Formosa FFM107-M Chip fast recovery rectifier Datasheet

Formosa MS
Chip Fast Recovery Rectifiers
FFM101-M THRU FFM107-M
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 1
DS-121202
Issued Date
2008/02/10
Revised Date
Revision
Page.
2010/03/10
D
7
Formosa MS
Chip Fast Recovery Rectifiers
FFM101-M THRU FFM107-M
1.0A Surface Mount Fast
Recovery Rectifiers-50-1000V
Package outline
Features
• Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
•
SOD-123
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
Tiny plastic SMD package.
High current capability.
Fast switching for high efficiency.
High surge current capability.
Glass passivated chip junction.
Lead-free parts meet RoHS requirments.
Suffix "-H" indicates Halogen-free parts, ex. FFM101-M-H.
0.154(3.9)
0.138(3.5)
0.012(0.3) Typ.
0.075(1.9)
0.060(1.5)
Mechanical data
0.067(1.7)
0.051(1.3)
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123 / MINI SMA
• Terminals :Plated terminals, solderable per MIL-STD-750,
0.028(0.7) Typ.
0.028(0.7) Typ.
Method 2026
Dimensions in inches and (millimeters)
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.018 gram
Maximum ratings and Electrical Characteristics (AT
PARAMETER
T A=25 oC unless otherwise noted)
CONDITIONS
Forward rectified current
See Fig.2
Forward surge current
8.3ms single half sine-wave (JEDEC methode)
V R = V RRM T J = 25 OC
Reverse current
MAX.
UNIT
IO
1.0
A
I FSM
30
A
Symbol
Thermal Resistance
Junction to ambient
Junction to case
Diode junction capacitance
f=1MHz and applied 4V DC reverse voltage
Storage temperature
V RMS*2
(V)
*3
VR
(V)
FFM101-M
50
35
50
FFM102-M
100
70
100
FFM103-M
200
140
200
FFM104-M
400
280
400
FFM105-M
600
420
600
FFM106-M
800
560
800
FFM107-M
1000
700
1000
*4
VF
(V)
5.0
Operating
temperature
T J, ( OC)
*5
t rr
(ns)
100
R θJA
R θJC
CJ
T STG
*1
V RRM
(V)
TYP.
IR
V R = V RRM T J = 125 OC
SYMBOLS
MIN.
50
35
°C/W
°C/W
pF
15
+175
-65
μA
O
C
*1 Repetitive peak reverse voltage
*2 RMS voltage
150
*3 Continuous reverse voltage
1.30
-55 to +150
250
*4 Maximum forward voltage@I F=1.0A
*5 Maximum Reverse recovery time, note 1
500
Note 1. Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 2
DS-121202
Issued Date
2008/02/10
Revised Date
Revision
Page.
2010/03/10
D
7
Rating and characteristic curves (FFM101-M THRU FFM107-M)
FIG.1-TYPICAL FORWARD
FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE
AVERAGE FORWARD CURRENT,(A)
CHARACTERISTICS
10
3.0
1.0
1.2
1.0
0.8
0.6
P.C.B. Mounted on
0.2" x 0.2" (5 mm x 5 mm)
Copper Pad Areas
0.4
0.2
0
0
20
40
TJ=25 C
60
80
100
120
140
160
180
200
LEAD TEMPERATURE (°C)
Pulse Width 300us
1% Duty Cycle
0.1
.01
.6
.8
1.0
1.2
1.4
1.6
1.8
2.0
FORWARD VOLTAGE,(V)
FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE
RECOVERY TIME CHARACTERISTICS
50W
NONINDUCTIVE
10W
NONINDUCTIVE
( )
(+)
D.U.T.
25Vdc
(approx.)
PULSE
GENERATOR
(NOTE 2)
( )
PEAK FORWAARD SURGE CURRENT,(A)
FIG.4-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
50
40
30
8.3ms Single Half
TJ=25 C
JEDEC method
10
0
1
5
2. Rise Time= 10ns max., Source Impedance= 50 ohms.
|
|
|
|
|
|
|
|
0
-0.25A
100
FIG.5-TYPICAL JUNCTION CAPACITANCE
NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF.
+0.5A
50
10
NUMBER OF CYCLES AT 60Hz
OSCILLISCOPE
(NOTE 1)
trr
Sine Wave
20
(+)
1W
NONINDUCTIVE
35
JUNCTION CAPACITANCE,(pF)
INSTANTANEOUS FORWARD CURRENT,(A)
50
30
25
20
15
10
5
0
-1.0A
1cm
.01
SET TIME BASE FOR
.05
.1
.5
1
5
10
50
100
Revised Date
Revision
Page.
2010/03/10
D
7
REVERSE VOLTAGE,(V)
50 / 10ns / cm
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 3
DS-121202
Issued Date
2008/02/10
Formosa MS
Chip Fast Recovery Rectifiers
FFM101-M THRU FFM107-M
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
1
Symbol
2
1
2
Marking
Type number
Marking code
FFM101-M
FFM102-M
FFM103-M
FFM104-M
FFM105-M
FFM106-M
FFM107-M
F1
F2
F3
F4
F5
F6
F7
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
PACKAGE
A
B
C
SOD-123
0.075 (1.90)
0.055 (1.40)
0.075 (1.90)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 4
DS-121202
Issued Date
2008/02/10
Revised Date
Revision
Page.
2010/03/10
D
7
Formosa MS
Chip Fast Recovery Rectifiers
FFM101-M THRU FFM107-M
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOD-123
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
1.90
3.90
1.68
1.50
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 5
DS-121202
Issued Date
2008/02/10
Revised Date
Revision
Page.
2010/03/10
D
7
Formosa MS
Chip Fast Recovery Rectifiers
FFM101-M THRU FFM107-M
Reel packing
PACKAGE
SOD-123
REEL SIZE
7"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
2,500
4.0
BOX
(pcs)
25,000
INNER
BOX
REEL
DIA,
CARTON
SIZE
CARTON
APPROX.
GROSS WEIGHT
(m/m)
(m/m)
(m/m)
(pcs)
(kg)
183*183*123
178
382*262*387
9.5
200,000
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 6
DS-121202
Issued Date
2008/02/10
Revised Date
Revision
Page.
2010/03/10
D
7
Formosa MS
Chip Fast Recovery Rectifiers
FFM101-M THRU FFM107-M
High reliability test capabilities
Item Test
Conditions
Reference
O
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16"±1/32"
MIL-STD-750D
METHOD-2031
2. Solderability
at 245±5 OC for 5 sec.
MIL-STD-202F
METHOD-208
3. High Temperature Reverse Bias
V R=80% rate at T J=150 OC for 168 hrs.
MIL-STD-750D
METHOD-1038
4. Forward Operation Life
Rated average rectifier current at T A=25 OC for 500hrs.
MIL-STD-750D
METHOD-1027
T A = 25 OC, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
5. Intermittent Operation Life
6. Pressure Cooker
JESD22-A102
15P SIG at T A=121 OC for 4 hrs.
MIL-STD-750D
METHOD-1051
7. Temperature Cycling
-55 OC to +125 OC dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Forward Surge
8.3ms single half sine-wave , one surge.
MIL-STD-750D
METHOD-4066-2
9. Humidity
at T A=85 OC, RH=85% for 1000hrs.
MIL-STD-750D
METHOD-1021
10. High Temperature Storage Life
at 175 OC for 1000 hrs.
MIL-STD-750D
METHOD-1031
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 7
DS-121202
Issued Date
2008/02/10
Revised Date
Revision
Page.
2010/03/10
D
7
Similar pages