IPB80N08S2-07 IPP80N08S2-07, IPI80N08S2-07 OptiMOS® Power-Transistor Product Summary Features • N-channel - Enhancement mode • Automotive AEC Q101 qualified V DS 75 V R DS(on),max (SMD version) 7.1 mΩ ID 80 A • MSL1 up to 260°C peak reflow • 175°C operating temperature PG-TO263-3-2 PG-TO220-3-1 PG-TO262-3-1 • Green package (lead free) • Ultra low Rds(on) • 100% Avalanche tested Type Package Ordering Code Marking IPB80N08S2-07 PG-TO263-3-2 SP0002-19048 2N0807 IPP80N08S2-07 PG-TO220-3-1 SP0002-19040 2N0807 IPI80N08S2-07 PG-TO262-3-1 SP0002-19043 2N0807 Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Continuous drain current1) ID Conditions T C=25 °C, V GS=10 V T C=100 °C, V GS=10 V2) Value 80 Unit A 80 Pulsed drain current2) I D,pulse T C=25 °C 320 Avalanche energy, single pulse2) E AS I D=80A 810 mJ Gate source voltage4) V GS ±20 V Power dissipation P tot 300 W Operating and storage temperature T j, T stg -55 ... +175 °C T C=25 °C IEC climatic category; DIN IEC 68-1 Rev. 1.0 55/175/56 page 1 2006-03-03 IPB80N08S2-07 IPP80N08S2-07, IPI80N08S2-07 Parameter Symbol Values Conditions Unit min. typ. max. Thermal characteristics2) Thermal resistance, junction - case R thJC - - 0.5 Thermal resistance, junction ambient, leaded R thJA - - 62 SMD version, device on PCB R thJA minimal footprint - - 62 6 cm2 cooling area5) - - 40 K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D= 1 mA 75 - - Gate threshold voltage V GS(th) V DS=V GS, I D=250 µA 2.1 3.0 4.0 Zero gate voltage drain current I DSS V DS=75 V, V GS=0 V, T j=25 °C - 0.01 1 - 1 100 V DS=75 V, V GS=0 V, T j=125 °C2) V µA Gate-source leakage current I GSS V GS=20 V, V DS=0 V - 1 100 nA Drain-source on-state resistance RDS(on) V GS=10 V, I D=80 A, - 5.8 7.4 mΩ V GS=10 V, I D=80 A, SMD version - 5.5 7.1 Rev. 1.0 page 2 2006-03-03 IPB80N08S2-07 IPP80N08S2-07, IPI80N08S2-07 Parameter Symbol Values Conditions Unit min. typ. max. - 4700 - - 1260 - Dynamic characteristics2) Input capacitance C iss Output capacitance C oss Reverse transfer capacitance Crss - 580 - Turn-on delay time t d(on) - 26 - Rise time tr - 50 - Turn-off delay time t d(off) - 61 - Fall time tf - 30 - Gate to source charge Q gs - 25 37 Gate to drain charge Q gd - 69 116 Gate charge total Qg - 144 180 Gate plateau voltage V plateau - 5.4 - V - - 80 A - - 320 V GS=0 V, V DS=25 V, f =1 MHz V DD=40 V, V GS=10 V, I D=80 A, R G=2.2 Ω pF ns Gate Charge Characteristics2) V DD=60 V, I D=80 A, V GS=0 to 10 V nC Reverse Diode Diode continous forward current2) IS Diode pulse current2) I S,pulse Diode forward voltage V SD V GS=0 V, I F=80 A, T j=25 °C - 0.9 1.3 V Reverse recovery time2) t rr V R=40 V, I F=I S, di F/dt =100 A/µs - 110 140 ns Reverse recovery charge2) Q rr V R=40 V, I F=I S, di F/dt =100 A/µs - 470 590 nC T C=25 °C 1) Current is limited by bondwire; with an R thJC = 0.5K/W the chip is able to carry 132A at 25°C. For detailed information see Application Note ANPS071E at www.infineon.com/optimos 2) Defined by design. Not subject to production test. 3) See diagram 13. 4) Qualified at -20V and +20V. 5) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.0 page 3 2006-03-03 IPB80N08S2-07 IPP80N08S2-07, IPI80N08S2-07 1 Power dissipation 2 Drain current P tot = f(T C); V GS ≥ 6 V I D = f(T C); V GS ≥ 10 V 350 100 300 80 60 200 I D [A] P tot [W] 250 150 40 100 20 50 0 0 0 50 100 150 200 0 50 T C [°C] 100 150 200 T C [°C] 3 Safe operating area 4 Max. transient thermal impedance I D = f(V DS); T C = 25 °C; D = 0 Z thJC = f(t p) parameter: t p parameter: D =t p/T 1000 100 0.5 10 µs 10-1 100 µs 100 0.1 I D [A] Z thJC [K/W] 1 ms 0.05 10-2 10 0.01 single pulse 10-3 1 0.1 1 10 100 10-6 10-5 10-4 10-3 10-2 10-1 100 t p [s] V DS [V] Rev. 1.0 10-7 page 4 2006-03-03 IPB80N08S2-07 IPP80N08S2-07, IPI80N08S2-07 5 Typ. output characteristics 6 Typ. drain-source on-state resistance I D = f(V DS); T j = 25 °C R DS(on) = (I D); T j = 25 °C parameter: V GS parameter: V GS 300 40 7V 10 V 35 250 30 RDS(on) [mW] I D [A] 200 150 6V 25 20 100 5.5 V 15 5V 10 50 6.5 V 10 V 4.5 V 0 5 0 2 4 6 8 10 0 20 40 60 80 100 120 I D [A] V DS [V] 7 Typ. transfer characteristics 8 Typ. Forward transconductance I D = f(V GS); V DS = 6V g fs = f(I D); T j = 25°C parameter: T j parameter: g fs 320 150 280 125 240 100 g fs [S] I D [A] 200 160 75 120 50 80 25 40 175 °C 25 °C 0 2 3 4 0 -55 °C 5 6 7 8 V GS [V] Rev. 1.0 0 50 100 150 200 I D [A] page 5 2006-03-03 IPB80N08S2-07 IPP80N08S2-07, IPI80N08S2-07 9 Typ. Drain-source on-state resistance 10 Typ. gate threshold voltage R DS(ON) = f(T j) V GS(th) = f(T j); V GS = V DS parameter: I D = 80 A; VGS = 10 V parameter: I D 4 12 3.5 10 1250 µA 8 250 µA V GS(th) [V] R DS(on) [mΩ] 3 6 2.5 2 4 1.5 2 1 -60 -20 20 60 100 140 -60 180 -20 20 60 T j [°C] 100 140 180 T j [°C] 11 Typ. capacitances 12 Typical forward diode characteristicis C = f(V DS); V GS = 0 V; f = 1 MHz IF = f(VSD) parameter: T j 103 104 102 I F [A] C [pF] Ciss Coss 103 175 °C 101 25 °C Crss 102 100 0 5 10 15 20 25 30 V DS [V] Rev. 1.0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 V SD [V] page 6 2006-03-03 IPB80N08S2-07 IPP80N08S2-07, IPI80N08S2-07 13 Typical avalanche energy 14 Typ. gate charge E AS = f(T j) V GS = f(Q gate); I D = 80 A pulsed parameter: I D = 80A parameter: V DD 900 12 800 15V 60V 10 700 8 500 V GS [V] E AS [mJ] 600 400 300 6 4 200 2 100 0 0 25 75 125 0 175 20 40 60 T j [°C] 80 100 120 140 160 Q gate [nC] 15 Typ. drain-source breakdown voltage 16 Gate charge waveforms V BR(DSS) = f(T j); I D = 1 mA 90 V GS Qg V BR(DSS) [V] 85 80 75 70 Q gate Q gs Q gd 65 -60 -20 20 60 100 140 180 T j [°C] Rev. 1.0 page 7 2006-03-03 IPB80N08S2-07 IPP80N08S2-07, IPI80N08S2-07 Published by Infineon Technologies AG St.-Martin-Straße 53 D-81541 München © Infineon Technologies AG 2004 All Rights Reserved. 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Infineon Technologies' components may only be used in life-support devices or systems with the expressed written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.0 page 8 2006-03-03