Material Content Data Sheet Sales Product Name IPW60R099CP MA# MA000849054 Package PG-TO247-3-41 Issued 29. August 2013 Weight* 6050.18 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal non noble metal noble metal non noble metal < 10% silicon phosphorus iron copper aluminium carbon black epoxy resin silicondioxide tin nickel antimony silver tin 7440-21-3 7723-14-0 7439-89-6 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7440-36-0 7440-22-4 7440-31-5 15.501 0.26 1.192 0.02 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.26 2562 2562 197 3.972 0.07 3967.074 65.55 65.64 655692 656 656545 4.245 0.07 0.07 702 702 19.922 0.33 3293 378.510 6.26 1593.725 26.34 32.93 263416 62561 329270 31.874 0.53 0.53 5268 5268 29.065 0.48 0.48 4804 4804 0.514 0.01 1.284 0.02 3.339 0.06 85 212 0.09 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 552 849 1000000