MOTOROLA MPA1016FN Introduction to motorola programmable arrays and the mpa design system Datasheet

Logic: Standard, Special
and Programmable
In Brief . . .
Page
Motorola Programmable Arrays (MPA) . . . . . . . . . . . . 3.1–1
Selection by Function
Logic Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–8
Device Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–36
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–46
Case Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–50
Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–83
Surface Mount . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–83
Pin Conversion Tables . . . . . . . . . . . . . . . . . . . . . . . 3.1–83
Tape and Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–84
This selector guide is a quick reference to Motorola’s vast
offering of standard logic integrated circuits. In TTL, popular
due to its ease of use, low cost, medium–to–high speed
operation and good output drive capability, Motorola offers
both LS and FAST. Motorola’s CMOS portfolio includes
MC14000B standard CMOS series devices, High–Speed
CMOS consisting of a full line of products that are pinout–
compatible with many LSTTL and MC14000B standard
CMOS logic devices which offers designers a solution to the
long–standing combined barrier — high speed and low
power. Motorola’s Emitter Coupled Logic (MECL) is a
non–saturated form of digital logic which eliminates
transistor storage time permitting very high speed operation.
Motorola offers five versions of MECL: MECL 10K, MECL
10H, MECL III, and the recently introduced families ECLinPS
(ECL in picoseconds) and ECLinPS Lite. Also included are
timing solution products such as clock drivers, clock
generators and programmable delay chips, high
performance and communications products such as VCO’s,
prescalers, and synthesizers, and a wide variety of
translators, low–voltage bus interface and serial data
transmission devices. Field programmable logic and in
particular, field programmable arrays, have become the
solution of choice for logic design implementation in
applications where time to market is a critical product
development factor. In addition, reconfigurable arrays have
been used to enhance Customer product flexibility in ways
that no other technology can match.
Motorola Master Selection Guide
3.0–1
Logic: Standard, Special and Programmable
INTRODUCTION TO
MOTOROLA PROGRAMMABLE ARRAYS
AND THE MPA DESIGN SYSTEM
Field programmable logic and in particular, field
programmable arrays, have become the solution of choice
for logic design implementation in applications where time
to market is a critical product development factor. In
addition, reconfigurable arrays have been used to enhance
Customer product flexibility in ways that no other
technology can match.
Programmable logic not only vastly reduces the time
necessary to implement a static design, but significant
product feature benefits can be realized when hardware can
be dynamically altered as easily as software.
The reconfigurable Motorola Programmable Array (MPA)
and MPA design system maximize application flexibility and
minimize time to market by delivering a gate level, push
button, programmable logic solution.
architecture is ideal for traditional schematic driven or high
level language based design capture methods. In fact, logic
synthesis tools were originally designed for and produce the
most efficient results for targeting gate level devices.
A design is analyzed, optimized, transformed into MPA
cells, partitioned, placed and routed based on timing
constraints for all paths in the design – automatically. A
netlist from one of the popular design capture systems or an
existing XNF or LPM netlist is imported into the MPA design
system. The logic is mapped to a series of MPA cells and
the entire resulting netlist is optimized and checked. Based
on a simple clock specification, the MPA design system
generates timing constraints for all paths in the design.
During automatic partitioning, placement and routing path
slack time is constantly redistributed insuring only the
resources required to meet timing requirements are
consumed. Because MPA tools implement the design
according to constraints, tool induced design iterations are
virtually eliminated. Completed layouts can be transformed
into device configurations, as well as annotated simulation
netlists. A layout browser is also available.
The MPA design system also includes complete on–line,
hypermedia, help covers the device, the design system and
the integration kits. Integration kits for Viewlogic, Exemplar,
VHDL (1076 and SDF), Verilog (OVI and SDF) and OrCAD
are included (contact your vendor for additional kits).All
these features add up to a powerful yet extremely easy to
use design implementation engine for the MPA product
family.
Design Capture
Logic system designers have two basic options when
selecting a method for capturing their designs. For smaller
or very regular designs, schematic capture continues to be
a popular design entry vehicle. With the increasing size
and complexity of today’s designs coupled with decreasing
design cycle time requirements, many designers are turning
to Hardware Description Languages (HDLs).
The MPA family was designed from the outset to be well
suited to both methodologies. The output of logic synthesis
compilers maps effortlessly and efficiently onto the MPA
architecture. Unlike other FPGA offerings, the MPA poses
no significant architectural limitations for which the designer
might otherwise have to adjust his schematic design
techniques for.
Design Importation
Push Button Design Implementation
Designs can be captured using schematics, a high level
language, or a combination of these entry methods using
commercially available design capture and logic synthesis
software and the appropriate interface kit. Alternatively,
existing designs can be retargeted from other
programmable logic devices to the MPA device using
commercial logic synthesis tools or the powerful retargetting
capabilities provided with MPA design system.
Design importation begins with a netlist and an optional
clock specification file. The clock specification file provides
a mechanism for the user or design capture tools to
document system level timing requirements. In addition, a
rich set of attributes can be attached to specific components
or nets within the design to specify timing and design pinout
constraints.
The MPA design system minimizes training investment
and automatically generates design implementations which
meet timing constraints.
The gate level logic and abundant hierarchical routing
resources of the MPA device present a rich implementation
media for design implementation. MPA design tools
understand and optimally utilize the MPA device resources
so there are no elaborate rules to learn or design
modifications required to begin design capture. Staying
focused on end product design rather than implementation
tools or device architecture gets the design done faster and,
unlike other programmable solutions, without programmable
logic device specificity to impede future design migration
efforts. The combination of automatic tools and gate level
Motorola Master Selection Guide
3.1–1
Logic: Standard, Special and Programmable
A retargetting rules file is read and the input netlist is
transformed into a series of MPA cells and associated
interconnections. Rules files provide a mechanism to
perform attribute mapping, cell mapping and macro
expansion. By creating custom rule files, the user can
extend the importation process from arbitrary sources. The
MPA design system comes with rules for it’s native
library/EDIF. The resulting netlist is optimized to clip unused
logic and remove redundant logic. For example: each MPA
cell has programmable input inversion capability. All
Inverters or non–inverting buffers can be removed from the
netlist and replaced with signal sense information attached
to each input.
A series of design rule checks are performed to insure
design integrity before the layout process begins.
the same size called clusters. A cluster boundary delay
estimation is applied to pull the most tightly constrained
paths into a minimum number of clusters. The clusters are
then assigned to zones talking into account zonal boundary
delay cost and relative zone placement delay costs. Other
costs like total number of port connections per zone and are
also considered. As assignment proceeds, cluster and zone
boundary delay costs are added to each path and slack is
recomputed.
Next global placement and routing is done. Global routes
begin and end on either I/O cells or port cells. Intrazone
placement and routing is deferred to a later phase. During
global routing all the port cell and I/O cell locations are fixed
and the connections between them established. High fanout
nets are constructed in a highly regular manner to insure
efficient resource utilization. As in partitioning, slack
estimates are refined throughout global routing.
Constraint Generation
Finally the intrazonal placement and routing is done.
Cells assigned to a particular zone are placed and routed to
other zone cells or zone port cells. Port cells and core cells
are constructed to allow port swapping. Core cells can be
routed through if necessary. Allowing core cells to act as
routing cells allows dynamic adjustment of routing
resources within the zone. Dynamic resource adjustment is
a powerful design specific adaptation mechanism.
Timing constraints, the optimized MPA netlist and static
timing analysis is used to generate path slack constraints
for all paths in the design. Each unique signal pathway
between a register output and a register input throughout
the design are enumerated. The total logic and estimated or
real wire delays along the path are summed. The time
between the active upstream register clock edge and the
next active downstream clock edge minus the downstream
register setup time is subtracted from the total path delay.
This difference is called path slack. If any path in the design
has a negative slack value, the implementation will not
function at the required clock rate(s).
Path constraints are utilized throughout the layout
process to insure that a design implementation which meets
timing constraints is automatically generated. If no clock or
timing specifications are provided, the MPA design system
uses the fastest possible clock based on very small net
delay estimates to generate the path constraints. This
usually results in the best possible implementation, but may
take longer than the time required to generate a satisfactory
rather than best possible result.
Contrast this to other programmable logic design tools
which only provide manual net constraint annotation or net
criticality assignment. In these cases significant effort is
necessary to generate constraints and many costly
iterations are required to tune these constraints for a given
design. If any changes are made to the design, another
costly round of iterations is required.
This process produces a layout from which device
configurations, delay back annotations, and chipviews can
be generated.
Incremental Design Support
When specification changes necessitate design
iterations, simply push the button again. Constraints are
automatically recalculated and autolayout only reworks
those portions of the design which have changed. Full
incremental design support means simple design changes
to facilitate design verification can be made quickly and
easily.
Delay Back Annotation
Designs can be verified through numerous methods. One
particularly useful method is the annotation of device and
implementation specific delays back into the original
simulation environment to improve system or device level
simulation accuracy. A MPA device layout can be
transformed into an appropriately formatted delay
annotation file or annotated netlist quickly and easily. The
annotated delay information represents the worst case
delays for a given device speed grade.
Autolayout
The autolayout process makes use of the hierarchical
organization of the MPA device to minimize run time and
deliver implementations that meet timing requirements.
Designs which have diverse timing requirements are ideally
implemented because path slack estimates are refined
throughout the autolayout process insuring only the
resources required to meet timing requirements are
consumed.
The process begins by flattening the design and
partitioning it into small component groups of approximately
Logic: Standard, Special and Programmable
Chipview
While the MPA design system provides a rich set of
reports describing the implementation of a design, a
graphical view of the implementation can be indispensable
for reviewing overall layout quality. Chipview provides a
graphical view of a completed layout. Chipview can be
useful during initial design iterations to visually verify I/O pin
placements before commencing PCB layout, for example.
3.1–2
Motorola Master Selection Guide
Configuration
at no charge on the MPA design system CDROM. Other kits
can be acquired directly from the vendor. Refer to the MPA
Design System Product List for more information.
A layout can be transformed into a device configuration
which, when loaded into the appropriate MPA device,
produces a physical design realization. Many formatting
options are available. The MPA download pod can be used
to emulate a serial PROM. Using the pod, device
configuration files can be downloaded to a device directly
from the PC or workstation development environment.
Low Cost, Easy Access
MPA Design systems are easy to use, competitively
priced and widely available. Copies of MPA design system
software supporting up to 8000 gates can be downloaded
from the World Wide Web (WWW) at URL:
Integration Kits
http://sps.motorola.com/fpga
The MPA design system can be used with a large number
of commercial electronic design automation software. For
each supported vendor, an integration kit is provided which
facilitates MPA design within that vendors’ environment.
Many of these kits are available from Motorola and included
Motorola Master Selection Guide
Complete kits including download pod, evaluation board,
MPA device, CDROM and documentation can be ordered
from your local authorized Motorola distributor or Motorola
sales representative.
3.1–3
Logic: Standard, Special and Programmable
MPA Family Overview
SEMICONDUCTOR TECHNICAL DATA
The Motorola Programmable Array (MPA) design system is a bridge between a design capture environment and Motorola
field programmable arrays. The MPA design system automatically transforms designs into device configurations to realize a
design, when loaded into an MPA device. A design is automatically analyzed, optimized, transformed into MPA cells,
partitioned, placed and routed based on timing constraints for every path in the design. MPA design tools understand and
optimally utilize the MPA device architecture; this eliminates the need to learn a new set of rules and makes these tools ideally
suited for use with logic synthesis. Full incremental design support reduces design implementation time and powerful library
retargeting capabilities allow you to reuse designs which may have been implemented on less capable devices. The MPA
design system operates on existing hardware platforms and supports design capture and simulation tools from more than 10
vendors. All these features plus on–line, hypermedia, help make the MPA design system a powerful, yet extremely easy to
use, design implementation engine.
Features
•
•
•
•
•
•
•
•
• Layout viewer
Push Button Implementation
Optimal Use of MPA Device Resources
Optimal Results with Gate Level Design Input
Library of Common MSI Functions
Design Flow Manager
Design Retargeter
Timing Driven with Integrated Static Timing Analysis
Layout Delay extraction for post layout simulation
• Incremental design support
• On–line, hypermedia, documentation
• Supports all popular design capture and simulation tools
• Lowest cost FPGA development systems.
• Instant access; Downloading via the internet (WWW, ftp).
• Supports multiple speed grades
Design Importation
• Read Appropriate Rules File
• Retarget to MPA Primitives
• Macro Expansion
• Design Optimization
• Design Rule Checks
Constraint Generation
• Read User Constraints
• Path Enumeration
• Path Constraint Generation
Chipview
• Read Stored Layout
• Construct Graphical
Representation
Timing Driven Autolayout
• Partition Design Into Clusters
• Assign Clusters to Zones
• Global Place & Route
• Zonal Place & Route
• Continuous Slack
Redistribution
Delay Annotation
• Read Stored Layout
• Construct Annotated
Netlist
Configuration
• Read Stored Layout
• Construct Bitstream
MPA
Device
Logic: Standard, Special and Programmable
3.1–4
Motorola Master Selection Guide
MPA Family Overview
SEMICONDUCTOR TECHNICAL DATA
Motorola Programmable Array (MPA) products are a high density, high
performance, low cost, solution for your reconfigurable logic needs.
When used with our automatic high performance design tools, MPA
delivers custom logic solutions in minutes rather than weeks. And the low
cost keeps those solutions competitive throughout the product lifecycle.
The MPA architecture has solved the historical problems associated
with fine grain devices without sacrificing re–programmability, reliability,
or cost. MPA1000 devices are reprogrammable SRAM based products
manufactured on a standard 0.43µ Leff CMOS process with logic
capacities from 3,500 to more than 22,000 equivalent FPGA gates. MPA
Logic resources hold a single gate or storage element providing a highly
efficient, adaptable, design implementation medium. Gate level logic
resources, abundant hierarchical interconnection resources and
automatic, timing driven, tools work together to quickly provide design
implementations that meet timing constraints without sacrificing device
utilization.
Staying focused on end product design rather than implementation
tools or device architecture gets the design done faster and, unlike other
programmable solutions, without programmable logic device specificity to
impede future design migration efforts. The combination of automatic
tools and gate level architecture is ideal for traditional schematic driven or
high level language based design methodologies. In fact, logic synthesis
tools were originally designed for and produce the most efficient results
when targeting gate level devices.
High MPA1000 register count and controlled clock skew is ideal for
designs employing pipelining techniques such as communications. The
unique set of MPA1000 I/O programming options make these devices
suitable for industrial and computer interfacing circuits.
PROGRAMMABLE ARRAY
3,500 to 22,000 GATES
•
•
•
•
•
•
•
•
Multiple I/O from 80–200 I/O Pins
Programmable 3V/5V I/O at Any Site
Multiple Packaging Options
Fine Grain Structure Is Optimized for
Logic Synthesis
Programmable Output Drive,
4/6mA @ 5.0V and 3.3V
High Register Count, with 560–2,900
Flip–Flops
IEEE 1149.1 JTAG Boundary Scan
Eight Low–Skew (<1ns) Clocks
MPA1000 Family Members
FPGA
Gates*
Part No.
Logic
Cells
Internal
Flip–Flops
I/O Cell
Flip–Flops
Avail
I/O Pins
Packages
Availability
3500
MPA1016FN
MPA1016DD
1600
400
122
160
61
80
84 PLCC
128 PQFP
NOW
NOW
8000
MPA1036FN
MPA1036DD
MPA1036DH
MPA1036HI
3600
900
122
160
240
240
61
80
120
120
84 PLCC
128 PQFP
160 PQFP
181 PGA
NOW
NOW
NOW
NOW
14200
MPA1064DH
MPA1064DK
MPA1064KE
MPA1064BG
6400
1600
240
320
320
320
120
160
160
160
160 PQFP
208 PQFP
224 PGA
256 PBGA
NOW
NOW
NOW
3Q97
22000
MPA1100DK
MPA1100HV
MPA1100BG
10000
2500
320
400
400
160
200
200
208 PQFP
299 PGA
256 PBGA
NOW
NOW
3Q97
* Equivalent to Industry Standards, as supplied by most manufacturers.
Motorola Master Selection Guide
3.1–5
Logic: Standard, Special and Programmable
MPA Family Overview
SEMICONDUCTOR TECHNICAL DATA
The MPA17128, MPA1765 serial OTP EPROMs provide a compact,
low pin count, non–volatile configuration store for MPA1000 devices.
MPA17000 devices can be cascaded for increased memory capacity
when needed. They are available in the standard 8–pin plastic DIP (N
suffix), 8–pin SOIC (D suffix) and 20–pin PLCC (FN suffix) packages.
• Configuration EPROM for MPA1000 Devices
•
•
•
•
•
•
•
•
•
•
Voltage Range — 4.5 to 6.0V
Maximum Read Current of 10mA
Standby Current of 10µA, Typical
Industry Standard Synchronous Serial Interface
Full Static Operation
10MHz Maximum Clock Rate at 5.0V
Programmable Polarity on Hardware Reset
Programs With Industry Standard Programmers
Electrostatic Discharge Protection > 2000 Volts
8–Pin PDIP and SOIC; 20–Pin PLCC Packages
128K, 64K SERIAL EPROM
8
• Commercial (0 to +70°C) and Industrial (–40 to +85°C)
1
P SUFFIX
PLASTIC PACKAGE
CASE 626–05
8–Lead Pinouts
(Top View)
8
DATA 1
8 VCC
CLK 2
7 Vpp
1
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–05
6 CEO
RESET/OE 3
CE 4
5 Vss
8
19
3
FN SUFFIX
PLCC PACKAGE
CASE 775–02
20–Lead Pinout
(Top View)
NC
Vpp
NC
NC CEO
18
17
16
15
14
NC
19
13
NC
VCC
20
12
NC
NC
1
11
NC
DATA
2
10
Vss
NC
3
9
NC
4
5
6
7
CLK NC RESET/ NC
OE
Logic: Standard, Special and Programmable
4
PIN NAMES
8
CE
3.1–6
Pins
Function
DATA
CLK
RESET/OE
CE
VSS
CEO
VPP
VCC
NC
Data I/O
Clock
Reset Input and Output Enable
Chip Enable Input
Ground
Chip Enable Output
Programming Voltage Supply
+4.5 to 6.0V Power Supply
Not Connected
Motorola Master Selection Guide
MPA Family Overview
SEMICONDUCTOR TECHNICAL DATA
The MPA17C256 is an easy to use and cost effective serial
configuration memory ideally suited for use with today’s popular SRAM
based FPGAs. The MPA17C256 is available in 8–pin PDIP and 20–pin
SOIC and PLCC packages, adhering to industry standard pinouts. The
device interfaces downstream FPGA(s) with a very simple enable, clock
and data interface. The MPA17C256 is reprogrammable with no need for
a higher programming “super voltage”; it may even be reprogrammed on
board. The MPA17C256 also has user programmable RESET/OE
polarity.
MPA17C256
P SUFFIX
8–LEAD PLASTIC PACKAGE
CASE 626–05
• EE Programmable 262,144 x 1 bit Serial Memories Designed to Store
Configuration Programs for FPGAs
• Simple Interface to SRAM FPGAs
• Cascadable to Support Additional Configurations or Future Higher
Density FPGAs
• Low Power CMOS EEPROM Process
• Programmable Reset Polarity
• Available in Space Efficient 8–Pin PDIP, 20–Pin SOIC and 20–Pin PLCC
Packages
DW SUFFIX
20–LEAD PLASTIC SOIC WIDE PACKAGE
CASE 751D–04
• In–System Programmable via 2–Wire Bus
FN SUFFIX
20–LEAD PLCC PACKAGE
CASE 775–02
Controlling the MPA17C256 Serial EEPROM
Most connections between the FPGA device and the Serial EEPROM
are simple and self–explanatory:
PIN NAMES
• The DATA output of the MPA17C256 drives DIN of the FPGA devices
Pins
Function
• The master FPGA DCLK output drives the CLK input of the MPA17C256
• The CEO output of the first MPA17C256 drives the CE input of the next
MPA17C256 in a cascade chain of EEPROMs.
• SER_EN must be connected to VCC
• CE enables the chip and is required to enable the DATA output pin
DATA
CLK
RESET/OE
CE
VSS
CEO
SER_EN
VCC
NC
Data I/O
Clock
Reset Input and Output Enable
Chip Enable Input
Ground
Chip Enable Output
Programming Enable
+4.5 to 6.0V Power Supply
Not Connected
• RESET/OE is chip reset and is part of the DATA output enable structure
This document contains information on a new product. Specifications and information herein are subject to
change without notice.
Motorola Master Selection Guide
3.1–7
Logic: Standard, Special and Programmable
Selection by Function
In order to better serve our customers, we have made some modifications to the Selection by Function portion of the Logic
Selector Guide. For easy selection of Logic’s newer, more complex functions, as well as standard family functions, refer to the
subject index below. Within the Selection by Function tables on the next 27 pages, you will find functions sorted by these broad
subjects, and then broken down alphabetically into more precise functions.
Logic Functions
AMPLIFIER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–9
ARITHMETIC OPERATORS . . . . . . . . . . . . . . . . . . 3.1–9
BOUNCE ELIMINATOR . . . . . . . . . . . . . . . . . . . . . . 3.1–9
BUFFERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–9
BUFFERS, 3–STATE . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–9
BUS INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–10
CBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–12
CLOCK DISTRIBUTION CHIPS . . . . . . . . . . . . . . 3.1–12
CLOCK DRIVERS . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–12
COAX CABLE DRIVERS . . . . . . . . . . . . . . . . . . . . 3.1–13
COMPARATORS . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–14
CONVERTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–14
COUNTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–14
DECODER/DEMULTIPLEXERS . . . . . . . . . . . . . . 3.1–16
DETECTORS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–17
DISPLAY DECODE DRIVERS . . . . . . . . . . . . . . . . 3.1–17
DIVIDERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–17
DRIVER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–17
EDACs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–17
ENCODERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–17
ENCODER/DECODERS . . . . . . . . . . . . . . . . . . . . . 3.1–18
EXPANDERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–18
FIELD PROGRAMMABLE GATE ARRAYS . . . . . 3.1–18
FLIP–FLOPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–18
GATES, AND/NAND . . . . . . . . . . . . . . . . . . . . . . . . 3.1–21
GATES, COMPLEX . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–22
GATES, EXCLUSIVE OR/EXCLUSIVE NOR . . . 3.1–23
GATES, NOR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1–24
Logic: Standard, Special and Programmable
GATES, OR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
INDUSTRIAL CONTROL UNIT . . . . . . . . . . . . . . .
INVERTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
INVERTER/BUFFERS, 2–STATE . . . . . . . . . . . . .
LATCHES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
MEMORY SUPPORT . . . . . . . . . . . . . . . . . . . . . . .
MISCELLANEOUS . . . . . . . . . . . . . . . . . . . . . . . . .
MULTIPLEXER/DATA SELECTORS . . . . . . . . . . .
MULTIVIBRATORS . . . . . . . . . . . . . . . . . . . . . . . . .
OSCILLATORS . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
OSCILLATOR/TIMERS . . . . . . . . . . . . . . . . . . . . . .
PARITY CHECKERS . . . . . . . . . . . . . . . . . . . . . . . .
PHASE–LOCKED LOOP . . . . . . . . . . . . . . . . . . . .
PRESCALERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PROGRAMMABLE DELAY CHIPS . . . . . . . . . . . .
RAMs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RECEIVERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
REGISTER FILES . . . . . . . . . . . . . . . . . . . . . . . . . .
SCHMITT TRIGGERS . . . . . . . . . . . . . . . . . . . . . . .
SCSI BUS TERMINATORS . . . . . . . . . . . . . . . . . .
SERIAL EPROMs . . . . . . . . . . . . . . . . . . . . . . . . . .
SHIFT REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . .
SYNTHESIZERS . . . . . . . . . . . . . . . . . . . . . . . . . . .
TRANSCEIVERS . . . . . . . . . . . . . . . . . . . . . . . . . . .
TRANSLATORS . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VCO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1–8
3.1–24
3.1–25
3.1–25
3.1–25
3.1–26
3.1–27
3.1–27
3.1–27
3.1–29
3.1–29
3.1–30
3.1–30
3.1–30
3.1–30
3.1–31
3.1–31
3.1–31
3.1–32
3.1–32
3.1–32
3.1–32
3.1–32
3.1–32
3.1–34
3.1–34
3.1–34
3.1–35
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
AMPLIFIER
Fiber Optic Post Amplifier
ECL
MC10SX1125
–
16
D
TTL
MC74F181
–
24
N
DW
TTL
MC74F381
–
20
N
DW
TTL
MC74F382
–
20
N
DW
ECL
MC10H181
–
24
P,L,
PW,
LW
FN
ECL
MC10181
–
24
P,L
TTL
MC74F283
–
16
N
D
TTL
SN54LS83A
SN74LS83A
14
N,J
D
TTL
SN54LS283
SN74LS283
16
N,J
D
4–Bit Full Adder
CMOS
MC14008B
–
16
P,L
D
9’s Complementer
CMOS
MC14561B
–
14
P
D
BCD Rate Multiplier
CMOS
MC14527B
–
16
P
DW
Carry Lookahead Generator
TTL
MC74F182
–
16
N
D
Dual 2–Bit Adder/Subtractor
ECL
MC10H180
–
16
P,L
FN
ARITHMETIC OPERATORS
4–Bit Arithmetic Logic Unit
4–Bit Arithmetic Logic Unit/Function Generator
4–Bit Binary Full Adder With Fast Carry
ECL
MC10180
–
16
P,L
Look Ahead Carry Block
ECL
MC10H179
–
16
P,L
FN
NBCD Adder
CMOS
MC14560B
–
16
P,L
D
Triple Serial Adder (Negative Logic)
CMOS
MC14038B
–
16
L
CMOS
MC14490
–
16
P,L
1:2 Differential Fanout Buffer
ECL
MC100LVEL11
8
D
2:8 Differential Fanout Buffer
ECL
MC100LVE310
MC100E310
28
FN
Dual 1:3 Fanout Buffer
ECL
MC100LVEL13
MC100EL13
20
Expandable Buffer
DTL
MC832
Low Voltage Dual 1:4, 1:5 Differential Fanout Buffer, ECL/PECL
Compatible
ECL
MC100LVE210
Low–Voltage CMOS 16–Bit Buffer, 3–State, Inverting With
5V Tolerant Inputs and Outputs
CMOS
MC74LCX16240A
Low–Voltage CMOS 16–Bit Buffer, 3–State, Non–Inverting With
5V Tolerant Inputs and Outputs
CMOS
Low–Voltage CMOS Octal Buffer, 3–State, Non–Inverting With
5V Tolerant Inputs and Outputs
BOUNCE ELIMINATOR
Hex Contact Bounce Eliminator
DW
BUFFERS
–
–
MC100E210
14
DW
P,L
28
FN
–
20
DW,M,
DT
MC74LCX16244
–
20
DW,M,
DT
CMOS
MC74LCX244
–
20
DW,M,
DT
Low–Voltage CMOS Octal Buffer, 3–State, Inverting With 5V
Tolerant Inputs and Outputs
CMOS
MC74LCX240
–
20
DW,M,
DT
Low–Voltage CMOS Octal Buffer Flow Through Pinout, 3–State,
Non–Inverting With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX541
–
20
DW,M,
DT
Low–Voltage CMOS Octal Buffer Flow Through Pinout, 3–State,
Inverting With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX540
–
20
DW,M,
DT
Low–Voltage CMOS Quad Buffer, 3–State, Inverting With 5V
Tolerant Inputs and Outputs
CMOS
MC74LCX125
–
20
DW,M,
DT
Low–Voltage Quiet CMOS Octal Buffer
CMOS
MC74LVQ541
–
20
D,M,
SD,DT
Low–Voltage Quiet CMOS Octal Buffer, 3–State, Non–Inverting
CMOS
MC74LVQ244
–
20
DW,M,
SD,DT
BUFFERS, 3–STATE
Motorola Master Selection Guide
3.1–9
Logic: Standard, Special and Programmable
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
BUFFERS, 3–STATE
Low–Voltage Quiet CMOS Octal Buffer, 3–State, Inverting
CMOS
MC74LVQ240
–
20
DW,M,
SD,DT
Low–Voltage Quiet CMOS Quad Buffer, 3–State, Non–Inverting
CMOS
MC74LVQ125
–
14
D,M,
SD,DT
10–Bit Buffer/Line Driver (Inverting), With 3–State Outputs
TTL
MC74F828
–
24
N
DW
10–Bit Buffer/Line Driver (Non–Inverting), With 3–State Outputs
TTL
MC74F827
–
24
N
DW
3–Bit Registered Bus Transceiver, 25Ω Cutoff Outputs
ECL
MC10E336
MC100E336
28
FN
3–Bit Scannable Registered Bus Transceiver
ECL
MC10E337
MC100E337
28
FN
32–Bit to 32/16/8–Bit Dynamic READ/WRITE Bus Sizer
CMOS
MC68150*33
–
68
FN
CMOS
MC68150*40
–
68
FN
9–Bit Bus Interface, NINV, 3 State Outputs
TTL
MC74F823
–
24
N
DW
Dual Bus Driver/Receiver With 4–to–1 Output Multiplexer (25Ω)
ECL
MC10H332
–
20
P,L
FN
Hex 3–State Inverting Buffer With Common Enables
CMOS
MC54HC366
16
N,J
Hex 3–State Inverting Buffer With Separate 2–Bit and 4–Bit
Sections
CMOS
MC74HC368
16
N
Hex 3–State Non–Inverting Buffer With Common Enables
CMOS
MC54HC365
MC74HC365
16
N,J
Hex 3–State Non–Inverting Buffer With Separate 2–Bit and 4–Bit
Sections
CMOS
MC54HC367
MC74HC367
16
N,J
Hex Buffer 4/2–Bit/Inverting With 3–State Outputs
TTL
SN54LS368A
SN74LS368A
16
N,J
D
Hex Buffer 4/2–Bit/Non–Inverting With 3–State Outputs
TTL
SN54LS367A
SN74LS367A
16
N,J
D
Hex Buffer Driver, 4+2–Bit, Inverting, With 3–State Outputs
TTL
MC74F368
16
N
D
Hex Buffer Gated Enable Inverting With 3–State Outputs
TTL
SN54LS366A
SN74LS366A
16
N,J
D
Hex Buffer Gated Enable Non–Inverting With 3–State Outputs
TTL
SN54LS365A
SN74LS365A
16
N,J
D
Hex Buffer/Driver Gated Enable Inverting, With 3–State Outputs
TTL
MC74F366
–
16
N
D
Hex Buffer/Driver Gated Enable Non–Inverting, With 3–State
Outputs
TTL
MC74F365
–
16
N
D
Hex Buffer/Driver, 4+2–Bit, Non–Inverting, With 3–State Outputs
TTL
MC74F367
–
16
N
D
Hex With 3–State Outputs Buffer (Non–Inverting)
CMOS
MC14503B
–
16
P,L
D
Octal 3–State Non–Inverting Bus Transceiver With LSTTL
Compatible Inputs
CMOS
MC54HCT245A
MC74HCT245A
20
N,J
DW,
SD,DT
Octal Bidirectional Transceiver With 3–State Inputs/Outputs
CMOS
MC74AC245
–
20
N
DW
CMOS
MC74ACT245
–
20
N
DW
CMOS
MC74AC620
–
20
N
DW
CMOS
MC74ACT620
–
20
N
DW
CMOS
MC74AC623
–
20
N
DW
CMOS
MC74ACT623
–
20
N
DW
CMOS
MC74AC640
–
20
N
DW
CMOS
MC74ACT640
–
20
N
DW
CMOS
MC74AC643
–
20
N
DW
CMOS
MC74ACT643
–
20
N
DW
TTL
MC74F245
–
20
N
DW
Octal Bidirectional Transceiver With 8–Bit Parity
y Generator
Checker With 3–State
3 State Outputs
O tp ts
Checker,
TTL
MC74F657A
–
24
N
DW
TTL
MC74F657B
–
24
N
DW
Octal Bidirectional Transceiver, With 3–State Inputs/Outputs
TTL
MC74F1245
–
20
N
DW
(81LS95) TTL
SN54LS795
SN74LS795
20
N,J
DW
(81LS96) TTL
SN54LS796
SN74LS796
20
N,J
DW
(81LS97) TTL
SN54LS797
SN74LS797
20
N,J
DW
(81LS98) TTL
SN54LS798
SN74LS798
20
N,J
DW
BUS INTERFACE
Octal Bidirectional Transceiver With 3–State Outputs
Octal Buffer With 3–State Outputs
Logic: Standard, Special and Programmable
3.1–10
MC74HC366
–
–
DT
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
BUS INTERFACE
Octal Buffer/Line Driver With 3–State Outputs
TTL
SN54LS244
20
N,J
DW
TTL
MC74F240
–
20
N
DW
TTL
MC74F241
–
20
N
DW
TTL
MC74F244
–
20
N
DW
TTL
SN54LS240
SN74LS240
20
N,J
DW
TTL
SN54LS241
SN74LS241
20
N,J
DW
TTL
SN54LS540
SN74LS540
20
N,J
DW
TTL
SN54LS541
SN74LS541
20
N,J
DW
CMOS
MC74AC241
–
20
N
DW
CMOS
MC74AC244
–
20
N
DW
CMOS
MC74ACT244
–
20
N
DW
CMOS
MC74AC540
–
20
N
DW
CMOS
MC74ACT540
–
20
N
DW
CMOS
MC74AC541
–
20
N
DW
CMOS
MC74ACT541
–
20
N
DW
CMOS
MC74AC240
–
20
N
DW
CMOS
MC74ACT240
–
20
N
DW
CMOS
MC74ACT241
–
20
N
DW
TTL
SN54LS245
SN74LS245
20
N,J
DW
TTL
SN54LS623
SN74LS623
20
N,J
DW
Octal Bus Transceiver, With 3–State Outputs
TTL
MC74F623
20
N
DW
Octal Bus Transceiver/Inverting With 3–State Outputs
TTL
SN54LS640
20
N,J
DW
TTL
MC74F620
–
20
N
DW
TTL
MC74F640
–
20
N
DW
Octal Bus Transceiver/Non–Inverting With 3–State Outputs
TTL
SN54LS645
20
N,J
DW
Octal Bus Transceiver/Register With 3–State Outputs
Non–Inverting
CMOS
MC74AC652
–
24
N
DW
Octal Bus Transceiver
SN74LS244
–
SN74LS640
SN74LS645
CMOS
MC74ACT652
–
24
N
DW
Octal Registered Transceiver Inverting, With 3–State Outputs
TTL
MC74F544
–
24
N
DW
Octal Transceiver/Register With 3–State Outputs Non–Inverting
CMOS
MC74AC646
–
24
N
DW
CMOS
MC74ACT646
–
24
N
DW
CMOS
MC74AC648
–
24
N
DW
CMOS
MC74ACT648
–
24
N
DW
Octal Transceiver/Register, With 3–State Outputs
TTL
MC74F646
–
24
N
DW
Octal With 3–State Non–Inverting Buffer/Line Driver/Line Receiver
CMOS
MC54HC241A
MC74HC241A
20
N,J
DW
Octal With 3–State Non–Inverting
g Buffer/Line Driver/Line Receiver
With LSTTL Compatible Inputs
CMOS
MC54HCT241A
MC74HCT241A
20
N,J
DW
CMOS
MC54HCT244A
MC74HCT244A
20
N,J
DW,
SD,DT
Octal With 3–State Outputs Inverting Buffer/Line Driver/Line
Receiver
CMOS
MC54HC240A
MC74HC240A
20
N,J
DW,
DT
MC74HC540A
20
N,J
DW
20
N
DW,
SD,DT
Octal Transceiver/Register With 3–State Outputs Inverting
CMOS
MC54HC540A
Octal With 3–State Outputs Inverting Buffer/Line Driver/Line
Receiver With LSTTL Compatible Inputs
CMOS
MC74HCT240A
Octal With 3–State Outputs Inverting Bus Transceiver
CMOS
MC54HC640A
MC74HC640A
20
N,J
DW
Octal With 3–State Outputs Non–Inverting Buffer/Line Driver/Line
Receiver
CMOS
MC54HC541A
MC74HC541A
20
N,J
DW
CMOS
MC74VHC541
–
20
CMOS
MC74HCT541A
–
20
Octal With 3–State Outputs Non–Inverting Buffer/Line Driver/Line
Receiver With LSTTL Compatible Inputs
Motorola Master Selection Guide
3.1–11
–
DW,
DT,M
N
DW
Logic: Standard, Special and Programmable
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
20
N,J
DW,
SD,DT
BUS INTERFACE
Octal With 3–State Outputs Non–Inverting Buffer/Line Driver/Line
Receiver
CMOS
MC54HC244A
CMOS
MC74VHC244
CMOS
MC54HC245A
CMOS
MC74VHC245
Octal With 3–State Outputs Non–Inverting Bus Transceiver & D
Flip–Flop
CMOS
MC54HC646
MC74HC646
24
N,J
Quad Buffers With 3–State Outputs
TTL
SN54LS125A
SN74LS125A
14
N,J
D
Quad 3–State Non–Inverting Buffers
CMOS
MC74HC125A
–
14
N
D,DT
CMOS
MC74VHC125
–
14
CMOS
MC74HC126A
–
14
N
D,DT
CMOS
MC74AC125
–
14
N
D
CMOS
MC74ACT125
–
14
N
D
CMOS
MC74AC126
–
14
N
D
CMOS
MC74ACT126
–
14
N
D
TTL
MC74F125
–
14
N
D
TTL
MC74F126
–
14
N
D
TTL
SN54LS126A
14
N,J
D
Quad Bus Driver
ECL
MC10192
–
16
P,L
FN
Quad Bus Driver/Receiver With 2–to–1 Output Multiplexer (25Ω)
ECL
MC10H330
–
24
P,L
FN
Quad Bus Driver/Receiver With Transmit & Receiver Latches
(25Ω)
ECL
MC10H334
–
20
P,L
FN
Quad Bus Transceiver/Inverting With 3–State Outputs
TTL
SN54LS242
SN74LS242
14
N,J
D
Quad Bus Transceiver/Non–Inverting With 3–State Outputs
TTL
SN54LS243
SN74LS243
14
N,J
D
Quad Bus Transceivers With 3–State Outputs
TTL
MC74F242
–
14
N
D
TTL
MC74F243
–
14
N
D
Quad With 3–State Outputs Inverting Bus Transceiver
CMOS
MC74HC242
–
14
N
Triple 3–Input Bus Driver With Enable (25Ω)
ECL
MC10H423
–
16
P,L
FN
Triple 4–3–3 Input Bus Driver (25Ω)
ECL
MC10H123
–
16
P,L
FN
ECL
MC10123
–
16
P,L
FN
SXLG
MC68194
–
52
1:4 Clock Distribution Chip
ECL
MC10EL15
MC100EL15
16
D
1:5 Clock Distribution Chip
ECL
MC100LVEL14
MC100EL14
20
DW
1:6 Differential Clock Distribution Chip
ECL
MC10E211
MC100E211
28
FN
Low Voltage 1:12 Clock Distribution Chip
SXLG
MPC948
–
32
FA
FA
Octal With 3–State Outputs Non–Inverting Bus Transceiver
Quad Buffer With 3–State Outputs
MC74HC244A
–
MC74HC245A
–
SN74LS126A
20
20
DW,
DT,M
N,J
20
DW
DW
DT,M
DW
D,
DT,M
CBM
CBM – Carrier Band Modem
*FJ
CLOCK DISTRIBUTION CHIPS
SXLG
MPC948L
–
32
Low Voltage 1:9 Clock Distribution Chip
SXLG
MPC947
–
32
FA
Low Voltage 1:9 ECL/PECL Clock Distribution Chip
ECL
MC100LVE111
–
28
FN
1:2 Differential Clock Driver
ECL
MC10EL11
8
D
1:6 PCI Clock Generator/Fanout Buffer
CMOS
MPC903
–
16
D
CMOS
MPC904
–
16
D
CMOS
MPC905
–
16
D
ECL
MC10E111
28
FN
CLOCK DRIVERS
1:9 Differential Clock Driver With Low Skew, Enable, Vbb
Logic: Standard, Special and Programmable
3.1–12
MC100EL11
MC100E111
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
CLOCK DRIVERS
1:9 Differential ECL/PECL RAMBus Clock Buffer
ECL
MC10E411
–
28
FN
1:9 TTL/TTL Clock Distribution Chip
ECL
MC10H645
–
28
FN
3.3/5.0V Fully Integrated PLL Clock Driver
CMOS
MPC974
–
52
FA
50 MHz Low Skew CMOS PLL Clock Driver With µP Power Down
CMOS
MC88920
–
20
DW
66 MHz Low Skew CMOS PLL Clock Driver With µP
Power–Down/Power–Up Feature
CMOS
MC88921
–
20
DW
68030/040 PECL/TTL Clock Driver
ECL
MC10H640
MC100H640
28
FN
ECL
MC10H642
MC100H642
28
FN
ECL
MC10H644
MC100H644
20
TTL
MC74F1803
–
14
N
N
Clock Driver Quad D–Type Flip–Flop w/ Matched Propagation
Delays
FN
D
TTL
MC74F803
–
14
CMOS PLL Clock Driver Programmable Frequency, Low Skew,
High Fan–Out
CMOS
MC88PL117
–
52
Dual 3.3V PLL Clock Generator
CMOS
MPC980
–
52
FA
Dual Supply ECL/TTL 1:8 Clock Driver
ECL
MC10H643
28
FN
High Frequency PLL Clock Generator
ECL
MC12429
–
28
FN
ECL
MC12430
–
28
FN
ECL
MC12439
–
28
Low Skew CMOS Clock Driver
CMOS
MC88913
–
14
N
D
Low Skew CMOS Clock Driver With Reset
CMOS
MC88914
–
14
N
D
Low Skew CMOS PLL 68060 Clock Driver
CMOS
MC88LV926
–
20
DW
Low Skew CMOS PLL Clock Driver
CMOS
MC88915*55
–
28
FN
CMOS
MC88915*70
–
28
FN
CMOS
MC88916*70
–
20
DW
CMOS
MC88916*80
–
20
DW
CMOS
MC88915T*160
–
28
FN
133 MHz Version CMOS
MC88915T*133
–
28
FN
100 MHz Version CMOS
MC88915T*100
–
28
FN
70 MHz Version CMOS
MC88915T*70
–
28
FN
55 MHz Version CMOS
Low Skew CMOS PLL Clock Driver With Processor Reset
Low Skew CMOS PLL Clock Driver
160 MHz Version
MC100H643
D
FN
FN
MC88915T*55
–
28
FN
Low Voltage 1:10 CMOS Clock Driver
CMOS
MPC946
–
32
FA
Low Voltage 1:15 Differential ÷1/2 ECL/PECL Clock Driver
ECL
MC100LVE222
–
52
FA
Low Voltage 1:15 PECL to CMOS Clock Driver
CMOS
MPC949
–
52
FA
Low Voltage 1:9 Differential ECL/HSTL to HSTL Clock Driver
CMOS
MPC911
–
28
FN
Low Voltage PECL PLL Clock Driver
CMOS
MPC992
–
32
FA
Low Voltage PLL Clock Driver
CMOS
MPC930
MPC931
32
FA
CMOS
MPC950
MPC951
32
FA
CMOS
MPC956
–
32
FA
CMOS
MPC970
–
52
FA
CMOS
MPC972
MPC973
52
FA
CMOS
MPC990
MPC991
52
FA
Low Voltage Wide Fanout PLL Clock Driver
CMOS
MPC952
–
32
FA
PECL/TTL to TTL 1: 8 Clock Distribution Chip
ECL
MC10H646
MC100H646
28
FN
Single Supply PECL/TTL 1:9 Clock Distribution Chip
ECL
MC10H641
MC100H641
28
FN
÷2, ÷4/6 Clock Generation Chip (3.3V)
ECL
MC100LVEL38
MC100EL38
20
DW
÷2/4, ÷4/6 Clock Generation Chip
ECL
MC100LVEL39
MC100EL39
20
DW
÷2,4,8 Differential Clock Driver
ECL
MC10EL34
MC100EL34
16
D
Fibre Channel Coaxial Cable Driver and Loop Resiliency Circuit
SDX
MC10SX1189
–
16
D
300 MBit/s LED Driver for FDDI and Fibre Channel
SDX
MC10SX1130
–
16
D
COAX CABLE DRIVERS
Motorola Master Selection Guide
3.1–13
Logic: Standard, Special and Programmable
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
COMPARATORS
4–Bit Magnitude Comparator
TTL
MC74F85
–
16
N
D
CMOS
MC74HC85
–
16
N
DT
TTL
SN54LS85
16
N,J
D
CMOS
MC14585B
–
16
P,L
D
ECL
MC10H166
–
16
P,L
FN
ECL
MC10166
–
16
P,L
FN
8–Bit Equality Comparator
CMOS
MC54HC688
20
N,J
DW
8–Bit Identity Comparator
CMOS
MC74ACT521
–
20
N
TTL
MC74F521
–
20
N
DW
TTL
SN54LS682
SN74LS682
20
N,J
DW
TTL
SN54LS684
SN74LS684
20
N,J
DW
TTL
SN54LS688
SN74LS688
20
N,J
DW
9–Bit Magnitude Comparator
ECL
MC10E166
MC100E166
Dual Analog Comparator With Latch
ECL
MC10E1651
–
16,20
L
FN
Dual Analog Comparator With Latch (Hi–Perf MC1651)
ECL
MC10E1652
–
16,20
L
FN
4–Bit Parallel to Serial Converter
ECL
MC10E446
MC100E446
28
4–Bit Serial to Parallel Converter
ECL
MC10E445
MC100E445
28
Dual A/D Converter
ECL
MC1650
–
16
L
ECL
MC1651
–
16
L
12–Bit Binary Counter
CMOS
MC14040B
–
16
P,L
D
12–Stage Binary Ripple Counter
CMOS
MC54HC4040A
MC74HC4040A
16
N,J
D,DT
CMOS
MC74AC4040
–
16
N
D
14–Bit Binary Counter
CMOS
MC14020B
–
16
P,L
D
14–Bit Binary Counter and Oscillator
CMOS
MC14060B
–
16
P,L
D
14–Stage Binary Ripple Counter
CMOS
MC74HC4020A
–
16
N
D,DT
CMOS
MC74AC4020
–
16
N
D
CMOS
MC54HC4060
MC74HC4060
16
N,J
DT
CMOS
MC54HC4060A
MC74HC4060A
16
N,J
D,DT
3–Digit BCD Counter
CMOS
MC14553B
–
16
P
DW
4–Bit BCD Decade Counter, Asynchronous Reset
TTL
SN54LS160A
SN74LS160A
16
N,J
D
TTL
SN54LS162A
SN74LS162A
16
N,J
D
4–Bit Bidirectional Binary Counter, With 3–State Outputs
TTL
MC74F569
–
20
N
DW
4–Bit Bidirectional Decade Counter, With 3–State Outputs
TTL
MC74F568
–
20
N
DW
4–Bit Binary Counter
TTL
SN54LS93
SN74LS93
14
N,J
D
TTL
SN54LS293
SN74LS293
14
N,J
D
ECL
MC10H16
–
16
P,L
FN
CMOS
MC14161B
–
16
P
D
CMOS
MC14163B
–
16
P
D
TTL
SN54LS161A
SN74LS161A
16
N,J
D
TTL
SN54LS163A
SN74LS163A
16
N,J
D
4–Bit Up/Down Counter With 3–State Outputs
TTL
SN54LS569A
SN74LS569A
20
N,J
DW
4–Stage Presettable Ripple Counters
TTL
SN54LS196
SN74LS196
14
N,J
D
TTL
SN54LS197
SN74LS197
14
N,J
D
TTL
MC74F168
–
16
N
D
TTL
MC74F169
–
16
N
D
5 Cascaded BCD Counters
CMOS
MC14534B
–
24
P,L
DW
6–Bit Universal Counter, (Lookahead Carry)
ECL
MC10E136
7–Stage Ripple Counter
CMOS
MC14024B
5–Bit Magnitude Comparator
8–Bit Magnitude Comparator
SN74LS85
MC74HC688
28
FN
CONVERTERS
FN
FN
COUNTERS
14–Stage Binary Ripple Counter With Oscillator
4–Bit Binary Counter, Synchronous Presettable
4–Bit Binary Counter, Synchronous Reset
4–Stage Synchronous Bidirectional Counter
Logic: Standard, Special and Programmable
3.1–14
MC100E136
–
28
14
FN
P,L
D
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
COUNTERS
8–Bit Bidirectional Binary Counter
TTL
MC74F269
–
24
N
DW
8–Bit Bidirectional Binary Counter, With 3–State Outputs
TTL
MC74F579
–
20
N
DW
TTL
MC74F779
–
16
N
8–Bit Ripple Counter
ECL
MC10E137
MC100E137
28
8–Bit Synchronous Binary Up Counter
ECL
MC10E016
MC100E016
28
BCD Decade Counter, Synchronous Presettable
TTL
MC74F160A
–
16
N
D
TTL
MC74F162A
–
16
N
D
BCD Decade Synchronous Bidirectional Counter
TTL
SN54LS168
16
N,J
D
Bi–Quinary Counter
ECL
MC10138
–
16
P,L
FN
Binary Counter
ECL
MC10154
–
16
P,L
ECL
MC10178
–
16
P,L
FN
TTL
MC74F161A
–
16
N
D
D
Binary Counter, Synchronous Presettable, 4–Bit
SN74LS168
D
FN
FN
TTL
MC74F163A
–
16
N
Counter Control Logic
ECL
MC12014
–
16
P,L
Decade Counter
TTL
SN54LS90
SN74LS90
14
N,J
D
TTL
SN54LS290
SN74LS290
14
N,J
D
CMOS
MC14017B
–
16
P,L
D
CMOS
MC74HC4017
–
16
N
D
Divide By 12 Counter
TTL
SN54LS92
SN74LS92
14
N,J
D
Dual 4–Stage Binary Counter
TTL
SN54LS393
SN74LS393
16
N,J
D
Dual 4–Stage Binary Ripple Counter
CMOS
MC54HC393
MC74HC393
14
N,J
D
Dual 4–Stage Binary Ripple Counter W ÷2, ÷5 Sections
CMOS
MC54HC390
MC74HC390
16
N,J
D
Dual BCD Up Counter
CMOS
MC14518B
–
16
P,L
DW
Dual Binary Up Counter
CMOS
MC14520B
–
16
P,L
DW
Dual Decade Counter
TTL
SN54LS390
SN74LS390
16
N,J
D
SN74LS490
16
N,J
D
16
P
D
16
N,J
D
D
TTL
SN54LS490
Industrial Time Base Generator
CMOS
MC14566B
Modulo 16 Binary Synchronous Bidirectional Counter
TTL
SN54LS169
Octal Counter
CMOS
MC14022B
–
16
P,L
Phase Comparator and Programmable Counter
CMOS
MC14568B
–
16
P,L
D
Presettable 4–Bit BCD Down Counter
CMOS
MC14522B
–
16
P
DW
Presettable 4–Bit Binary Down Counter
CMOS
MC14526B
–
16
P,L
DW
Presettable 4–Bit Binary Up/Down Counter
TTL
SN54LS191
SN74LS191
16
N,J
D
SN74LS193
16
N,J
D
16
P
D
–
SN74LS169
TTL
SN54LS193
Presettable BCD Up/Down Counter
CMOS
MC14510B
Presettable BCD/Decade Up/Down Counter
TTL
SN54LS190
SN74LS190
16
N,J
D
TTL
SN54LS192
SN74LS192
16
N,J
D
Presettable Binary Up/Down Counter
CMOS
MC14516B
–
16
P,L
D
Presettable Binary/BCD Up/Down Counter
CMOS
MC14029B
–
16
P,L
D
Presettable Counter
CMOS
MC54HC160
MC74HC160
16
N,J
D
CMOS
MC54HC161A
MC74HC161A
16
N,J
D
CMOS
MC54HCT161A
MC74HCT161A
16
N,J
D
CMOS
MC54HC162
MC74HC162
16
N,J
D
CMOS
MC54HC163A
MC74HC163
16
N,J
D
CMOS
MC54HCT163A
MC74HCT163A
16
N,J
D
Presettable Divide–by–N Counter
CMOS
MC14018B
–
16
P
D
Programmable Dual Binary/BCD Counter
CMOS
MC14569B
–
16
P,L
DW
Motorola Master Selection Guide
3.1–15
–
Logic: Standard, Special and Programmable
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
COUNTERS
Programmable Modulo–N Counters (N=0–9)
ECL
MC4016
–
16
P,L
ECL
MC4018
–
16
P,L
ECL
MC4316
–
16
P,L
Synchronous 4–Bit Up/Down Counter
TTL
SN54LS669
16
N,J
D
Synchronous Presettable Binary Counter
CMOS
MC74AC161
–
16
N
D
CMOS
MC74ACT161
–
16
N
D
CMOS
MC74AC163
–
16
N
D
CMOS
MC74ACT163
–
16
N
D
CMOS
MC74AC160
–
16
N
D
CMOS
MC74ACT160
–
16
N
D
CMOS
MC74AC162
–
16
N
D
CMOS
MC74ACT162
–
16
N
D
Universal Decade Counter
ECL
MC10137
–
16
P,L
Universal Hexadecimal Counter
ECL
MC10H136
–
16
P,L
FN
ECL
MC10136
–
16
P,L
FN
CMOS
MC74AC190
–
16
N
D
CMOS
MC74HC42
–
16
N
D
TTL
SN54LS42
SN74LS42
16
N,J
D
1–of–10 Decoder/Driver Open–Collector
TTL
SN54LS145
SN74LS145
16
N,J
D
1–of–10 Decoder, With 3–State Outputs
TTL
MC74F537
20
N
DW
1–of–16 Decoder/Demultiplexer
CMOS
MC54HC154
24
N,J
DW
1–of–16 Decoder/Demultiplexer With Address Latch
CMOS
MC74HC4514
–
24
N
DW
1–of–4 Decoder, With 3–State Outputs
TTL
MC74F539
–
20
N
DW
1–of–8 Decoder, With 3–State Outputs
TTL
MC74F538
–
20
N
DW
1–of–8 Decoder/Demultiplexer
CMOS
MC74AC138
–
16
N
D
CMOS
MC74ACT138
–
16
N
D
TTL
MC74F138
–
16
N
D
CMOS
MC54HC138A
16
N,J
CMOS
MC74VHC138
–
16
CMOS
MC74HCT138A
–
16
N
D,DT
TTL
SN54LS138
16
N,J
D
CMOS
MC74HC137
–
16
N
D
CMOS
MC74HC237
–
16
N
D
3–Line to 8–Line Decoders/Demultiplexers With Address Latches
TTL
SN54LS137
16
N,J
D
4–Bit Transparent Latch/4–to–16 Line Decoder (High)
CMOS
MC14514B
–
24
P,L
DW
4–Bit Transparent Latch/4–to–16 Line Decoder (Low)
CMOS
MC14515B
–
24
P,L
DW
8–Bit Addressable Latch/1–of–8 Decoder
CMOS
MC54HC259
16
N,J
D
BCD–to–Decimal Decoder/Binary–to–Octal Decoder
CMOS
MC14028B
–
16
P,L
D
Binary to 1–4 Decoder (Low)
ECL
MC10171
–
16
P,L
FN
Binary to 1–8 Decoder, (High)
ECL
MC10H162
–
16
P,L
FN
ECL
MC10162
–
16
P,L
FN
ECL
MC10H161
–
16
P,L
FN
–
Synchronous Presettable Binary Counter
Synchronous Presettable Binary–Coded–Decimal Decade Counter
Up/Down Counter With Preset and Ripple Clock
SN74LS669
DECODER/DEMULTIPLEXERS
1–of–10 Decoder
1–of–8 Decoder/Demultiplexer With Address Latch
Binary to 1–8 Decoder, (Low)
–
MC74HC154
MC74HC138A
SN74LS138
SN74LS137
MC74HC259
D
D,DT,
M
ECL
MC10161
16
P,L
FN
Dual 1–of–4 Decoder
TTL
SN54LS155
SN74LS155
16
N,J
D
Dual 1–of–4 Decoder Open–Collector
TTL
SN54LS156
SN74LS156
16
N,J
D
Logic: Standard, Special and Programmable
3.1–16
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
DECODER/DEMULTIPLEXERS
Dual 1–of–4 Decoder/Demultiplexer
Dual 1–of–4 Decoder/Demultiplexer
Dual Binary to 1–4 Decoder (High)
CMOS
MC74AC139
–
16
N
D
CMOS
MC74ACT139
–
16
N
D
TTL
MC74F139
–
16
N
D
CMOS
MC54HC139A
MC74HC139A
16
N,J
D
TTL
SN54LS139
SN74LS139
16
N,J
D
ECL
MC10H172
–
16
P,L
FN
ECL
MC10172
–
16
P,L
FN
Dual Binary to 1–4 Decoder (Low)
ECL
MC10H171
–
16
P,L
FN
Dual Binary to 1–of–4 Decoder (Active High Outputs)
CMOS
MC14555B
–
16
P
D
Dual Binary to 1–of–4 Decoder (Active Low Outputs)
CMOS
MC14556B
–
16
P
Low–Voltage CMOS 1–of–8 Decoder/Demultiplexer With 5V
Tolerant Inputs and Outputs
CMOS
MC74LCX138
–
16
D,DT
Low–Voltage Quiet CMOS 1–of–8 Decoder/Demultiplexer
CMOS
MC74LVQ138
–
16
D,M,
SD,DT
Analog Mixer
ECL
MC12002
–
14
P,L
Phase–Frequency Detector
ECL
MC4044
–
14
P,L
ECL
MC4344
–
14
P,L
ECL
MC12040
–
14
P,L
ECL
MCH12140
MCK12140
8
TTL
SN54LS48
SN74LS48
16
CMOS
MC14558B
TTL
SN54LS47
SN74LS47
TTL
SN54LS247
TTL
D
DETECTORS
D
FN
D
DISPLAY DECODE DRIVERS
BCD–to–Seven Segment Decoder
BCD–to–Seven Segment Decoder/Driver
N,J
D
16
P,L
D
16
N,J
D
SN74LS247
16
N,J
D
SN54LS248
SN74LS248
16
N,J
D
SN74LS249
D
–
TTL
SN54LS249
16
N,J
BCD–to–Seven Segment Latch/Decoder/Display Driver
CMOS
MC74HC4511
–
16
N
D
BCD–to–Seven Segment Latch/Decoder/Driver
CMOS
MC14511B
–
16
P,L
D,DW
BCD–to–Seven Segment Latch/Decoder/Driver for Liquid Crystals
CMOS
MC14543B
–
16
P,L
D
BCD–to–Seven Segment
g
Latch/Decoder/Driver With Ripple
pp
Blanking
CMOS
MC14544B
–
18
P,L
CMOS
MC14513B
–
18
P
High Current BCD–to–Seven Segment Decoder/Driver
CMOS
MC14547B
–
16
P,L
ECL
MC10EL32
ECL
MC100LVEL32
ECL
MC10EL33
ECL
MC100LVEL33
–
Coaxial Cable Driver
ECL
MC10EL89
300MBit/s LED Driver for FDDI and Fibre Channel
ECL
MC10SX1130
Error Detection–Correction Circuit (IBM Code)
ECL
Error Detection–Correction Circuit (Motorola Code)
ECL
10–Line to 4–Line Priority Encoder
TTL
SN54LS147
8–Bit Priority Encoder
CMOS
MC14532B
DW
DIVIDERS
÷ 2 Divider
÷ 4 Divider
MC100EL32
8
D
8
D
8
D
8
D
–
8
D
–
16
D
MC10163
–
16
P,L
MC10193
–
16
P,L
16
N,J
D
16
P,L
D
–
MC100EL33
DRIVER
EDACs
ENCODERS
Motorola Master Selection Guide
3.1–17
SN74LS147
–
Logic: Standard, Special and Programmable
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
ENCODERS
8–Input Priority Encoder
TTL
SN54LS348
ECL
MC10H165
SN74LS348
16
N,J
D
–
16
P,L
FN
–
16
P,L
FN
16
N,J
D
ECL
MC10165
8–Input Priority Encoder (Glitchless)
TTL
SN54LS848
8–Line to 3–Line Priority Encoder
TTL
MC74F148
16
N
D
TTL
SN54LS148
SN74LS148
16
N,J
D
TTL
SN54LS748
SN74LS748
16
N,J
D
CMOS
MC74HC147
–
16
N
D
ECL
MC100SX1230
–
28
Dual 4–Iput Expander
HTL
MC669
–
14
P,L
Expandable Dual 4–Input Gate (Active Pullup)
HTL
MC660
–
14
P,L
Expandable Dual 4–Input Gate (Passive Pullup)
HTL
MC661
–
14
P,L
Expandable Dual 4–Input Line Driver
HTL
MC662
–
14
P,L
Expandable Dual Power Gate
DTL
MC844
–
14
P,L
DTL
MC944
–
14
P,L
14,200–Gate Programmable Array With Up to 160 User I/Os
CMOS
MPA1064
–
160,
224
22,000–Gate Programmable Array With Up to 200 User I/Os
CMOS
MPA1100
–
229
HV
3,500–Gate Programmable Array With Up to 80 User I/Os
CMOS
MPA1016
–
84,
128
FN,
DD
8,000–Gate Programmable Array With Up to 120 User I/Os
CMOS
MPA1036
–
84,
128,
160,
181
FN,
DD,
DH,
HI
3–Bit Differential Flip–Flop
ECL
MC10E431
MC100E431
28
FN
4–Bit D Flip–Flop Individual Clock, Reset Differential Output
ECL
MC10E131
MC100E131
28
4–Bit D Flip–Flop With Enable
TTL
SN54LS379
SN74LS379
16
N,J
D
4–Bit D–Type Register With With 3–State Outputs
TTL
SN54LS173A
SN74LS173A
16
N,J
D
5–Bit Differential Register
ECL
MC10E452
MC100E452
28
FN
6–Bit 2:1 Mux–Register With Common Clock, Asynchronous
Master Reset Single Ended
ECL
MC10E167
MC100E167
28
FN
6–Bit D Register With Common Clock, Asynchronous Master
Reset, Differential Outputs
ECL
MC10E151
MC100E151
28
FN
6–Bit D Register, With Differential Inputs, (Data & Clock) , VBB,
Common Reset
ECL
MC10E451
MC100E451
28
FN
6–Bit Parallel D Register With Enable
CMOS
MC74AC378
–
16
N
D
CMOS
MC74ACT378
–
16
N
D
9–Bit Hold Register, 700MHz, With Asynchronous Master Reset
ECL
MC10E143
Clocked Flip–Flop
DTL
MC845
Clocked Flip–Flop
DTL
MC945
D Flip–Flop With Set & Reset
ECL
MC10EL31
MC100EL31
8
D
Differential Clock D Flip–Flop
ECL
MC10EL51
MC100EL51
8
D
ECL
MC100LVEL51
8
D
Differential Data & Clock D Flip–Flop
ECL
MC10EL52
Dual D Flip–Flop
CMOS
MC74AC74
–
14
CMOS
MC74ACT74
–
CMOS
MC14013B
–
Decimal–to–BCD Encoder
SN74LS848
–
ENCODER/DECODERS
CMI Encoder/Decoder
FN
EXPANDERS
FIELD PROGRAMMABLE GATE ARRAY
DH,
KE
FLIP–FLOPS
Logic: Standard, Special and Programmable
3.1–18
MC100E143
FN
28
FN
–
14
P,L
–
14
P,L
–
MC100EL52
8
D
N
D
14
N
D
14
P,L
D
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
14
N,J
D,DT
FLIP–FLOPS
Dual D Flip–Flop With Set and Reset
CMOS
MC54HC74A
CMOS
MC74VHC74
MC74HC74A
–
14
Dual D Flip–Flop With Set and Reset With LSTTL Compatible
Inputs
CMOS
MC74HCT74A
–
14
Dual D–Type Positive Edge–Triggered Flip–Flop
TTL
MC74F74
–
TTL
SN54LS74A
SN74LS74A
Dual Differential Data and Clock D Flip–Flop With Set and Reset
ECL
MC100LVEL29
MC100EL29
20
Dual J–K Negative Edge–Triggered Flip–Flop
TTL
SN54LS112A
SN74LS112A
16
N,J
D
TTL
SN54LS113A
SN74LS113A
14
N,J
D
TTL
SN54LS114A
SN74LS114A
14
N,J
D
Dual J–K Positive Edge–Triggered Flip–Flop
TTL
SN54LS109A
SN74LS109A
16
N,J
D
Dual J–K Flip–Flop
HTL
MC663
14
P,L
–
N
D
14
N
D
16
N,J
D
DW
TTL
SN54LS107A
14
N,J
Dual J–K Flip–Flop (Common Clock and CD Separate SD)
DTL
MC952
–
14
P,L
Dual J–K Flip–Flop (Separate Clock and SD, No CD)
DTL
MC953
–
14
P,L
Dual J–K Flip–Flop Negative Edge Trigger
CMOS
MC74AC112
–
16
N
D
CMOS
MC74ACT112
–
16
N
D
CMOS
MC74AC113
–
14
N
D
CMOS
MC74ACT113
–
14
N
D
Dual J–K Flip–Flop With Set and Clear
TTL
SN54LS76A
16
N,J
D
Dual J–K Flip–Flop With Set and Reset
CMOS
MC74HC112
–
16
N
D,DT
Dual J–K Flip–Flop
CMOS
MC14027B
–
16
P,L
D
Dual J–K Flip–Flop With Reset
CMOS
MC74HC73
–
14
N
D
CMOS
MC74HC107
–
14
N
D
Dual J–K Flip–Flop With Set and Reset
CMOS
MC74HC76
–
16
N
D
Dual J–K Master–Slave Flip–Flop
ECL
MC10135
–
16
P,L
FN
ECL
MC10H135
–
16
P,L
FN
TTL
MC74F112
–
16
N
D
TTL
SN54LS73A
14
N,J
D
CMOS
MC74AC109
–
16
N
D
CMOS
MC74ACT109
–
16
N
D
Dual J–K Flip–Flop With Set and Reset
CMOS
MC74HC109
–
16
N
D
Dual J–K Positive Edge–Triggered Flip–Flop
TTL
MC74F109
–
16
N
D
Dual Type–D Master–Slave Flip–Flop
ECL
MC10131
–
16
P,L
FN
ECL
MC10H131
–
16
P,L
FN
TTL
SN54LS174
16
N,J
D
CMOS
MC14174B
16
P,L
D
Hex D Flip–Flop With Enable
TTL
SN54LS378
16
N,J
D
Hex D Flip–Flop With Master Reset
CMOS
MC74AC174
–
16
N
D
TTL
MC74F174
–
16
N
D
CMOS
MC74ACT174
–
16
N
D
CMOS
MC54HC174A
16
N,J
D
CMOS
MC74HCT174A
–
16
N
D
ECL
MC10H176
–
16
P,L
FN
ECL
MC10176
–
16
P,L
FN
ECL
MC10H186
–
16
P,L
FN
ECL
MC10186
–
16
P,L
FN
High Speed Dual D Master–Slave Flip–Flop
ECL
MC10231
–
16
P,L
FN
J–K Flip–Flop
ECL
MC10EL35
Dual J–K Flip–Flop Negative Edge Trigger
Dual J–K Negative Edge–Triggered Flip–Flop
Dual J–K Positive Edge–Triggered Flip–Flop With Set & Clear
Hex D Flip–Flop
Hex D Flip–Flop With Common Clock & Reset
Hex D Master–Slave Flip–Flop
Hex D Master–Slave Flip–Flop With Reset
Motorola Master Selection Guide
3.1–19
SN74LS107A
D,
DT,M
SN74LS76A
SN74LS73A
SN74LS174
–
SN74LS378
MC74HC174A
MC100EL35
8
D
D
Logic: Standard, Special and Programmable
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
FLIP–FLOPS
Low–Voltage CMOS Octal D–Type Flip–Flop With Set and Reset,
3–State, Non–Inverting With 5V Tolerant Inputs
CMOS
MC74LCX74
–
14
D,DT
Low–Voltage CMOS 16–Bit D–Type Flip–Flop, 3–State,
Non–Inverting With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX16374
–
20
DW,M,
DT
Low–Voltage CMOS Octal D–Type Flip–Flop, 3–State,
Non–Inverting With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX374
–
20
DW,M,
DT
Low–Voltage CMOS Octal D–Type Flip–Flop Flow Through Pinout,
3–State, Non–Inverting With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX574
–
20
DW,M,
DT
Low Voltage D Flip–Flop With Set & Reset
ECL
MC100LVEL31
–
8
D
Low–Voltage Quiet CMOS Octal D–Type Flip–Flop
CMOS
MC74LVQ374
–
20
DW,M,
SD,DT
Low–Voltage Quiet CMOS Octal D–Type Flip–Flop Flow Through
Pinout
CMOS
MC74LVQ574
–
20
DW,M,
SD,DT
Master–Slave Flip–Flop
ECL
MC1670
–
16
Master–Slave R–S Flip–Flop
HTL
MC664
–
14
P,L
Octal 3–State Inverting D Flip–Flop
CMOS
MC54HC534A
MC74HC534A
20
N,J
DW
Octal 3–State Non–Inverting D Flip–Flop With LSTTL Compatible
Inputs
CMOS
MC54HCT374A
MC74HCT374A
20
N,J
DW,
SD,DT
Octal D Flip Flop, With 3–State Outputs
TTL
MC74F374
–
20
N
DW
Octal D Flip–Flop
CMOS
MC74AC273
–
20
N
DW
CMOS
MC74ACT273
–
20
N
DW
Octal D Flip–Flop With 3–State Outputs/Broadside Pinout, F374
TTL
MC74F574
–
20
N
DW
Octal D Flip–Flop With Clear
TTL
SN54LS273
20
N,J
DW
Octal D Flip–Flop With Clock Enable
CMOS
MC74AC377
–
20
N
DW
CMOS
MC74ACT377
–
20
N
DW
Octal D Flip–Flop With Common Clock & Reset
CMOS
MC54HC273A
20
N,J
DW,
DT
Octal D Flip–Flop With Common Clock and Reset With LSTTL
Compatible Inputs
CMOS
MC74HCT273A
–
20
N
DW
Octal D Flip–Flop With Enable
TTL
MC74F377
–
20
N
DW
Octal D Flip–Flop With Enable/ Non–Inverting
TTL
SN54LS377
20
N,J
DW
Octal D Type Flip–Flop With 3–State Outputs
CMOS
MC74AC374
–
20
N
DW
CMOS
MC74ACT374
–
20
N
DW
TTL
MC74F534
–
20
N
DW
TTL
SN54LS374
20
N,J
DW
CMOS
MC74AC534
–
20
N
DW
CMOS
MC74ACT534
–
20
N
DW
CMOS
MC74AC564
–
20
N
DW
CMOS
MC74ACT564
–
20
N
DW
CMOS
MC74AC574
–
20
N
DW
DW
Octal D–Type Latch With 3–State Outputs
SN74LS273
MC74HC273A
SN74LS377
SN74LS374
L
CMOS
MC74ACT574
–
20
N
Octal With 3–State Outputs Inverting D Flip–Flop
CMOS
MC74HC564A
–
20
N
DW
Octal With 3–State Outputs Non–Inverting D Flip–Flop
CMOS
MC54HC374A
20
N,J
DW,
SD,DT
CMOS
MC74VHC374
CMOS
MC54HC574A
CMOS
MC74VHC574
Octal With 3–State Outputs Non–Inverting D Flip–Flop With LSTTL
Compatible Inputs
CMOS
MC54HCT574A
Quad D Flip–Flop
CMOS
CMOS
TTL
Logic: Standard, Special and Programmable
3.1–20
MC74HC374A
–
MC74HC574A
20
20
DW,
DT,M
N,J
DW
–
20
DW,
DT,M
MC74HCT574A
20
N,J
DW
MC74AC175
–
16
N
D
MC74ACT175
–
16
N
D
MC74F175
–
16
N
D
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
16
N,J
D
16
P,L
D
FLIP–FLOPS
Quad D Flip–Flop
TTL
SN54LS175
CMOS
MC14175B
CMOS
MC54HC175
MC74HC175
16
N,J
D
CMOS
MC54HC175A
MC74HC175A
16
N,J
D,SD
Quad D–Type Register With 3–State Outputs
CMOS
MC14076B
–
16
P,L
D
Quad Parallel Register With Enable
TTL
MC74F379
–
16
N
D
Quad With 3–State Outputs D Flip–Flop With Common Clock &
Reset
CMOS
MC74HC173
–
16
N
D
Triple D Flip–Flop With Set and Reset
ECL
MC100LVEL30
CMOS
MC74HC133
TTL
SN54LS133
CMOS
MC74HC30
TTL
SN54LS30
CMOS
MC14068B
TTL
MC74F21
TTL
SN54LS21
CMOS
MC14082B
TTL
MC74F40
TTL
SN54LS40
CMOS
MC74AC20
–
CMOS
MC74ACT20
TTL
MC74F20
CMOS
MC74HC20
TTL
SN54LS20
SN74LS20
TTL
SN54LS22
SN74LS22
CMOS
MC14012B
Dual 4–Input NAND Gate (Unbuffered)
CMOS
Expandable NAND Gate
Hex AND Gate
Quad D Flip–Flop With Common Clock & Reset
SN74LS175
–
MC100EL30
20
DW
GATES, AND/NAND
13–Input NAND Gate
16
N
D
16
N,J
D
14
N
D
14
N,J
D
–
14
P
D
–
14
N
D
14
N,J
D
–
14
P,L
D
–
14
N
D
14
N,J
D
14
N
D
–
14
N
D
–
14
N
D
–
14
N
D
14
N,J
D
14
N,J
D
–
14
P,L
D
MC14012UB
–
14
P,L
D
DTL
MC830
–
14
P,L
ECL
MC10197
–
16
P,L
Low–Voltage CMOS Quad 2–Input AND Gate, 5V–Tolerant Inputs
CMOS
MC74LCX08
–
14
D,DT
Low–Voltage CMOS Quad 2–Input NAND Gate, 5V–Tolerant
Inputs
CMOS
MC74LCX00
–
14
D,DT
Low–Voltage Quiet CMOS Quad 2–Input NAND Gate
CMOS
MC74LVQ00
–
14
D,M,
DT,SD
Quad 2–Input AND Gate
CMOS
MC74AC08
–
14
N
D
CMOS
MC74ACT08
–
14
N
D
TTL
MC74F08
–
14
N
D
CMOS
MC54HC08A
14
N,J
D,DT
CMOS
MC74VHC08
TTL
SN54LS08
SN74LS08
14
N,J
TTL
SN54LS09
SN74LS09
14
N,J
D
ECL
MC10H104
–
16
P,L
FN
ECL
MC10104
–
16
P,L
FN
–
14
P,L
D
14
N,J
D
14
N
D
8–Input NAND Gate
Dual 4–Input AND Gate
Dual 4–Input NAND Buffer
Dual 4–Input NAND Gate
–
SN74LS133
–
SN74LS30
SN74LS21
SN74LS40
MC74HC08A
–
14
FN
D,
DT,M
D
CMOS
MC14081B
Quad 2–Input AND Gate With LSTTL–Compatible Inputs
CMOS
MC54HCT08A
Quad 2–Input NAND Buffer
TTL
MC74F37
TTL
SN54LS26
SN74LS26
14
N,J
D
TTL
SN54LS37
SN74LS37
14
N,J
D
Motorola Master Selection Guide
3.1–21
MC74HCT08A
–
Logic: Standard, Special and Programmable
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
14
N
D
14
N,J
D
GATES, AND/NAND
Quad 2–Input NAND Buffer Open–Collector
TTL
MC74F38
Quad 2–Input NAND Buffer Open–Collector
TTL
SN54LS38
Quad 2–Input NAND Gate
DTL
MC846
–
14
P,L
DTL
MC946
–
14
P,L
CMOS
MC74AC00
–
14
N
D
CMOS
MC74ACT00
–
14
N
D
TTL
MC74F00
–
14
N
D
CMOS
MC54HC00A
14
N,J
D,DT
CMOS
MC74VHC00
TTL
SN54LS00
SN74LS00
14
N,J
D
TTL
SN54LS01
SN74LS01
14
N,J
D
TTL
SN54LS03
SN74LS03
14
N,J
D
CMOS
MC14011B
–
14
P,L
D
Quad 2–Input NAND Gate (Unbuffered)
CMOS
MC14011UB
–
14
P,L
D
Quad 2–Input NAND Gate With LSTTL–Compatible Inputs
CMOS
MC54HCT00A
14
N,J
D
Quad 2–Input NAND Gate With Open–Drain Outputs
CMOS
MC74HC03A
–
14
N
D,DT
Triple 3–Input AND Gate
CMOS
MC74AC11
–
14
N
D
CMOS
MC74ACT11
–
14
N
D
TTL
MC74F11
–
14
N
D
CMOS
MC74HC11
–
14
N
D
TTL
SN54LS11
SN74LS11
14
N,J
D
TTL
SN54LS15
SN74LS15
14
N,J
D
CMOS
MC14073B
–
14
P,L
D
CMOS
MC74AC10
–
14
N
D
CMOS
MC74ACT10
–
14
N
D
TTL
MC74F10
–
14
N
D
CMOS
MC74HC10
–
14
N
D
TTL
SN54LS10
SN74LS10
14
N,J
D
TTL
SN54LS12
SN74LS12
14
N,J
D
CMOS
MC14023B
–
14
P,L
D
CMOS
MC14023UB
–
14
P,L
D
2–Input AND/NAND Gate
ECL
MC10EL04
MC100EL04
8
D
2–Input Differential AND/NAND Gate
ECL
MC10EL05
MC100EL05
8
D
ECL
MC100LVEL05
8
D
2–Input XOR/NOR Gate
ECL
MC10EL07
2–Wide, 2–Input/2–Wide, 3–Input AND–NOR Gate
CMOS
MC74HC51
–
14
N
D
2–Wide, 2–Input/2–Wide, 3–Input AND–OR Gate
CMOS
MC74HC58
–
14
N
D
2–Wide, 4–Input AND/OR Invert Gate
TTL
SN54LS55
SN74LS55
14
N,J
D
3–2–2–3–Input AND/OR Invert Gate
TTL
SN54LS54
SN74LS54
14
N,J
D
4–2–3–2 Input AND–OR–Invert Gate
TTL
MC74F64
–
14
N
D
4–Bit AND/OR Selector
CMOS
MC14519B
–
16
P
D
4–Input OR/NOR Gate
ECL
MC10EL01
Triple 3–Input NAND Gate
Triple 3–Input NAND Gate (Unbuffered)
–
SN74LS38
MC74HC00A
–
MC74HCT00A
14
D,
DT,M
GATES, COMPLEX
–
MC100EL07
MC100EL01
8
D
8
D
ECL
MC100LVEL01
–
8
4–Wide 4–3–3–3 Input OR–AND Gate
ECL
MC10H119
–
16
P,L
FN
4–Wide OR–AND/OR–AND–Invert Gate
ECL
MC10H121
–
16
P,L
FN
4–Wide OR–AND/OR–AND–Invert Gate
ECL
MC10121
–
16
P,L
FN
Logic: Standard, Special and Programmable
3.1–22
D
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
14
N
D
14
N,J
D
GATES, COMPLEX
8–Input NOR/OR Gate
CMOS
MC74HC4078
Dual 2 Wide 2–Input/3–Input AND/OR Invert Gate
TTL
SN54LS51
–
Dual 2–Wide 2–3–Input OR–AND/OR–AND–Invert Gate
ECL
MC10117
–
16
P,L
FN
ECL
MC10H117
–
16
P,L
FN
Dual 2–Wide 2–Input, 2–Wide 3–Input AND–OR–Invert Gate
TTL
MC74F51
–
14
N
D
Dual 2–Wide 3–Input OR–AND Gate
ECL
MC10H118
–
16
P,L
FN
Dual 4–5 Input OR/NOR Gate
ECL
MC10H109
–
16
P,L
FN
ECL
MC10109
–
16
P,L
FN
SN74LS51
ECL
MC10H209
–
16
P,L
FN
Dual 4–Input NAND, 2–Input NOR/OR, 8–Input AND/NAND Gate
(Unbuffered)
CMOS
MC14501UB
–
16
P
D
Dual 4–Input OR/NOR Gate
ECL
MC1660
–
16
L
Dual 5–Input Majority Logic Gate
CMOS
MC14530B
–
16
P
Dual Expandable AND OR Invert Gate (Unbuffered)
CMOS
MC14506UB
–
16
L
Hex NAND/NOR/Invert Gate (Unbuffered)
CMOS
MC14572UB
–
16
P
High Speed Dual 3–Input 3–Output OR/NOR Gate
ECL
MC10212
–
16
P
Quad 4–Input OR/NOR Gate
ECL
MC10E101
MC100E101
28
Quad Differential AND/NAND Gate
ECL
MC10E404
MC100E404
28
Quad OR/NOR Gate
ECL
MC10H101
–
16
P,L
FN
ECL
MC10101
–
16
P,L
FN
Quint 2–Input AND/NAND Gate
ECL
MC10E104
MC100E104
28
Quint 2–Input XOR/XNOR Gate
ECL
MC10E107
MC100E107
28
Triple 2–3–2 Input OR/NOR Gate
ECL
MC10H105
–
16
P,L
FN
ECL
MC10105
–
16
P,L
FN
ECL
MC10H107
–
16
P,L
FN
ECL
MC10107
–
16
P,L
FN
Low–Voltage CMOS Quad 2–Input Exclusive OR Gate With 5V
Tolerant Inputs
CMOS
MC74LCX86
–
14
Quad 2–Input Exclusive NOR Gate
CMOS
MC74AC810
–
14
N
DW
CMOS
MC74ACT810
–
14
N
DW
CMOS
MC74HC7266
–
14
N
D
CMOS
MC74HC7266A
–
14
N
D,DT
TTL
SN54LS266
14
N,J
D
Quad Exclusive NOR Gate
CMOS
MC14077B
–
14
P,L
D
Quad 2–Input Exclusive OR Gate
CMOS
MC74AC86
–
14
N
D
CMOS
MC74ACT86
–
14
N
D
TTL
MC74F86
–
14
N
D
CMOS
MC54HC86
MC74HC86
14
N,J
D
CMOS
MC54HC86A
MC74HC86A
14
N,J
D,DT
TTL
SN74LS136
14
N,J
D
TTL
SN54LS386
SN74LS386
14
N,J
D
TTL
SN54LS86
SN74LS86
14
N,J
D
ECL
MC10H113
–
16
P,L
FN
ECL
MC10113
–
16
P,L
FN
CMOS
MC14070B
–
14
P,L
D
ECL
MC1672
–
16
L
Triple 2–Input Exclusive OR/Exclusive NOR Gate
D
D
FN
FN
FN
FN
GATES, EXCLUSIVE OR/EXCLUSIVE NOR
Quad Exclusive OR Gate
Triple 2–Input Exclusive–OR Gate
Motorola Master Selection Guide
3.1–23
SN74LS266
–
D,M
SD,DT
Logic: Standard, Special and Programmable
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
GATES, NOR
8–Input NOR Gate
CMOS
MC14078B
–
14
P
D
Dual 3–Input 3–Output NOR Gate
ECL
MC10111
–
16
P,L
FN
ECL
MC10H211
–
16
P,L
FN
ECL
MC10211
–
16
P,L
FN
CMOS
MC74HC4002
–
14
N
D
CMOS
MC14002B
–
14
P,L
D
Dual 4–Input NOR Gate (Unbuffered)
CMOS
MC14002UB
–
14
P,L
D
Dual 5–Input NOR Gate
TTL
SN54LS260
14
N,J
D
Low–Voltage CMOS Quad 2–Input NOR Gate, 5V–Tolerant Inputs
CMOS
MC74LCX02
Quad 2–Input NOR Buffer
TTL
SN54LS28
SN74LS28
14
N,J
D
TTL
SN54LS33
SN74LS33
14
N,J
D
CMOS
MC74AC02
–
14
N
D
CMOS
MC74ACT02
–
14
N
D
TTL
MC74F02
–
14
N
D
CMOS
MC54HC02A
14
N,J
D,DT
CMOS
MC74VHC02
TTL
SN54LS02
14
N,J
D
ECL
MC10H102
–
16
P,L
FN
ECL
MC10102
–
16
P,L
FN
ECL
MC1662
–
16
L
Dual 4–Input NOR Gate
Quad 2–Input NOR Gate
SN74LS260
–
MC74HC02A
–
SN74LS02
14
D,DT
14
D,
DT,M
CMOS
MC14001B
–
14
P,L
Quad 2–Input NOR Gate (Unbuffered)
CMOS
MC14001UB
–
14
P,L
D
D
Quad 2–Input NOR Gate With strobe
ECL
MC10H100
–
16
P,L
FN
Triple 3–Input NOR Gate
CMOS
MC54HC27
MC74HC27
14
N,J
D
TTL
SN54LS27
SN74LS27
14
N,J
D
CMOS
MC14025B
–
14
P,L
D
Triple 3–Input NOR Gate (Unbuffered)
CMOS
MC14025UB
–
14
P,L
D
Triple 4–3–3 Input NOR Gate
ECL
MC10H106
–
16
P,L
FN
ECL
MC10106
–
16
P,L
FN
ECL
MC10110
–
16
P,L
FN
ECL
MC10H210
–
16
P,L
FN
ECL
MC10210
–
16
P,L
FN
Dual 4–Input OR Gate
CMOS
MC14072B
–
14
P
Low–Voltage CMOS Quad 2–Input OR Gate, 5V–Tolerant Inputs
CMOS
MC74LCX32
–
14
D,DT
Low–Voltage Quiet CMOS Quad 2–Input OR Gate, 5V–Tolerant
Inputs
CMOS
MC74LVQ32
–
14
D,M
SD,DT
Quad 2–Input OR Gate
CMOS
MC74AC32
–
14
N
D
CMOS
MC74ACT32
–
14
N
D
TTL
MC74F32
–
14
N
D
CMOS
MC54HC32A
14
N,J
D,DT
CMOS
MC74VHC32
CMOS
MC54HCT32A
MC74HCT32A
14
N,J
TTL
SN54LS32
SN74LS32
14
N,J
D
ECL
MC10H103
–
16
P,L
FN
ECL
MC10103
–
16
P,L
FN
CMOS
MC14071B
–
14
P,L
D
GATES, OR
Dual 3–Input 3–Output OR Gate
Logic: Standard, Special and Programmable
3.1–24
MC74HC32A
–
14
D
D,
DT,M
D
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
GATES, OR
Triple 3–Input OR Gate
CMOS
MC74HC4075
–
14
N
D
CMOS
MC14075B
–
14
P,L
D
CMOS
MC14500B
–
16
P
DW
DTL
MC836
–
14
P
DTL
MC837
–
14
P
DTL
MC936
–
14
P,L
DTL
MC937
–
14
P,L
DTL
MC840
–
14
P
9–Bit Buffer
ECL
MC10E122
MC100E122
28
FN
Driver
ECL
MC10EL12
MC100EL12
8
D
ECL
MC100LVEL12
–
8
Dual Complementary Pair Plus Inverter (Unbuffered)
CMOS
MC14007UB
–
14
P
D
Hex Buffer With Enable
ECL
MC10H188
–
16
P,L
FN
INDUSTRIAL CONTROL UNIT
Industrial Control Unit
INVERTERS
Hex Inverter
Hex Inverter (Without Input Diodes)
INVERTER/BUFFERS, 2–STATE
D
ECL
MC10188
–
16
P,L
FN
Hex Buffer/Non–Inverting
CMOS
MC14050B
–
16
P,L
D
Hex Inverter
CMOS
MC74AC04
–
14
N
D
CMOS
MC74ACT04
–
14
N
D
TTL
MC74F04
–
14
N
D
CMOS
MC54HC04A
14
N,J
D,SD,
DT
CMOS
MC74VHC04
TTL
SN54LS04
SN74LS04
14
N,J
D
TTL
SN54LS05
SN74LS05
14
N,J
D
Hex Inverter Gate (Unbuffered)
CMOS
MC14069UB
–
14
P,L
D
Hex Inverter With Enable
ECL
MC10H189
–
16
P,L
FN
MC74HC04A
–
14
D,
DT,M
ECL
MC10189
–
16
P,L
FN
Hex Inverter With LSTTL Compatible Inputs
CMOS
MC74HCT04A
–
14
N
D,DT
Hex Inverter With open Drain Outputs
CMOS
MC74AC05
–
14
N
D
CMOS
MC74ACT05
–
14
N
D
Hex Inverter With Strobe (Active Pullup)
HTL
MC677
–
14
P,L
Hex Inverter With Strobe (Without Output Resistors)
HTL
MC678
–
14
P,L
Hex Inverter/Buffer
ECL
MC10195
–
16
P,L
FN
CMOS
MC14049B
–
16
P
D
Hex Inverter/Buffer (Unbuffered)
CMOS
MC14049UB
–
16
P,L
D
Hex Inverting Buffer/Logic–Level Down Converter
CMOS
MC54HC4049
MC74HC4049
16
N,J
D
Hex Non–Inverting Buffer/Logic–Level Down Converter
CMOS
MC54HC4050
MC74HC4050
16
N,J
D
Hex Unbuffered Inverter
CMOS
MC74HCU04
–
14
N
D
CMOS
MC74HCU04A
–
14
N
D,DT
Low–Voltage CMOS Hex Inverter, With 5V–Tolerant Inputs
CMOS
MC74LCX04
–
14
D,DT
Low–Voltage Quiet CMOS Hex Inverter
CMOS
MC74LVQ04
–
14
D,M,
SD,DT
Quad 2–Input Gate (Active Pullup)
HTL
MC672
–
14
P,L
Quad 2–Input Gate (Passive Pullup)
HTL
MC668
–
14
P,L
Quad Driver
ECL
MC10E112
Strobed Hex Inverter/Buffer
CMOS
MC14502B
–
16
P,L
Triple 3–Input Gate (Active Pullup)
HTL
MC671
–
14
P,L
Triple 3–Input Gate (Passive Pullup)
HTL
MC670
–
14
P,L
Motorola Master Selection Guide
3.1–25
MC100E112
28
FN
DW
Logic: Standard, Special and Programmable
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
LATCHES
3–Bit 4:1 Mux–Latch (Integrated E156 & E171)
ECL
MC10E256
MC100E256
28
FN
3–Bit 4:1 Mux–Latch, With Common Enable, Asynchronous Master
Reset, Differential Output
ECL
MC10E156
MC100E156
28
FN
4–Bit D Latch
TTL
SN54LS75
SN74LS75
16
N,J
D
TTL
SN54LS77
SN74LS77
14
N,J
D
TTL
SN54LS375
SN74LS375
16
N,J
5–Bit 2:1 Mux–Latch, With Common Enable, Asynchronous Master
Reset Differential Output
ECL
MC10E154
MC100E154
28
FN
6–Bit 2:1 Mux–Latch, With Common Enable, Asynchronous Master
Reset Single Ended
ECL
MC10E155
MC100E155
28
FN
6–Bit D Latch
ECL
MC10E150
MC100E150
28
8–Bit Addressable Latch
CMOS
MC74AC259
–
16
N
D
CMOS
MC74ACT259
–
16
N
D
TTL
MC74F259
–
16
N
D
TTL
SN54LS259
16
N,J
D
CMOS
MC14099B
–
16
P
DW
CMOS
MC14599B
–
18
P
8–Bit Bus Compatible Addressable Latch
CMOS
MC14598B
–
18
P,L
9–Bit Latch, With Parity
ECL
MC10E175
Dual Latch
ECL
MC10H130
–
16
P,L
FN
Dual 2–Bit Transparent Latch
CMOS
MC74HC75
–
16
N
D
Dual 4–Bit Addressable Latch
CMOS
MC74AC256
–
16
N
DW
CMOS
MC74ACT256
–
16
N
DW
TTL
MC74F256
–
16
N
D
TTL
SN54LS256
–
16
N,J
D
Dual 4–Bit Latch
CMOS
MC14508B
–
24
P,L
DW
Dual Latch
ECL
MC10130
–
16
P,L
Low–Voltage CMOS Octal Transparent Latch, 3–State,
Non–Inverting With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX373
–
20
DW,M,
DT
Low–Voltage CMOS 16–Bit Transparent Latch, 3–State,
Non–Inverting With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX16373
–
48
DT
Low–Voltage CMOS Octal Transparent Latch Flow Through
Pinout, 3–State, Non–Inverting With 5V Tolerant Inputs and
Outputs
CMOS
MC74LCX573
–
20
DW,M,
SD,DT
Low–Voltage Quiet CMOS Octal Transparent Latch
CMOS
MC74LVQ373
–
20
DW,M,
SD,DT
Low–Voltage Quiet CMOS Octal Transparent Latch Flow Through
Pinout
CMOS
MC74LVQ573
–
20
DW,M,
SD,DT
Octal 3–State Non–Inverting Transparent Latch With LSTTL
Compatible Inputs
CMOS
MC54HCT373A
MC74HCT373A
20
N,J
DW,
SD,DT
Octal D Latch With 3–State Outputs
CMOS
MC74AC563
–
20
N
DW
CMOS
MC74ACT563
–
20
N
DW
CMOS
MC74AC573
–
20
N
DW
CMOS
MC74ACT573
–
20
N
DW
CMOS
MC74AC373
–
20
N
DW
CMOS
MC74ACT373
–
20
N
DW
TTL
SN54LS373
20
N,J
DW
TTL
MC74F373
–
20
N
DW
TTL
MC74F533
–
20
N
DW
CMOS
MC74AC533
–
20
N
DW
CMOS
MC74ACT533
–
20
N
DW
Octal Transparent Latch With 3–State Outputs
Logic: Standard, Special and Programmable
3.1–26
SN74LS259
MC100E175
SN74LS373
D
FN
28
FN
FN
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
LATCHES
Octal With 3–State Outputs Inverting Transparent Latch
CMOS
MC54HC533A
MC74HC533A
20
N,J
DW
CMOS
MC54HC563A
MC74HC563A
20
N,J
DW,DT
CMOS
MC54HC373A
MC74HC373A
20
N,J
DW,
DT,SD
CMOS
MC74VHC373
CMOS
MC54HC573A
CMOS
MC74VHC573
–
20
Octal With 3–State Outputs Non–Inverting Transparent Latch With
LSTTL Compatible Inputs
CMOS
MC74HCT573A
–
20
N
DW
Quad Latch
ECL
MC10133
–
16
P,L
FN
ECL
MC10153
–
16
P,L
FN
Quad NAND R–S Latch
CMOS
MC14044B
–
16
P
D
Quad NOR R–S Latch
CMOS
MC14043B
–
16
P,L
D
Quad Set/Reset Latch
TTL
SN54LS279
16
N,J
D
Quad Transparent Latch
CMOS
MC14042B
–
16
P,L
D
Quint Latch
ECL
MC10H175
–
16
P,L
FN
ECL
MC10175
–
16
P,L
FN
ECL
MC10H660
ECL
MC10E197
CMOS
CMOS
16–Channel Analog Multiplexer/Demultiplexer
CMOS
MC14067B
16:1 Multiplexer
ECL
MC10E164
MC100E164
28
FN
2–Bit 8:1 Multiplexer
ECL
MC10E163
MC100E163
28
FN
2:1 Multiplexer
ECL
MC10EL58
MC100EL58
8
D
3–Bit 4:1 Multiplexer, With Split Select Differential Output
ECL
MC10E171
MC100E171
28
FN
4:1 Differential Multiplexer
ECL
MC10EL57
MC100EL57
16
D
5–Bit 2:1 Multiplexer, With Differential Output
ECL
MC10E158
MC100E158
28
FN
8–Channel Analog Multiplexer/Demultiplexer With Address Latch
CMOS
MC54HC4351
MC74HC4351
20
N,J
DW
8–Channel Analog Multiplexer/Demultiplexer
CMOS
MC54HC4051
MC74HC4051
16
N,J
D, DW
,DT
Octal With 3–State Outputs Non–Inverting Transparent Latch
–
MC74HC573A
SN74LS279
20
20
DW,
DT,M
N,J
DW
DW,
DT,M
MEMORY SUPPORT
4–Bit ECL–TTL Load Reducing DRAM Driver
MC100H660
28
FN
–
28
FN
MC74AC151
–
16
N
D
MC74ACT151
–
16
N
D
–
24
P
DW
MISCELLANEOUS
Data Separator
MULTIPLEXER/DATA SELECTORS
1–of–8 Decoder/Demultiplexer
CMOS
MC14051B
–
16
P,L
D
8–Channel Data Selector
CMOS
MC14512B
–
16
P,L
D
8–Input Data Selector/Multiplexer
CMOS
MC74HC151
–
16
N
D
8–Input Data Selector/Multiplexer With 3–State Outputs
CMOS
MC54HC251
16
N,J
D
8–Input Multiplexer
TTL
MC74F151
16
N
D
TTL
SN54LS151
SN74LS151
16
N,J
D
TTL
SN54LS251
SN74LS251
16
N,J
D
TTL
MC74F251
–
16
N
D
CMOS
MC74AC251
–
16
N
D
CMOS
MC74ACT251
–
16
N
D
8–Input Data Selector/Multiplexer With Data and Address Latchs
and With 3–State Outputs
CMOS
MC54HC354
20
N,J
DW
8–Line Multiplexer
ECL
MC10H164
–
16
P,L
FN
ECL
MC10164
–
16
P,L
FN
CMOS
MC74HC4851A
MC74HC4852A
16
N
MC74HC4853A
–
D,DW,
DT
8–Input Multiplexer With 3–State Outputs
Analog
With Injection
Current Effect
g Multiplexer/Demultiplexer
p
p
j
Control Automotive Customized
Control,
Motorola Master Selection Guide
3.1–27
MC74HC251
–
MC74HC354
Logic: Standard, Special and Programmable
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
MULTIPLEXER/DATA SELECTORS
Dual 4–Channel Analog Data Selector
CMOS
MC14529B
–
16
P
D
Dual 4–Channel Analog Multiplexer/Demultiplexer
CMOS
MC74HC4052
–
16
N
D, DW
CMOS
MC14052B
–
16
P,L
D
Dual 4–Channel Data Selector/Multiplexer
CMOS
MC14539B
–
16
P
D
Dual 4–Input Data Selector/Multiplexer
CMOS
MC74HC153
–
16
N
D
Dual 4–Input Data Selector/Multiplexer With 3–State Outputs
CMOS
MC74HC253
–
16
N
D
Dual 4–Input Multiplexer
CMOS
MC74AC153
–
16
N
D
CMOS
MC74ACT153
–
16
N
D
CMOS
MC74AC352
–
16
N
DW
CMOS
MC74ACT352
–
16
N
DW
TTL
MC74F153
–
16
N
D
TTL
MC74F352
–
16
N
D
TTL
SN54LS153
SN74LS153
16
N,J
D
TTL
SN54LS352
SN74LS352
16
N,J
D
CMOS
MC74AC253
–
16
N
DW
CMOS
MC74ACT253
–
16
N
DW
CMOS
MC74AC353
–
16
N
D
CMOS
MC74ACT353
–
16
N
D
TTL
SN54LS253
SN74LS253
16
N,J
D
TTL
SN54LS353
SN74LS353
16
N,J
D
TTL
MC74F253
–
16
N
D
TTL
MC74F353
–
16
N
D
ECL
MC10H174
–
16
P,L
FN
–
16
P,L
Dual 4–Input Multiplexer With 3–State Outputs
Dual 4–to–1 Multiplexer
ECL
MC10174
Dual Differential 2:1 Multiplexer (3.3V)
ECL
MC100LVEL56
Dual Multiplexer With Latch
ECL
MC10134
–
16
Low Voltage 16:1 Multiplexer
ECL
MC100LVE164
–
32
FA
Low–Voltage CMOS Quad 2–Input, Non–Inverting With 5V Tolerant
Inputs and Outputs
CMOS
MC74LCX157
–
16
M,D,
SD,DT
Quad 2–Input Multiplexer With Latch
ECL
MC10H173
–
16
P,L
FN
Quad 2–Channel Analog Multiplexer/Demultiplexer
CMOS
MC14551B
–
16
P
D
Quad 2–Input Data Selector/Multiplexer
CMOS
MC54HC158
16
N,J
D
CMOS
MC74HC158A
–
16
N,J
D,DT
Quad 2–Input Data Selector/Multiplexer With 3–State Outputs
CMOS
MC74HC257
–
16
N
D
Quad 2–Input Data Selectors/Multiplexers
CMOS
MC54HC157A
16
N,J
D,DT
CMOS
MC74VHC157
–
16
Quad 2–Input Data Selector/Multiplexer With LSTTL Compatible
Inputs
CMOS
MC74HCT157A
–
16
N
D
Quad 2–Input Multiplexer
TTL
MC74F157A
–
16
N
D
TTL
MC74F158A
–
16
N
D
TTL
SN54LS157
SN74LS157
16
N,J
D
SN74LS158
MC100EL56
MC74HC158
MC74HC157A
20
FN
DW
P,L
FN
D,
DT,M
TTL
SN54LS158
16
N,J
D
Quad 2–Input Multiplexer (Inverting)
ECL
MC10159
–
16
P,L
FN
Quad 2–Input Multiplexer (Non–Inverting)
ECL
MC10158
–
16
P,L
FN
Quad 2–Input Multiplexer Inverting With 3–State Outputs
CMOS
MC74AC258
–
16
N
DW
CMOS
MC74ACT258
–
16
N
DW
CMOS
MC74ACT257
–
16
N
D
CMOS
MC74AC257
–
16
N
D
Quad 2–Input Multiplexer With 3–State Outputs
TTL
SN54LS257B
SN74LS257B
16
N,J
D
Quad 2–Input Multiplexer With Storage
TTL
SN54LS298
SN74LS298
16
N,J
D
Quad 2–Input Multiplexer Non–Inverting With 3–State Outputs
Logic: Standard, Special and Programmable
3.1–28
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
D
MULTIPLEXER/DATA SELECTORS
Quad 2–Input Multiplexer, Inverting
CMOS
MC74AC158
–
16
N
CMOS
MC74ACT158
–
16
N
D
Quad 2–Input Multiplexer, Inverting Output
ECL
MC10H159
–
16
P,L
FN
Quad 2–Input Multiplexer, Inverting, With 3–State Outputs
TTL
SN54LS258B
16
N,J
D
Quad 2–Input Multiplexer, Non–Inverting
CMOS
MC74AC157
–
16
N
D
CMOS
MC74ACT157
–
16
N
D
Quad 2–Input Multiplexer, Non–Inverting Output
ECL
MC10H158
–
16
P,L
FN
Quad 2–Input Multiplexer, With 3–State Outputs
TTL
MC74F257A
–
16
N
D
SN74LS258B
TTL
MC74F258A
–
16
N
D
Quad 2–Input Multiplexer/Latch
ECL
MC10173
–
16
P,L
FN
Quad 2–Port Register
TTL
MC74F398
–
20
N
DW
TTL
MC74F399
–
16
N
D
TTL
SN54LS398
SN74LS398
20
N,J
DW
TTL
SN54LS399
SN74LS399
16
N,J
Quad 2:1 Mux, Individual–Select
ECL
MC10E157
MC100E157
28
Quad Analog Switch/Multiplexer
CMOS
MC14016B
CMOS
MC14066B
CMOS
MC54HC4016
MC74HC4016
CMOS
MC54HC4066
MC74HC4066
Quad Analog Switch/Multiplexer/Demultiplexer With Separate
Analog/Digital Power Supplies
CMOS
MC74HC4316
Triple 2–Channel Analog Multiplexer/Demultiplexer
CMOS
MC54HC4053
CMOS
MC14053B
Triple 2–Channel Analog Multiplexer/Demultiplexer With Address
Latch
CMOS
MC54HC4353
Triple 2:1 Multiplexer
ECL
MC100EL59
–
20
DW
Triple 2:1 Multiplexer (3.3V)
ECL
MC100LVEL59
–
20
DW
Triple Differential 2:1 Multiplexer
ECL
MC100E457
–
28
FN
ECL
MC10E457
–
28
FN
130MHz Voltage Controlled Multivibrator
ECL
MC12101
–
20
P
FN
200 MHz Voltage Controlled Multivibrator
ECL
MC12100
–
20
P
FN
Dual Monostable Multivibrator
HTL
MC667
–
14
P,L
CMOS
MC14528B
–
16
P,L
D
Dual Monstable Multivibrators With Schmitt Trigger Inputs
TTL
SN54LS221
SN74LS221
16
N,J
D
Dual Precision Monostable Multivibrator Retriggerable, Resettable)
CMOS
MC54HC4538A
MC74HC4538A
16
N,J
D
Dual Precision Monostable Multivibrator
CMOS
MC14538B
–
16
P,L
D, DW
Dual Voltage–Controlled Multivibrator
ECL
MC4024
–
14
P,L
Monostable Multivibrator
DTL
MC951
–
14
P,L
ECL
MC10198
–
16
P,L
FN
TTL
SN54LS122
SN74LS122
14
N,J
D
TTL
SN54LS123
SN74LS123
14
N,J
D
ECL
MC1658
–
16
P,L
D,FN
7–Stage Binary Ripple Counter
CMOS
MC74HC4024
–
14
N
D
Crystal Oscillator
ECL
MC12061
–
16
P,L
Dual Voltage–Controlled Multivibrator
ECL
MC4324
–
14
P,L
Low Power Voltage Controlled Oscillator
ECL
MC12148
–
8
Quad Analog Switch/Multiplexer/Demultiplexer
–
14
–
–
MC74HC4053
–
MC74HC4353
D
FN
P,L
D
14
P,L
D
14
N,J
D
14
N,J
D,DT
16
N
D
16
N,J
D, DW
16
P,L
D
20
N,J
DW
MULTIVIBRATORS
Retriggerable Monostable Multivibrators
Voltage Controlled Multivibrator
OSCILLATORS
Motorola Master Selection Guide
3.1–29
D,SD
Logic: Standard, Special and Programmable
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
OSCILLATORS
Voltage Controlled Oscillator
ECL
MC1648
–
14
P,L
D,FN
24–Stage Frequency Divider
CMOS
MC14521B
–
16
P,L
D
Programmable Oscillator Timer
CMOS
MC14541B
–
14
P,L
D
Programmable Timer
CMOS
MC14536B
–
16
P,L
DW
Quad Precision Timer/Driver
CMOS
MC14415
–
16
P,L
DW
ECL
MC10H160
–
16
P,L
FN
ECL
MC10160
–
16
P,L
FN
12–Bit Parity Generator/Checker, Register–Shiftable, Diff Output
ECL
MC10E160
12–Bit Parity Tree
CMOS
MC14531B
–
16
P
D
9 + 2–Bit Parity Generator–Checker
ECL
MC10170
–
16
P,L
FN
9–Bit Odd/Even Parity Generator/Checker
CMOS
MC74HC280
–
14
N
D
14
N,J
D
14
N
OSCILLATOR/TIMERS
PARITY CHECKERS
12–Bit Parity Generator/Checker
MC100E160
SN74LS280
28
FN
TTL
SN54LS280
9–Bit Parity Generator/Checker
TTL
MC74F280
Error Detection and Correction Circuit
ECL
MC10E193
CMOS
MC14046B
–
16
P,L
1.1GHz ÷10/20/40/80 Prescaler
ECL
MC12080
–
8
P
1.1GHz ÷126/128, ÷254/256 Low Power Dual Modulus Prescaler
ECL
MC12058
–
8
1.1GHz ÷127/128, ÷255/256 Low Power Dual Modulus Prescaler
ECL
MC12038A
–
8
P
D
1.1GHz ÷8/9, ÷16/17 Dual Modulus Prescaler
ECL
MC12026A
–
8
P
D
D
–
MC100E193
28
D
FN
PHASE–LOCKED LOOP
Phase–Locked Loop
DW
PRESCALERS
D
D,SD
ECL
MC12026B
–
8
P
1.1GHz ÷2 Low Power Prescaler With Stand–By Mode
ECL
MC12083
–
8
P
D
1.1GHz ÷2/4/8 Low Power Prescaler With Stand–By Mode
ECL
MC12093
–
8
P
D,SD
1.1GHz ÷256 Prescaler
ECL
MC12074
–
8
P
D
1.1GHz ÷32/33, ÷64/65 Dual Modulus Prescaler
ECL
MC12028A
–
8
P
D
1.1GHz ÷32/33, ÷64/65 Dual Modulus Prescaler
ECL
MC12028B
–
8
P
D
1.1GHz ÷64 Prescaler
ECL
MC12073
–
8
P
D
1.1GHz ÷64/65, ÷128/129 Dual Modulus Prescaler
ECL
MC12022A
–
8
P
D
ECL
MC12022B
–
8
P
D
ECL
MC12022SLA
–
8
P
D
ECL
MC12022SLB
–
8
P
D
ECL
MC12022TSA
–
8
P
D
ECL
MC12022TSB
–
8
P
D
1.1GHz ÷64/65, ÷128/129 Dual Modulus Prescaler With Stand–By
y
Mode
ECL
MC12036A
–
8
P
D
ECL
MC12036B
–
8
P
D
1.1GHz ÷64/65, ÷128/129 Low Voltage Dual Modulus Prescaler
ECL
MC12022LVA
–
8
P
D
ECL
MC12022LVB
–
8
P
D
ECL
MC12022TVA
–
8
P
D
ECL
MC12022TVB
–
8
P
1.1GHz ÷64/65, ÷128/129 Super Low Power Dual Modulus
Prescaler
ECL
MC12052A
–
8
D,SD
1.1GHz ÷64/65, ÷128/129 Super Low Power Dual Modulus
Prescaler With Stand–By Mode
ECL
MC12053A
–
8
D,SD
1.3GHz ÷64 Prescaler
ECL
MC12075
–
8
1.3GHz ÷64/256 Prescaler
ECL
MC12066
–
8
Logic: Standard, Special and Programmable
3.1–30
P
D
D
D
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
PRESCALERS
1.3GHz ÷256 Prescaler
ECL
MC12076
–
8
P
D
ECL
MC12078
–
8
P
D
ECL
MC12034A
–
8
P
D
ECL
MC12034B
–
8
P
D
ECL
MC12033A
–
8
P
D
ECL
MC12033B
–
8
P
D
ECL
MC12032A
–
8
P
D
ECL
MC12032B
–
8
P
D
ECL
MC12031A
–
8
P
D
ECL
MC12031B
–
8
P
2.0GHz ÷64/65, ÷128/129 Super Low Power Dual Modulus
Prescaler
ECL
MC12054A
–
8
D,SD
2.5GHz ÷2, ÷4 Low Power Prescaler With Satnd–By Mode
ECL
MC12095
–
8
D,SD
2.5GHz ÷8192 Prescaler
ECL
MC12098
–
8
2.8GHz ÷64/128/256 Prescaler
ECL
MC12079
–
8
P
D
ECL
MC12089
–
8
P
D
225MHz ÷20/21 Dual Modulus Prescaler
ECL
MC12019
–
8
P,L
D
225MHz ÷32/33 Dual Modulus Prescaler
ECL
MC12015
–
8
P,L
D
225MHz ÷40/41 Dual Modulus Prescaler
ECL
MC12016
–
8
P,L
D
225MHz ÷64 Prescaler
ECL
MC12023
–
8
P
D
225MHz ÷64/65 Dual Modulus Prescaler
ECL
MC12017
–
8
P,L
D
480MHz ÷5/6 Dual Modulus Prescaler
ECL
MC12009
–
16
P,L
520MHz ÷128/129 Dual Modulus Prescaler
ECL
MC12018
–
8
P,L
D
520MHz ÷64/65 Dual Modulus Prescaler
ECL
MC12025
–
8
P
D
550MHz ÷10/11 Dual Modulus Prescaler
ECL
MC12013
–
16
P,L
550MHz ÷8/9 Dual Modulus Prescaler
ECL
MC12011
–
16
P,L
750MHz ÷2 UHF Prescaler
ECL
MC12090
–
16
P,L
Programmable Delay Chip (Dig 80ps Anal. 1.6 Ps/mv)
ECL
MC10E196
MC100E196
28
FN
Programmable Delay Chip (Digitally Selectable 20ps Res)
ECL
MC10E195
MC100E195
28
FN
1024 X 1–Bit Random Access Memory
ECL
MCM10146
–
16
L
256 X 1–Bit Random Access Memory
ECL
MCM10152
–
16
L
ECL
MC10EL16
ECL
MC100LVEL16
–
8
High Speed Triple Line Receiver
ECL
MC10216
–
16
Low–Voltage Quad Differential Line Receiver
ECL
MC100LVEL17
Quad Bus Receiver
ECL
MC10129
–
16
L
Quad Line Receiver
ECL
MC10H115
–
16
P,L
FN
ECL
MC10115
–
16
P,L
FN
ECL
MC1692
–
16
L
ECL
MC10E116
MC100E116
28
FN
ECL
MC10E416
MC100E416
28
FN
2.0GHz ÷32/33, ÷64/65 Dual Modulus Prescaler
2.0GHz ÷32/33, ÷64/65 Low Voltage Dual Modulus Prescaler
2.0GHz ÷64/65, ÷128/129 Dual Modulus Prescaler
2.0GHz ÷64/65, ÷128/129 Low Voltage Dual Modulus Prescaler
D
D
PROGRAMMABLE DELAY CHIPS
RAMs
RECEIVERS
Differential Receiver
Quint Differential Line Receiver
Motorola Master Selection Guide
3.1–31
MC100EL16
MC100EL17
8
D
D
P,L
20
FN
DW
Logic: Standard, Special and Programmable
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
RECEIVERS
Triple Line Receiver
ECL
MC10H116
–
16
P,L
D,FN
ECL
MC10114
–
16
P,L
FN
ECL
MC10116
–
16
P,L
FN
4 X 4 Multiport Register
CMOS
MC14580B
–
24
P,L
D
Hex Parallel D Register With Enable
TTL
MC74F378
–
16
N
D
16 X 4–Bit Register File (RAM)
ECL
MC10H145
–
16
P,L
FN
4 X 4 Register File Open Collector
TTL
SN54LS170
SN74LS170
16
N,J
D
4 X 4 Register File With 3–State Outputs
TTL
SN54LS670
SN74LS670
16
N,J
D
64–Bit Register File (RAM)
ECL
MCM10145
–
16
L
8 X 2 Multiport Register File (RAM)
ECL
MCM10143
–
24
L
TTL
MC74F13
–
14
N
D
TTL
SN54LS13
14
N,J
D
Dual Schmitt Trigger
CMOS
MC14583B
–
16
P
D
Hex Inverter Schmitt Trigger
CMOS
MC74AC14
–
14
N
D
CMOS
MC74ACT14
–
14
N
D
TTL
MC74F14
–
14
N
D
TTL
SN54LS14
14
N,J
D
CMOS
MC14106B
–
14
P,L
D
CMOS
MC14584B
–
14
P,L
D
CMOS
MC54HC14A
14
N,J
D,DT
CMOS
MC74VHC14
REGISTERS
REGISTER FILES
SCHMITT TRIGGERS
Dual 4–Input NAND Schmitt Trigger
Hex Schmitt Trigger
Hex Schmitt Trigger Inverter
SN74LS13
SN74LS14
MC74HC14A
–
14
D,
DT,M
CMOS
MC54HCT14A
MC74HCT14A
14
N,J
D
Quad 2–Input NAND Gate With Schmitt Trigger Inputs
CMOS
MC54HC132A
MC74HC132A
14
N,J
D
Quad 2–Input NAND Schmitt Trigger
CMOS
MC74AC132
–
14
N
D
CMOS
MC74ACT132
–
14
N
D
TTL
MC74F132
–
14
N
D
CMOS
MC14093B
–
14
P,L
D
TTL
SN54LS132
14
N,J
D
9–Bit Switchable Active SCSI–2 Bus Term (110Ω) with Volt Reg
CMOS
MCCS142237
–
16,20
DW,
DT
9–Bit Switchable SCSI Bus Term (220Ω & 330Ω: Passive)
CMOS
MCCS142233
–
20
FN
18–Bit Active SCSI Bus Terminator
(*Also Available in 32–Pin QFP Package)
CMOS
MCCS142235
–
24,32
DW,
*FA
18–Bit Switchable Active SCSI–2 Bus Term (110Ω) with Volt Reg
CMOS
MCCS142236
–
28
DW
18–Bit Switchable Active SCSI–2 Bus Term (110Ω) with Volt Reg
Plus Inverted Disconnect
CMOS
MCCS142238
–
28
DW
9–Bit Switchable Active SCSI Bus Terminator (110Ω) with Volt Reg
CMOS
MCCS142239
–
16
D,DW
Serial EPROM for MPA1016: 8–Pin DIP and SOIC; 20–Pin PLCC
CMOS
MPA1765
–
8,20
N
D,FN
Serial EPROM for MPA1036: 8–Pin DIP and SOIC; 20–Pin PLCC
CMOS
MPA17128
–
8,20
P
D,FN
1–to–64–Bit Variable Length Shift Register
CMOS
MC14557B
–
16
P,L
DW
128–Bit Static Shift Register
CMOS
MC14562B
–
14
P,L
18–Bit Static Shift Register
CMOS
MC14006B
–
14
P,L
3–Bit Scannable Registered Address Driver, ECL
ECL
MC10E212
Quad 2–Input Schmitt Trigger NAND Gate
SN74LS132
SCSI BUS TERMINATORS
SERIAL EPROMs
SHIFT REGISTERS
Logic: Standard, Special and Programmable
3.1–32
MC100E212
28
D
FN
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
SHIFT REGISTERS
4–Bit Bidirectional Universal Shift Register
CMOS
MC74AC194
–
16
N
D
CMOS
MC74ACT194
–
16
N
D
TTL
MC74F194
–
16
N
D
CMOS
MC74HC194
–
16
N
TTL
SN54LS194A
16
N,J
D
TTL
MC74F195
16
N
D
TTL
SN54LS95B
14
N,J
D
CMOS
MC14035B
–
16
P,L
D
4–Bit Shift Register With 3–State Outputs
TTL
SN74LS395
–
16
N,J
D
4–Bit Shifter With 3–State
CMOS
MC74AC350
–
16
N
D
CMOS
MC74ACT350
–
16
N
D
4–Bit Shifter, With 3–State Outputs
TTL
MC74F350
–
16
N
D
4–Bit Universal Shift Register
CMOS
MC74HC195
–
16
N
ECL
MC10H141
–
16
P,L
FN
ECL
MC10141
–
16
P,L
FN
CMOS
MC14194B
–
16
P,L
D
8–Bit Bidirectional Universal Shift Register With parallel I/O
CMOS
MC74HC299
–
20
N
DW
8–Bit Parallel–to–Serial Shift Register
TTL
SN54LS165
SN74LS165
16
N,J
8–Bit Scannable Register
ECL
MC10E241
MC100E241
28
8–Bit Serial In–Serial Out Shift Register
TTL
MC74F164
8–Bit Serial or Parallel–Input/Serial–Output Shift Register
CMOS
MC54HC165
8–Bit Serial or Parallel–Input/Serial–Output
p
p Shift Register
g
With 3–State
3 State Outputs
O tp ts
CMOS
MC54HC589
CMOS
8–Bit Serial or Parallel–Input/Serial–Output
p
p Shift Register
g
With
Inp t Latch
Input
4–Bit Shift Register
SN74LS194A
–
SN74LS95B
14
N
D
MC74HC165
16
N,J
D
MC74HC589
16
N,J
D
MC54HC589A
MC74HC589A
16
N,J
D,SD
DT
CMOS
MC54HC597
MC74HC597
16
N,J
D
CMOS
MC54HC597A
MC74HC597A
16
N,J
D,DT
8–Bit Serial–In/Parallel–Out Shift Register
TTL
SN54LS164
SN74LS164
14
N,J
D
8–Bit Serial–Input/Parallel–Output Shift Register
CMOS
MC54HC164
MC74HC164
14
N,J
D
CMOS
MC54HC164A
MC74HC164A
14
N,J
D,DT
CMOS
MC54HC595A
MC74HC595A
16
N,J
D,DT
CMOS
MC74VHC595
ECL
MC10E141
MC100E141
28
TTL
SN54LS166
SN74LS166
16
N,J
D
8–Bit Shift Registers With Sign Extend
TTL
SN54LS322A
SN74LS322A
20
N,J
DW
8–Bit Shift/Storage Register With 3–State Outputs
TTL
SN54LS299
SN74LS299
20
N,J
DW
TTL
SN54LS323
SN74LS323
20
N,J
DW
CMOS
MC14014B
–
16
P,L
D
CMOS
MC14021B
–
16
P,L
D
8–Input Shift/Storage Register W/Synchronous Reset and
Common I/O Pins
TTL
MC74F323
–
20
N
DW
8–Input
p Universal Shift/Storage
g Register
g
With Common Parallel I/O
Pins With 3–State
Pins:
3 State Outputs
O tp ts
CMOS
MC74AC299
–
20
N
DW
CMOS
MC74ACT299
–
20
N
DW
8–Input
p Universal Shift/Storage
g Register
g
With Syn
y Reset/Common
Parallel I/O Pins:
Pins With 3
3–State
State O
Outputs
tp ts
CMOS
MC74AC323
–
20
N
DW
CMOS
MC74ACT323
–
20
N
DW
8–Input Universal Shift/Storage Register, W/Common Parallel I/O
Pins
TTL
MC74F299
–
20
N
DW
8–Stage Shift/Store Register With 3–State Outputs
CMOS
MC14094B
–
16
P,L
9–Bit Shift Register, 700MHz, With Asynchronous Master Reset
ECL
MC10E142
Dual 5–Bit Shift Register
CMOS
MC14015B
8–Bit Serial–Input/Serial or Parallel–Output Shift Register With
Latched 3–State Outputs
8–Bit Shift Register
8–Bit Static Shift Register
Motorola Master Selection Guide
3.1–33
–
D
FN
–
MC100E142
–
16
D,
DT,M
FN
28
16
D
FN
P,L
D
Logic: Standard, Special and Programmable
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
SHIFT REGISTERS
Dual 64–Bit Static Shift Register
CMOS
MC14517B
–
16
P
DW
Successive Approximation Register
CMOS
MC14549B
–
16
P,L
DW
CMOS
MC14559B
–
16
P,L
DW
TTL
SN54LS195A
16
N,J
D
1.1GHz Serial Input Synthesizer With ÷64/65, ÷128/129 Prescaler
ECL
MC12202
–
16,20
D,M,
DT
125–1000MHz Frequency Synthesizer With Parallel Programming
Interface
ECL
MC12181
–
16
DT
2.0GHz Serial Input Synthesizer With ÷64/65, ÷128/129 Prescaler
ECL
MC12206
–
16,20
D,DT
2.5GHz Serial Input Synthesizer With ÷32/33, ÷64/65 Prescaler
ECL
MC12210
–
16,20
D,DT
2.7GHz Frequency Synthesizer
ECL
MC12179
–
8
D
25Ω Octal Bidirectional Transceiver w/ 3–State Inputs and Outputs
ECL
MC74F2245
–
20
DW,SD
4–Bit Differential ECL Bus/TTL Bus Transceiver
ECL
MC10H680
28
FN
Dual Supply Octal Translating Transceiver
CMOS
MC74LVX4245
–
24
DW,DT
ECL/TTL Inverting Bidirectional Transceivers With Latch (4–Bit)
ECL
MC10804
–
16
L
ECL/TTL Inverting Bidirectional Transceivers With Latch (5–Bit)
ECL
MC10805
–
20
L
Hex ECL/TTL Transceiver With Latches
ECL
MC10H681
28
FN
Low–Voltage CMOS 16–Bit Latching Transceiver, 3–State,
Non–Inverting With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX16543A
–
56
DT
Low–Voltage CMOS 16–Bit Transceiver, 3–State, Non–Inverting
With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX16245
–
48
DT
Low–Voltage CMOS 18–Bit Universal Bus Transceiver, 3–State,
Non–Inverting With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX16500
–
56
DT
Universal 4–Bit Shift Register
SN74LS195A
SYNTHESIZERS
TRANSCEIVERS
MC100H680
MC100H681
CMOS
MC74LCX16501
–
56
DT
Low–Voltage CMOS Octal Registered Transceiver With Dual
Output and Clock Enables, With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX2952
–
24
DW,
SD,DT
Low–Voltage CMOS Octal Transceiver, 3–State, Non–Inverting
With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX245
–
20
M,DW,
DT
Low–Voltage Quiet CMOS Octal Transceiver, 3–State,
Non–Inverting
CMOS
MC74LVQ245
–
20
M,DW,
SD,DT
Low–Voltage CMOS Octal Transceiver/Registered Transceiver
With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX646
–
24
DW,
SD,DT
Low–Voltage CMOS Octal Transceiver/Registered Transceiver
With Dual Enable, With 5V Tolerant Inputs and Outputs
CMOS
MC74LCX652
–
24
DW,
DT
Low–Voltage Quiet CMOS Octal Transceiver/Registered
Transceiver
CMOS
MC74LVQ646
–
24
DW,
SD,DT
Low–Voltage Quiet CMOS Octal Transceiver/Registered
Transceiver
CMOS
MC74LVQ652
–
24
DW,
SD,DT
Octal Bus Transceiver/Inverting With Open Collector
TTL
SN54LS642
SN74LS642
20
N,J
DW
Octal Bus Transceiver/Non–Inverting With Open Collector
TTL
SN54LS641
SN74LS641
20
N,J
DW
Quad Futurebus Backplane Transceiver, With 3–State Outputs and
Open Collector
TTL
MC74F3893A
9–Bit ECL/TTL Translator
ECL
MC10H601
9–Bit Latch ECL/TTL Translator
ECL
MC10H603
9–Bit Latch TTL/ECL Translator
ECL
9–Bit TTL/ECL Translator
–
20
FN
MC100H601
28
FN
MC100H603
28
FN
MC10H602
MC100H602
28
FN
ECL
MC10H600
MC100H600
28
FN
Differential ECL/TTL Translator
ECL
MC10ELT25
MC100ELT25
8
D
Differential PECL/TTL Translator
ECL
MC10ELT21
MC100ELT21
8
D
Dual Differential PECL/TTL Translator
ECL
MC100ELT23
–
8
D
Dual LVTTL/LVCMOS to Differential PECL Translator
ECL
MC100LVELT22
–
8
D
Dual TTL/Differential PECL Translator
ECL
MC10ELT22
8
D
TRANSLATORS
Logic: Standard, Special and Programmable
3.1–34
MC100ELT22
Motorola Master Selection Guide
Selection by Function
Description
Tech.
Device(s)
Pins
DIP
SM
FN
TRANSLATORS
ECL/TTL Translator (Single P.S. @+ 5.0V)
ECL
MC10H350
–
16
P,L
Hex ECL/MST Translator
ECL
MC10191
–
16
P,L
Hex TTL OR CMOS/CMOS Hex Level Shifter
CMOS
MC14504B
–
16
P,L
D
Quad CMOS/ECL Translator (Single P.S. @+ 5.0V)
ECL
MC10H352
–
20
P,L
FN
Quad MECL/TTL Translator
ECL
MC10H125
–
16
P,L
FN
ECL
MC10125
–
16
P,L
FN
Quad MST/ECL Translator
ECL
MC10190
–
16
P
Quad TTL/ECL Translator (ECL Strobe)
ECL
MC10H424
–
16
P,L
FN
Quad TTL/MECL Translator
ECL
MC10124
–
16
P,L
FN
Quad TTL/MECL Translator, With TTL Strobe Input
ECL
MC10H124
–
16
P,L
FN
Quad TTL/NMOS–to–PECL Translator (Single P.S. @+ 5.0V)
ECL
MC10H351
–
20
P,L
FN
Registered Hex ECL/TTL Translator
ECL
MC10H605
MC100H605
28
FN
Registered Hex PECL/TTL Translator
ECL
MC10H607
MC100H607
28
FN
Registered Hex TTL/ECL Translator
ECL
MC10H604
MC100H604
28
FN
Registered Hex TTL/PECL Translator
ECL
MC10H606
MC100H606
28
Triple MECL/NMOS Translator
ECL
MC10177
Triple ECL to PECL Translator
ECL
MC100LVEL90
20
DW
Triple PECL to LVPECL Translator
ECL
MC100LVEL92
–
20
DW
Triple PECL to ECL Translator
ECL
MC100LVEL91
–
20
DW
TTL/Differential ECL Translator
ECL
MC10ELT24
MC100ELT24
8
D
TTL/Differential PECL Translator
ECL
MC10ELT20
MC100ELT20
8
D
TTL to Differential PECL/Differential PECL to TTL Translator
ECL
MC10ELT28
MC100ELT28
8
D
Phase–Locked–Loop With VCO
CMOS
MC74HC4046A
–
16
Low Power Voltage Controlled Oscillator Buffer
CMOS
MC12147
–
8
D,SD
Low Power Voltage Controlled Oscillator Buffer
CMOS
MC12149
–
8
D,SD
–
MC100EL90
16
FN
L
VCO
Motorola Master Selection Guide
3.1–35
N
D
Logic: Standard, Special and Programmable
Device Index
MC100E016
3.1–15
MC100EL11
3.1–12
MC100LVE310
3.1–9
MC100E101
3.1–23
MC100EL12
3.1–25
MC100LVEL01
3.1–22
MC100E104
3.1–23
MC100EL13
3.1–9
MC100LVEL05
3.1–22
MC100E107
3.1–23
MC100EL14
3.1–12
MC100LVEL11
3.1–9
MC100E111
3.1–12
MC100EL15
3.1–12
MC100LVEL12
3.1–25
MC100E112
3.1–25
MC100EL16
3.1–31
MC100LVEL13
3.1–9
MC100E116
3.1–31
MC100EL17
3.1–31
MC100LVEL14
3.1–12
MC100E122
3.1–25
MC100EL29
3.1–19
MC100LVEL16
3.1–31
MC100E131
3.1–18
MC100EL30
3.1–21
MC100LVEL17
3.1–31
MC100E136
3.1–14
MC100EL31
3.1–18
MC100LVEL29
3.1–19
MC100E137
3.1–15
MC100EL32
3.1–17
MC100LVEL30
3.1–21
MC100E141
3.1–33
MC100EL33
3.1–17
MC100LVEL31
3.1–20
MC100E142
3.1–33
MC100EL34
3.1–13
MC100LVEL32
3.1–17
MC100E143
3.1–18
MC100EL35
3.1–19
MC100LVEL33
3.1–17
MC100E150
3.1–26
MC100EL38
3.1–13
MC100LVEL38
3.1–13
MC100E151
3.1–18
MC100EL39
3.1–13
MC100LVEL39
3.1–13
MC100E154
3.1–26
MC100EL51
3.1–18
MC100LVEL51
3.1–18
MC100E155
3.1–26
MC100EL52
3.1–18
MC100LVEL56
3.1–28
MC100E156
3.1–26
MC100EL56
3.1–28
MC100LVEL59
3.1–29
MC100E157
3.1–29
MC100EL57
3.1–27
MC100LVEL90
3.1–35
MC100E158
3.1–27
MC100EL58
3.1–27
MC100LVEL91
3.1–35
MC100E160
3.1–30
MC100EL59
3.1–29
MC100LVEL92
3.1–35
MC100E163
3.1–27
MC100EL90
3.1–35
MC100LVELT22
3.1–34
MC100E164
3.1–27
MC100ELT20
3.1–35
MC100SX1230
3.1–18
MC100E166
3.1–14
MC100ELT21
3.1–34
MC10101
3.1–23
MC100E167
3.1–18
MC100ELT22
3.1–34
MC10102
3.1–24
MC100E171
3.1–27
MC100ELT23
3.1–34
MC10103
3.1–24
MC100E175
3.1–26
MC100ELT24
3.1–35
MC10104
3.1–21
MC100E193
3.1–30
MC100ELT25
3.1–34
MC10105
3.1–23
MC100E195
3.1–31
MC100ELT28
3.1–35
MC10106
3.1–24
MC100E196
3.1–31
MC100H600
3.1–34
MC10107
3.1–23
MC100E210
3.1–9
MC100H601
3.1–34
MC10109
3.1–23
MC100E211
3.1–12
MC100H602
3.1–34
MC10110
3.1–24
MC100E212
3.1–32
MC100H603
3.1–34
MC10111
3.1–24
MC100E241
3.1–33
MC100H604
3.1–35
MC10113
3.1–23
MC100E256
3.1–26
MC100H605
3.1–35
MC10114
3.1–32
MC100E310
3.1–9
MC100H606
3.1–35
MC10115
3.1–31
MC100E336
3.1–10
MC100H607
3.1–35
MC10116
3.1–32
MC100E337
3.1–10
MC100H640
3.1–13
MC10117
3.1–23
MC100E404
3.1–23
MC100H641
3.1–13
MC10121
3.1–22
MC100E416
3.1–31
MC100H642
3.1–13
MC10123
3.1–12
MC100E431
3.1–18
MC100H643
3.1–13
MC10124
3.1–35
MC100E445
3.1–14
MC100H644
3.1–13
MC10125
3.1–35
MC100E446
3.1–14
MC100H646
3.1–13
MC10129
3.1–31
MC100E451
3.1–18
MC100H660
3.1–27
MC10130
3.1–26
MC100E452
3.1–18
MC100H680
3.1–34
MC10131
3.1–19
MC100E457
3.1–29
MC100H681
3.1–34
MC10133
3.1–27
MC100EL01
3.1–22
MC100LVE111
3.1–12
MC10134
3.1–28
MC100EL04
3.1–22
MC100LVE164
3.1–28
MC10135
3.1–19
MC100EL05
3.1–22
MC100LVE210
3.1–9
MC10136
3.1–16
MC100EL07
3.1–22
MC100LVE222
3.1–13
MC10137
3.1–16
TTL, ECL, CMOS and Special Logic Circuits
3.1–36
Motorola Master Selection Guide
Device Index
MC10138
3.1–15
MC10E141
3.1–33
MC10EL52
3.1–18
MC10141
3.1–33
MC10E142
3.1–33
MC10EL57
3.1–27
MC10153
3.1–27
MC10E143
3.1–18
MC10EL58
3.1–27
MC10154
3.1–15
MC10E150
3.1–26
MC10EL89
3.1–17
MC10158
3.1–28
MC10E151
3.1–18
MC10ELT20
3.1–35
MC10159
3.1–28
MC10E154
3.1–26
MC10ELT21
3.1–34
MC10160
3.1–30
MC10E155
3.1–26
MC10ELT22
3.1–34
MC10161
3.1–16
MC10E156
3.1–26
MC10ELT24
3.1–35
MC10162
3.1–16
MC10E157
3.1–29
MC10ELT25
3.1–34
MC10163
3.1–17
MC10E158
3.1–27
MC10ELT28
3.1–35
MC10164
3.1–27
MC10E160
3.1–30
MC10H100
3.1–24
MC10165
3.1–18
MC10E163
3.1–27
MC10H101
3.1–23
MC10166
3.1–14
MC10E164
3.1–27
MC10H102
3.1–24
MC10170
3.1–30
MC10E1651
3.1–14
MC10H103
3.1–24
MC10171
3.1–16
MC10E1652
3.1–14
MC10H104
3.1–21
MC10172
3.1–17
MC10E166
3.1–14
MC10H105
3.1–23
MC10173
3.1–29
MC10E167
3.1–18
MC10H106
3.1–24
MC10174
3.1–28
MC10E171
3.1–27
MC10H107
3.1–23
MC10175
3.1–27
MC10E175
3.1–26
MC10H109
3.1–23
MC10176
3.1–19
MC10E193
3.1–30
MC10H113
3.1–23
MC10177
3.1–35
MC10E195
3.1–31
MC10H115
3.1–31
MC10178
3.1–15
MC10E196
3.1–31
MC10H116
3.1–32
MC10180
3.1–9
MC10E197
3.1–27
MC10H117
3.1–23
MC10181
3.1–9
MC10E211
3.1–12
MC10H118
3.1–23
MC10186
3.1–19
MC10E212
3.1–32
MC10H119
3.1–22
MC10188
3.1–25
MC10E241
3.1–33
MC10H121
3.1–22
MC10189
3.1–25
MC10E256
3.1–26
MC10H123
3.1–12
MC10190
3.1–35
MC10E336
3.1–10
MC10H124
3.1–35
MC10191
3.1–35
MC10E337
3.1–10
MC10H125
3.1–35
MC10192
3.1–12
MC10E404
3.1–23
MC10H130
3.1–26
MC10193
3.1–17
MC10E411
3.1–13
MC10H131
3.1–19
MC10195
3.1–25
MC10E416
3.1–31
MC10H135
3.1–19
MC10197
3.1–21
MC10E431
3.1–18
MC10H136
3.1–16
MC10198
3.1–29
MC10E445
3.1–14
MC10H141
3.1–33
MC10210
3.1–24
MC10E446
3.1–14
MC10H145
3.1–32
MC10211
3.1–24
MC10E451
3.1–18
MC10H158
3.1–29
MC10212
3.1–23
MC10E452
3.1–18
MC10H159
3.1–29
MC10216
3.1–31
MC10E457
3.1–29
MC10H16
3.1–14
MC10231
3.1–19
MC10EL01
3.1–22
MC10H160
3.1–30
MC10804
3.1–34
MC10EL04
3.1–22
MC10H161
3.1–16
MC10805
3.1–34
MC10EL05
3.1–22
MC10H162
3.1–16
MC10E016
3.1–15
MC10EL07
3.1–22
MC10H164
3.1–27
MC10E101
3.1–23
MC10EL11
3.1–12
MC10H165
3.1–18
MC10E104
3.1–23
MC10EL12
3.1–25
MC10H166
3.1–14
MC10E107
3.1–23
MC10EL15
3.1–12
MC10H171
3.1–17
MC10E111
3.1–12
MC10EL16
3.1–31
MC10H172
3.1–17
MC10E112
3.1–25
MC10EL31
3.1–18
MC10H173
3.1–28
MC10E116
3.1–31
MC10EL32
3.1–17
MC10H174
3.1–28
MC10E122
3.1–25
MC10EL33
3.1–17
MC10H175
3.1–27
MC10E131
3.1–18
MC10EL34
3.1–13
MC10H176
3.1–19
MC10E136
3.1–14
MC10EL35
3.1–19
MC10H179
3.1–9
MC10E137
3.1–15
MC10EL51
3.1–18
MC10H180
3.1–9
Motorola Master Selection Guide
3.1–37
TTL, ECL, CMOS and Special Logic Circuits
Device Index
MC10H181
3.1–9
MC12022TSA
3.1–30
MC12430
3.1–13
MC10H186
3.1–19
MC12022TSB
3.1–30
MC12439
3.1–13
MC10H188
3.1–25
MC12022TVA
3.1–30
MC14001B
3.1–24
MC10H189
3.1–25
MC12022TVB
3.1–30
MC14001UB
3.1–24
MC10H209
3.1–23
MC12023
3.1–31
MC14002B
3.1–24
MC10H210
3.1–24
MC12025
3.1–31
MC14002UB
3.1–24
MC10H211
3.1–24
MC12026A
3.1–30
MC14006B
3.1–32
MC10H330
3.1–12
MC12026B
3.1–30
MC14007UB
3.1–25
MC10H332
3.1–10
MC12028A
3.1–30
MC14008B
3.1–9
MC10H334
3.1–12
MC12028B
3.1–30
MC14011B
3.1–22
MC10H350
3.1–35
MC12031A
3.1–31
MC14011UB
3.1–22
MC10H351
3.1–35
MC12031B
3.1–31
MC14012B
3.1–21
MC10H352
3.1–35
MC12032A
3.1–31
MC14012UB
3.1–21
MC10H423
3.1–12
MC12032B
3.1–31
MC14013B
3.1–18
MC10H424
3.1–35
MC12033A
3.1–31
MC14014B
3.1–33
MC10H600
3.1–34
MC12033B
3.1–31
MC14015B
3.1–33
MC10H601
3.1–34
MC12034A
3.1–31
MC14016B
3.1–29
MC10H602
3.1–34
MC12034B
3.1–31
MC14017B
3.1–15
MC10H603
3.1–34
MC12036A
3.1–30
MC14018B
3.1–15
MC10H604
3.1–35
MC12036B
3.1–30
MC14020B
3.1–14
MC10H605
3.1–35
MC12038A
3.1–30
MC14021B
3.1–33
MC10H606
3.1–35
MC12040
3.1–17
MC14022B
3.1–15
MC10H607
3.1–35
MC12052A
3.1–30
MC14023B
3.1–22
MC10H640
3.1–13
MC12053A
3.1–30
MC14023UB
3.1–22
MC10H641
3.1–13
MC12054A
3.1–31
MC14024B
3.1–14
MC10H642
3.1–13
MC12058
3.1–30
MC14025B
3.1–24
MC10H643
3.1–13
MC12061
3.1–29
MC14025UB
3.1–24
MC10H644
3.1–13
MC12066
3.1–30
MC14027B
3.1–19
MC10H645
3.1–13
MC12073
3.1–30
MC14028B
3.1–16
MC10H646
3.1–13
MC12074
3.1–30
MC14029B
3.1–15
MC10H660
3.1–27
MC12075
3.1–30
MC14035B
3.1–33
MC10H680
3.1–34
MC12076
3.1–31
MC14038B
3.1–9
MC10H681
3.1–34
MC12078
3.1–31
MC14040B
3.1–14
MC10SX1125
3.1–9
MC12079
3.1–31
MC14042B
3.1–27
MC10SX1130
3.1–13, 3.1–17
MC12080
3.1–30
MC14043B
3.1–27
MC10SX1189
3.1–13
MC12083
3.1–30
MC14044B
3.1–27
MC12002
3.1–17
MC12089
3.1–31
MC14046B
3.1–30
MC12009
3.1–31
MC12090
3.1–31
MC14049B
3.1–25
MC12011
3.1–31
MC12093
3.1–30
MC14049UB
3.1–25
MC12013
3.1–31
MC12095
3.1–31
MC14050B
3.1–25
MC12014
3.1–15
MC12098
3.1–31
MC14051B
3.1–27
MC12015
3.1–31
MC12100
3.1–29
MC14052B
3.1–28
MC12016
3.1–31
MC12101
3.1–29
MC14053B
3.1–29
MC12017
3.1–31
MC12147
3.1–35
MC14060B
3.1–14
MC12018
3.1–31
MC12148
3.1–29
MC14066B
3.1–29
MC12019
3.1–31
MC12149
3.1–35
MC14067B
3.1–27
MC12022A
3.1–30
MC12179
3.1–34
MC14068B
3.1–21
MC12022B
3.1–30
MC12181
3.1–34
MC14069UB
3.1–25
MC12022LVA
3.1–30
MC12202
3.1–34
MC14070B
3.1–23
MC12022LVB
3.1–30
MC12206
3.1–34
MC14071B
3.1–24
MC12022SLA
3.1–30
MC12210
3.1–34
MC14072B
3.1–24
MC12022SLB
3.1–30
MC12429
3.1–13
MC14073B
3.1–22
TTL, ECL, CMOS and Special Logic Circuits
3.1–38
Motorola Master Selection Guide
Device Index
MC14075B
3.1–25
MC14549B
3.1–34
MC54HC164
3.1–33
MC14076B
3.1–21
MC14551B
3.1–28
MC54HC164A
3.1–33
MC14077B
3.1–23
MC14553B
3.1–14
MC54HC165
3.1–33
MC14078B
3.1–24
MC14555B
3.1–17
MC54HC174A
3.1–19
MC14081B
3.1–21
MC14556B
3.1–17
MC54HC175
3.1–21
MC14082B
3.1–21
MC14557B
3.1–32
MC54HC175A
3.1–21
MC14093B
3.1–32
MC14558B
3.1–17
MC54HC240A
3.1–11
MC14094B
3.1–33
MC14559B
3.1–34
MC54HC241A
3.1–11
MC14099B
3.1–26
MC14560B
3.1–9
MC54HC244A
3.1–12
MC14106B
3.1–32
MC14561B
3.1–9
MC54HC245A
3.1–12
MC14161B
3.1–14
MC14562B
3.1–32
MC54HC251
3.1–27
MC14163B
3.1–14
MC14566B
3.1–15
MC54HC259
3.1–16
MC14174B
3.1–19
MC14568B
3.1–15
MC54HC27
3.1–24
MC14175B
3.1–21
MC14569B
3.1–15
MC54HC273A
3.1–20
MC14194B
3.1–33
MC14572UB
3.1–23
MC54HC32A
3.1–24
MC14415
3.1–30
MC14580B
3.1–32
MC54HC354
3.1–27
MC14490
3.1–9
MC14583B
3.1–32
MC54HC365
3.1–10
MC14500B
3.1–25
MC14584B
3.1–32
MC54HC366
3.1–10
MC14501UB
3.1–23
MC14585B
3.1–14
MC54HC367
3.1–10
MC14502B
3.1–25
MC14598B
3.1–26
MC54HC373A
3.1–27
MC14503B
3.1–10
MC14599B
3.1–26
MC54HC374A
3.1–20
MC14504B
3.1–35
MC1648
3.1–30
MC54HC390
3.1–15
MC14506UB
3.1–23
MC1650
3.1–14
MC54HC393
3.1–15
MC14508B
3.1–26
MC1651
3.1–14
MC54HC4016
3.1–29
MC14510B
3.1–15
MC1658
3.1–29
MC54HC4040A
3.1–14
MC14511B
3.1–17
MC1660
3.1–23
MC54HC4049
3.1–25
MC14512B
3.1–27
MC1662
3.1–24
MC54HC4050
3.1–25
MC14513B
3.1–17
MC1670
3.1–20
MC54HC4051
3.1–27
MC14514B
3.1–16
MC1672
3.1–23
MC54HC4053
3.1–29
MC14515B
3.1–16
MC1692
3.1–31
MC54HC4060
3.1–14
MC14516B
3.1–15
MC4016
3.1–16
MC54HC4060A
3.1–14
MC14517B
3.1–34
MC4018
3.1–16
MC54HC4066
3.1–29
MC14518B
3.1–15
MC4024
3.1–29
MC54HC4351
3.1–27
MC14519B
3.1–22
MC4044
3.1–17
MC54HC4353
3.1–29
MC14520B
3.1–15
MC4316
3.1–16
MC54HC4538A
3.1–29
MC14521B
3.1–30
MC4324
3.1–29
MC54HC533A
3.1–27
MC14522B
3.1–15
MC4344
3.1–17
MC54HC534A
3.1–20
MC14526B
3.1–15
MC54HC00A
3.1–22
MC54HC540A
3.1–11
MC14527B
3.1–9
MC54HC02A
3.1–24
MC54HC541A
3.1–11
MC14528B
3.1–29
MC54HC04A
3.1–25
MC54HC563A
3.1–27
MC14529B
3.1–28
MC54HC08A
3.1–21
MC54HC573A
3.1–27
MC14530B
3.1–23
MC54HC132A
3.1–32
MC54HC574A
3.1–20
MC14531B
3.1–30
MC54HC138A
3.1–16
MC54HC589
3.1–33
MC14532B
3.1–17
MC54HC139A
3.1–17
MC54HC589A
3.1–33
MC14534B
3.1–14
MC54HC14A
3.1–32
MC54HC595A
3.1–33
MC14536B
3.1–30
MC54HC154
3.1–16
MC54HC597
3.1–33
MC14538B
3.1–29
MC54HC157A
3.1–28
MC54HC597A
3.1–33
MC14539B
3.1–28
MC54HC158
3.1–28
MC54HC640A
3.1–11
MC14541B
3.1–30
MC54HC160
3.1–15
MC54HC646
3.1–12
MC14543B
3.1–17
MC54HC161A
3.1–15
MC54HC688
3.1–14
MC14544B
3.1–17
MC54HC162
3.1–15
MC54HC74A
3.1–19
MC14547B
3.1–17
MC54HC163A
3.1–15
MC54HC86
3.1–23
Motorola Master Selection Guide
3.1–39
TTL, ECL, CMOS and Special Logic Circuits
Device Index
MC54HC86A
3.1–23
MC74AC163
3.1–16
MC74ACT10
3.1–22
MC54HCT00A
3.1–22
MC74AC174
3.1–19
MC74ACT109
3.1–19
MC54HCT08A
3.1–21
MC74AC175
3.1–20
MC74ACT11
3.1–22
MC54HCT14A
3.1–32
MC74AC190
3.1–16
MC74ACT112
3.1–19
MC54HCT161A
3.1–15
MC74AC194
3.1–33
MC74ACT113
3.1–19
MC54HCT163A
3.1–15
MC74AC20
3.1–21
MC74ACT125
3.1–12
MC54HCT241A
3.1–11
MC74AC240
3.1–11
MC74ACT126
3.1–12
MC54HCT244A
3.1–11
MC74AC241
3.1–11
MC74ACT132
3.1–32
MC54HCT245A
3.1–10
MC74AC244
3.1–11
MC74ACT138
3.1–16
MC54HCT32A
3.1–24
MC74AC245
3.1–10
MC74ACT139
3.1–17
MC54HCT373A
3.1–26
MC74AC251
3.1–27
MC74ACT14
3.1–32
MC54HCT374A
3.1–20
MC74AC253
3.1–28
MC74ACT151
3.1–27
MC54HCT574A
3.1–20
MC74AC256
3.1–26
MC74ACT153
3.1–28
MC660
3.1–18
MC74AC257
3.1–28
MC74ACT157
3.1–29
MC661
3.1–18
MC74AC258
3.1–28
MC74ACT158
3.1–29
MC662
3.1–18
MC74AC259
3.1–26
MC74ACT160
3.1–16
MC663
3.1–19
MC74AC273
3.1–20
MC74ACT161
3.1–16
MC664
3.1–20
MC74AC299
3.1–33
MC74ACT162
3.1–16
MC667
3.1–29
MC74AC32
3.1–24
MC74ACT163
3.1–16
MC668
3.1–25
MC74AC323
3.1–33
MC74ACT174
3.1–19
MC669
3.1–18
MC74AC350
3.1–33
MC74ACT175
3.1–20
MC670
3.1–25
MC74AC352
3.1–28
MC74ACT194
3.1–33
MC671
3.1–25
MC74AC353
3.1–28
MC74ACT20
3.1–21
MC672
3.1–25
MC74AC373
3.1–26
MC74ACT240
3.1–11
MC677
3.1–25
MC74AC374
3.1–20
MC74ACT241
3.1–11
MC678
3.1–25
MC74AC377
3.1–20
MC74ACT244
3.1–11
MC68150*33
3.1–10
MC74AC378
3.1–18
MC74ACT245
3.1–10
MC68150*40
3.1–10
MC74AC4020
3.1–14
MC74ACT251
3.1–27
MC68194
3.1–12
MC74AC4040
3.1–14
MC74ACT253
3.1–28
MC74AC00
3.1–22
MC74AC533
3.1–26
MC74ACT256
3.1–26
MC74AC02
3.1–24
MC74AC534
3.1–20
MC74ACT257
3.1–28
MC74AC04
3.1–25
MC74AC540
3.1–11
MC74ACT258
3.1–28
MC74AC05
3.1–25
MC74AC541
3.1–11
MC74ACT259
3.1–26
MC74AC08
3.1–21
MC74AC563
3.1–26
MC74ACT273
3.1–20
MC74AC10
3.1–22
MC74AC564
3.1–20
MC74ACT299
3.1–33
MC74AC109
3.1–19
MC74AC573
3.1–26
MC74ACT32
3.1–24
MC74AC11
3.1–22
MC74AC574
3.1–20
MC74ACT323
3.1–33
MC74AC112
3.1–19
MC74AC620
3.1–10
MC74ACT350
3.1–33
MC74AC113
3.1–19
MC74AC623
3.1–10
MC74ACT352
3.1–28
MC74AC125
3.1–12
MC74AC640
3.1–10
MC74ACT353
3.1–28
MC74AC126
3.1–12
MC74AC643
3.1–10
MC74ACT373
3.1–26
MC74AC132
3.1–32
MC74AC646
3.1–11
MC74ACT374
3.1–20
MC74AC138
3.1–16
MC74AC648
3.1–11
MC74ACT377
3.1–20
MC74AC139
3.1–17
MC74AC652
3.1–11
MC74ACT378
3.1–18
MC74AC14
3.1–32
MC74AC74
3.1–18
MC74ACT521
3.1–14
MC74AC151
3.1–27
MC74AC810
3.1–23
MC74ACT533
3.1–26
MC74AC153
3.1–28
MC74AC86
3.1–23
MC74ACT534
3.1–20
MC74AC157
3.1–29
MC74ACT00
3.1–22
MC74ACT540
3.1–11
MC74AC158
3.1–29
MC74ACT02
3.1–24
MC74ACT541
3.1–11
MC74AC160
3.1–16
MC74ACT04
3.1–25
MC74ACT563
3.1–26
MC74AC161
3.1–16
MC74ACT05
3.1–25
MC74ACT564
3.1–20
MC74AC162
3.1–16
MC74ACT08
3.1–21
MC74ACT573
3.1–26
TTL, ECL, CMOS and Special Logic Circuits
3.1–40
Motorola Master Selection Guide
Device Index
MC74ACT574
3.1–20
MC74F243
3.1–12
MC74F657A
3.1–10
MC74ACT620
3.1–10
MC74F244
3.1–11
MC74F657B
3.1–10
MC74ACT623
3.1–10
MC74F245
3.1–10
MC74F74
3.1–19
MC74ACT640
3.1–10
MC74F251
3.1–27
MC74F779
3.1–15
MC74ACT643
3.1–10
MC74F253
3.1–28
MC74F803
3.1–13
MC74ACT646
3.1–11
MC74F256
3.1–26
MC74F823
3.1–10
MC74ACT648
3.1–11
MC74F257A
3.1–29
MC74F827
3.1–10
MC74ACT652
3.1–11
MC74F258A
3.1–29
MC74F828
3.1–10
MC74ACT74
3.1–18
MC74F259
3.1–26
MC74F85
3.1–14
MC74ACT810
3.1–23
MC74F269
3.1–15
MC74F86
3.1–23
MC74ACT86
3.1–23
MC74F280
3.1–30
MC74HC00A
3.1–22
MC74F00
3.1–22
MC74F283
3.1–9
MC74HC02A
3.1–24
MC74F02
3.1–24
MC74F299
3.1–33
MC74HC03A
3.1–22
MC74F04
3.1–25
MC74F32
3.1–24
MC74HC04A
3.1–25
MC74F08
3.1–21
MC74F323
3.1–33
MC74HC08A
3.1–21
MC74F10
3.1–22
MC74F350
3.1–33
MC74HC10
3.1–22
MC74F109
3.1–19
MC74F352
3.1–28
MC74HC107
3.1–19
MC74F11
3.1–22
MC74F353
3.1–28
MC74HC109
3.1–19
MC74F112
3.1–19
MC74F365
3.1–10
MC74HC11
3.1–22
MC74F1245
3.1–10
MC74F366
3.1–10
MC74HC112
3.1–19
MC74F125
3.1–12
MC74F367
3.1–10
MC74HC125A
3.1–12
MC74F126
3.1–12
MC74F368
3.1–10
MC74HC132A
3.1–32
MC74F13
3.1–32
MC74F37
3.1–21
MC74HC133
3.1–21
MC74F132
3.1–32
MC74F373
3.1–26
MC74HC137
3.1–16
MC74F138
3.1–16
MC74F374
3.1–20
MC74HC138A
3.1–16
MC74F139
3.1–17
MC74F377
3.1–20
MC74HC139A
3.1–17
MC74F14
3.1–32
MC74F378
3.1–32
MC74HC147
3.1–18
MC74F148
3.1–18
MC74F379
3.1–21
MC74HC14A
3.1–32
MC74F151
3.1–27
MC74F38
3.1–22
MC74HC151
3.1–27
MC74F153
3.1–28
MC74F381
3.1–9
MC74HC153
3.1–28
MC74F157A
3.1–28
MC74F382
3.1–9
MC74HC154
3.1–16
MC74F158A
3.1–28
MC74F3893A
3.1–34
MC74HC157A
3.1–28
MC74F160A
3.1–15
MC74F398
3.1–29
MC74HC158
3.1–28
MC74F161A
3.1–15
MC74F399
3.1–29
MC74HC158A
3.1–28
MC74F162A
3.1–15
MC74F40
3.1–21
MC74HC160
3.1–15
MC74F163A
3.1–15
MC74F51
3.1–23
MC74HC161A
3.1–15
MC74F164
3.1–33
MC74F521
3.1–14
MC74HC162
3.1–15
MC74F168
3.1–14
MC74F533
3.1–26
MC74HC163
3.1–15
MC74F169
3.1–14
MC74F534
3.1–20
MC74HC164
3.1–33
MC74F174
3.1–19
MC74F537
3.1–16
MC74HC164A
3.1–33
MC74F175
3.1–20
MC74F538
3.1–16
MC74HC165
3.1–33
MC74F1803
3.1–13
MC74F539
3.1–16
MC74HC173
3.1–21
MC74F181
3.1–9
MC74F544
3.1–11
MC74HC174A
3.1–19
MC74F182
3.1–9
MC74F568
3.1–14
MC74HC175
3.1–21
MC74F194
3.1–33
MC74F569
3.1–14
MC74HC175A
3.1–21
MC74F195
3.1–33
MC74F574
3.1–20
MC74HC194
3.1–33
MC74F20
3.1–21
MC74F579
3.1–15
MC74HC195
3.1–33
MC74F21
3.1–21
MC74F620
3.1–11
MC74HC20
3.1–21
MC74F2245
3.1–34
MC74F623
3.1–11
MC74HC237
3.1–16
MC74F240
3.1–11
MC74F64
3.1–22
MC74HC240A
3.1–11
MC74F241
3.1–11
MC74F640
3.1–11
MC74HC241A
3.1–11
MC74F242
3.1–12
MC74F646
3.1–11
MC74HC242
3.1–12
Motorola Master Selection Guide
3.1–41
TTL, ECL, CMOS and Special Logic Circuits
Device Index
MC74HC244A
3.1–12
MC74HC541A
3.1–11
MC74LCX157
MC74HC245A
3.1–12
MC74HC563A
3.1–27
MC74LCX16240A
MC74HC251
3.1–27
MC74HC564A
3.1–20
MC74LCX16244
3.1–9
MC74HC253
3.1–28
MC74HC573A
3.1–27
MC74LCX16245
3.1–34
MC74HC257
3.1–28
MC74HC574A
3.1–20
MC74LCX16373
3.1–26
MC74HC259
3.1–16
MC74HC58
3.1–22
MC74LCX373
3.1–26
MC74HC27
3.1–24
MC74HC589
3.1–33
MC74LCX16374
3.1–20
MC74HC273A
3.1–20
MC74HC589A
3.1–33
MC74LCX16500
3.1–34
MC74HC280
3.1–30
MC74HC595A
3.1–33
MC74LCX16501
3.1–34
MC74HC299
3.1–33
MC74HC597
3.1–33
MC74LCX16543A
3.1–34
MC74HC30
3.1–21
MC74HC597A
3.1–33
MC74LCX240
MC74HC32A
3.1–24
MC74HC640A
3.1–11
MC74LCX244
3.1–9
MC74HC354
3.1–27
MC74HC646
3.1–12
MC74LCX245
3.1–34
MC74HC365
3.1–10
MC74HC688
3.1–14
MC74LCX2952
3.1–34
MC74HC366
3.1–10
MC74HC7266
3.1–23
MC74LCX32
3.1–24
MC74HC367
3.1–10
MC74HC7266A
3.1–23
MC74LCX374
3.1–20
MC74HC368
3.1–10
MC74HC73
3.1–19
MC74LCX540
3.1–9
MC74HC373A
3.1–27
MC74HC74A
3.1–19
MC74LCX541
3.1–9
MC74HC374A
3.1–20
MC74HC75
3.1–26
MC74LCX573
3.1–26
MC74HC390
3.1–15
MC74HC76
3.1–19
MC74LCX574
3.1–20
MC74HC393
3.1–15
MC74HC85
3.1–14
MC74LCX652
3.1–34
MC74HC4002
3.1–24
MC74HC86
3.1–23
MC74LCX86
3.1–23
MC74HC4016
3.1–29
MC74HC86A
3.1–23
MC74LVQ00
3.1–21
MC74HC4017
3.1–15
MC74HCT00A
3.1–22
MC74LVQ04
3.1–25
MC74HC4020A
3.1–14
MC74HCT04A
3.1–25
MC74LVQ125
3.1–10
MC74HC4024
3.1–29
MC74HCT08A
3.1–21
MC74LVQ138
3.1–17
MC74HC4040A
3.1–14
MC74HCT138A
3.1–16
MC74LVQ240
3.1–10
MC74HC4046A
3.1–35
MC74HCT14A
3.1–32
MC74LVQ244
3.1–9
MC74HC4049
3.1–25
MC74HCT157A
3.1–28
MC74LVQ245
3.1–34
MC74HC4050
3.1–25
MC74HCT161A
3.1–15
MC74LVQ32
3.1–24
MC74HC4051
3.1–27
MC74HCT163A
3.1–15
MC74LVQ373
3.1–26
MC74HC4052
3.1–28
MC74HCT174A
3.1–19
MC74LVQ374
3.1–20
MC74HC4053
3.1–29
MC74HCT240A
3.1–11
MC74LVQ541
3.1–9
MC74HC4060
3.1–14
MC74HCT241A
3.1–11
MC74LVQ573
3.1–26
MC74HC4060A
3.1–14
MC74HCT244A
3.1–11
MC74LVQ574
3.1–20
MC74HC4066
3.1–29
MC74HCT245A
3.1–10
MC74LVQ646
3.1–34
MC74HC4075
3.1–25
MC74HCT273A
3.1–20
MC74LVQ652
3.1–34
MC74HC4078
3.1–23
MC74HCT32A
3.1–24
MC74LVX4245
3.1–34
MC74HC42
3.1–16
MC74HCT373A
3.1–26
MC74VHC02
3.1–24
MC74HC4316
3.1–29
MC74HCT374A
3.1–20
MC74VHC04
3.1–25
MC74HC4351
3.1–27
MC74HCT541A
3.1–11
MC74VHC08
3.1–21
MC74HC4353
3.1–29
MC74HCT573A
3.1–27
MC74HC126A
3.1–12
MC74HC4511
3.1–17
MC74HCT574A
3.1–20
MC74VHC125
3.1–12
MC74HC4514
3.1–16
MC74HCT74A
3.1–19
MC74VHC138
3.1–16
MC74HC4538A
3.1–29
MC74HCU04
3.1–25
MC74VHC14
3.1–32
MC74HC4851A
3.1–27
MC74HCU04A
3.1–25
MC74VHC157
3.1–28
MC74HC4852A
3.1–27
MC74LCX00
3.1–21
MC74VHC244
3.1–12
MC74HC4853A
3.1–27
MC74LCX02
3.1–24
MC74VHC245
3.1–12
MC74HC51
3.1–22
MC74LCX04
3.1–25
MC74VHC32
3.1–24
MC74HC533A
3.1–27
MC74LCX08
3.1–21
MC74VHC373
3.1–27
MC74HC534A
3.1–20
MC74LCX125
3.1–9
MC74VHC374
3.1–20
MC74HC540A
3.1–11
MC74LCX138
3.1–17
MC74VHC541
3.1–11
TTL, ECL, CMOS and Special Logic Circuits
3.1–42
3.1–28
3.1–9
3.1–9
Motorola Master Selection Guide
Device Index
MC74VHC573
3.1–27
MPA1765
3.1–32
SN54LS147
3.1–17
MC74VHC574
3.1–20
MPC903
3.1–12
SN54LS148
3.1–18
MC74VHC595
3.1–33
MPC904
3.1–12
SN54LS15
3.1–22
MC74VHC74
3.1–19
MPC905
3.1–12
SN54LS151
3.1–27
MC830
3.1–21
MPC911
3.1–13
SN54LS153
3.1–28
MC832
3.1–9
MPC930
3.1–13
SN54LS155
3.1–16
MC836
3.1–25
MPC931
3.1–13
SN54LS156
3.1–16
MC837
3.1–25
MPC946
3.1–13
SN54LS157
3.1–28
MC840
3.1–25
MPC947
3.1–12
SN54LS158
3.1–28
MC844
3.1–18
MPC948
3.1–12
SN54LS160A
3.1–14
MC845
3.1–18
MPC948L
3.1–12
SN54LS161A
3.1–14
MC846
3.1–22
MPC949
3.1–13
SN54LS162A
3.1–14
MC88913
3.1–13
MPC950
3.1–13
SN54LS163A
3.1–14
MC88914
3.1–13
MPC951
3.1–13
SN54LS164
3.1–33
MC88915*55
3.1–13
MPC952
3.1–13
SN54LS165
3.1–33
MC88915*70
3.1–13
MPC956
3.1–13
SN54LS166
3.1–33
MC88915T*100
3.1–13
MPC970
3.1–13
SN54LS168
3.1–15
MC88915T*133
3.1–13
MPC972
3.1–13
SN54LS169
3.1–15
MC88915T*160
3.1–13
MPC973
3.1–13
SN54LS170
3.1–32
MC88915T*55
3.1–13
MPC974
3.1–13
SN54LS173A
3.1–18
MC88915T*70
3.1–13
MPC980
3.1–13
SN54LS174
3.1–19
MC88916*70
3.1–13
MPC990
3.1–13
SN54LS175
3.1–21
MC88916*80
3.1–13
MPC991
3.1–13
SN54LS190
3.1–15
MC88920
3.1–13
MPC992
3.1–13
SN54LS191
3.1–15
MC88921
3.1–13
SN54LS00
3.1–22
SN54LS192
3.1–15
MC88LV926
3.1–13
SN54LS01
3.1–22
SN54LS193
3.1–15
MC88PL117
3.1–13
SN54LS02
3.1–24
SN54LS194A
3.1–33
MC936
3.1–25
SN54LS03
3.1–22
SN54LS195A
3.1–34
MC937
3.1–25
SN54LS04
3.1–25
SN54LS196
3.1–14
MC944
3.1–18
SN54LS05
3.1–25
SN54LS197
3.1–14
MC945
3.1–18
SN54LS08
3.1–21
SN54LS20
3.1–21
MC946
3.1–22
SN54LS09
3.1–21
SN54LS21
3.1–21
MC951
3.1–29
SN54LS10
3.1–22
SN54LS22
3.1–21
MC952
3.1–19
SN54LS107A
3.1–19
SN54LS221
3.1–29
MC953
3.1–19
SN54LS109A
3.1–19
SN54LS240
3.1–11
MCCS142233
3.1–32
SN54LS11
3.1–22
SN54LS241
3.1–11
MCCS142235
3.1–32
SN54LS112A
3.1–19
SN54LS242
3.1–12
MCCS142236
3.1–32
SN54LS113A
3.1–19
SN54LS243
3.1–12
MCCS142237
3.1–32
SN54LS114A
3.1–19
SN54LS244
3.1–11
MCCS142238
3.1–32
SN54LS12
3.1–22
SN54LS245
3.1–11
MCCS142239
3.1–32
SN54LS122
3.1–29
SN54LS247
3.1–17
MCH12140
3.1–17
SN54LS123
3.1–29
SN54LS248
3.1–17
MCK12140
3.1–17
SN54LS125A
3.1–12
SN54LS249
3.1–17
MCM10143
3.1–32
SN54LS126A
3.1–12
SN54LS251
3.1–27
MCM10145
3.1–32
SN54LS13
3.1–32
SN54LS253
3.1–28
MCM10146
3.1–31
SN54LS132
3.1–32
SN54LS256
3.1–26
MCM10152
3.1–31
SN54LS133
3.1–21
SN54LS257B
3.1–28
MPA1016
3.1–18
SN54LS137
3.1–16
SN54LS258B
3.1–29
MPA1036
3.1–18
SN54LS138
3.1–16
SN54LS259
3.1–26
MPA1064
3.1–18
SN54LS139
3.1–17
SN54LS26
3.1–21
MPA1100
3.1–18
SN54LS14
3.1–32
SN54LS260
3.1–24
MPA17128
3.1–32
SN54LS145
3.1–16
SN54LS266
3.1–23
Motorola Master Selection Guide
3.1–43
TTL, ECL, CMOS and Special Logic Circuits
Device Index
SN54LS27
3.1–24
SN54LS670
3.1–32
SN74LS148
3.1–18
SN54LS273
3.1–20
SN54LS682
3.1–14
SN74LS15
3.1–22
SN54LS279
3.1–27
SN54LS684
3.1–14
SN74LS151
3.1–27
SN54LS28
3.1–24
SN54LS688
3.1–14
SN74LS153
3.1–28
SN54LS280
3.1–30
SN54LS73A
3.1–19
SN74LS155
3.1–16
SN54LS283
3.1–9
SN54LS748
3.1–18
SN74LS156
3.1–16
SN54LS290
3.1–15
SN54LS74A
3.1–19
SN74LS157
3.1–28
SN54LS293
3.1–14
SN54LS75
3.1–26
SN74LS158
3.1–28
SN54LS298
3.1–28
SN54LS76A
3.1–19
SN74LS160A
3.1–14
SN54LS299
3.1–33
SN54LS77
3.1–26
SN74LS161A
3.1–14
SN54LS30
3.1–21
SN54LS795
3.1–10
SN74LS162A
3.1–14
SN54LS32
3.1–24
SN54LS796
3.1–10
SN74LS163A
3.1–14
SN54LS322A
3.1–33
SN54LS797
3.1–10
SN74LS164
3.1–33
SN54LS323
3.1–33
SN54LS798
3.1–10
SN74LS165
3.1–33
SN54LS33
3.1–24
SN54LS83A
3.1–9
SN74LS166
3.1–33
SN54LS348
3.1–18
SN54LS848
3.1–18
SN74LS168
3.1–15
SN54LS352
3.1–28
SN54LS85
3.1–14
SN74LS169
3.1–15
SN54LS353
3.1–28
SN54LS86
3.1–23
SN74LS170
3.1–32
SN54LS365A
3.1–10
SN54LS90
3.1–15
SN74LS173A
3.1–18
SN54LS366A
3.1–10
SN54LS92
3.1–15
SN74LS174
3.1–19
SN54LS367A
3.1–10
SN54LS93
3.1–14
SN74LS175
3.1–21
SN54LS368A
3.1–10
SN54LS95B
3.1–33
SN74LS190
3.1–15
SN54LS37
3.1–21
SN74LS00
3.1–22
SN74LS191
3.1–15
SN54LS373
3.1–26
SN74LS01
3.1–22
SN74LS192
3.1–15
SN54LS374
3.1–20
SN74LS02
3.1–24
SN74LS193
3.1–15
SN54LS375
3.1–26
SN74LS03
3.1–22
SN74LS194A
3.1–33
SN54LS377
3.1–20
SN74LS04
3.1–25
SN74LS195A
3.1–34
SN54LS378
3.1–19
SN74LS05
3.1–25
SN74LS196
3.1–14
SN54LS379
3.1–18
SN74LS08
3.1–21
SN74LS197
3.1–14
SN54LS38
3.1–22
SN74LS09
3.1–21
SN74LS20
3.1–21
SN54LS386
3.1–23
SN74LS10
3.1–22
SN74LS21
3.1–21
SN54LS390
3.1–15
SN74LS107A
3.1–19
SN74LS22
3.1–21
SN54LS393
3.1–15
SN74LS109A
3.1–19
SN74LS221
3.1–29
SN54LS398
3.1–29
SN74LS11
3.1–22
SN74LS240
3.1–11
SN54LS399
3.1–29
SN74LS112A
3.1–19
SN74LS241
3.1–11
SN54LS40
3.1–21
SN74LS113A
3.1–19
SN74LS242
3.1–12
SN54LS42
3.1–16
SN74LS114A
3.1–19
SN74LS243
3.1–12
SN54LS47
3.1–17
SN74LS12
3.1–22
SN74LS244
3.1–11
SN54LS48
3.1–17
SN74LS122
3.1–29
SN74LS245
3.1–11
SN54LS490
3.1–15
SN74LS123
3.1–29
SN74LS247
3.1–17
SN54LS51
3.1–23
SN74LS125A
3.1–12
SN74LS248
3.1–17
SN54LS54
3.1–22
SN74LS126A
3.1–12
SN74LS249
3.1–17
SN54LS540
3.1–11
SN74LS13
3.1–32
SN74LS251
3.1–27
SN54LS541
3.1–11
SN74LS132
3.1–32
SN74LS253
3.1–28
SN54LS55
3.1–22
SN74LS133
3.1–21
SN74LS257B
3.1–28
SN54LS569A
3.1–14
SN74LS136
3.1–23
SN74LS258B
3.1–29
SN54LS623
3.1–11
SN74LS137
3.1–16
SN74LS259
3.1–26
SN54LS640
3.1–11
SN74LS138
3.1–16
SN74LS26
3.1–21
SN54LS641
3.1–34
SN74LS139
3.1–17
SN74LS260
3.1–24
SN54LS642
3.1–34
SN74LS14
3.1–32
SN74LS266
3.1–23
SN54LS645
3.1–11
SN74LS145
3.1–16
SN74LS27
3.1–24
SN54LS669
3.1–16
SN74LS147
3.1–17
SN74LS273
3.1–20
TTL, ECL, CMOS and Special Logic Circuits
3.1–44
Motorola Master Selection Guide
Device Index
SN74LS279
3.1–27
SN74LS378
3.1–19
SN74LS645
3.1–11
SN74LS28
3.1–24
SN74LS379
3.1–18
SN74LS669
3.1–16
SN74LS280
3.1–30
SN74LS38
3.1–22
SN74LS670
3.1–32
SN74LS283
3.1–9
SN74LS386
3.1–23
SN74LS682
3.1–14
SN74LS290
3.1–15
SN74LS390
3.1–15
SN74LS684
3.1–14
SN74LS293
3.1–14
SN74LS393
3.1–15
SN74LS688
3.1–14
SN74LS298
3.1–28
SN74LS395
3.1–33
SN74LS73A
3.1–19
SN74LS299
3.1–33
SN74LS398
3.1–29
SN74LS748
3.1–18
SN74LS30
3.1–21
SN74LS399
3.1–29
SN74LS74A
3.1–19
SN74LS32
3.1–24
SN74LS40
3.1–21
SN74LS75
3.1–26
SN74LS322A
3.1–33
SN74LS42
3.1–16
SN74LS76A
3.1–19
SN74LS323
3.1–33
SN74LS47
3.1–17
SN74LS77
3.1–26
SN74LS33
3.1–24
SN74LS48
3.1–17
SN74LS795
3.1–10
SN74LS348
3.1–18
SN74LS490
3.1–15
SN74LS796
3.1–10
SN74LS352
3.1–28
SN74LS51
3.1–23
SN74LS797
3.1–10
SN74LS353
3.1–28
SN74LS54
3.1–22
SN74LS798
3.1–10
SN74LS365A
3.1–10
SN74LS540
3.1–11
SN74LS83A
3.1–9
SN74LS366A
3.1–10
SN74LS541
3.1–11
SN74LS848
3.1–18
SN74LS367A
3.1–10
SN74LS55
3.1–22
SN74LS85
3.1–14
SN74LS368A
3.1–10
SN74LS569A
3.1–14
SN74LS86
3.1–23
SN74LS37
3.1–21
SN74LS623
3.1–11
SN74LS90
3.1–15
SN74LS373
3.1–26
SN74LS640
3.1–11
SN74LS92
3.1–15
SN74LS374
3.1–20
SN74LS641
3.1–34
SN74LS93
3.1–14
SN74LS375
3.1–26
SN74LS642
3.1–34
SN74LS95B
3.1–33
SN74LS377
3.1–20
Motorola Master Selection Guide
3.1–45
TTL, ECL, CMOS and Special Logic Circuits
Ordering Information
Device Nomenclatures
LS – Low Power Schottky
SN
VV
WW
XXXX
Y
Package Type
• N for Plastic (74 Series Only)
• J for Ceramic
• D for 150 mil Plastic SOIC (74 Series Only)
• DW for 300 mil Plastic SOIC (74 Series Only)
Standard Prefix
Temperature Range
• 74 Series (0 to +70°C)
• 54 Series (–55 to +125°C)
Function Type
Family
• LS = Low Power Schottky
FAST
MC
VV
W
XXXX
Y
Package Type
• N for Plastic (74 Series Only)
• D for 150 mil Plastic SOIC (74 Series Only)
• DW for 300 mil Plastic SOIC (74 Series Only)
• SD for Plastic SSOP
Motorola
Circuit Identifier
Temperature Range
• 74 Series (0 to +70°C)
Function Type
Family
• F = FAST
MECL 10K, MECL 10H/100H
MC
WWW
XXX
Package Type
• P for Plastic
• L for Ceramic
• FN for PLCC
Motorola
Circuit Identifier
Temperature Range
• 10 = 10K (–30 to +85°C)
• 10H = 10H (0 to +75°C)
• 100H = 100K Compatible (0 to +85°C)
TTL, ECL, CMOS and Special Logic Circuits
YY
Function Type
3.1–46
Motorola Master Selection Guide
ECLinPS, ECLinPS Lite
MC
WWW
XXX
YYY
ZZ
Package Type
• FN = PLCC
• D = Plastic SOIC
• L = Ceramic DIP
• P = Plastic DIP
Motorola
Circuit Identifier
• MC = Fully Qualified Circuit
• XC = Non Reliability Qualified
Function Type
• YYY = 3–Digits for ECLinPS
• YY= 2–Digits for ECLinPS Lite
Compatibility Identifier
• 10 = 10H Compatible (0 to +85°C)
• 100 = 100K Compatible (0 to +85°C)
ECLinPS Family Identifier
• E = ECLinPS
• EL = ECLinPS Lite
• ELT = ECLinPS Lite Translator
• LVE = Low Voltage ECLinPS
• LVEL = Low Voltage ECLinPS Lite
Metal Gate 14000 Series CMOS
MC
14XXX YY
ZZ
Package and Temperature Range
• CL for Ceramic –55 to +125°C
• CP for Plastic –55 to +125°C
• D/DW for Small Outline Package (Plastic) –55 to +125°C
• DT for Plastic TSSOP
Motorola Circuit Identifier
Function Type
Identifier (per JEDEC Standard)
• B (or Blank)= Buffered Outputs
• UB = Unbuffered Outputs
High–Speed CMOS
MC
VV
WWW
XXXX
Y
Package Type
• N for Plastic (74 Series Only)
• J for Ceramic (54 Series Only)
• D for 150 mil Plastic SOIC (74 Series Only)
• DW for 300 mil Plastic SOIC (74 Series Only)
• SD for Plastic SSOP
• DT for Plastic TSSOP
Motorola
Circuit Identifier
Temperature Range
• 74 Series (–55 to +125°C)
• 54 Series (–55 to +125°C)
Function Type
• XX(X) Same Function and Pin Configuration as
LSTTL
• 4XXX Same Function and Pin Configuration as
CMOS 14000
• 7XX(X) Variation of LSTTL or CMOS 14000
Device
High–Speed CMOS
Specification Identifier
• HC = Buffered High–Speed CMOS
• HCU = Unbuffered High–Speed CMOS*
• HCT = High–Speed CMOS TTL Compatible
*Not Available On All Devices
FACT
MC
WWWWW
YY
Package Type
• N for Plastic
• D for Narrow SOIC
• DW for Wide SOIC
• SD for Plastic SSOP
• DT for Plastic TSSOP
Motorola
Circuit Identifier
Temperature Range Family
• 74AC = FACT (–40 to +85°C)
• 74ACT = TTL Compatible (–40 to +85°C)
Motorola Master Selection Guide
XXX
Function Type
3.1–47
TTL, ECL, CMOS and Special Logic Circuits
Other Logic Circuits
MC/MCCS
WWWWWW
X
YY
Motorola
Circuit Identifier
• MC = Standard Circuit Identifier
• MCCS = Circuit Chip–Set Identifier
ZZ
Package Type
• N for Plastic
• D for Narrow SOIC
• FN for PLCC
• FJ for CLCC
Function Type
Option Type
Option Suffix Indicator
MECL III/HTL/DTL
MC
XXXX
Y
Package Type
• P for Plastic
• L for Ceramic
• D for Narrow SOIC
• FN for PLCC
Motorola
Circuit Identifier
Function Type
LCX Products
MC
74
LCX
YYYYY
ZZ
Package Type
• D for Plastic Narrow JEDEC SOIC
• DW for Plastic Wide JEDEC SOIC
• M for Plastic EIAJ SOIC
• SD for Plastic SSOP
• DT for Plastic TSSOP
Motorola
Circuit Identifier
Temperature Range
• 74 = –40 to +85°C
Function Type
Family Identifier
• LCX = 5V–Tolerant Low–Voltage CMOS
LVQ Products
MC
74
LVQ
YYYY
Package Type
• D for Plastic Narrow JEDEC SOIC
• DW for Plastic Wide JEDEC SOIC
• M for Plastic EIAJ SOIC
• SD for Plastic SSOP
• DT for Plastic TSSOP
Motorola
Circuit Identifier
Temperature Range
• 74 = –40 to +85°C
Function Type
Family Identifier
• LVQ =Low–Voltage Quiet CMOS
TTL, ECL, CMOS and Special Logic Circuits
ZZ
3.1–48
Motorola Master Selection Guide
Motorola Programmable Arrays (MPA)
FPGA Nomenclature
MPA1 XXX YY Z I
Temperature Grade
• Blank = Commercial
• I = Industrial
Motorola
Programmable Array
(First Series)
Circuit Identifier
Speed Grade
Package Type
• FN = 84 PLCC
• DD = 128 PQFP
• DH = 160 PQFP
• DK = 208 PQFP
• HI = 181 CPGA
• KE = 224 CPGA
• HV = 299 CPGA
• BG = 256 PBGA
Number of Core Cells
Physical Number of Cells in 100’s
• 016 = 1,600 Cells
• 036 = 3,600 Cells
• 064 = 6,400 Cells
• 100 = 10,000 Cells
EPROM/EEPROM Nomenclature
MPA17 C XXX YY I
Temperature Grade
• Blank = Commercial
• I = Industrial
Motorola
EPROM/EEPROM
Circuit Identifier
PROM Type
• Blank = EPROM
• C = EEPROM
Package Type
• D = SOIC
• P = PDIP
• FN = PLCC
Number of Memory
Bits (in K)
Motorola Master Selection Guide
3.1–49
TTL, ECL, CMOS and Special Logic Circuits
Case Outlines
8–Pin Packages
P SUFFIX
PLASTIC DIP PACKAGE
CASE 626–05
ISSUE K
8
5
–B–
1
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4
F
–A–
NOTE 2
L
DIM
A
B
C
D
F
G
H
J
K
L
M
N
C
J
–T–
N
SEATING
PLANE
D
M
K
G
H
0.13 (0.005)
T A
M
M
B
M
MILLIMETERS
MIN
MAX
9.40
10.16
6.10
6.60
3.94
4.45
0.38
0.51
1.02
1.78
2.54 BSC
0.76
1.27
0.20
0.30
2.92
3.43
7.62 BSC
–––
10_
0.76
1.01
INCHES
MIN
MAX
0.370
0.400
0.240
0.260
0.155
0.175
0.015
0.020
0.040
0.070
0.100 BSC
0.030
0.050
0.008
0.012
0.115
0.135
0.300 BSC
–––
10_
0.030
0.040
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751–05
ISSUE S
D
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
C
8
5
0.25
H
E
M
B
M
1
4
h
B
e
X 45 _
q
A
C
SEATING
PLANE
L
0.10
A1
B
0.25
M
C B
S
A
TTL, ECL, CMOS and Special Logic Circuits
S
DIM
A
A1
B
C
D
E
e
H
h
L
q
3.1–50
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.35
0.49
0.18
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
Motorola Master Selection Guide
8–Pin Packages
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940–03
ISSUE B
8X
K REF
0.12 (0.005)
0.25 (0.010)
T U
M
S
V
N
S
M
8
L/2
N
5
F
B
L
DETAIL E
PIN 1
IDENT
1
ÇÇÇÇ
ÉÉÉ
ÇÇÇÇ
ÉÉÉ
ÇÇÇÇ
4
K
–U–
A
–V–
0.20 (0.008)
M
T U
J
J1
K1
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13 (0.005)
TOTAL IN EXCESS OF K DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K
BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
SECTION N–N
0.076 (0.003)
–T–
SEATING
PLANE
–W–
C
D
DETAIL E
H
G
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
2.87
3.13
5.20
5.38
1.73
1.99
0.05
0.21
0.63
0.95
0.65 BSC
0.44
0.60
0.09
0.20
0.09
0.16
0.25
0.38
0.25
0.33
7.65
7.90
0_
8_
INCHES
MIN
MAX
0.113
0.123
0.205
0.212
0.068
0.078
0.002
0.008
0.024
0.037
0.026 BSC
0.017
0.023
0.003
0.008
0.003
0.006
0.010
0.015
0.010
0.013
0.301
0.311
0_
8_
14–Pin Packages
L,J SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
–A–
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
9
–B–
1
7
C
–T–
L
K
SEATING
PLANE
F
G
D
N
M
J
14 PL
0.25 (0.010)
Motorola Master Selection Guide
M
T A
S
14 PL
0.25 (0.010)
3.1–51
M
T B
S
DIM
A
B
C
D
F
G
J
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.245
0.280
0.155
0.200
0.015
0.020
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.94
6.23
7.11
3.94
5.08
0.39
0.50
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15_
0.51
1.01
TTL, ECL, CMOS and Special Logic Circuits
14–Pin Packages
P,N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE M
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
5. ROUNDED CORNERS OPTIONAL.
8
B
1
7
A
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
N
C
–T–
SEATING
PLANE
J
K
H
D 14 PL
G
M
0.13 (0.005)
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.290
0.310
–––
10_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
18.80
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.37
7.87
–––
10_
0.38
1.01
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
14
8
–B–
1
P 7 PL
0.25 (0.010)
7
G
B
M
M
R X 45 _
C
F
–T–
SEATING
PLANE
D 14 PL
0.25 (0.010)
M
K
M
T B
TTL, ECL, CMOS and Special Logic Circuits
S
A
S
3.1–52
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.228
0.244
0.010
0.019
Motorola Master Selection Guide
14–Pin Packages
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL
CONDITION. DAMBAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN PROTRUSIONS AND
ADJACENT LEAD TO BE 0.46 ( 0.018).
LE
8
Q1
M_
E HE
L
7
1
DETAIL P
Z
D
A
e
DIM
A
A1
b
c
D
E
e
HE
0.50
LE
M
Q1
Z
VIEW P
c
A1
b
0.13 (0.005)
M
0.10 (0.004)
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
1.42
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.056
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940A–03
ISSUE B
14X
K REF
0.12 (0.005)
T U
M
S
V
S
0.25 (0.010)
N
14
L/2
8
M
B
L
N
F
PIN 1
IDENT
1
7
DETAIL E
–U–
A
–V–
0.20 (0.008)
M
T U
K
J
S
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
J1
K1
SECTION N–N
0.076 (0.003)
–T–
SEATING
PLANE
–W–
C
D
G
H
Motorola Master Selection Guide
DETAIL E
3.1–53
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13 (0.005)
TOTAL IN EXCESS OF K DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K
BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
6.07
6.33
5.20
5.38
1.73
1.99
0.05
0.21
0.63
0.95
0.65 BSC
1.08
1.22
0.09
0.20
0.09
0.16
0.25
0.38
0.25
0.33
7.65
7.90
0_
8_
INCHES
MIN
MAX
0.238
0.249
0.205
0.212
0.068
0.078
0.002
0.008
0.024
0.037
0.026 BSC
0.042
0.048
0.003
0.008
0.003
0.006
0.010
0.015
0.010
0.013
0.301
0.311
0_
8_
TTL, ECL, CMOS and Special Logic Circuits
14–Pin Packages
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
14X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
S
N
2X
14
L/2
0.25 (0.010)
8
M
B
–U–
L
PIN 1
IDENT.
F
7
1
0.15 (0.006) T U
N
S
DETAIL E
K
A
–V–
ÇÇÇ
ÉÉ
ÇÇÇ
ÉÉ
K1
J J1
SECTION N–N
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
H
G
D
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
DETAIL E
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.020
0.024
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
16–Pin Packages
L,J SUFFIX
CERAMIC DIP PACKAGE
CASE 620–10
ISSUE V
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
L
–T–
K
N
SEATING
PLANE
M
E
F
J
G
D
0.25 (0.010)
16 PL
0.25 (0.010)
16 PL
M
T A
TTL, ECL, CMOS and Special Logic Circuits
S
3.1–54
M
T B
S
DIM
A
B
C
D
E
F
G
H
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.240
0.295
–––
0.200
0.015
0.020
0.050 BSC
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.93
6.10
7.49
–––
5.08
0.39
0.50
1.27 BSC
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15 _
0.51
1.01
Motorola Master Selection Guide
16–Pin Packages
P,N SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
16
9
1
8
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
SEATING
PLANE
–T–
K
H
G
D
M
J
16 PL
0.25 (0.010)
T A
M
M
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
B
M
S
G
R
K
F
X 45 _
C
–T–
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
Motorola Master Selection Guide
M
T B
S
A
S
3.1–55
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
TTL, ECL, CMOS and Special Logic Circuits
16–Pin Packages
DW SUFFIX
PLASTIC WIDE SOIC PACKAGE
CASE 751G–02
ISSUE A
–A–
16
9
–B–
8X
P
0.010 (0.25)
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSIOM D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
B
M
M
8
16X
J
D
0.010 (0.25)
T A
M
B
S
S
F
DIM
A
B
C
D
F
G
J
K
M
P
R
R X 45 _
C
–T–
14X
G
K
M
SEATING
PLANE
MILLIMETERS
MIN
MAX
10.15
10.45
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.400
0.411
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 966–01
ISSUE O
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL
CONDITION. DAMBAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN PROTRUSIONS AND
ADJACENT LEAD TO BE 0.46 ( 0.018).
LE
9
Q1
M_
E HE
1
L
8
DETAIL P
Z
D
e
VIEW P
A
A1
b
0.13 (0.005)
c
M
TTL, ECL, CMOS and Special Logic Circuits
0.10 (0.004)
3.1–56
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
0.78
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.031
Motorola Master Selection Guide
16–Pin Packages
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940B–03
ISSUE B
16X
K REF
0.12 (0.005)
T U
M
S
V
S
0.25 (0.010)
N
16
L/2
9
M
N
B
L
F
PIN 1
IDENT
1
8
DETAIL E
ÉÉÉÉ
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
K
–U–
A
–V–
0.20 (0.008)
M
J
T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE
BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.15 (0.006) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF K
DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K BY MORE
THAN 0.07 (0.002) AT LEAST MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM
PLANE –W–.
J1
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
K1
S
SECTION N–N
–T–
–W–
C
0.076 (0.003)
SEATING
PLANE
D
G
DETAIL E
H
MILLIMETERS
MIN
MAX
6.07
6.33
5.20
5.38
1.73
1.99
0.05
0.21
0.63
0.95
0.65 BSC
0.73
0.90
0.09
0.20
0.09
0.16
0.25
0.38
0.25
0.33
7.65
7.90
0_
8_
INCHES
MIN
MAX
0.238
0.249
0.205
0.212
0.068
0.078
0.002
0.008
0.024
0.037
0.026 BSC
0.028
0.035
0.003
0.008
0.003
0.006
0.010
0.015
0.010
0.013
0.301
0.311
0_
8_
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F–01
ISSUE O
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
S
V
S
ÇÇ
ÉÉ
ÇÇ
ÉÉ
ÇÇ
S
K
K1
2X
L/2
16
9
J1
B
–U–
L
PIN 1
IDENT.
SECTION N–N
J
N
8
1
0.25 (0.010)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE
ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE –W–.
M
0.15 (0.006) T U
S
A
–V–
N
F
DETAIL E
–W–
C
0.10 (0.004)
–T– SEATING
PLANE
H
D
Motorola Master Selection Guide
DETAIL E
G
3.1–57
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.007
0.011
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
TTL, ECL, CMOS and Special Logic Circuits
18–Pin Packages
L,J SUFFIX
CERAMIC DIP PACKAGE
CASE 726–04
ISSUE G
–A–
18
10
1
9
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F FOR FULL LEADS. HALF
LEADS OPTIONAL AT LEAD POSITIONS 1,
9, 10, AND 18.
–B–
OPTIONAL LEAD
CONFIGURATION (1, 9, 10, 18)
L
C
N
–T–
SEATING
PLANE
K
F
M
G
D 18 PL
0.25 (0.010)
J
M
T A
18 PL
0.25 (0.010)
S
M
T B
S
DIM
A
B
C
D
F
G
J
K
L
M
N
INCHES
MIN
MAX
0.880
0.910
0.240
0.295
–––
0.200
0.015
0.021
0.055
0.070
0.100 BSC
0.008
0.012
0.125
0.170
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
22.35
23.11
6.10
7.49
–––
5.08
0.38
0.53
1.40
1.78
2.54 BSC
0.20
0.30
3.18
4.32
7.62 BSC
0_
15_
0.51
1.02
P,N SUFFIX
PLASTIC DIP PACKAGE
CASE 707–02
ISSUE C
18
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
10
B
9
1
A
L
C
N
F
H
D
G
SEATING
PLANE
TTL, ECL, CMOS and Special Logic Circuits
K
M
3.1–58
J
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MILLIMETERS
MIN
MAX
22.22
23.24
6.10
6.60
3.56
4.57
0.36
0.56
1.27
1.78
2.54 BSC
1.02
1.52
0.20
0.30
2.92
3.43
7.62 BSC
0_
15_
0.51
1.02
INCHES
MIN
MAX
0.875
0.915
0.240
0.260
0.140
0.180
0.014
0.022
0.050
0.070
0.100 BSC
0.040
0.060
0.008
0.012
0.115
0.135
0.300 BSC
0_
15 _
0.020
0.040
Motorola Master Selection Guide
20–Pin Packages
L,J SUFFIX
CERAMIC DIP PACKAGE
CASE 732–03
ISSUE E
20
11
1
10
NOTES:
1. LEADS WITHIN 0.25 (0.010) DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
B
A
L
C
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
N
H
G
D
J
K
M
SEATING
PLANE
20
11
1
10
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
B
C
–T–
K
SEATING
PLANE
M
N
E
F
J
D
20 PL
0.25 (0.010)
20 PL
0.25 (0.010)
M
T A
–A–
20
11
–B–
10X
P
0.010 (0.25)
M
B
M
10
20X
T B
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
0.010 (0.25)
M
T A
B
S
S
F
R X 45 _
C
–T–
G
Motorola Master Selection Guide
K
SEATING
PLANE
M
3.1–59
INCHES
MIN
MAX
1.010
1.070
0.240
0.260
0.150
0.180
0.015
0.022
0.050 BSC
0.050
0.070
0.100 BSC
0.008
0.015
0.110
0.140
0.300 BSC
0_
15 _
0.020
0.040
MILLIMETERS
MIN
MAX
25.66
27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
J
D
18X
M
M
DW SUFFIX
PLASTIC WIDE SOIC PACKAGE
CASE 751D–04
ISSUE E
1
INCHES
MIN
MAX
0.940
0.990
0.260
0.295
0.150
0.200
0.015
0.022
0.055
0.065
0.100 BSC
0.020
0.050
0.008
0.012
0.125
0.160
0.300 BSC
0_
15_
0.010
0.040
P,N SUFFIX
PLASTICC DIP PACKAGE
CASE 738–03
ISSUE E
–A–
G
MILLIMETERS
MIN
MAX
23.88
25.15
6.60
7.49
3.81
5.08
0.38
0.56
1.40
1.65
2.54 BSC
0.51
1.27
0.20
0.30
3.18
4.06
7.62 BSC
0_
15 _
0.25
1.02
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
12.65
12.95
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.499
0.510
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.010
0.012
0.004
0.009
0_
7_
0.395
0.415
0.010
0.029
TTL, ECL, CMOS and Special Logic Circuits
20–Pin Packages
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 967–01
ISSUE O
20
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL
CONDITION. DAMBAR CANNOT BE LOCATED ON
THE LOWER RADIUS OR THE FOOT. MINIMUM
SPACE BETWEEN PROTRUSIONS AND
ADJACENT LEAD TO BE 0.46 ( 0.018).
LE
11
Q1
M_
E HE
1
L
10
DETAIL P
Z
D
VIEW P
e
A
c
A1
b
0.13 (0.005)
0.10 (0.004)
M
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
12.35
12.80
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
0.81
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.486
0.504
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.032
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940C–03
ISSUE B
20X
K REF
0.12 (0.005)
M
T U
S
V
S
0.25 (0.010)
N
L/2
20
11
M
B
L
PIN 1
IDENT
1
N
F
10
DETAIL E
–U–
A
–V–
0.20 (0.008)
M
T U
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
K
J
S
J1
K1
SECTION N–N
0.076 (0.003)
–T–
SEATING
PLANE
–W–
C
D
G
H
TTL, ECL, CMOS and Special Logic Circuits
DETAIL E
3.1–60
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13 (0.005)
TOTAL IN EXCESS OF K DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K
BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
7.07
7.33
5.20
5.38
1.73
1.99
0.05
0.21
0.63
0.95
0.65 BSC
0.59
0.75
0.09
0.20
0.09
0.16
0.25
0.38
0.25
0.33
7.65
7.90
0_
8_
INCHES
MIN
MAX
0.278
0.288
0.205
0.212
0.068
0.078
0.002
0.008
0.024
0.037
0.026 BSC
0.023
0.030
0.003
0.008
0.003
0.006
0.010
0.015
0.010
0.013
0.301
0.311
0_
8_
Motorola Master Selection Guide
20–Pin Packages
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948E–02
ISSUE A
20X
0.15 (0.006) T U
K REF
0.10 (0.004)
S
M
T U
S
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED 0.25
(0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
ÍÍÍ
ÍÍÍ
ÍÍÍ
K
K1
2X
L/2
20
11
B
L
J J1
–U–
PIN 1
IDENT
SECTION N–N
1
10
0.25 (0.010)
N
0.15 (0.006) T U
S
M
A
–V–
N
F
DETAIL E
–W–
C
D
0.100 (0.004)
–T– SEATING
G
H
DETAIL E
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
6.40
6.60
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.252
0.260
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
PLANE
Motorola Master Selection Guide
3.1–61
TTL, ECL, CMOS and Special Logic Circuits
20–Pin Packages
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
0.007 (0.180) M T L–M
B
Y BRK
–N–
U
N
S
0.007 (0.180) M T L–M
S
S
N
S
D
–L–
–M–
Z
W
20
D
1
V
0.010 (0.250)
G1
X
S
T L–M
S
N
S
VIEW D–D
A
0.007 (0.180) M T L–M
S
N
S
R
0.007 (0.180) M T L–M
S
N
S
Z
C
–T–
SEATING
PLANE
F
VIEW S
G1
0.010 (0.250) S T L–M
N
S
K
0.004 (0.100)
J
S
K1
E
G
0.007 (0.180) M T L–M
H
0.007 (0.180)
M
T L–M
S
N
S
VIEW S
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
TTL, ECL, CMOS and Special Logic Circuits
3.1–62
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.310
0.330
0.040
–––
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
7.88
8.38
1.02
–––
Motorola Master Selection Guide
24–Pin Packages
J SUFFIX
CERAMIC DIP PACKAGE
CASE 758–02
ISSUE A
B
24
13
1
12
L
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
J
–A–
N
C
K
–T–
SEATING
PLANE
G
DIM
A
B
C
D
F
G
J
K
L
N
P
INCHES
MIN
MAX
1.240
1.285
0.285
0.305
0.160
0.200
0.015
0.021
0.045
0.062
0.100 BSC
0.008
0.013
0.100
0.165
0.300
0.310
0.020
0.050
0.360
0.400
MILLIMETERS
MIN
MAX
31.50
32.64
7.24
7.75
4.07
5.08
0.38
0.53
1.14
1.57
2.54 BSC
0.20
0.33
2.54
4.19
7.62
7.87
0.51
1.27
9.14
10.16
F
D 24 PL
0.25 (0.010)
M
T A
M
L,J,JW SUFFIX
CERAMIC DIP PACKAGE
CASE 623–05
ISSUE M
24
NOTES:
1. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
2. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION (WHEN FORMED
PARALLEL).
13
B
1
12
A
F
C
SEATING
PLANE
L
G
Motorola Master Selection Guide
D
N
K
M
3.1–63
J
DIM
A
B
C
D
F
G
J
K
L
M
N
MILLIMETERS
MIN
MAX
31.24
32.77
12.70
15.49
4.06
5.59
0.41
0.51
1.27
1.52
2.54 BSC
0.20
0.30
3.18
4.06
15.24 BSC
0_
15 _
0.51
1.27
INCHES
MIN
MAX
1.230
1.290
0.500
0.610
0.160
0.220
0.016
0.020
0.050
0.060
0.100 BSC
0.008
0.012
0.125
0.160
0.600 BSC
0_
15_
0.020
0.050
TTL, ECL, CMOS and Special Logic Circuits
24–Pin Packages
N SUFFIX
PLASTIC DIP PACKAGE
CASE 709–02
ISSUE C
24
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO
SEATING PLANE AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
13
B
1
12
A
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
C
N
K
H
F
M
SEATING
PLANE
D
G
J
24
13
1
12
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
–B–
L
C
–T–
NOTE 1
K
N
E
G
M
J
F
D
24 PL
0.25 (0.010)
24 PL
0.25 (0.010)
P
M
T A
M
M
P,N,PW SUFFIX
PLASTIC DIP PACKAGE
CASE 649–03
ISSUE D
A
13
24
Q
T B
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
1
12
H
F
C
L
N
K
D
SEATING
PLANE
TTL, ECL, CMOS and Special Logic Circuits
J
3.1–64
M
INCHES
MIN
MAX
1.230
1.265
0.250
0.270
0.145
0.175
0.015
0.020
0.050 BSC
0.040
0.060
0.100 BSC
0.007
0.012
0.110
0.140
0.300 BSC
0_
15_
0.020
0.040
MILLIMETERS
MIN
MAX
31.25
32.13
6.35
6.85
3.69
4.44
0.38
0.51
1.27 BSC
1.02
1.52
2.54 BSC
0.18
0.30
2.80
3.55
7.62 BSC
0_
15_
0.51
1.01
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
B
G
INCHES
MIN
MAX
1.235
1.265
0.540
0.560
0.155
0.200
0.014
0.022
0.040
0.060
0.100 BSC
0.065
0.080
0.008
0.015
0.115
0.135
0.600 BSC
0_
15_
0.020
0.040
P,N SUFFIX
PLASTIC DIP PACKAGE
CASE 724–03
ISSUE D
–A–
SEATING
PLANE
MILLIMETERS
MIN
MAX
31.37
32.13
13.72
14.22
3.94
5.08
0.36
0.56
1.02
1.52
2.54 BSC
1.65
2.03
0.20
0.38
2.92
3.43
15.24 BSC
0_
15_
0.51
1.02
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
Q
MILLIMETERS
MIN
MAX
31.50
32.13
13.21
13.72
4.70
5.21
0.38
0.51
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.30
2.92
3.43
14.99
15.49
–––
10
0.51
1.02
0.13
0.38
0.51
0.76
INCHES
MIN
MAX
1.240
1.265
0.520
0.540
0.185
0.205
0.015
0.020
0.040
0.060
0.100 BSC
0.065
0.085
0.008
0.012
0.115
0.135
0.590
0.610
–––
10 _
0.020
0.040
0.005
0.015
0.020
0.030
Motorola Master Selection Guide
24–Pin Packages
DW SUFFIX
PLASTIC WIDE SOIC PACKAGE
CASE 751E–04
ISSUE E
–A–
24
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
13
–B–
12X
P
0.010 (0.25)
1
M
B
M
12
D
24X
J
0.010 (0.25)
M
T A
S
B
S
DIM
A
B
C
D
F
G
J
K
M
P
R
F
R
X 45 _
C
–T–
M
SEATING
PLANE
22X
K
G
MILLIMETERS
MIN
MAX
15.25
15.54
7.40
7.60
2.35
2.65
0.35
0.49
0.41
0.90
1.27 BSC
0.23
0.32
0.13
0.29
0_
8_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.601
0.612
0.292
0.299
0.093
0.104
0.014
0.019
0.016
0.035
0.050 BSC
0.009
0.013
0.005
0.011
0_
8_
0.395
0.415
0.010
0.029
SD SUFFIX
PLASTIC SSOP PACKAGE
CASE 940D–03
ISSUE B
24X
K REF
0.12 (0.005)
M
T U
S
V
S
ÉÉÉÉ
ÇÇÇÇ
ÇÇÇÇ
ÉÉÉÉ
K
L/2
24
J
13
K1
B
L
J1
SECTION N–N
PIN 1
IDENT
1
12
0.20 (0.008)
M
T U
0.25 (0.010)
–U–
A
–V–
N
M
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION/INTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13 (0.005)
TOTAL IN EXCESS OF K DIMENSION AT
MAXIMUM MATERIAL CONDITION. DAMBAR
INTRUSION SHALL NOT REDUCE DIMENSION K
BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
N
F
DETAIL E
0.076 (0.003)
–T–
SEATING
PLANE
–W–
C
D
G
H
Motorola Master Selection Guide
DETAIL E
3.1–65
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
8.07
8.33
5.20
5.38
1.73
1.99
0.05
0.21
0.63
0.95
0.65 BSC
0.44
0.60
0.09
0.20
0.09
0.16
0.25
0.38
0.25
0.33
7.65
7.90
0_
8_
INCHES
MIN
MAX
0.317
0.328
0.205
0.212
0.068
0.078
0.002
0.008
0.024
0.037
0.026 BSC
0.017
0.024
0.003
0.008
0.003
0.006
0.010
0.015
0.010
0.013
0.301
0.311
0_
8_
TTL, ECL, CMOS and Special Logic Circuits
24–Pin Packages
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948H–01
ISSUE O
24X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
2X
24
L/2
B
–U–
L
PIN 1
IDENT.
12
1
0.15 (0.006) T U
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
13
S
A
–V–
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
C
0.10 (0.004)
–T– SEATING
PLANE
G
D
H
–W–
MILLIMETERS
MIN
MAX
7.70
7.90
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.27
0.37
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.303
0.311
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.011
0.015
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
DETAIL E
N
ÇÇÇ
ÉÉ
ÇÇÇ
ÉÉ
ÇÇÇ
ÉÉ
0.25 (0.010)
K
K1
J1
M
N
F
SECTION N–N
J
TTL, ECL, CMOS and Special Logic Circuits
DETAIL E
3.1–66
Motorola Master Selection Guide
28–Pin Packages
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180)
B
M
T L–M
N
S
T L–M
S
S
Y BRK
–N–
0.007 (0.180)
U
M
N
S
D
Z
–M–
–L–
W
28
D
X
G1
0.010 (0.250)
T L–M
S
N
S
S
V
1
VIEW D–D
A
0.007 (0.180)
R
0.007 (0.180)
M
T L–M
S
N
S
C
M
T L–M
S
N
0.007 (0.180)
H
Z
M
T L–M
N
S
S
S
K1
E
0.004 (0.100)
G
J
S
SEATING
PLANE
K
F
VIEW S
G1
0.010 (0.250)
–T–
T L–M
S
N
S
M
T L–M
S
N
S
VIEW S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
Motorola Master Selection Guide
0.007 (0.180)
3.1–67
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485
0.495
0.485
0.495
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.450
0.456
0.450
0.456
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10_
0.410
0.430
0.040
–––
MILLIMETERS
MIN
MAX
12.32
12.57
12.32
12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10_
10.42
10.92
1.02
–––
TTL, ECL, CMOS and Special Logic Circuits
32–Pin Package
A
–T–, –U–, –Z–
FA SUFFIX
PLASTIC TQFP PACKAGE
CASE 873A–02
ISSUE A
4X
A1
32
0.20 (0.008) AB T–U Z
25
1
–U–
–T–
B
V
AE
P
B1
DETAIL Y
17
8
V1
AE
DETAIL Y
9
4X
–Z–
9
0.20 (0.008) AC T–U Z
S1
S
DETAIL AD
G
–AB–
BASE
METAL
ÉÉ
ÉÉ
ÉÉ
N
F
8X
M_
R
D
J
M
0.10 (0.004) AC
AC T–U Z
–AC–
0.20 (0.008)
SEATING
PLANE
SECTION AE–AE
W
K
X
DETAIL AD
TTL, ECL, CMOS and Special Logic Circuits
Q_
GAUGE PLANE
H
0.250 (0.010)
C E
3.1–68
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9. EXACT SHAPE OF EACH CORNER MAY VARY
FROM DEPICTION.
DIM
A
A1
B
B1
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
V
V1
W
X
MILLIMETERS
MIN
MAX
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
1.400
1.600
0.300
0.450
1.350
1.450
0.300
0.400
0.800 BSC
0.050
0.150
0.090
0.200
0.500
0.700
12_ REF
0.090
0.160
0.400 BSC
1_
5_
0.150
0.250
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
INCHES
MIN
MAX
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.055
0.063
0.012
0.018
0.053
0.057
0.012
0.016
0.031 BSC
0.002
0.006
0.004
0.008
0.020
0.028
12_ REF
0.004
0.006
0.016 BSC
1_
5_
0.006
0.010
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
Motorola Master Selection Guide
40–Pin Packages
N SUFFIX
PLASTIC DIP PACKAGE
CASE 711–03
ISSUE C
40
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL
CONDITION, IN RELATION TO SEATING PLANE
AND EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
21
B
1
20
L
A
C
DIM
A
B
C
D
F
G
H
J
K
L
M
N
N
J
H
G
F
K
D
M
SEATING
PLANE
MILLIMETERS
MIN
MAX
51.69
52.45
13.72
14.22
3.94
5.08
0.36
0.56
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.38
2.92
3.43
15.24 BSC
0_
15_
0.51
1.02
INCHES
MIN
MAX
2.035
2.065
0.540
0.560
0.155
0.200
0.014
0.022
0.040
0.060
0.100 BSC
0.065
0.085
0.008
0.015
0.115
0.135
0.600 BSC
0_
15_
0.020
0.040
48–Pin Packages
J SUFFIX
CERAMIC DIP PACKAGE
CASE 740–03
ISSUE B
–A–
48
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
25
–B–
1
N
–T–
DIM
A
B
C
D
E
F
G
J
K
L
M
N
24
C
L
K
SEATING
PLANE
F
M
E
G
D
J
48 PL
0.25 (0.010)
Motorola Master Selection Guide
M
T A
3.1–69
MILLIMETERS
MIN
MAX
60.36
61.56
14.64
15.34
3.05
4.31
0.381
0.533
1.27 BSC
0.762
1.397
2.54 BSC
0.204
0.330
2.54
4.19
15.24 BSC
0°
10°
1.016
1.524
48 PL
0.25 (0.010)
M
INCHES
MIN
MAX
2.376
2.424
0.576
0.604
0.120
0.127
0.015
0.021
0.050 BSC
0.030
0.055
0.100 BSC
0.008
0.013
0.100
0.165
0.600 BSC
0°
10°
0.040
0.060
M
T B
M
TTL, ECL, CMOS and Special Logic Circuits
48–Pin Packages
N SUFFIX
PLASTIC DIP PACKAGE
CASE 767–02
ISSUE B
–A–
48
25
–B–
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
TIP TAPER
24
DETAIL X
C
–T–
L
K
SEATING
PLANE
F
D 32 PL
0.51 (0.020)
G
M
T A
M 48 PL
N
DETAIL X
J
48 PL
0.25 (0.010)
S
T B
M
S
INCHES
MIN
MAX
2.415
2.445
0.540
0.560
0.155
0.200
0.014
0.022
0.040
0.060
0.100 BSC
0.070 BSC
0.008
0.015
0.115
0.150
0.600 BSC
0_
15_
0.020
0.040
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MILLIMETERS
MIN
MAX
61.34
62.10
13.72
14.22
3.94
5.08
0.36
0.55
1.02
1.52
2.54 BSC
1.79 BSC
0.20
0.38
2.92
3.81
15.24 BSC
0_
15_
0.51
1.01
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 1201–01
ISSUE A
48X
K REF
0.12 (0.005)
M
T U
S
V
K
K1
S
T U
S
J J1
48
25
SECTION N–N
M
0.254 (0.010)
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
B
–U–
L
N
1
24
A
–V–
PIN 1
IDENT.
N
F
DETAIL E
D
C
TTL, ECL, CMOS and Special Logic Circuits
0.25 (0.010)
–W–
0.076 (0.003)
–T– SEATING
PLANE
M
DETAIL E
G
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
12.40
12.60
6.00
6.20
–––
1.10
0.05
0.15
0.50
0.75
0.50 BSC
0.37
–––
0.09
0.20
0.09
0.16
0.17
0.27
0.17
0.23
7.95
8.25
0_
8_
INCHES
MIN
MAX
0.488
0.496
0.236
0.244
–––
0.043
0.002
0.006
0.020
0.030
0.0197 BSC
0.015
–––
0.004
0.008
0.004
0.006
0.007
0.011
0.007
0.009
0.313
0.325
0_
8_
H
3.1–70
Motorola Master Selection Guide
52–Pin Packages
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 778–02
ISSUE C
0.007 (0.18)
B
Y BRK
–N–
U
M
T L–M
0.007 (0.18)
M
S
N
S
T L–M
N
S
S
D
Z
–M–
–L–
W
D
52
1
X
V
A
0.007 (0.18)
M
T L–M
S
N
S
R
0.007 (0.18)
M
T L–M
S
N
S
E
C
0.004 (0.100)
–T– SEATING
J
VIEW S
PLANE
G1
0.010 (0.25)
S
T L–M
S
H
N
F
S
0.007 (0.18)
M
T L–M
S
N
S
0.007 (0.18)
M
T L–M
S
N
S
VIEW S
Motorola Master Selection Guide
T L–M
S
N
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE
TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT
MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED
AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
K1
K
S
VIEW D–D
Z
G
G1
0.010 (0.25)
3.1–71
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.785
0.795
0.785
0.795
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.750
0.756
0.750
0.756
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10 _
0.710
0.730
0.040
–––
MILLIMETERS
MIN
MAX
19.94
20.19
19.94
20.19
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
19.05
19.20
19.05
19.20
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10 _
18.04
18.54
1.02
–––
TTL, ECL, CMOS and Special Logic Circuits
52–Pin Packages
FA SUFFIX
PLASTIC TQFP PACKAGE
CASE 848D–03
ISSUE D
4X
4X 13 TIPS
0.20 (0.008) H L–M N
0.20 (0.008) T L–M N
–X–
X=L, M, N
52
40
1
CL
39
AB
3X
–L–
–M–
AB
B
B1
13
V
VIEW Y
J
26
BASE METAL
F
PLATING
V1
27
14
–N–
A1
G
VIEW Y
ÇÇÇÇ
ÉÉÉÉ
ÉÉÉÉ
ÇÇÇÇ
U
0.13 (0.005)
M
D
T L–M
S
N
S
S1
SECTION AB–AB
A
ROTATED 90_ CLOCKWISE
S
4X
C
q2
0.10 (0.004) T
–H–
–T–
SEATING
PLANE
4X
q3
VIEW AA
0.05 (0.002)
S
W
2X R
q1
R1
0.25 (0.010)
C2
q
GAGE PLANE
K
C1
E
VIEW AA
TTL, ECL, CMOS and Special Logic Circuits
Z
3.1–72
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF LEAD AND IS
COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE
PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE.
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED AT DATUM
PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING
PLANE –T–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER
SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION.
DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH
TO EXCEED 0.46 (0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR PROTRUSION 0.07
(0.003).
DIM
A
A1
B
B1
C
C1
C2
D
E
F
G
J
K
R1
S
S1
U
V
V1
W
Z
θ
θ1
θ2
θ3
MILLIMETERS
MIN
MAX
10.00 BSC
5.00 BSC
10.00 BSC
5.00 BSC
–––
1.70
0.05
0.20
1.30
1.50
0.20
0.40
0.45
0.75
0.22
0.35
0.65 BSC
0.07
0.20
0.50 REF
0.08
0.20
12.00 BSC
6.00 BSC
0.09
0.16
12.00 BSC
6.00 BSC
0.20 REF
1.00 REF
0_
7_
–––
0_
12 _ REF
12 _ REF
INCHES
MIN
MAX
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
–––
0.067
0.002
0.008
0.051
0.059
0.008
0.016
0.018
0.030
0.009
0.014
0.026 BSC
0.003
0.008
0.020 REF
0.003
0.008
0.472 BSC
0.236 BSC
0.004
0.006
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
0_
7_
–––
0_
12 _ REF
12 _ REF
Motorola Master Selection Guide
56–Pin Packages
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 1202–01
ISSUE A
56X
K
K1
K REF
0.12 (0.005)
M
T U
S
V
ÇÇÇÇ
ÉÉ
ÇÇÇÇ
ÉÉ
S
T U
S
J J1
29
0.254 (0.010)
M
56
SECTION N–N
B
–U–
L
1
N
28
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSIONS A AND B ARE TO BE
DETERMINED AT DATUM PLANE –W–.
A
–V–
PIN 1
IDENT.
N
F
DETAIL E
D
C
Motorola Master Selection Guide
0.25 (0.010)
–W–
0.076 (0.003)
–T– SEATING
PLANE
M
DETAIL E
G
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
13.90
14.10
6.00
6.20
–––
1.10
0.05
0.15
0.50
0.75
0.50 BSC
0.12
–––
0.09
0.20
0.09
0.16
0.17
0.27
0.17
0.23
7.95
8.25
0_
8_
INCHES
MIN
MAX
0.547
0.555
0.236
0.244
–––
0.043
0.002
0.006
0.020
0.030
0.0197 BSC
0.005
–––
0.004
0.008
0.004
0.006
0.007
0.011
0.007
0.009
0.313
0.325
0_
8_
H
3.1–73
TTL, ECL, CMOS and Special Logic Circuits
68–Pin Package
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 779–02
ISSUE C
0.007 (0.18)
B
Y BRK
–N–
M
0.007 (0.18)
U
T L–M
M
S
N
T L–M
S
S
N
S
D
Z
–L–
–M–
W
68
X
D
1
V
Z
0.007 (0.18)
R
M
M
T L–M
T L–M
S
S
E
C
0.004 (0.10)
G
0.010 (0.25)
S
H
–T–
J
VIEW S
G1
T L–M
S
N
SEATING
PLANE
S
0.007 (0.18)
M
T L–M
S
N
S
K
0.007 (0.18)
M
T L–M
S
N
S
VIEW S
TTL, ECL, CMOS and Special Logic Circuits
N
N
S
T L–M
S
N
S
S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF
LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS
R AND U ARE DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
K1
F
S
VIEW D–D
0.007 (0.18)
A
G1
0.010 (0.25)
3.1–74
INCHES
MIN
MAX
0.985
0.995
0.985
0.995
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
–––
0.025
–––
0.950
0.956
0.950
0.956
0.042
0.048
0.042
0.048
0.042
0.056
–––
0.020
2_
10_
0.910
0.930
0.040
–––
MILLIMETERS
MIN
MAX
25.02
25.27
25.02
25.27
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
–––
0.64
–––
24.13
24.28
24.13
24.28
1.07
1.21
1.07
1.21
1.07
1.42
–––
0.50
2_
10_
23.12
23.62
1.02
–––
Motorola Master Selection Guide
Programmable Array
84–Pin Package
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 780A–01
ISSUE A
B
0.18 (0.007)
M
T N
S
–P
L
S
S
–M
S
U
0.18 (0.007)
–N–
M
T N
–P
S
S
L
S
–M
S
Y BRK
D
Z1
–L–
–M–
W
D
84
1
X
V
–P–
G1
0.25 (0.010)
M
T N
S
–P
S
L
S
–M
S
DETAIL D–D
A
0.18 (0.007)
M
T L
0.18 (0.007)
M
T L
Z
S
–M
S
N
S
–P
S
S
–M
S
N
S
–P
S
R
E
G
C
G1
0.25 (0.010)
S
T L
0.100 (0.004)
–T– SEATING
J
S
–M
H
K1
K
F
S
N
S
–P
PLANE
DETAIL S
S
0.18 (0.007)
M
T L
S
–M
S
N
S
–P
S
0.18 (0.007)
M
T N
S
–P
S
L
S
–M
S
0.18 (0.007)
M
T L
S
–M
S
N
S
–P
S
0.18 (0.007)
M
T N
S
–P
S
L
S
–M
S
NOTES:
1. DATUMS –L–, –M–, –N–, AND –P–
DETERMINED WHERE TOP OF LEAD
SHOULDER EXITS PACKAGE BODY AT GLASS
PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
GLASS PROTRUSION. ALLOWABLE GLASS
PROTRUSION IS 0.25 (0.010) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
INCHES
MILLIMETERS
DIM MIN
MAX
MIN
MAX
A
1.185
1.195
30.10
30.35
B
1.185
1.195
30.10
30.35
C
0.165
0.180
4.20
4.57
E
0.090
0.110
2.29
2.79
F
0.013
0.021
0.33
0.53
G
0.050 BSC
1.27 BSC
H
0.026
0.032
0.66
0.81
J
0.020
–––
0.51
–––
K
0.025
–––
0.64
–––
R
1.150
1.156
29.21
29.36
U
1.150
1.156
29.21
29.36
V
0.042
0.048
1.07
1.21
W
0.042
0.048
1.07
1.21
X
0.042
0.056
1.07
1.42
Y
–––
0.020
–––
0.50
Z
2_
10_
2_
10_
G1 1.110
1.130
28.20
28.70
K1 0.040
–––
1.02
–––
Z1
2_
10_
2_
10_
DETAIL S
Motorola Master Selection Guide
3.1–75
TTL, ECL, CMOS and Special Logic Circuits
Programmable Array
128–Pin Package
DD SUFFIX
PLASTIC QFP PACKAGE
CASE 862A–02
ISSUE B
L
Y
96
65
97
DETAIL A
C A–B
33
1
32
–D–
A
0.20 (0.008)
M
H A–B
S
D
S
S
D
S
0.05 (0.002) A–B
S
0.20 (0.008)
M
C A–B
M
DETAIL C
–H–
C E
–C–
DATUM
PLANE
0.10 (0.004)
G
SEATING
PLANE
DETAIL B
M
H
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
W
F
J
U
DATUM
PLANE
N
M
C A–B
T
R
BASE
METAL
D
0.20 (0.008)
–H–
S
D
K
S
DETAIL B
TTL, ECL, CMOS and Special Logic Circuits
X
DETAIL C
3.1–76
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D–TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT BE
LOCATED ON THE LOWER RADIUS OF THE
FOOT.
Z
128
–A–, –B–, –D–
M
V
0.20 (0.008)
0.20 (0.008)
M
B
0.05 (0.002) D
–B–
L
S
S
H A–B
–A–
P
D
D
S
S
64
Q
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
MILLIMETERS
MIN
MAX
27.90
28.10
27.90
28.10
–––
4.07
0.30
0.45
3.17
3.67
0.30
0.40
0.80 BSC
0.25
0.35
0.13
0.23
0.65
0.95
24.80 REF
5_
16 _
0.13
0.17
0.40 BSC
0_
7_
0.13
0.30
30.95
31.45
0.13
–––
0_
–––
30.95
31.45
0.40
–––
1.60 REF
1.60 REF
1.60 REF
INCHES
MIN
MAX
1.098
1.106
1.098
1.106
–––
0.160
0.012
0.018
0.125
0.144
0.012
0.016
0.032 BSC
0.010
0.014
0.005
0.009
0.026
0.037
0.976 REF
5_
16 _
0.005
0.007
0.016 BSC
0_
7_
0.005
0.012
1.219
1.238
0.005
–––
0_
–––
1.219
1.238
0.016
–––
0.063 REF
0.063 REF
0.063 REF
Motorola Master Selection Guide
Programmable Array
160–Pin Package
DH SUFFIX
PLASTIC QFP PACKAGE
CASE 864A–03
ISSUE C
Y
L
120
81
121
S
S
D
C A–B
S
–A–, –B–, –D–
B
B
M
V
0.20 (0.008)
M
B
L
0.20 (0.008)
–B–
–A–
0.20 (0.008) A–B
H A–B
S
D
80
P
DETAIL A
G
DETAIL A
41
160
Z
1
40
–D–
A
0.20 (0.008)
M
H A–B
S
D
0.20 (0.008) A–B
N
S
0.20 (0.008)
M
C A–B
S
D
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇ
BASE
METAL
S
S
J
F
DETAIL C
D
–H–
0.13 (0.005)
M
C A–B
S
D
S
SECTION B–B
M_
TOP &
BOTTOM
U_
C
E
T
–H–
R
Q_
W
–C–
SEATING
PLANE
K
H
X
0.10 (0.004)
DETAIL C
Motorola Master Selection Guide
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT BE
LOCATED ON THE LOWER RADIUS OR THE FOOT.
3.1–77
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
MILLIMETERS
MIN
MAX
27.90
28.10
27.90
28.10
3.35
3.85
0.22
0.38
3.20
3.50
0.22
0.33
0.65 BSC
0.25
0.35
0.11
0.23
0.70
0.90
25.35 REF
5_
16_
0.11
0.19
0.325 BSC
0_
7_
0.13
0.30
31.00
31.40
0.13
–––
0_
–––
31.00
31.40
0.40
–––
1.60 REF
1.33 REF
1.33 REF
INCHES
MIN
MAX
1.098
1.106
1.098
1.106
0.132
0.152
0.009
0.015
0.126
0.138
0.009
0.013
0.026 REF
0.010
0.014
0.004
0.009
0.028
0.035
0.998 REF
5_
16_
0.004
0.007
0.013 BSC
0_
7_
0.005
0.012
1.220
1.236
0.005
–––
0_
–––
1.220
1.236
0.016
–––
0.063 REF
0.052 REF
0.052 REF
TTL, ECL, CMOS and Special Logic Circuits
Programmable Array
181–Pin Package
HI SUFFIX
CERAMIC PGA PACKAGE
CASE 768N–01
ISSUE O
K
A
PIN 1 INDENTIFICATION
C
G
F
B
M
TTL, ECL, CMOS and Special Logic Circuits
G
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
N
L
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
DIM
A
B
C
D
F
G
K
L
M
N
INCHES
MIN
MAX
1.555
1.595
1.555
1.595
0.102
0.124
0.016
0.020
0.040
0.060
0.100 BSC
0.110
0.150
0.043
0.057
0.655
0.675
0.090
0.110
MILLIMETERS
MIN
MAX
39.50
40.51
39.50
40.51
2.59
3.15
0.41
0.51
1.02
1.52
2.54 BSC
2.79
3.81
1.09
1.45
16.64
17.15
2.29
2.79
D 181 PL
–T–
0.030 (0.76)
M
T A
0.015 (0.38)
M
T
3.1–78
S
B
S
Motorola Master Selection Guide
Programmable Array
208–Pin Package
DK SUFFIX
PLASTIC QFP PACKAGE
CASE 872A–01
ISSUE O
L
Y
156
105
157
0.20 (0.008)
–B–
DETAIL A
S
D
S
53
208
1
Z
52
–D–
A
0.20 (0.008)
H A–B
M
D
S
S
0.05 (0.002) A–B
S
0.20 (0.008)
M
C A–B
S
D
S
DETAIL C
M
E
C
–H–
–C–
SEATING
PLANE
DATUM
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED
AT DATUM PLANE –H–.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.38 (0.015).
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
MILLIMETERS
MIN
MAX
27.90
28.10
27.90
28.10
3.45
4.10
0.14
0.30
3.20
3.60
0.14
0.26
0.50 BSC
0.25
0.35
0.09
0.20
0.70
0.90
25.50 REF
5_
9_
0.09
0.18
0.25 BSC
0_
7_
0.13
0.30
31.00
31.40
0.13
–––
0_
–––
31.00
31.40
0.40
–––
1.60 REF
1.25 REF
1.25 REF
INCHES
MIN
MAX
1.098
1.106
1.098
1.106
0.136
0.161
0.005
0.012
1.126
0.142
0.005
0.010
0.020 BSC
0.010
0.014
0.003
0.008
0.027
0.036
1.004 REF
5_
9_
0.003
0.007
0.010 BSC
0_
7_
0.005
0.012
1.220
1.236
0.005
–––
0_
–––
1.220
1.236
0.016
–––
0.063 REF
0.049 REF
0.049 REF
0.10 (0.004)
G
H
C A–B
M
V
0.20 (0.008)
M
B
0.05 (0.002) A–B
–A–
L
H A–B
S
D
S
104
DETAIL B
M
U
T
BASE METAL
P
ÇÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇÇ
ÉÉÉÉ
ÇÇÇÇÇ
ÉÉÉÉ
F
J
–H–
R
DATUM
PLANE
N
B
D
–A–, –B–, –D–
DETAIL A
Motorola Master Selection Guide
0.06 (0.002)
M
C A–B
S
D
S
W
B
K
DETAIL B
SECTION B–B
ROTATED 7 _ CCW
3.1–79
Q
X
DETAIL C
TTL, ECL, CMOS and Special Logic Circuits
Programmable Array
224–Pin Package
KE SUFFIX
PIN GRID ARRAY PACKAGE
CASE 860F–01
ISSUE O
C
16X 0.100
A
B
0.080 MAX
Q
E
16X 0.100
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
0.080 MAX
SEATING
PLANE
17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
D
A
L
224X
0.008 C
0.020
0.016
0.030
M
C A
0.010
M
C
M
B
M
NOTES:
1. DIMENSIONS ARE IN INCHES.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. MINIMUM SPACING BETWEEN CONDUCTORS
SHALL BE 0.020.
DIM
A
D
E
L
Q
TTL, ECL, CMOS and Special Logic Circuits
3.1–80
INCHES
MIN
MAX
0.070
0.145
1.740
1.780
1.740
1.780
0.100
0.200
0.045
0.075
Motorola Master Selection Guide
Programmable Array
256–Pin Package
BG SUFFIX
PLASTIC BGA PACKAGE
CASE 1208A–01
ISSUE O
X
DETAIL K
D
M
F
E
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
G
DIM
A
A1
A2
A3
b
D
E
F
G
e
S
M
Y
MILLIMETERS
MIN
MAX
1.92
2.32
0.50
0.70
0.36 REF
1.12
1.22
0.60
0.90
27.00 BSC
27.00 BSC
24.00
24.70
24.00
24.70
1.27 BSC
0.635 BSC
0.20
S
20X
e
3
256X
A3
A1
0.35 Z
A2
20X
S
e
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
A
21 20 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Z
0.15 Z
4
DETAIL K
ROTATED 90 _CLOCKWISE
b
VIEW M–M
0.25 Z X Y
Motorola Master Selection Guide
3.1–81
TTL, ECL, CMOS and Special Logic Circuits
Programmable Array
299–Pin Package
HV SUFFIX
PIN GRID ARRAY PACKAGE
CASE 861B–01
ISSUE O
C
16X 0.100
A
B
0.080 MAX
Q
E
D
16X 0.100
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
0.080 MAX
SEATING
PLANE
20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
L
224X
0.008 C
0.020
0.016
0.030
M
C A
0.010
M
C
M
B
M
NOTES:
1. DIMENSIONS ARE IN INCHES.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. MINIMUM SPACING BETWEEN CONDUCTORS
SHALL BE 0.020.
DIM
A
D
E
L
Q
S
TTL, ECL, CMOS and Special Logic Circuits
3.1–82
INCHES
MIN
MAX
0.070
0.145
2.040
2.080
2.040
2.080
0.100
0.200
0.045
0.075
0.050 BSC
Motorola Master Selection Guide
Packaging Information
Surface Mount
stacked closer together and utilize less total volume than
insertion populated PC boards.
Printed circuit costs are lowered with the reduction of the
number of board layers required. The elimination or reduction
of the number of plated through holes in the board, contributes
significantly to lower PC board prices.
Automatic placement equipment is available that can place
Surface Mount components at the rate of a few thousand per
hour to hundreds of thousands of components per hour.
Surface Mount Technology is cost effective, allowing the
manufacturer the opportunity to produce smaller units and/or
offer increased functions with the same size product.
Surface Mount assembly does not require the preparation
of components that are common on insertion technology lines.
Surface Mount components are sent directly to the assembly
line, eliminating an intermediate step.
Why Surface Mount?
Surface Mount Technology is utilized to offer answers to
many problems that have been created in the use of insertion
technology.
Limitations have been reached with insertion packages
and PC board technology. Surface Mount Technology
offers the opportunity to continue to advance the state–
of–the–art designs that cannot be accomplished with
Insertion Technology.
Surface Mount Packages allow more optimum device
performance with the smaller Surface Mount configuration.
Internal lead lengths, parasitic capacitance and inductance
that placed limitations on chip performance have been
reduced.
The lower profile of Surface Mount Packages allows more
boards to be utilized in a given amount of space. They are
Pin Conversion Tables
Dual–in–Line Package to PLCC Pin Conversion Data
The following table gives the equivalent I/O pinouts of Dual–In–Line Package (DIP) configuration and Plastic Leaded Chip
Carrier (PLCC) packages.*
Conversion Tables
8 PIN DIP
1
2
3
4
5
6
7
8
20 PIN PLCC
2
5
7
10
12
15
17
20
14 PIN DIP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
20 PIN PLCC
2
3
4
6
8
9
10
12
13
14
16
18
19
20
16 PIN DIP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
20 PIN PLCC
2
3
4
5
7
8
9
10
12
13
14
15
17
18
19
20
20 PIN DIP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
20 PIN PLCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
24 PIN DIP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
28 PIN PLCC
2
3
4
5
6
7
9
10
11
12
13
14
16
17
18
19
20
21
23
24
25
26
27
28
* The MC1648 has a Non–Standard Conversion Table. For more information, refer to the Motorola MECL Data Book, DL122/D.
Motorola Master Selection Guide
3.1–83
TTL, ECL, CMOS and Special Logic Circuits
Tape and Reel
Logic Integrated Circuits
Motorola’s tape and reel packaging fully conforms to the latest EIA RS–481A specification. The antistatic embossed tape provides a secure cavity sealed with a peel–back cover tape.
Mechanical Polarization
Typical
PLCC Devices
View from
tape side
PIN 1
Linear direction of travel
Typical
SOIC Devices
View from
tape side
Linear direction of travel
General Information
— Reel Size
— Tape Width
13 inch (330 mm) Suffix: R2
12 mm to 24 mm (see table)
— Units/Reel
500 to 5000 (see table)
Ordering Information
To order devices which are to be delivered in Tape and Reel, add the suffix R2 to the device number being ordered.
Tape and Reel Data
Device Type
PLCC–20
PLCC–28
SO–8
SO–14
SO–16
SO–16 Wide
SO–20 Wide
Tape Width
(mm)
Device/Reel
Reel Size
(inch)
Min Lot Size Per Part No.
Tape and Reel
16
24
12
16
16
16
24
1,000
500
2,500
2,500
2,500
1,000
1,000
13
13
13
13
13
13
13
3,000
500
5,000
5,000
5,000
5,000
5,000
TTL, ECL, CMOS and Special Logic Circuits
3.1–84
Motorola Master Selection Guide