Formosa MS Chip Fast Recovery Rectifiers FFM101-M THRU FFM107-M List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Rating and characteristic curves........................................................ 3 Pinning information........................................................................... 4 Marking........................................................................................... 4 Suggested solder pad layout............................................................. 4 Packing information.......................................................................... 5 Reel packing.................................................................................... 6 Suggested thermal profiles for soldering processes............................. 6 High reliability test capabilities........................................................... 7 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 1 DS-121202 Issued Date 2008/02/10 Revised Date Revision Page. 2010/03/10 D 7 Formosa MS Chip Fast Recovery Rectifiers FFM101-M THRU FFM107-M 1.0A Surface Mount Fast Recovery Rectifiers-50-1000V Package outline Features • Batch process design, excellent power dissipation offers • • • • • • • • SOD-123 better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Tiny plastic SMD package. High current capability. Fast switching for high efficiency. High surge current capability. Glass passivated chip junction. Lead-free parts meet RoHS requirments. Suffix "-H" indicates Halogen-free parts, ex. FFM101-M-H. 0.154(3.9) 0.138(3.5) 0.012(0.3) Typ. 0.075(1.9) 0.060(1.5) Mechanical data 0.067(1.7) 0.051(1.3) • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, SOD-123 / MINI SMA • Terminals :Plated terminals, solderable per MIL-STD-750, 0.028(0.7) Typ. 0.028(0.7) Typ. Method 2026 Dimensions in inches and (millimeters) • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.018 gram Maximum ratings and Electrical Characteristics (AT PARAMETER T A=25 oC unless otherwise noted) CONDITIONS Forward rectified current See Fig.2 Forward surge current 8.3ms single half sine-wave (JEDEC methode) V R = V RRM T J = 25 OC Reverse current MAX. UNIT IO 1.0 A I FSM 30 A Symbol Thermal Resistance Junction to ambient Junction to case Diode junction capacitance f=1MHz and applied 4V DC reverse voltage Storage temperature V RMS*2 (V) *3 VR (V) FFM101-M 50 35 50 FFM102-M 100 70 100 FFM103-M 200 140 200 FFM104-M 400 280 400 FFM105-M 600 420 600 FFM106-M 800 560 800 FFM107-M 1000 700 1000 *4 VF (V) 5.0 Operating temperature T J, ( OC) *5 t rr (ns) 100 R θJA R θJC CJ T STG *1 V RRM (V) TYP. IR V R = V RRM T J = 125 OC SYMBOLS MIN. 50 35 °C/W °C/W pF 15 +175 -65 μA O C *1 Repetitive peak reverse voltage *2 RMS voltage 150 *3 Continuous reverse voltage 1.30 -55 to +150 250 *4 Maximum forward voltage@I F=1.0A *5 Maximum Reverse recovery time, note 1 500 Note 1. Reverse recovery time test condition, I F =0.5A, I R =1.0A, I RR =0.25A http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 2 DS-121202 Issued Date 2008/02/10 Revised Date Revision Page. 2010/03/10 D 7 Rating and characteristic curves (FFM101-M THRU FFM107-M) FIG.1-TYPICAL FORWARD FIG.2-TYPICAL FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 10 3.0 1.0 1.2 1.0 0.8 0.6 P.C.B. Mounted on 0.2" x 0.2" (5 mm x 5 mm) Copper Pad Areas 0.4 0.2 0 0 20 40 TJ=25 C 60 80 100 120 140 160 180 200 LEAD TEMPERATURE (°C) Pulse Width 300us 1% Duty Cycle 0.1 .01 .6 .8 1.0 1.2 1.4 1.6 1.8 2.0 FORWARD VOLTAGE,(V) FIG.3- TEST CIRCUIT DIAGRAM AND REVERSE RECOVERY TIME CHARACTERISTICS 50W NONINDUCTIVE 10W NONINDUCTIVE ( ) (+) D.U.T. 25Vdc (approx.) PULSE GENERATOR (NOTE 2) ( ) PEAK FORWAARD SURGE CURRENT,(A) FIG.4-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 50 40 30 8.3ms Single Half TJ=25 C JEDEC method 10 0 1 5 2. Rise Time= 10ns max., Source Impedance= 50 ohms. | | | | | | | | 0 -0.25A 100 FIG.5-TYPICAL JUNCTION CAPACITANCE NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF. +0.5A 50 10 NUMBER OF CYCLES AT 60Hz OSCILLISCOPE (NOTE 1) trr Sine Wave 20 (+) 1W NONINDUCTIVE 35 JUNCTION CAPACITANCE,(pF) INSTANTANEOUS FORWARD CURRENT,(A) 50 30 25 20 15 10 5 0 -1.0A 1cm .01 SET TIME BASE FOR .05 .1 .5 1 5 10 50 100 Revised Date Revision Page. 2010/03/10 D 7 REVERSE VOLTAGE,(V) 50 / 10ns / cm http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 3 DS-121202 Issued Date 2008/02/10 Formosa MS Chip Fast Recovery Rectifiers FFM101-M THRU FFM107-M Pinning information Pin Pin1 Pin2 Simplified outline cathode anode 1 Symbol 2 1 2 Marking Type number Marking code FFM101-M FFM102-M FFM103-M FFM104-M FFM105-M FFM106-M FFM107-M F1 F2 F3 F4 F5 F6 F7 Suggested solder pad layout C A B Dimensions in inches and (millimeters) PACKAGE A B C SOD-123 0.075 (1.90) 0.055 (1.40) 0.075 (1.90) http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 4 DS-121202 Issued Date 2008/02/10 Revised Date Revision Page. 2010/03/10 D 7 Formosa MS Chip Fast Recovery Rectifiers FFM101-M THRU FFM107-M Packing information P0 P1 d E F B A W P D2 D1 T C W1 D unit:mm Item Symbol Tolerance SOD-123 Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.1 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 1.90 3.90 1.68 1.50 178.00 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 5 DS-121202 Issued Date 2008/02/10 Revised Date Revision Page. 2010/03/10 D 7 Formosa MS Chip Fast Recovery Rectifiers FFM101-M THRU FFM107-M Reel packing PACKAGE SOD-123 REEL SIZE 7" REEL (pcs) COMPONENT SPACING (m/m) 2,500 4.0 BOX (pcs) 25,000 INNER BOX REEL DIA, CARTON SIZE CARTON APPROX. GROSS WEIGHT (m/m) (m/m) (m/m) (pcs) (kg) 183*183*123 178 382*262*387 9.5 200,000 Suggested thermal profiles for soldering processes 1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 6 DS-121202 Issued Date 2008/02/10 Revised Date Revision Page. 2010/03/10 D 7 Formosa MS Chip Fast Recovery Rectifiers FFM101-M THRU FFM107-M High reliability test capabilities Item Test Conditions Reference O 1. Solder Resistance at 260 ± 5 C for 10 ± 2sec. immerse body into solder 1/16"±1/32" MIL-STD-750D METHOD-2031 2. Solderability at 245±5 OC for 5 sec. MIL-STD-202F METHOD-208 3. High Temperature Reverse Bias V R=80% rate at T J=150 OC for 168 hrs. MIL-STD-750D METHOD-1038 4. Forward Operation Life Rated average rectifier current at T A=25 OC for 500hrs. MIL-STD-750D METHOD-1027 T A = 25 OC, I F = I O On state: power on for 5 min. off state: power off for 5 min. on and off for 500 cycles. MIL-STD-750D METHOD-1036 5. Intermittent Operation Life 6. Pressure Cooker JESD22-A102 15P SIG at T A=121 OC for 4 hrs. MIL-STD-750D METHOD-1051 7. Temperature Cycling -55 OC to +125 OC dwelled for 30 min. and transferred for 5min. total 10 cycles. 8. Forward Surge 8.3ms single half sine-wave , one surge. MIL-STD-750D METHOD-4066-2 9. Humidity at T A=85 OC, RH=85% for 1000hrs. MIL-STD-750D METHOD-1021 10. High Temperature Storage Life at 175 OC for 1000 hrs. MIL-STD-750D METHOD-1031 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Document ID Page 7 DS-121202 Issued Date 2008/02/10 Revised Date Revision Page. 2010/03/10 D 7