SMD Type Reflective Photo Sensor Subminiature Photointerrupter Description MIR-3306-TC11 Package Dimensions Unit: mm The MIR-3306-TC11 consists of a Gallium Arsenide infrared emitting diode and a NPN silicon phototransistor built in a black plastic housing. It is a reflective subminiature photointerrupter. Features Compact and thin MIR-3306-TC11 : Compact DIP, SMD type Optimum detecting diatance : 0.8 - 1.0 mm Wavelength : 940nm NOTE: (1).Tolerance:±0.2mm (2). ( ) Reference dimensions Visible light cut-off type Item Content Lead Material The Cu System Mold Material Inner: Epoxy Resin Outer:PPA Absolute Maximum Ratings @ TA=25oC Parameter Symbol Minimum Rating Maximum Rating Unit Continuous Forward Current IF - 50 mA Reverse Voltage VR - 5 V Power Dissipation Pad - 80 mW Collector-emitter breakdown voltage V(BR)CEO 30 - V OUTPUT Emitter-Collector breakdown voltage V(BR)ECO 5 - V PC - 75 mW PTOT - INPUT Collector power dissipation Total power dissipation 100 o mW o Operating Temperature Range Topr -40 C to + 85 C Storage Temperature Range Tstg -40oC to + 85oC Lead Soldering Temperature (minimum 1.6mm from body) at 300 oC within 2 sec Unity Opto Technology Co., Ltd. 11/06/2003 MIR-3306-TC11 Optical-Electrical Characteristics symbol Min. Typ. Max. Unit. Test Conditions Forward Voltage VF - 1.2 1.4 V IF =20mA Reverse Current IR - - 10 µA VR =3V Capacitance Co - 25 - pF VR =0V, f=1MHz Collector Dark Current Iceo - - 100 nA Vce =20V Capacitance CCE - 10 - pF VCE =5V, f=1MHz Ic 45 110 360 µA IF =4mA, Vce =3V tr - 20 100 µS Ic=100µA, Vce =2V tf - 20 100 µS RL =1kΩ, d =1mm ILEAK - - 0.1 µA IF =4mA, Vce =3V VCE(set) - - 0.4 V IF =20mA, Ic =0.1mA Parameter Input Output @ TA=25oC *1 Collector Current Response Time (RISE) Transfer ChaResponse Time (FALL) racteristics *2 Leak Current Saturation Voltage *1 THE CONDITION AND ARRANGEMENT OF THE REFLECTIVE OBJECT ARE SHOWN AS FOLLOWING . *2 WITHOUT REFLECTIVE OBJECT. TEST CONDITION AND ARRANGEMENT FOR COLLECTOR CURRENT Al refletive Surface 1 mm-thick glass Device 60 Power Dissipation (mW) Forward Current IF (mA) Typical Optical-Electrical Characteristic Curves 50 40 30 20 10 0 -25 0 25 50 75 120 PTOT 100 Pad , PC 80 60 40 20 0 100 -25 50 40 30 20 10 0 0.0 0.5 1.0 Forward Voltage VF (V) Fig.3 Forward Current VS Forward Voltage 0 25 50 75 100 Ambient Temperature TA ( oC ) Fig.2 Power Dissipation vs. Ambient Temperature Collector Current Ic (µA) Forward Current IF (mA) Ambient Temperature TA (oC) Fig.1 forward Current VS. Ambient Temperature 1.5 600 Vce=5V Ta=25oC 500 400 300 200 100 0 0 5 10 15 20 Forward Current IF (mA) Fig.4 Collector Current vs. Forward Current Unity Opto Technology Co., Ltd. 11/06/2003 MIR-3306-TC11 350 Relative Collector Current (%) Collector Current Ic (µA) Typical Optical-Electrical Characteristic Curves Ta=25oC 300 IF=10mA 250 200 4mA 150 100 50 1mA 0 0 2 4 6 8 10 12 120 100 80 60 40 20 0 -25 -7 10 10-8 10-9 10-10 0 25 50 75 10 100 60 40 20 800 900 1000 1100 100 td 1 VCE=2V IC=100µA ts T a=25oC 0.1 1 10 Load Resistance Rt (KΩ) Fig.8 Response Time vs. Load Resistance Ta=25oC 0 700 75 tr 0.1 0.01 Relative Collector Current (%) Relative Sensitivity (%) 80 50 tr Ambient Temperature TA (oC) Fig.7 Collector Dark Current vs. Ambient Temperature 100 25 100 VCE=10V Response Time (µs) Collector Dark Current ICEO Collector-Emitter Voltage Vce (V) Fig.5 Collector Current vs. Vce 10-6 0 Ambient Temperature TA (oC) Fig.6 Relative Collector Current VS. 1200 Wavelength (nm) Fig.9 Spectral Sensitivity (Detecting side) 120 IF=4mA VCE=5V 100 T A=25oC 80 60 40 20 0 0 1 2 3 4 5 6 7 8 9 10 Distance (mm) Fig.10 Relative Collector Current vs. Distance between MIR-3306 and Card Test Circuit for Response Time Vcc Input RD RL Input Output Output 10% td 90% ts tr tf Unity Opto Technology Co., Ltd. 11/06/2003 MIR-3306-TC11 Reliability Test Item Test Item Description and Test Condition Reference Standard Judgement Operation Life Evaluates resistance of the device when operated at electrical stress Ta=under room temperature Test Time=1000hrs (-24hrs,+72hrs) MIL-STD-750:1026 MIL-STD-883:1005 JIS C 7021:B-1 ACCEPT: Power Decay <30% High Temperature High Humidity Evaluates moisture resistance of the device when stored for a long term at high temperature and high humidityTa=85±5 oC Rh=85±5%RhTest Time=1000hrs (-24hrs,+72hrs) MIL-STD-202:103B JIS C 7021:B-11 ACCEPT: None is OPEN/SHORT High Temperature Storage Evaluates device durability for long term storage in high temperature Ta=105 oC Test Time=1000hrs(-24hrs,+72hrs) MIL-STD-883:1008 JIS C 7021:B-10 ACCEPT: None is OPEN/SHORT Low Temperature Storage Evaluates device durability for long term storage in low temperature Ta=-55 oC Test Time=1000hrs(-24hrs,+72hrs) JIS C 7021:B-12 ACCEPT: None is OPEN/SHORT MIL-STD-202:107D MIL-STD-750:1051 MIL-STD-883:1010 JIS C 7021:A-4 ACCEPT: None is OPEN/SHORT Evaluates device’s structure and mechanical resistance when suddenly exposed at severe MIL-STD-202:107D changes MIL-STD-750:1051 o o MIL-STD-883:1011 105 C ~ -55 C 10min 10min 10 Cycles ACCEPT: None is OPEN/SHORT MIL-STD-202:210A MIL-STD-750:2031 JIS C 7021:A-1 ACCEPT: None is OPEN/SHORT Evaluates resistance of device at thermal stresses or expansion and contraction Temperature Cycling 105oC ~ 25 oC ~ -55 oC ~ 25oC 30min 5min 30min 5min 20 Cycles Thermal Shock Reflow Soldering Reflow process : Condition is as follow Heat Resistance Test page. Less than 2 time. Solderability PresureCooker Test Drop Test Evaluates solderability on leads of device T.Sol=230oC Dwell Time=5 sec Phase1:110oC, 85%RH, 1.242kgf/cm2 Phase2:130oC, 85%RH,2.714kgf/cm2 Distance of Dropping : 1 m Drop the Device on the Maple Board 3 Times MIL-STD-202:208D ACCEPT: MIL-STD-750:2026 95% soldering areaon MIL-STD-883:2003 the lead frame JIS C 7021:A-2 - ACCEPT: None is OPEN/SHORT - ACCEPT: None is OPEN/SHORT Unity Opto Technology Co., Ltd. 11/06/2003 MIR-3306-TC11 RECOMMENDED SOLDERING CONDITION 1. Reflow Soldering. 5 sec. MAX soldering time 240 oC MAX + 5 oC /sec. MAX 160+10 oC - 5 oC /sec. MAX 90 - 120 sec Preheating 1.a The above temp. profile shall be at the surface of LED resin. 1.b Number of reflow process should be less than 2 times.If the second reflow process is performed, intervals between the first and the second process should be as short as possible to prevent moisture absorption from LED resin. Cooling process to normal temp. is required between the first and the second reflow process. 1.c Temp. fluctuation to LED at pre-heat process should be minimized. ( less than 6 oC ) 2. Dip Soldering. o 2.a. Preheat temp. for soldering : 120 - 150 C, 60 - 120 sec. 2.b. Soldering temp.: Temp. of soldering pot 300 oC Max and soldering time less than 2 sec. 2.c. Number of dip soldering process must be less than 2 times and the process is performed in sequrence. Cooling process to normal temp. will be required between the first and the second soldering process. Unity Opto Technology Co., Ltd. 11/06/2003 MIR-3306-TC11 Tape Dimensions Unit:mm Tape Material: PET Symbol Dimension A 3.50+0.1 B 5.55+0.1 C 8.00+0.2 D 4.00+0.1 E 1.75+0.1 F 5.50+0.1 G φ 1.50+0.1,-0 H 12.00+0.3 T 1.95+0.1 t 0.25+0.1,-0.05 REEL Dimensions Reel Material : PS Symbol Dimension A φ 180.0+0,-3 B φ 60.0+1,-0 C φ 13.0+0.2 D 2.0+0.5 W1 13.0+0.3 W2 15.4+1.0 Quantity : 1000pcs Unity Opto Technology Co., Ltd. 11/06/2003 MIR-3306-TC11 Taping Construction Pulling direction 1. The sproket holes shall be on the left side against the pull-out direction. 2.The space of more than 20 pitches shall be provided on each front of tape mounting. 3.The space of more than 40 mm shall be provided on each rear of tape mounting. 4.The leader of more than 400 mm by the cover tape shall be provided at the pull-out start portion. Unity Opto Technology Co., Ltd. 11/06/2003 MIR-3306-TC11 Taping Mechanical characteristics and specifications 1. Peeling strength of cover tape : (1). F=0.2~0.7N(20~70gf)(measure by tension gage) (2). Tape should not be burst by peeling. 2. Specifications : (1). When the tape is bent to radius 30 mm, products do not fall down from the tape and tape doesn't get any gamage. (2). During the peeling, products do not fix to cover tape. (3). The product which was enclossed in reverse direction or with back side up should be count as 0pcs/reel. The number of dropped parts should be 0.1% reel. Unity Opto Technology Co., Ltd. 11/06/2003 MIR-3306-TC11 Tolerance ± 10 mm H : 13 mm L : 180 mm PCS/Reel L H 1000pcs Al laminate bag:1 Reel 4 REELS/INNER BOX H : 190 mm L : 190 mm W : 75 mm Label H PCS/INNER BOX L 4000pcs W 10 INNER BOXES/OUTER BOX H : 215 mm L : 415 mm W : 400 mm H Label W PCS/OUTER BOX 40000pcs L PACKAGE LABEL MIR-3306-TC11 Unity Opto Technology Co., Ltd. 11/06/2003