HMC1093 v00.0613 MIXERS - SUB HARMONIC - CHIP GaAs MMIC SUB HARMONIC MIXER, 37 - 46.5 GHz Typical Applications Features The HMC1093 is ideal for: Sub-Harmonically Pumped (x4) LO • 38 GHz Microwave Radio Low LO Power: -1 dBm • 42 GHz Microwave Radio High 4LO/RF Isolation: 20 dB • Military End-Use Wide IF Bandwidth: DC to 7.5 GHz Downconversion Applications Die Size: 1.45 X 3.85 X 0.1 mm General Description Functional Diagram The HMC1093 chip is a sub-harmonically pumped (x4) MMIC mixer with an integrated LO amplifier. The HMC1093 chip is ideal for use as a downconverter with 37 to 46.5 GHz at the RF port and DC to 7.5 GHz at the IF port. The HMC1093 utilizes a GaAs PHEMT technology and delivers excellent 4LO to RF isolation of 20 dB, which eliminates the need for additional filtering. The LO amplifier is a single bias (+3V) twostage design requiring only -1 dBm of LO power. The RF and LO ports are DC blocked and matched to 50 Ohms for ease of use. All data shown herein is measured with the chip in a 50 Ohm test fixture connected via 0.025mm (1 mil) wire bonds of minimal length <0.31 mm (<12 mils). Electrical Specifications, TA = +25° C, Vdd = +3V, USB [1] Parameter Min. RF Frequency Range Typ. Max. Min. 37 - 40 Typ. LO Frequency Range 8.5 - 11 IF Frequency Range DC - 7.5 Conversion Loss 14 4LO to RF Isolation 22 Max. Min. 40 - 43 16 11 Typ. Max. 43 - 46.5 Units GHz GHz GHz 13 9 11 dB 15 15 dB dB 4LO to IF Isolation 16 18 25 Input Third Order Intercept (IP3) 30 26 21 dB 20 18 16 dBm Input Power for 1 dB Compression Idd [2] 140 160 210 140 160 210 140 160 210 mA [1] Unless otherwise noted , all measurements performed as a downconverter with LO = -1 dBm. [2] Data taken at IF = 7.5 GHz, USB. 1 Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, 2delivery, and to placeChelmsford, orders: Analog MA Devices, Inc., For price, delivery and to place orders: Microwave Corporation, Elizabeth Drive, 01824 responsibility is assumed by Analog Devices for its use, nor for anyHittite infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 Fax: 978-250-3373 Phone: Order781-329-4700 On-line at www.hittite.com • Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 978-250-3343 or [email protected] HMC1093 v00.0613 GaAs MMIC SUB HARMONIC MIXER, 37 - 46.5 GHz Data taken at IF = 1 GHz, USB 2 -2 -2 -6 -10 -14 -18 -22 -26 -6 -10 -14 -18 -22 -26 -30 -30 37 38 39 40 41 42 43 44 45 46 47 37 38 39 40 RF FREQUENCY (GHz) +25 C 41 42 43 44 45 46 47 RF FREQUENCY (GHz) +85 C -55 C -5 dBm RF Return Loss -1 dBm +3 dBm LO Return Loss vs. Temperature 5 -5 RETURN LOSS (dB) RETURN LOSS (dB) 0 -5 -10 -15 -10 -15 -20 MIXERS - SUB HARMONIC - CHIP Conversion Loss vs. LO Drive 2 CONVERSION GAIN (dB) CONVERSION GAIN (dB) Conversion Loss vs. Temperature -25 -20 37 38 39 40 41 42 43 44 45 46 7 47 8 9 +25 C 10 11 12 13 FREQUENCY (GHz) FREQUENCY (GHz) +85 C +25 C -55 C +85 C -55 C 4LO Isolation IF Return Loss 0 0 -5 -10 ISOLATION (dB) RETURN LOSS (dB) -5 -10 -15 -15 -20 -25 -30 -20 -35 -25 0 1 2 3 4 5 6 7 8 9 IF FREQUENCY (GHz) 10 -40 8 9 10 11 12 LO FREQUENCY (GHz) 25 C 85 C -55 C 4LO/RF 4LO/IF Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, 2delivery, and to placeChelmsford, orders: Analog MA Devices, Inc., For price, delivery and to place orders: Microwave Corporation, Elizabeth Drive, 01824 responsibility is assumed by Analog Devices for its use, nor for anyHittite infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 Fax: 978-250-3373 Phone: Order781-329-4700 On-line at www.hittite.com • Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 978-250-3343 or [email protected] 2 HMC1093 v00.0613 GaAs MMIC SUB HARMONIC MIXER, 37 - 46.5 GHz Data taken at IF = 1 GHz, USB Output IP3 vs. Temperature 42 30 38 26 22 30 IP3 (dBm) IP3 (dBm) 34 26 18 14 22 10 18 6 14 10 2 37 38 39 40 41 42 43 44 45 46 47 37 38 39 40 +25 C +85 C -55 C 42 +25 C Input IP3 vs. LO Power 43 44 45 46 47 +85 C -55 C Output IP3 vs. LO Power 42 30 38 26 34 22 IP3 (dBm) 30 26 18 14 22 10 18 6 14 10 2 37 38 39 40 41 42 43 44 45 46 47 37 38 39 40 -5 dBm -1 dBm 41 42 43 44 45 46 47 RF FREQUENCY (GHz) RF FREQUENCY (GHz) 3 41 RF FREQUENCY (GHz) RF FREQUENCY (GHz) IP3 (dBm) MIXERS - SUB HARMONIC - CHIP Input IP3 vs. Temperature +3 dBm -5 dBm -1 dBm +3 dBm Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, 2delivery, and to placeChelmsford, orders: Analog MA Devices, Inc., For price, delivery and to place orders: Microwave Corporation, Elizabeth Drive, 01824 responsibility is assumed by Analog Devices for its use, nor for anyHittite infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 Fax: 978-250-3373 Phone: Order781-329-4700 On-line at www.hittite.com • Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 978-250-3343 or [email protected] HMC1093 v00.0613 GaAs MMIC SUB HARMONIC MIXER, 37 - 46.5 GHz Data taken at IF = 2 GHz, USB 2 -2 -2 -6 -10 -14 -18 -22 -6 -10 -14 -18 -22 -26 -26 -30 -30 37 38 39 40 41 42 43 44 45 46 37 47 38 39 40 +25 C +85 C 42 -5 dBm -55 C Input IP3 vs. Temperature 43 44 45 46 47 -1 dBm +3 dBm Output IP3 vs. Temperature 42 30 38 26 34 22 30 IP3 (dBm) IP3 (dBm) 41 RF FREQUENCY (GHz) RF FREQUENCY (GHz) 26 18 14 22 10 18 6 14 10 MIXERS - SUB HARMONIC - CHIP Conversion Loss vs. LO Drive 2 CONVERSION GAIN (dB) CONVERSION GAIN (dB) Conversion Loss vs. Temperature 2 37 38 39 40 41 42 43 44 45 46 +85 C 37 38 39 40 41 42 43 44 45 46 47 RF FREQUENCY (GHz) RF FREQUENCY (GHz) +25 C 47 -55 C +25 C +85 C -55 C Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, 2delivery, and to placeChelmsford, orders: Analog MA Devices, Inc., For price, delivery and to place orders: Microwave Corporation, Elizabeth Drive, 01824 responsibility is assumed by Analog Devices for its use, nor for anyHittite infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 Fax: 978-250-3373 Phone: Order781-329-4700 On-line at www.hittite.com • Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 978-250-3343 or [email protected] 4 HMC1093 v00.0613 GaAs MMIC SUB HARMONIC MIXER, 37 - 46.5 GHz Data taken at IF = 3.5 GHz, USB 2 -2 -2 CONVERSION GAIN (dB) CONVERSION GAIN (dB) Conversion Loss vs. LO Drive 2 -6 -10 -14 -18 -22 -14 -18 -22 -30 -30 37 38 39 40 41 42 43 44 45 46 37 47 38 39 40 +25 C 41 42 43 44 45 46 47 RF FREQUENCY (GHz) RF FREQUENCY (GHz) +85 C -5 dBm -55 C Input IP3 vs. Temperature -1 dBm +3 dBm Output IP3 vs. Temperature 42 30 38 26 22 34 18 IP3 (dBm) 30 26 22 14 10 6 18 2 14 -2 10 -6 37 38 39 40 41 42 43 44 45 46 +25 C +85 C 47 37 38 39 40 41 42 43 44 45 46 47 RF FREQUENCY (GHz) RF FREQUENCY (GHz) 5 -6 -10 -26 -26 IP3 (dBm) MIXERS - SUB HARMONIC - CHIP Conversion Loss vs. Temperature -55 C +25 C +85 C -55 C Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, 2delivery, and to placeChelmsford, orders: Analog MA Devices, Inc., For price, delivery and to place orders: Microwave Corporation, Elizabeth Drive, 01824 responsibility is assumed by Analog Devices for its use, nor for anyHittite infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 Fax: 978-250-3373 Phone: Order781-329-4700 On-line at www.hittite.com • Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 978-250-3343 or [email protected] HMC1093 v00.0613 GaAs MMIC SUB HARMONIC MIXER, 37 - 46.5 GHz Data taken at IF = 7 GHz, USB 2 -2 -2 -6 -10 -14 -18 -22 -6 -10 -14 -18 -22 -26 -26 -30 -30 37 38 39 40 41 42 43 44 45 46 37 47 38 39 40 +25 C +85 C 43 44 45 46 47 -1 dBm +3 dBm Output P1dB vs. Temperature [1] 24 10 22 8 20 6 P1dB (dBm) P1dB (dBm) 42 -5 dBm -55 C Input P1dB vs. Temperature [1] 18 16 4 2 14 0 12 -2 10 -4 37 38 39 40 41 42 43 44 45 46 47 37 38 39 40 RF FREQUENCY (GHz) +25 C +85 C -55C 26 34 22 30 18 IP3 (dBm) 30 26 22 18 2 6 -6 2 -10 42 43 44 45 46 RF FREQUENCY (GHz) +25 C +85 C 46 47 +85 C -55 C 6 -2 41 45 10 10 40 44 14 14 39 43 Output IP3 vs. Temperature 38 38 42 +25 C 42 37 41 RF FREQUENCY (GHz) Input IP3 vs. Temperature IP3 (dBm) 41 RF FREQUENCY (GHz) RF FREQUENCY (GHz) MIXERS - SUB HARMONIC - CHIP Conversion Loss vs. LO Drive 2 CONVERSION GAIN (dB) CONVERSION GAIN (dB) Conversion Loss vs. Temperature 47 37 38 39 40 41 42 43 44 45 46 47 RF FREQUENCY (GHz) -55 C +25 C +85 C -55 C [1] Data taken at IF = 7.5 GHz, USB Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, 2delivery, and to placeChelmsford, orders: Analog MA Devices, Inc., For price, delivery and to place orders: Microwave Corporation, Elizabeth Drive, 01824 responsibility is assumed by Analog Devices for its use, nor for anyHittite infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 Fax: 978-250-3373 Phone: Order781-329-4700 On-line at www.hittite.com • Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 978-250-3343 or [email protected] 6 HMC1093 v00.0613 GaAs MMIC SUB HARMONIC MIXER, 37 - 46.5 GHz MIXERS - SUB HARMONIC - CHIP Absolute Maximum Ratings Bias Voltage +3.5V RF Input Power +18dBm LO Input Power +5dBm Channel Temperature 175 °C Continuous Pdiss (T = 85 °C) (derate 15mW/ °C above 85 °C) 1.6 Thermal Resistance (RTH) (channel to die bottom) 66.7 °C/W Operating Temperature -55°C to +85°C Storage Temperature -65°C to 125°C ESD Sensitivity (HBM) Class 0, Passed 150V ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Outline Drawing Die Packaging Information [1] Standard Alternate GP-2 (Gel Pack) [2] NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM] 2. DIE THICKNESS IS .004” 3. TYPICAL BOND PAD IS 0.0026” [0.066] SQUARE 4. BACKSIDE METALLIZATION: GOLD 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 8. Overall die size ± .002 [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. 7 Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, 2delivery, and to placeChelmsford, orders: Analog MA Devices, Inc., For price, delivery and to place orders: Microwave Corporation, Elizabeth Drive, 01824 responsibility is assumed by Analog Devices for its use, nor for anyHittite infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 Fax: 978-250-3373 Phone: Order781-329-4700 On-line at www.hittite.com • Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 978-250-3343 or [email protected] HMC1093 v00.0613 GaAs MMIC SUB HARMONIC MIXER, 37 - 46.5 GHz Pad Descriptions Function Description 1 RF This pad is AC coupled and matched to 50 Ohms. 2 IF This pad is DC coupled and matched to 50 Ohms. 3 LO This pad is AC coupled and matched to 50 Ohms. 4, 5, 6 Vdd1, Vdd2, Vdd3 Power Supply Voltage for the LO Amplifier. External bypass capacitors 100pF, 0.01uF, and 4.7uF are required. Die Bottom Ground Die bottom must be connected to RF/DC ground. Pad Schematic Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, 2delivery, and to placeChelmsford, orders: Analog MA Devices, Inc., For price, delivery and to place orders: Microwave Corporation, Elizabeth Drive, 01824 responsibility is assumed by Analog Devices for its use, nor for anyHittite infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 Fax: 978-250-3373 Phone: Order781-329-4700 On-line at www.hittite.com • Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 978-250-3343 or [email protected] MIXERS - SUB HARMONIC - CHIP Pad Number 8 HMC1093 v00.0613 GaAs MMIC SUB HARMONIC MIXER, 37 - 46.5 GHz MIXERS - SUB HARMONIC - CHIP Assembly Diagram 9 Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, 2delivery, and to placeChelmsford, orders: Analog MA Devices, Inc., For price, delivery and to place orders: Microwave Corporation, Elizabeth Drive, 01824 responsibility is assumed by Analog Devices for its use, nor for anyHittite infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 Fax: 978-250-3373 Phone: Order781-329-4700 On-line at www.hittite.com • Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 978-250-3343 or [email protected] HMC1093 v00.0613 GaAs MMIC SUB HARMONIC MIXER, 37 - 46.5 GHz Mounting & Bonding Techniques for Millimeterwave GaAs MMICs 50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) RF Ground Plane Microstrip substrates should be located as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pick-up. 0.102mm (0.004”) Thick GaAs MMIC Wire Bond 0.076mm (0.003”) RF Ground Plane 0.150mm (0.005”) Thick Moly Tab 0.254mm (0.010”) Thick Alumina Thin Film Substrate MIXERS - SUB HARMONIC - CHIP The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). Figure 2. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <0.31mm (12 mils). Information furnished by Analog Devices is believed to be accurate and reliable. However, no For price, 2delivery, and to placeChelmsford, orders: Analog MA Devices, Inc., For price, delivery and to place orders: Microwave Corporation, Elizabeth Drive, 01824 responsibility is assumed by Analog Devices for its use, nor for anyHittite infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No Phone: 978-250-3343 Fax: 978-250-3373 Phone: Order781-329-4700 On-line at www.hittite.com • Order online at www.analog.com license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Application Support: Phone: 1-800-ANALOG-D Trademarks and registered trademarks are the property of their respective owners. Application Support: Phone: 978-250-3343 or [email protected] 10