.0 30.0 70.0 139.5 0.00 0.50 1.00 3.00 7.00 15.00 28.35 1.0 5.0 10.0 20.0 40.0 80.0 155.0 1.00 0.50 1.00 2.00 4.00 8.00 16.00 31.50 1.0 5.0 10.0 20.0 40.0 80.0 155.0 1.00 0.50 1.00 2.00 4.00 8.00 16.00 31.50 1.0 5.0 10.0 20.0 40.0 80.0 155.0 1.00 0.50 1.00 2.00 4.00 8.00 16.00 31.50 1 1 1 5.0 15.0 20.0 30.0 50.0 90.0 170.5 5.00 1.50 2.00 3.00 5.00 9.00 17.00 34.65 5.0 15.0 20.0 30.0 50.0 90.0 170.5 5.00 1.50 2.00 3.00 5.00 9.00 17.00 34.65 5.0 15.0 20.0 30.0 50.0 90.0 170.5 5.00 1.50 2.00 3.00 5.00 9.00 17.00 34.65 5 5 5 μA mA mA mA mA mA mA μA mA mA mA mA mA mA mA μA mA mA mA mA mA mA μA mA mA mA mA mA mA mA μA mA mA mA mA mA mA μA mA mA mA mA mA mA mA μA μA μA Sheet No.: F1-A00301EN IR2E46Y ■ I2C-BUS Interface timing characteristics All specified output timings are based on 20% and 80% of VDD. Fs-mode Parameter SCL clock frequency Hold time(repeated) START condition LOW period of the SCL clock HIGH period of the SCL clock Data set-up time Data hold time SCL and SDA rise time SCL and SDA fall time Capacitive load represented by each bus line Set-up time for STOP condition Tolerable spike width on bus Bus free time between START and STOP condition Noise margin at the LOW level for each connected device (including hysteresis) Noise margin at the HIGH level for each connected device (including hysteresis) Symbol fSCL tHD;STA tLOW tHIGH tSU;DAT tHD;DAT tr tf Cb tSU;STO tSP tBUF Conditions MIN. 0 600 1300 600 100 0 600 - TYP. - MAX. 400 900 300 300 400 50 Unit kHz ns ns ns ns ns ns ns pF ns ns Note 1. Note 1. 20+0.1Cb 1300 - - ns VnL 0.1VDD - - V VnH 0.2VDD - - V MIN. 0 160 160 160 60 10 20 10 10 TYP. - 20+0.1Cb Hs-mode Parameter SCL clock frequency Set-up time(repeated) START condition Hold time(repeated) START condition LOW period of the SCL clock HIGH period of the SCL clock Data set-up time Data hold time Rise time of the SCL signal Rise time of the SCL signal after the acknowledge bit Symbol fSCLH tSU;STA tHD;STA tLOW tHIGH tSU;DAT tHD;DAT trCL trCL1 Fall time of the SCL signal Rise time of the SDA signal Fall time of the SCL signal Set-up time for STOP condition Capacitive load for the SDA and SCL lines Capacitive load for the SDA and SCL lines Tolerable spike width on bus tfCL trDA tfCL1 tSU;STO 10 10 10 160 - 40 80 80 - ns ns ns ns Cb Cb2 tSP - - 100 400 5 pF pF ns Noise margin at the LOW level for each connected device (including hysteresis) VnL 0.1VDD - - V Noise margin at the HIGH level for each connected device (including hysteresis) VnH 0.2VDD - - V Conditions MAX. Unit 3.4 MHz ns ns ns ns ns 70 ns 40 ns 80 ns Note 1: Cb=100pF total capacitance of one bus line. Sheet No.: F1-A00301EN IR2E46Y Fig.1 I2C-Bus timing diagram (Fs-mode) SDA tBUF tf tLOW tSU;DAT tr tHD;STA tr tf tSP SCL tSU;STO tSU;STA tHD;STA tHD;DAT tHIGH Fig.2 I2C-Bus timing diagram (Hs-mode) SDAH tSU;STA tHD;STA tHD;DAT tSU;STO tHIGH tSU;DAT trCL1 SCLH trCL tLOW tfCL1 tfCL tLOW tHIGH Sheet No.: F1-A00301EN IR2E46Y ■ Example of typical characteristics Fig.4 fOSC vs. temperature fOSC(MHz fOSC(MHz) Fig.3 fOSC vs. VDD Temperature (oC) VDD (V) Fig.5 IDD vs. VDD Fig.6 IDD vs. temperature IDD vs. temperature IDD(mA) IDD(mA) IDD vs. VDD VDD (V) Temperature (oC) Sheet No.: F1-A00301EN IR2E46Y Fig.7 IOUT(R) vs. Terminal voltage Fig.8 IOUT(B) vs. Terminal voltage Fig.9 IOUT(G) vs. Terminal voltage Voltage and current pulse of pre illuminating (RGB each 20mA) to flashing (R=80mA, G=120mA, B=75mA). Pin: VDD1=VDD2=3.6V, ENR=ENG=ENB=XSTBY=3.6V, ADD0=ADD1=STRIG=0V Resister setting: RSLSET:h’F1, GBSLSET: h’01, STSET: h’10, RGSDSET:h’10, GBSDSET: h’3F, RIDSET: h’E8, GIDSET: h’E8, BIDSET: h’E8, RONSET: h’80, START: h’9F Stroboscopic trigger: START:h’3F VDD=3.6V Battery voltage=3.6V FLASH VDD=3.6V Battery voltage=2.9V FB pin voltage 2V/DIV Pre emission FLASH FB pin voltage 2V/DIV Pre emission Battery current 200mA/DIV Battery current 200mA/DIV Sheet No.: F1-A00301EN IR2E46Y ■Cautions ・Connect the power supply terminals (VDD1 pin and VDD2 pin) with the shortest distance and set terminals same potential. ・Connect the grounding terminals (PGND pin, SWGND pin, AGND pin, and LEDGND pin) with the shortest distance and set terminals same potential. ・Connect the LX terminals (LX1 pin, LX2 pin) with the shortest distance and set terminals same potential. ・Connect the CS terminals (CS1 pin, CS2 pin, and CSS pin) with the shortest distance and set terminals same potential. ・It is recommended to install a capacitor between the power supply terminal and grounding terminal. ・Position a bypass capacitor between the power supply terminal and grounding terminal close to the IC and use broad patterns. ・It is recommended to install an approximately 1000-pF capacitor between the Power supply terminal and ENx pin for countermeasure against static electricity. ・Use a broad and short patterns for the line that is connected from CVIN GND to CVIN GND through L and RCS. ・Position the Schottky-barrier diode (SBD) close to the CVOUT. ・Use patterns as broad and as short as possible for the power supply lines and grounding lines. ・Don’t set input terminals (ENR pin, ENG pin, ENB pin, STRIG pin, SDA pin, SCL pin, ADD0 pin, and ADD1pin) floating. ・Apply the voltage to input terminals (ENR pin, ENG pin, ENB pin, STRIG pin, SDA pin, SCL pin, ADD0 pin, and ADD1pin) with input voltage range specified electric characteristics. ・In any cases including the timing of power on and power off, do not use absolute maximum ratings. ・Continuous running with the maximum output power may be caused exceeding maximum power dissipation. Be careful not to exceed maximum power dissipation in consideration of heat transfer resistance of a mounting board, ambient air temperature, and output electric power. ・Position the RIREF close to the IC to circumvent the effect of noise. Sheet No.: F1-A00301EN IR2E46Y ■Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. · Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. · Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). · If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. · This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. · Contact and consult with a SHARP representative if there are any questions about the contents of this publication. Sheet No.: F1-A00301EN