TI1 BQ500215RGCT Compliant wireless power transmitter manager Datasheet

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bq500215
SLUSBZ1A – OCTOBER 2014 – REVISED NOVEMBER 2014
bq500215 WPC v1.1 Compliant Wireless Power Transmitter Manager With
Proprietary 10-W Power Delivery
1 Features
•
1
•
•
•
•
•
•
Qi-Certified WPC v1.1 Solution for 5-W Operation
and Proprietary 10-W Charging Capability With TI
bq51025 Wireless Power Receiver
– Proprietary Authentication Protocol With TI
bq51025 Receiver
– Faster Charging Time
– Compatible With Standard 5-W WPC
Receivers
12-V Input, Fixed Frequency, Rail Voltage Control
Architecture
Conforms to Wireless Power Consortium (WPC)
A29 Transmitter Type Specification
Enhanced Foreign Objection Detection (FOD)
Implementation With FOD Ping that Detects Metal
Objects Prior to Power Transfer
Low Standby Power During Idle and 'Charge
Complete'
10 Configurable LED Modes Indicate Charging
State and Fault Status
Digital Demodulation Reduces Components and
Simplifies Circuitry
2 Applications
•
WPC v1.1 Wireless Chargers:
– Qi-Certified Smart Phones, Tablets, and Other
Handhelds
– Point-of-Sale Devices
– Custom Wireless Power Applications
•
See www.ti.com/wirelesspower for More
Information on TI's Wireless Charging Solutions
3 Description
The bq500215 is a dedicated wireless power digital
controller that integrates the logic functions required
to control wireless power transfer to a single WPCcompliant receiver. The bq500215 complies with the
WPC v1.1 standard for power delivery up to 5 W and
uses a proprietary bidirectional communication
protocol to allow charging at up to 10 W with the
bq51025 wireless power receiver. The bq500215 is
an intelligent device that periodically pings the
surrounding environment for available devices to be
powered, detects if a foreign metal object is present
on the charging pad, monitors all communication from
the device being wirelessly powered, and adjusts
power applied to the transmitter coil per feedback
received from the powered device. The bq500215
also manages the fault conditions associated with the
power transfer and controls the operating mode
status indicator. The bq500215 uses a rail voltage
control scheme instead of the traditional frequency
control to adjust the amount of power delivered to the
receiver.
Device Information(1)
PART NUMBER
PACKAGE
bq500215
BODY SIZE (NOM)
VQFN (64)
9.00 mm × 9.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Simplified Diagram
Efficiency vs System Output Power With bq51025
Receiver
100%
90%
80%
Efficiency
70%
60%
50%
40%
30%
VOUT = 10V
VOUT = 7V
VOUT = 5V
20%
10%
0
0
1
2
3
4
5
6
Output Power (W)
7
8
9
10
D001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
bq500215
SLUSBZ1A – OCTOBER 2014 – REVISED NOVEMBER 2014
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Diagram ................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
5
7.1
7.2
7.3
7.4
7.5
7.6
5
5
6
6
7
8
Absolute Maximum Ratings .....................................
Handling Ratings.......................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................. 10
8.4 Device Functional Modes........................................ 15
9
Application and Implementation ........................ 18
9.1 Application Information............................................ 18
9.2 Typical Application .................................................. 18
10 Power Supply Recommendations ..................... 21
11 Layout................................................................... 21
11.1 Layout Guidelines ................................................. 21
11.2 Layout Example .................................................... 21
12 Device and Documentation Support ................. 27
12.1
12.2
12.3
12.4
Device Support......................................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
27
27
27
27
13 Mechanical, Packaging, and Orderable
Information ........................................................... 27
5 Revision History
Changes from Original (October 2014) to Revision A
•
2
Page
Updated device status to production data .............................................................................................................................. 1
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6 Pin Configuration and Functions
AGND3
V_SENSE
PWR_UP
LED_MODE
LOSS_THR
I_SENSE
V33FB
Unused
Unused
V_RAIL-
V_RAIL+
COMM_B-
COMM_B+
COMM_A-
COMM_A+
AGND
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
RGC (VQFN) PACKAGE
(TOP VIEW)
PEAK_DET
1
48
AGND2
T_SENSE
2
47
BPCAP
SNOOZE_CAP
3
46
V33A
Unused
4
45
V33D
Unused
5
44
V33DIO
Unused
6
43
DGND
V33DIO
7
42
Reserved
DGND
8
41
Reserved
RESET
9
40
Reserved
Reserved
10
39
Reserved
SLEEP
11
38
Reserved
LED-A
12
37
Reserved
LED-B
13
36
Reserved
SNOOZE
14
35
Reserved
Reserved
15
34
Reserved
Reserved
16
33
Reserved
bq500215
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
PWM-A
PWM-B
FP_RES
FP_DECAY
PWM_RAIL
FOD_CAL
FOD
PMOD
LED-C
DGND
Unused
Unused
Unused
SNOOZE_CHG
BUZZ-AC
BUZZ_DC
GND 65
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Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
PEAK_DET
1
I
Input from peak detect circuit
T_SENSE
2
I
Sensor input. Device shuts down when below 1 V. If not used, keep above 1 V by simply connecting to 3.3V supply
SNOOZE_CAP
3
I
Indicates wake from SNOOZE (short) or SLEEP (long)
Unused
4
—
This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding.
Unused
5
—
This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding.
Unused
6
—
This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding.
V33DIO
7
—
3.3-V IO power supply
DGND
8
—
GND
RESET
9
I
Reserved
10
—
Reserved, leave this pin open
SLEEP
11
O
Force SLEEP (5 s low power). Connected to 5-s interval circuit
LED-A
12
O
Connect to an LED with a 470-Ω resistor for status indication.
LED-B
13
O
Connect to an LED with a 470-Ω resistor for status indication.
SNOOZE
14
O
Force SNOOZE (500 ms low power)
Reserved
15
I
Reserved, connect to GND
Reserved
16
I/O
Reserved, connect to GND
PWM-A
17
O
PWM output A, controls one half of the full bridge in a phase-shifted full bridge. Switching dead times must
be externally generated.
PWM-B
18
O
PWM output B, controls other half of the full bridge in a phase-shifted full bridge. Switching dead times must
be externally generated.
FP_RES
19
O
Output to select the FOD ping calibration threshold
FP_DECAY
20
O
Output to select the FOD ping calibration threshold
PWM_RAIL
21
O
PWM control signal for full bridge rail voltage
FOD_CAL
22
O
Output to select the FOD calibration
FOD
23
O
Output to select the foreign object detection (FOD) threshold
PMOD
24
O
Output to select the PMOD threshold
LED-C
25
O
Connect to an LED with a 470-Ω resistor for status indication.
DGND
26
—
GND
Unused
27
—
This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding.
Unused
28
—
This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding.
Unused
29
—
This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding.
SNOOZE_CH
G
30
O
SNOOZE capacitor charging source. Connected to capacitor
BUZZ-AC
31
O
AC buzzer output. A 400-ms, 4-kHz AC pulse train when charging begins
BUZ-DC
32
O
DC buzzer output. A 400-ms DC pulse when charging begins. This could also be connected to an LED with
a 470-Ω resistor.
Reserved
33
—
Reserved, leave this pin open
Reserved
34
—
Reserved, leave this pin open
Reserved
35
—
Reserved, leave this pin open
Reserved
36
—
Reserved, leave this pin open
Reserved
37
—
Reserved, leave this pin open
Reserved
38
—
Reserved, leave this pin open
Reserved
39
—
Reserved, leave this pin open
Reserved
40
—
Reserved, connect to 10-kΩ resistor to GND
Reserved
41
—
Reserved, leave this pin open
Reserved
42
—
Reserved, leave this pin open
DGND
43
—
GND
4
Device reset. Use 10- to 100-kΩ pullup resistor to 3.3-V supply
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Pin Functions (continued)
PIN
NAME
NO.
I/O
DESCRIPTION
V33DIO
44
—
3.3-V IO power supply
V33D
45
—
Digital core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as possible.
V33A
46
—
Analog 3.3-V supply. This pin can be derived from V33D supply, decouple with 22-Ω resistor and additional
bypass capacitors.
BPCAP
47
—
Connect to 1uF bypass capacitors to 3.3V supply and GND
AGND2
48
—
GND
AGND
49
—
GND
COMM_A+
50
I
Digital demodulation non-inverting input A. Connect parallel to input B+
COMM_A-
51
I
Digital demodulation inverting input A. Connect parallel to input B–
COMM_B+
52
I
Digital demodulation non-inverting input B. Connect parallel to input A+
COMM_B–
53
I
Digital demodulation inverting input B. Connect parallel to input A–
V_RAIL+
54
I
Feedback for full bridge rail voltage control +
V_RAIL–
55
I
Feedback for full bridge rail voltage control –
Unused
56
—
This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding.
Unused
57
—
This pin can be either connected to GND or left open. Connecting to GND can improve layout grounding.
V33FB
58
I
Reserved, leave this pin open
I_SENSE
59
I
Full bridge input current sense
LOSS_THR
60
I
Input for FOD/PMOD calibration and configuration
LED_MODE
61
I
LED mode select
PWR_UP
62
I
First power-up indicator (pull high if unused)
V_SENSE
63
I
Transmitter rail voltage sense
AGND3
64
—
GND
EPAD
65
—
Flood with copper GND plane and stitch vias to PCB internal GND plane
7 Specifications
7.1 Absolute Maximum Ratings (1)
over operating free-air temperature (unless otherwise noted)
MIN
MAX
Voltage applied at V33D to DGND
–0.3
3.6
Voltage applied at V33A to AGND
–0.3
3.6
–0.3
3.6
Voltage applied to any pin
(1)
(2)
(2)
UNIT
V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to GND.
7.2 Handling Ratings
Tstg
Storage temperature range
V(ESD)
(1)
(2)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2)
MIN
MAX
–40
150
UNIT
°C
–2
2
kV
–750
750
kV
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
V
Supply voltage during operation, V33D, V33A
3.0
3.3
3.6
TA
Operating free-air temperature range
–40
TJ
Junction temperature
85
125
UNIT
V
°C
7.4 Thermal Information
THERMAL METRIC (1)
bq500215
RGC (64 pins)
RθJA
Junction-to-ambient thermal resistance
29.5
RθJC(top)
Junction-to-case (top) thermal resistance
15.1
RθJB
Junction-to-board thermal resistance
8.4
ψJT
Junction-to-top characterization parameter
0.2
ψJB
Junction-to-board characterization parameter
8.3
RθJC(bot)
Junction-to-case (bottom) thermal resistance
1.2
(1)
6
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
V33A = 3.3 V
8
15
V33D = 3.3 V
44
55
V33D = V33A = 3.3 V
52
70
UNIT
SUPPLY CURRENT
IV33A
IV33D
Supply current
ITotal
mA
EXTERNALLY SUPPLIED 3.3 V POWER
V33D
Digital 3.3-V power
TA = 25°C
3
3.6
V33A
Analog 3.3-V power
TA = 25°C
3
3.6
V33Slew
3.3-V slew rate
3.3-V slew rate between 2.3 and 2.9 V,
V33A = V33D
0.25
V
V/ms
DIGITAL DEMODULATION INPUTS: COMM_A+, COMM_A-, COMM_B+, COMM_BVCM
Common mode voltage each pin
–0.15
COMM+,
COMM–
Modulation voltage digital resolution
REA
Input Impedance
Ground reference
0.5
IOFFSET
Input offset current
1-kΩ source impedance
–5
1.631
1
1.5
V
mV
3
MΩ
5
µA
0.36
V
ANALOG INPUTS: V_SENSE, I_SENSE, T_SENSE, LED_MODE, LOSS_THR
VADC_OPEN
Voltage indicating open pin
LED_MODE, LOSS_THR open
VADC_SHORT
Voltage indicating pin shorted to GND
LED_MODE, LOSS_THR shorted to
ground
VADC_RANGE
Measurement range for voltage monitoring
All analog inputs
INL
ADC integral nonlinearity
Ilkg
Input leakage current
3 V applied to pin
RIN
Input impedance
Ground reference
CIN
Input capacitance
2.37
0
2.5
–2.5
2.5
100
8
mV
nA
MΩ
10
pF
DIGITAL INPUTS/OUTPUTS
VOL
Low-level output voltage
IOL = 6 mA , V33D = 3 V
VOH
High-level output voltage
IOH = –6 mA , V33D = 3 V
DGND1 + 0.25
VIH
High-level input voltage
V33D = 3 V
VIL
Low-level input voltage
V33D = 3.5 V
IOH(MAX)
Output high-source current
4
IOL(MAX)
Output low-sink current
4
V33D – 0.6 V
2.1
3.6
V
1.4
mA
SYSTEM PERFORMANCE
VRESET
Voltage where device comes out of reset
V33D pin
tRESET
Pulse duration needed for reset
RESET pin
ƒSW
Switching frequency (wireless power
transfer)
tdetect
Time to detect presence of device
requesting power
2.4
2
V
µs
130
kHz
0.5
s
PWM RAIL
ƒSW_RAIL
Switching frequency
520
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7.6 Typical Characteristics
CH1 = PWM-A
CH2 = PWM-B
CH1 = RX communication signal
CH2 = TX coil voltage
Figure 1. Typical PWM-A and PWM-B Signals
Figure 2. TX Coil and RX Communication Signals
With RX No Load
CH1 = RX communication signal
CH2 = TX coil voltage
Figure 3. TX Coil and RX Communication Signals
With Rx 10-W Load
8
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8 Detailed Description
8.1 Overview
The principle of wireless power transfer is simply an open-cored transformer consisting of a transmitter and
receiver coils. The transmitter coil and electronics are typically built into a charger pad and the receiver coil and
electronics are typically built into a portable device, such as a cell phone. When the receiver coil is positioned on
the transmitter coil, magnetic coupling occurs when the transmitter coil is driven. The flux is coupled into the
secondary coil, which induces a voltage and current flows. The secondary voltage is rectified, and power can be
transferred effectively to a load, wirelessly. Power transfer can be managed through any of the various closedloop control schemes.
After power is applied and the device comes out of reset, it can automatically begin the process of detecting and
powering a receiver. The bq500215 sends a ping to detect the presence of a receiver on the pad. After a
receiver is detected, the bq500215 attempts to establish communication and begin power transfer. If the
transmitter detects the bq51025 receiver through its proprietary authentication protocol, the transmitter allows 10W operation. If a standard 5-W WPC compliant receiver is detected, the transmitter allows 5-W of delivered
power as per WPC specification. The bq500215 controls a full-bridge power stage to drive the primary coil. It
regulates the power being delivered to the receiver by modulating the supply voltage of the power stage while
operating at a constant frequency. The full bridge power stage allows for higher power delivery for a given supply
voltage.
8.2 Functional Block Diagram
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8.3 Feature Description
8.3.1 A29 Coil Specification
The bq500215 controller supports A29 TX coil type. The coil and matching capacitor specification for A29
transmitter has been established by the WPC Standard. This is fixed and cannot be changed on the transmitter
side.
For a current list of coil vendors, see bqTESLA Transmitter Coil Vendors, SLUA649.
8.3.2 Option Select Pins
There are two option select pins (pin 60, LOSS_THR, and pin 61, LED_MODE) on the bq500215 and five
selector outputs (pins 19, 20, 22, 23, and 24) used to read multiple voltage thresholds . All the pin voltages will
be read by bq500215 at power-up.
• Pin 60 is used to program the loss threshold and calibrate the FOD algorithms.
• Pin 61 is used to select the LED mode of the device.
• Pins 19, 20, 22, 23, and 24 are used to sequentially bias the five programming resistors shown in Figure 4.
At power-up, a bias current is applied to pins LED_MODE and LOSS_THR, and the resulting voltage is
measured to identify the value of the attached programming resistor. For LED_MODE, the selected bin
determines the LED behavior based on Table 1. For the LOSS_THR, the selected bin sets a threshold based on
Table 2. See FOD and Parasitic Metal Object Detect (PMOD) Calibration for more information.
To 12-bit ADC
FOD
PMOD
60
FOD_CAL
LOSS_THR
61
FP_DECAY
Resistors
to set
options
FP_RES
LED_MODE
19
20
22
23
24
Figure 4. Pin 60 LOSS_THR and Pin 61 LED_MODE Connections
10
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Feature Description (continued)
8.3.3 LED Modes
The bq500215 can directly drive three LED outputs (pin 12, pin 13, and pin 25) through a simple current limit
resistor (typically 470 Ω), based on the mode selected. The three current limit resistors can be individually
adjusted to tune or match the brightness of the LEDs. Do not exceed the maximum output current rating of the
device.
The selection resistor, connected between pin 61 and GND, selects one of the desired LED indication schemes
presented in Table 1.
Table 1. LED Modes
LED
CONTROL
OPTION
LED
SELECTION
RESISTOR
X
<36.5 kΩ
OPERATIONAL STATES
DESCRIPTION
LED
STANDBY
POWER
TRANSFER
CHARGE
COMPLETE
FAULT
FOD Warning
High Power
Transfer (1)
—
—
—
—
—
—
LED_A, green
Off
Blink slow (2)
On
Off
Off
Blink fast (3)
LED_B, red
Off
Off
Off
On
Blink fast (3)
Off (3)
LED_A, green
Reserved, do not use
LED_B, red
LED_C, amber
1
2
3 (4)
4
5
6
7
8
9
10
(1)
(2)
(3)
(4)
42.2 kΩ
48.7 kΩ
56.2 kΩ
64.9 kΩ
75 kΩ
86.6 kΩ
100 kΩ
115 kΩ
133 kΩ
154 kΩ
Choice number 1
Choice number 2
Choice number 3
Choice number 4
Choice number 5
Choice number 6
Choice number 7
Choice number 8
Choice number 9
Choice number 10
LED_C, amber
—
—
—
—
—
—
LED_A, green
On
Blink slow (2)
On
Off
Off
Blink fast (3)
Off (3)
LED_B, red
On
Off
Off
On
Blink fast (3)
LED_C, amber
—
—
—
—
—
—
LED_A, green
Off
On
Off
Blink fast (3)
On
On
—
LED_B, red
—
—
—
—
—
LED_C, amber
—
—
—
—
—
—
LED_A, green
Off
On
Off
Off
Off
On
Off
LED_B, red
Off
Off
Off
On
Blink fast (3)
LED_C, amber
—
—
—
—
—
—
LED_A, green
Off
Off
On
Off
Off
Off
On
LED_B, red
Off
On
Off
Off
On
LED_C, amber
Off
Off
Off
Blink slow (2)
Off
Off
LED_A, green
Off
Blink slow (2)
On
Off
Off
Blink fast (3)
LED_B, red
Off
Off
Off
On
Blink fast (3)
Off
LED_C, amber
Off
Off
Off
Off
Off
Off
LED_A, green
Off
Blink slow (2)
Off
Off
Off
Blink fast (3)
LED_B, red
Off
Off
On
Off
Off
Off
LED_C, amber
Off
Off
Off
On
Blink fast (3)
Off
LED_A, green
Off
Off
On
Blink slow (2)
Off
Off
LED_B, red
Off
On
Off
Blink slow (2)
On
On
LED_C, amber
—
—
—
—
—
—
LED_A, green
Off
Blink slow (2)
On
Off
Off
Blink fast (3)
Off
LED_B, red
Off
OFF
Off
On
Blink fast (3)
LED_C, amber
—
—
—
—
—
—
LED_A, green
Off
On
Off
Blink fast (3)
On
On
LED_B, red
Off
Off
On
Off
Off
Off
LED_C, amber
—
—
—
—
—
—
Power transfer when operating with bq51025 wireless power receiver
Blink slow = 0.625 Hz
Blink fast = 2.5 Hz
The indication of the shutdown after an negative temperature coefficient (NTC) event may experience a delay in the rapid LED blinking
even though the power transfer has been disabled. The indication delay may persist up to as long as the entire NTC FAULT holdoff
time.
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8.3.4 FOD and Parasitic Metal Object Detect (PMOD) Calibration
The bq500215 supports multiple levels of protection against heating metal objects placed in the magnetic field.
An initial analysis of the impulse response to a short ping (FOD ping) detects most metal objects before any
power transfer is initiated. If a foreign metallic object is detected by the FOD ping, an FOD warning is issued (see
Table 1) for up to 6 seconds after the object is removed. In the case where a bq51025 receiver with a potential
foreign object is detected, the bq500215 transmitter will not configure the receiver in proprietary 10-W mode in
order to limit the losses in the foreign object. After power transfer has started, improved FOD (WPC1.1) and
enhanced PMOD (WPC 1.0) features continuously monitor input power, known losses, and the value of power
reported by the RX device being charged. Using these inputs, the bq500215 can estimate how much power is
unaccounted for and presumed lost due to metal objects placed in the wireless power transfer path. If this
unexpected loss exceeds the threshold set by the FOD or PMOD resistors, a fault is indicated and power transfer
is halted. The ID packet of the receiver being charged determines whether the FOD or PMOD algorithm is used.
The ultimate goal of the FOD feature is safety, to protect misplaced metal objects from becoming hot. Reducing
the loss threshold and making the system too sensitive leads to false trips and a bad user experience. Find the
balance which best suits the application. If the application requires disabling one function or the other (or both), it
is possible by leaving the respective FOD/PMOD terminal open. For example, to selectively disable the PMOD
function, PMOD should be left open. A final level of protection is provided with an optional temperature sensor to
detect any large increase in temperature in the system (see Shut Down Through External Thermal Sensor or
Trigger).
NOTE
Disabling FOD results in a TX solution that is not WPC v1.1 compliant.
Resistors of 1% tolerance should be used for a reliable selection of the desired threshold. The FOD and PMOD
resistors (pin 23 and pin 24) program the permitted power loss for the FOD and PMOD algorithms respectively.
The FOD_CAL resistor (pin 22), can be used to compensate for any load-dependent effect on the power loss.
Using a calibrated FOD reference receiver with no foreign objects present, the FOD_CAL resistor should be
selected such that the calculated loss across the load range is substantially constant (within approximately 100
mW). After correcting for the load dependence, the FOD and PMOD thresholds should be re-set above the
resulting average by approximately 400 mW for the transmitter to satisfy the WPC requirements on tolerated
heating.
Contact TI for the TX tuning tool to set appropriate FOD, PMOD, and FOD_CAL resistor values for your design.
Table 2. Option Select Bins
12
Bin Number
Resistance (kΩ)
Loss Threshold (mW)
0
<36.5
250
1
42.2
300
2
48.7
350
3
56.2
400
4
64.9
450
5
75.0
500
6
86.6
550
7
100
600
8
115
650
9
133
700
10
154
750
11
178
800
12
205
850
13
>237
Feature disabled
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8.3.5 FOD Ping Calibration
The bq500215 is able to detect most metal objects in the charging pad by analyzing the impulse response to a
short ping (FOD ping) sent before any power transfer is initiated. The bq500215 does this analysis by measuring
the change in resonant frequency and decay of the pulse response and comparing it to given threshold values
that are set by resistor in FP_RES and FP_DECAY pins.
Resistors of 1% tolerance should be used for a reliable selection of the desired threshold. The FP_RES and
FP_DECAY resistors (pin 19 and pin 20) program the boundary conditions to determine is a receiver or a metal
object is detected. The recommended resistor value for both FP_RES and FP_DECAY pins is 86.6 kΩ.
Contact TI for inquiries regarding FOD ping calibration.
NOTE
Removing resistors in FP_DECAY and FP_RES pins disables FOD ping and hence
foreign object detection prior to power transfer.
8.3.6 Shut Down Through External Thermal Sensor or Trigger
Typical applications of the bq500215 do not require additional thermal protection. This shutdown feature is
provided for enhanced applications and is not limited to thermal shutdown. The key parameter is the 1-V
threshold on pin 2, T_SENSE. Voltage below 1-V on pin 2 causes the device to shut down.
The application of thermal monitoring through a negative temperature coefficient (NTC) sensor, for example, is
straightforward. The NTC forms the lower leg of a temperature-dependant voltage divider. The NTC leads are
connected to the bq500215 device, pin 2 and GND. The threshold on pin 2 is set to 1-V, below which the system
shuts down and a fault is indicated (depending on LED mode chosen).
To
1.
2.
3.
4.
implement this feature follow these steps:
Consult the NTC data sheet and find the resistance versus temperature curve.
Determine the actual temperature where the NTC will be placed by using a thermal probe.
Read the NTC resistance at that temperature in the NTC data sheet, that is R_NTC.
Use the following formula to determine the upper leg resistor (R_Setpoint):
R _ Setpoint = 2.3 ´ R _ NTC
(1)
The system restores normal operation after approximately five minutes or if the receiver is removed. If the feature
is not used, this pin must be pulled high.
NOTE
Pin 2, T_SENSE, must always be terminated; otherwise, erratic behavior may occur.
3V3_VCC
Optional
Temperature
Sensor
R_Setpoint
T_SENSE
NTC
2
AGND
AGND
Figure 5. NTC Application
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8.3.7 Fault Handling and Indication
Table 3 shows end power transfer (EPT) packet responses, fault conditions, and the duration of how long the
condition lasts until a retry in attempted. The LED mode selected determines how the LED indicates the condition
or fault.
Table 3. Fault Handling and Indication
(1)
(2)
(3)
CONDITION
DURATION (1)
(BEFORE RETRY)
EPT-00
Immediate (2)
Unknown
EPT-01
up tp 5 s (3)
Charge complete
EPT-02
Infinite
Internal fault
EPT-03
5 minutes
Over temperature
EPT-04
Immediate (2)
Over voltage
EPT-05
Immediate (2)
Over current
EPT-06
Infinite
Battery failure
EPT-07
Not applicable
Reconfiguration
EPT-08
Immediate (2)
No response
OVP (over voltage)
Immediate (2)
OC (over current)
1 minute
NTC (external sensor)
5 minutes
PMOD/FOD warning
6s
PMOD/FOD
5 minutes
HANDLING
4-s LED only,
2-s LED + buzzer
After a FAULT, the magnetic field is recharacterized to improve the ability to detect the removal of the at-fault receiver. If the receiver is
removed in the first second immediately following the detection of this fault (before the re-characterization is complete), the field
corresponding to an empty pad may be associated with the faulty receiver and the LED indication may continue to indicate a fault state
even though no receiver is present. This indication persists until either the HOLDOFF time expires or a new receiver disturbs the field, at
which time normal operation, with proper LED indication, is resumed.
Immediate is <1 s.
The TX may retry immediately (<1 s) to start power after first EPT-01 is received. If the receiver is continuously sending EPT-01, the TX
holdoff time will be 5 seconds
8.3.8 Power Transfer Start Signal
The bq500215 features two signal outputs to indicate that power transfer has begun. Pin 31 BUZ_AC outputs a
400-ms duration, 4-kHz square wave for driving low cost AC type ceramic buzzers. Pin 32 BUZ_DC outputs logic
high, also for 400-ms, which is suitable for DC type buzzers with built-in tone generators, or as a trigger for any
type of customized indication scheme. Do not exceed 4-mA loading from either of these pins which is more than
adequate for small signaling and actuation. If not used, these pins should be left open.
8.3.9 Power-On Reset
The bq500215 has an integrated power-on reset (POR) circuit which monitors the supply voltage and handles
the correct device startup sequence. Additional supply voltage supervisor or reset circuits are not needed.
8.3.10 External Reset, RESET Pin
The bq500215 can be forced into a reset state by an external circuit connected to the RESET pin. A logic low
voltage on this pin holds the device in reset. For normal operation, this pin is pulled up to 3.3-V supply with a 10kΩ pullup resistor.
8.3.11 Trickle Charge and CS100
The WPC specification provides an EPT message (EPT–01) to indicate charge complete. Upon receipt of the
charge complete message, the bq500215 disables the output and changes the LED indication. The exact
indication depends on the LED_MODE chosen.
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In some battery charging applications, there is a benefit to continue the charging process in trickle-charge mode
to top off the battery. The WPC specification provides for an informational 'Charge Status' packet that conveys
the level of battery charger. The bq500215 uses this command to enable top-off charging. The bq500215
changes the LED indication to reflect charge complete when a Charge Status message is 100% received, but
unlike the response to an EPT, it will not halt power transfer while the LED indicates charge complete. The
mobile device can use a CS100 packet to enable trickle charge mode.
If the reported charge status drops below 90%, normal charging indication is resumed.
8.4 Device Functional Modes
8.4.1 Power Transfer
Power transfer depends on coil coupling. Coupling depends on the distance between coils, alignment, coil
dimensions, coil materials, number of turns, magnetic shielding, impedance matching, frequency, and duty cycle.
Most importantly, the receiver and transmitter coils must be aligned for best coupling and efficient power transfer.
The smaller the space between the coils is, the better the coupling.
Shielding is added as a backing to both the transmitter and receiver coils to direct the magnetic field to the
coupled zone. Magnetic fields outside the coupled zone do not transfer power. Thus, shielding also serves to
contain the fields to avoid coupling to other adjacent system components.
Regulation can be achieved by controlling any one of the coil coupling parameters. However, for WPC
compatibility, the transmitter-side coils and capacitance are specified and the resonant frequency point is fixed.
Power transfer is regulated by changing the supply voltage to the full-bridge power stage; higher voltage delivers
more power. Duty cycle remains constant at 50% throughout the power band and frequency also remains
constant at 130 kHz.
The WPC standard describes the dimensions, materials of the coils, and information regarding the tuning of the
coils to resonance. The value of the inductor and resonant capacitor are critical to proper operation and system
efficiency.
8.4.2 Communication
Communication within the WPC is from the receiver to the transmitter, where the receiver tells the transmitter to
send power and how much. To regulate, the receiver must communicate with the transmitter whether to increase
or decrease frequency. The receiver monitors the rectifier output and using amplitude modulation (AM), sends
packets of information to the transmitter. A packet is comprised of a preamble, a header, the actual message,
and a checksum, as defined by the WPC standard.
The receiver sends a packet by modulating an impedance network. This AM signal reflects back as a change in
the voltage amplitude on the transmitter coil. The signal is demodulated and decoded by the transmitter-side
electronics and the voltage on the inverter is adjusted to close the regulation loop. The bq500215 features
internal digital demodulation circuitry.
The modulated impedance network on the receiver can either be resistive or capacitive. Figure 6 shows the
resistive modulation approach, where a resistor is periodically added to the load, and the resulting amplitude
change in the transmitter voltage. Figure 7 shows the capacitive modulation approach, where a capacitor is
periodically added to the load and the resulting amplitude change in the transmitter voltage.
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Device Functional Modes (continued)
Rectifier
Receiver Coil
Receiver
Capacitor
Amax
Modulation
Resitor
Operating state at logic “0”
A(0)
Operating state at logic “1”
A(1)
Comm
Fsw
a)
F, kHz
b)
Figure 6. Receiver Resistive Modulation Circuit
Rectifier
Receiver Coil
Receiver
Capacitor
Modulation
Capacitors
Amax
Comm
A(0)
Operating state at logic “ 0”
A(1)
Operating state at logic “ 1”
Fsw
F, kHz
Fo(1) < Fo(0)
a)
b)
Figure 7. Receiver Capacitive Modulation Circuit
The bq500215 also supports a proprietary handshake with the bq51025 in which minimal communication from
the TX to the RX is used. This proprietary handshake enables the bq500215 to deliver power to the bq51025
receiver at levels higher than 5 W. The transmitter-to-receiver communication is achieved through frequency
modulation of the power signal.
8.4.3 Power Trains
The bq500215 drives a full-bridge power stage, which drives the coil assembly. TI recommends the
CSD97374CQ4M as the driver-plus-MOSFET device for this application. The supply voltage (Vrail) is controlled
by the bq500215 device.
8.4.4 Power Train Voltage Control
The bq500215 controls power delivery by modulating the supply voltage (Vrail) of the power stage driving the coil
assembly. The bq500215 device generates a PWM control signal in the PWM_RAIL terminal that controls an
external power stage circuit (TI recommends CSD97374CQ4M). The switching frequency for this DC-DC
controller signal is 520 kHz.
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Device Functional Modes (continued)
8.4.5 Signal Processing Components
The COMM signal used to control power transfer is derived from the coil voltage. The AC coupled coil voltage is
scaled down to a manageable level and biased to a 1-V offset. Series connected diodes are provided for
protection from any possible transients.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The bq500215 device is a wireless power transmitter controller designed for 5-W WPC compliant applications as
well as up to 10-W applications (in combination with the bq51025 wireless receiver). It integrates all functions
required to control wireless power transfer to a WPC v1.1 compliant receiver. Several tools are available for the
design of the system. See the product folder on www.ti.com for more details. The following sections highlight
some of the system design considerations.
9.2 Typical Application
Figure 8 shows the application block diagram for the transmitter.
12V
Input
TLV70450
Simple 5V Linear
TPS54231D
Buck 3.3V
I_SENSE
INA199A1
Current Monitor
Start-up
circuitry
2
IC
Bq500410
WPC Qi Controller
VRAIL PWM
bq500215
CSD97374CQ4M
Power Stage
PWM_A
VRAIL
CSD97374CQ4M
Power Stage
Coil
Assembly
PWM_B
CSD97374CQ4M
Power Stage
Figure 8. bq500215 System Diagram
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Typical Application (continued)
9.2.1 Design Requirements
Table 4. Design Parameters
DESIGN PARAMETER
VALUE
WPC coil type
A29
Input voltage
12 V
9.2.2 Detailed Design Procedure
9.2.2.1 Capacitor Selection
Capacitor selection is critical to proper system operation. The total capacitance value of 2 × 100 nF + 47 nF is
required in the resonant tank. This is the WPC system compatibility requirement, not a guideline.
NOTE
A total capacitance value of 2 × 100 nF + 47 nF (C0G dielectric type, 100-V rating) is
required in the resonant tank to achieve the correct resonance frequency.
The capacitors chosen must be rated for at least 100 V and must be of a high-quality C0G dielectric (sometimes
also called NP0). These are typically available in a 5% tolerance, which is adequate. TI does not recommend the
use of X7R types or below if WPC compliance is required because critical WPC Certification Testing, such as the
minimum modulation or guaranteed power test, might fail.
The designer can combine capacitors to achieve the desired capacitance value. Various combinations can work
depending on market availability. All capacitors must be of C0G types (not mixed with any other dielectric types).
9.2.2.2 Current Monitoring Requirements
The bq500215 is WPC v1.1 ready. To enable the PMOD or FOD features, provide current monitoring in the
design.
For proper scaling of the current monitor signal, the current sense resistor should be 20 mΩ and the current
shunt amplifier should have a gain of 50, such as the INA199A1. For FOD accuracy, the current sense resistor
must be a quality component with 0.5% tolerance, at least 1/4-W rating, and a temperature stability of ±200 PPM.
Proper current sensing techniques in the application hardware should also be observed.
9.2.2.3 All Unused Pins
All unused pins can be left open unless otherwise indicated. Refer to the table in Pin Configuration and
Functions. To improve PCB layout, ground unused pins, if it is an option.
9.2.2.4 Input Regulators
The bq500215 requires 3.3 VDC to operate. A buck converter is used to step down from the supply voltage, such
as the TPS54231D used in this design.
9.2.2.5 Input Power Requirements
The design works with 12-V input voltage. A29 TX type requires 12-V system voltage.
9.2.2.6 LED Mode
bq500215 can directly drive three LED outputs (pin 12 (LED-A), pin 13 (LED-B), and pin 25 (LED-C)). Select one
of the desired LED indication schemes by choosing the selection resistor connected between pin 61
(LED_MODE) and GND.
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100%
100%
90%
90%
80%
80%
70%
70%
60%
60%
Efficiency
Efficiency
9.2.3 Application Curves
50%
40%
30%
50%
40%
30%
VOUT = 10V
VOUT = 7V
VOUT = 5V
20%
10%
bq51013B
bq51021
bq51221
20%
10%
0
0
0
1
2
3
4
5
6
Output Power (W)
7
8
9
10
0
0.1
0.2
0.3
D001
Figure 9. System Efficiency With bq51025 10-W RX
0.4
0.5 0.6
IOUT (A)
0.7
0.8
0.9
1
D001
Figure 10. System Efficiency With WPC 5-W RX
8.1
7.8
7.5
7.2
VRAIL (V)
6.9
6.6
6.3
6
bq51013B
bq51021
bq51221
bq51025 - 5V
bq51025 - 7V
5.7
5.4
5.1
4.8
4.5
0
0.2
0.4
0.6
0.8
1
1.2
IOUT (A)
1.4
1.6
1.8
2
D002
Figure 11. VRAIL Voltage Level vs WPC RX Load
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10 Power Supply Recommendations
This device is designed to operate from an input voltage supply range between 3- to 3.6-V, nominal 3.3-V. The
A29 TX type requires a 12-V system voltage.
11 Layout
11.1 Layout Guidelines
Careful PCB layout practice is critical to proper system operation. Many references are available on proper PCB
layout techniques. A few good tips are as follows:
The TX layout requires a 4-layer PCB layout for best ground plane technique. A 2-layer PCB layout can be
achieved though not as easily. Ideally, the approach to the layer stack-up is:
•
•
•
•
Layer
Layer
Layer
Layer
1
2
3
4
component placement and as much ground plane as possible
clean ground
finish routing
clean ground
Thus, the circuitry is virtually sandwiched between grounds. This minimizes EMI noise emissions and also
provides a noise-free voltage reference plane for device operation.
Keep as much copper as possible. Make sure the bq500215 GND pins and the EPAD GND power pad have a
continuous flood connection to the ground plane. The power pad should also be stitched to the ground plane,
which also acts as a heat sink for the bq500215. A good GND reference is necessary for proper bq500215
operation, such as analog-digital conversion, clock stability, and best overall EMI performance.
Separate the analog ground plane from the power ground plane and use only one tie point to connect grounds.
Having several tie points defeats the purpose of separating the grounds.
The COMM return signal from the resonant tank should be routed as a differential pair. This is intended to reduce
stray noise induction. The frequencies of concern warrant low-noise analog signaling techniques, such as
differential routing and shielding, but the COMM signal lines do not need to be impedance matched.
The DC-DC buck regulator used from the 12-V input supplies the bq500215 with 3.3-V. Typically, the designer
uses a single-chip controller solution with integrated power FET and synchronous rectifier or outboard diode. Pull
in the buck inductor and power loop as close as possible to create a tight loop. Likewise, the power-train, fullbridge components should be pulled together as tight as possible. See the bq500215 EVM for an example of a
good layout technique.
11.2 Layout Example
A DC-DC buck regulator is used to step down the system voltage to the 3.3-V supply to the bq500215. The
system voltage is 12-V; with such a step-down ratio, switching duty-cycle is low and the regulator is mostly
freewheeling. Therefore, place the freewheeling diode current loop as close to the switching regulator as possible
and use wide traces. Place the buck inductor and power loop as close to that as possible to minimize current
path.
Place 3.3-V buck regulator input bypass capacitors as close as possible to the buck IC.
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Layout Example (continued)
Figure 12. 3.3-V DC-DC Buck Regulator Layout
Make sure the bypass capacitors intended for the bq500215 3.3-V supply are actually bypassing these supply
pins (pin 44, V33DIO, pin 45, V33D, and pin 46, V33A) to solid ground plane. This means they need to be placed
as close to the device as possible and the traces must be as wide as possible.
Figure 13. Bypass Capacitors Layout
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Layout Example (continued)
Make sure the bq500215 has a continuous flood connection to the ground plane.
Figure 14. Continuous GND Layout
A buck regulator is used to regulate the supply voltage to the full bridge. The buck power stage IC is controlled
by a PWM signal generated by the bq500215 IC, and it is directly powered from the 12-V input supply. Because
the buck output voltage can operate at a wide voltage range, significant current low is expected in both the buck
power stage input and ground connections. Make sure wide traces and continuous pours are used for input and
ground. Place input bypass capacitors, output capacitor and inductor as close as possible to the buck power
stage to make the current loop as small as possible.
Figure 15. V_RAIL Power Stage Layout
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Layout Example (continued)
The full-bridge power stage that drives the TX coil is composed of two half-bridge power stages and resonant
capacitors. Inputs bypass capacitors should be placed as close as possible to the power stage ICs. The input
and ground pours and traces should be made as wide as possible for better current flow. The trace to the coil
and resonant capacitors should also be made as wide as possible.
Figure 16. Ground Layout
To ensure proper operation, grounds conducting a large amount of current and switching noise must be isolated
from low current, quiet grounds. Separate the ground pours for the power stages and the bq500215 IC. Connect
all grounds to a single point at the main ground terminal.
Figure 17. Ground Layout
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Layout Example (continued)
Proper current sensing layout technique is very important, as it directly affects the FOD and PMOD performance.
When sampling the very-low voltages generated across a current sense resistor, be sure to use the so called 4wire or Kelvin-connection technique. This is important to avoid introducing false voltage drops from adjacent
pads and copper power routes. It is a common power-supply layout technique. Some high-accuracy sense
resistors have dedicated sense pins.
Figure 18. Current Sensing Layout
The COMM+/COMM– sense lines should be run as a balanced or differential pair. For communication, the WPC
packet information runs at 2 kHz, which is essentially audio frequency content, and this balancing reduces noise
pickup from the surrounding switching power electronics. The designer does not need to tune or impedancematch these lines as would be the case in RF signaling. It is important to keep this lines isolated from any fast
switching signal such as PWM, to prevent noise from being injected into the line.
The V_RAIL+/VRAIL– sense lines should also run as differential pair. Figure 19 shows a layout example for a
differential pair layout.
Figure 19. Balanced Differential Signal Layout
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Layout Example (continued)
A bypass capacitor needs to be connected between the point where the 3.3-V bias supply is connected to the
COMM+ resistor divider and the divider/COMM– ground connection.
Figure 20. Bypass Capacitors Layout for COMM+ Resistor Divider 3.3-V Bias
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12 Device and Documentation Support
12.1 Device Support
1. Technology, Wireless Power Consortium, www.wirelesspowerconsortium.com/
2. Analog applications journal, An Introduction to the Wireless Power Consortium Standard and TI’s Compliant
Solutions, Johns, Bill, SLYT401
3. Data sheet, Qi Compliant Wireless Power Transmitter Manager, SLUSAL8
4. Data sheet, Integrated Wireless Power Supply Receiver, Qi (WPC) Compliant, bq51011, bq51013, SLVSAT9
5. Data sheet, bq51025 WPC v1.1 Compliant Single Chip Wireless Power Receiver With Proprietary 10-W
Power Delivery, SLUSBX7
6. Application note, Building a Wireless Power Transmitter, SLUA635
7. Application note, bqTESLA Transmitter Coil Vendors, SLUA649
12.2 Trademarks
All trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: bq500215
27
PACKAGE OPTION ADDENDUM
www.ti.com
16-Nov-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
BQ500215RGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
BQ500215
BQ500215RGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
BQ500215
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
16-Nov-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Apr-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
BQ500215RGCR
VQFN
RGC
64
2000
330.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
BQ500215RGCT
VQFN
RGC
64
250
180.0
16.4
9.3
9.3
1.1
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Apr-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ500215RGCR
VQFN
RGC
64
2000
367.0
367.0
38.0
BQ500215RGCT
VQFN
RGC
64
250
210.0
185.0
35.0
Pack Materials-Page 2
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