ON ESD9X12ST5G Esd protection diodes in ultra small sod-923 package Datasheet

ESD9X3.3ST5G SERIES
ESD Protection Diodes
In Ultra Small SOD−923 Package
The ESD9X Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage,
and fast response time provide best in class protection on designs that
are exposed to ESD. Because of its small size, it is suited for use in
cellular phones, MP3 players, digital cameras and many other portable
applications where board space is at a premium.
http://onsemi.com
1
Specification Features:
• Small Body Outline Dimensions:
•
•
•
•
•
•
•
PIN 1. CATHODE
2. ANODE
0.039″ x 0.024″ (1.0 mm x 0.60 mm)
Low Body Height: 0.017″ (0.43 mm) Max
Stand−off Voltage: 3.3 V − 12 V
Low Leakage
Response Time is Typically < 1 ns
ESD Rating of Class 3 (> 16 kV) per Human Body Model
IEC61000−4−2 Level 4 ESD Protection
These are Pb−Free Devices
MARKING
DIAGRAM
X
M
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
ESD Voltage
Value
Unit
Contact
Symbol
±30
kV
Per Human Body Model
Per Machine Model
16
400
kV
V
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum
(10 Second Duration)
= Specific Device Code
= Date Code
ORDERING INFORMATION
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Rating
XM
SOD−923
CASE 514AA
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
IEC 61000−4−2 (ESD)
2
⎪
PD
150
mW
TJ, Tstg
−55 to
+150
°C
TL
260
°C
Device
Package
Shipping †
ESD9XxxST5G
SOD−923
8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
© Semiconductor Components Industries, LLC, 2006
October, 2006 − Rev. 1
1
Publication Order Number:
ESD9X3.3ST5G/D
ESD9X3.3ST5G SERIES
ELECTRICAL CHARACTERISTICS
I
(TA = 25°C unless otherwise noted)
IF
Parameter
Symbol
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
Working Peak Reverse Voltage
VBR
Breakdown Voltage @ IT
IT
Test Current
IF
Forward Current
VF
Forward Voltage @ IF
Ppk
Peak Power Dissipation
C
VC VBR VRWM
Maximum Reverse Leakage Current @ VRWM
V
IR VF
IT
IPP
Max. Capacitance @VR = 0 and f = 1 MHz
Uni−Directional TVS
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.9 V Max. @ IF = 10 mA for all types)
Device*
Device
Marking
VRWM (V)
IR (mA) @
VRWM
VBR (V) @ IT
(Note 2)
IT
Max
Max
Min
mA
Max IPP (A)
(Note 3)
VC (V) @
Max IPP
(Note 3)
Ppk (W)
(8 x 20 ms)
C (pF)
Max
Typ
Typ
ESD9X3.3ST5G
A
3.3
2.5
5.0
1.0
9.8
10.4
102
80
ESD9X5.0ST5G
B
5.0
1.0
6.2
1.0
8.7
12.3
107
65
ESD9X12ST5G
C
12
1.0
13.5
1.0
5.9
23.7
140
30
*Other voltages available upon request.
2. VBR is measured with a pulse test current IT at an ambient temperature of 25°C.
3. Surge current waveform per Figure 3.
http://onsemi.com
2
ESD9X3.3ST5G SERIES
7.4
20
7.3
18
7.2
16
7.1
14
IR (nA)
7.0
6.9
6.8
6.7
12
10
8
6.6
6
6.5
4
6.4
2
6.3
−55
+ 25
TEMPERATURE (°C)
0
−55
+ 150
Figure 1. Typical Breakdown Voltage
versus Temperature
100
% OF PEAK PULSE CURRENT
BREAKDOWN VOLTAGE (VOLTS) (VZ @ IZ)
TYPICAL CHARACTERISTICS
tr
90
+ 25
TEMPERATURE (°C)
+ 150
Figure 2. Typical Leakage Current
versus Temperature
PEAK VALUE IRSM @ 8 ms
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms
80
70
60
HALF VALUE IRSM/2 @ 20 ms
50
40
30
tP
20
10
0
0
20
40
60
80
t, TIME (ms)
Figure 3. 8 X 20 ms Pulse Waveform
Figure 5. Negative 8 kV contact per IEC 61000−4−2
− ESD9X5.0ST5G
Figure 4. Positive 8 kV contact per IEC 6100−4−2
− ESD9X5.0ST5G
http://onsemi.com
3
ESD9X3.3ST5G SERIES
PACKAGE DIMENSIONS
SOD−923
CASE 514AA−01
ISSUE B
D
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
−Y−
E
1
b
2
2X
0.08 (0.0032) X Y
DIM
A
b
c
D
E
HE
L
A
c
L
HE
MILLIMETERS
MIN
NOM MAX
0.36
0.40
0.43
0.15
0.20
0.25
0.07
0.12
0.17
0.75
0.80
0.85
0.55
0.60
0.65
0.95
1.00
1.05
0.05
0.10
0.15
MIN
0.014
0.006
0.003
0.030
0.022
0.037
0.002
INCHES
NOM
0.016
0.008
0.005
0.031
0.024
0.039
0.004
MAX
0.017
0.010
0.007
0.033
0.026
0.041
0.006
SOLDERING FOOTPRINT*
0.90
0.40
0.30
DIMENSIONS: MILLIMETERS
SOD−923
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ESD9X3.3ST5G/D
Similar pages