AIC1189 Ultra LDO 2A Linear Regulator With Adjustable & Bypass Pin FEATURES DESCRIPTION Guaranteed 2A Output Current. Fast Response in Line/Load Transient. Wide Operating Voltage Ranges: 2.3V to 5.5V. 0.01µA Shutdown Standby Current . Low Quiescent Current: 80µA. Fixed: 1.2V, 1.5V, 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V, 3.5V, 3.7V, 3.8V Output Voltage. Adjustable Output Voltage are available from 0.8~4.5V. Low Dropout 330mV at 1.5A and 2.8V output voltage, 440mV at 2A and 2.8V output voltage. High PSRR 70dB at 1kHz. ： ： Active Low or High Shutdown Control.Current Limit and Thermal Protection. ± Available in 2% Output Tolerance. Available in SOT-223 & TO-220 (3 pin) & SOP8 (8 pin) and TO-252 &TO-263 (3 & 5 pin) Package. APPLICATIONS A low noise, high PSRR and ultra low dropout linear regulator AIC1189 is optimized for low ESR ceramic capacitors operation with 2A continuous current. The AIC1189 is designed for portable and wireless devices with demanding performance and space requirements. The AIC1189 offers high precision output voltage of ±2% tolerance. Output voltage can also be adjusted for those other than the preset values. A noise bypass pin is available for further reduction of output noise. The bypass pin could be floating if it’s unnecessary. At 2A load current and 2.8V output voltage, a 440mV dropout is performed. The quality of low quiescent current and low dropout voltage makes this device ideal for battery power applications. The high ripple rejection and low noise of the AIC1189 provide enhanced performances for critical applications such as cellular phones, and PDAs. In addition, a logic-level shutdown input is included, which reduce supply current to 0.01µA (typ.) in shutdown mode with fast turn-on time less than 100µs. The AIC1189’s current limit and thermal protection provide protection against any overload condition that would create excessive junction temperatures. LCD TV, LCD Monitor, DPF. Networking, STB. Portable AV Equipment. Note Book PC Applications. PC Peripherals. TYPICAL APPLICATION CIRCUIT AIC1189AL-33 AIC1189-33 Vin 1 VIN VOUT 3 GND 1 ENABLE VOUT EN ADJ 4 5 Cin 4.7uF R1 300k R2 120k 3 Cout 4.7uF Fixed Linear Regulator Analog Integrations Corporation Vout 3.3V VIN Vout 2.8V GND 2 Cin 4.7uF 2 Vin Cout 4.7uF Adjustable Linear Regulator Si-Soft Research Center 3A1, No.1, Li-Hsin Rd. I, Science Park, Hsinchu 300, Taiwan, R.O.C. TEL: 886-3-5772500, FAX: 886-3-5772510 www.analog.com.tw DS-1189G-02 011909 1 AIC1189 TYPICAL APPLICATION CIRCUIT (Continued) EN/SD SW1 AIC1189L 1 2 Vin Vout 2.8V Cin 4.7uF 3 R1 300K 4 EN/SD GND VIN GND VOUT BP ADJ GND 8 7 6 5 Cbp 22nF Cout 4.7uF R2 120K Adjustable Linear Regulator in SOP-8 Package ORDERING INFORMATION AIC1189-XXXXX XX 3 PIN CONFIGURATION PACKING TYPE TR: TAPE & REEL TB: TUBE PACKAGE TYPE Y3: SOT-223 E3: TO-252 M3: TO-263 T3: TO-220 P: Lead Free Commercial G: Green Package OUTPUT VOLTAGE 12: 1.2V 15: 1.5V 18: 1.8V 20: 2.0V 25: 2.5V 27: 2.7V 30: 3.0V 33: 3.3V 35: 3.5V 37: 3.7V 38: 3.8V (Of a unit of 0.1V within 0.8~4.5V, additional voltage versions are available on demand) SOT-223 (Y3) TOP VIEW 1: VIN 2: GND (TAB) 3: VOUT 1 2 3 TO-252 (E3) TOP VIEW 1: VIN 2: GND (TAB) 3: VOUT 1 2 3 1 2 3 1 2 3 TO-263 (M3) TOP VIEW 1: VIN 2: GND (TAB) 3: VOUT TO-220 (T3) TOP VIEW 1: VIN 2: GND (TAB) 3: VOUT Example: AIC1189-18PE3TR 1.8V Version, in TO-252 Lead Free Package & Tape & Reel Packing Type 2 AIC1189 ORDERING INFORMATION (Continued) AIC1189XX-XXXXX XX 5 PIN CONFIGURATION PACKING TYPE TR: TAPE & REEL TB: TUBE PACKAGE TYPE E5: TO-252-5 M5: TO-263-5 P: Lead Free Commercial G: Green Package OUTPUT VOLTAGE 12: 1.2V 15: 1.5V 18: 1.8V 20: 2.0V 25: 2.5V 27: 2.7V 30: 3.0V 33: 3.3V 35: 3.5V 37: 3.7V 38: 3.8V TO-252-5 (E5) TOP VIEW 1: EN / EN 2: VIN 3: GND (TAB) 4: VOUT 5: BP/ ADJ 12345 TO-263-5 (M5) TOP VIEW 1: EN / EN 2: VIN 3: GND (TAB) 4: VOUT 5: BP/ ADJ 1 2 3 4 5 (Of a unit of 0.1V within 0.8~4.5V, additional voltage versions are available on demand) ENABLE TYPE L: Chip Enable Low H: Chip Enable High B: Bypass A: ADJ Example: AIC1189BH-18PM5TR With Bypass Pin, Chip Enable High, 1.8V Version, in TO-263-5 Lead Free Package & Tape & Reel Packing Type 3 AIC1189 ORDERING INFORMATION (Continued) AIC1189X-XXXXX XX 8 PIN CONFIGURATION PACKING TYPE TR: TAPE & REEL TB: TUBE PACKAGE TYPE R8: SOP-8 G: Green Package SOP-8 (R8) Exposed Pad (Heat Sink) TOP VIEW 1: EN / EN 2: VIN 3: VOUT 4: ADJ 5: GND (TAB) 6: BP 7: GND (TAB) 8: GND (TAB) 1 8 2 7 3 6 4 5 OUTPUT VOLTAGE 12: 1.2V 15: 1.5V 18: 1.8V 20: 2.0V 25: 2.5V 27: 2.7V 30: 3.0V 33: 3.3V 35: 3.5V 37: 3.7V 38: 3.8V (Of a unit of 0.1V within 0.8~4.5V, additional voltage versions are available on demand) ENABLE TYPE L: Chip Enable Low H: Chip Enable High Example: AIC1189H-18GR8TR Chip Enable High, 1.8V Version, in SOP-8 Green Package & Tape & Reel Packing Type Marking Part No Marking Part No Marking AIC1189-xxPY3 HAxxP AIC1189-xxGY3 HAxxG xx represents output voltage. (08=0.8V, 09=0.9V, ….…, 44=4.4V, 45=4.5V) 4 AIC1189 ABSOLUTE MAXIMUM RATINGS Input Voltage ....................................................................................................................................... 6V EN Pin Voltage .................................................................................................................................... 6V Noise Bypass Terminal Voltage .......................................................................................................... 6V Operating Temperature Range ............................................................................................ -40ºC~85ºC Maximum Junction Temperature .................................................................................................. 150ºC Storage Temperature Range ............................................................................................. -65ºC~150ºC Lead Temperature (Soldering, 10 sec) ......................................................................................... 260ºC Thermal Resistance (Junction to Case) SOT-223 ............................................................... 15ºC /W TO-252 .................................................................... 8ºC /W TO-263 .................................................................... 3ºC /W TO-220 .................................................................... 3ºC /W SOP-8 (Exposed Pad) .......................................... 15ºC /W Thermal Resistance (Junction to Ambient) SOT-223 ............................................................. 130ºC /W (Assume no ambient airflow, no heat sink) TO-252 ................................................................ 100ºC /W TO-263 .................................................................. 60ºC /W TO-220 .................................................................. 50ºC /W SOP-8 (Exposed Pad) 60ºC /W Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. 5 AIC1189 ELECTRICAL CHARACTERISTICS (CIN = Cout = 4.7µF, CBP = 22nF, VIN = VOUT + 1V, TJ=25°°C, unless otherwise specified) (Note 1) PARAMETER TEST CONDITIONS Input Voltage (Note 2) Output Voltage Tolerance IOUT =1mA Continuous Output Current Quiescent Current GND Pin Current Standby Current Chip Enable Low, VEN IOUT = 0 mA Chip Enable High, VEN IOUT = 0 mA Chip Enable Low, VEN IOUT = 2A Chip Enable High, VEN IOUT = 2A ≦0.4V, ≧1.6V, SYMBOL MIN. VIN TYP. MAX. UNIT 2.3 5.5 V VOUT -2 2 % IOUT 2 A IQ 80 110 µA IGND 90 120 µA ISTBY 0.01 0.5 µA 3.2 3.9 A ≦0.4V, ≧1.6V, =V Chip Enable High, V = 0 R = 0.1Ω I = 1.5A, 0.8V≦V <2V I = 2A, 0.8V≦V <2V I = 1.5A, 2V≦V <2.8V I = 2A, 2V≦V <2.8V I = 1.5A, V ≧2.8V I = 2A, V ≧2.8V Chip Enable Low, VEN IN EN Output Current Limit LOAD OUT 1500 1500 OUT OUT OUT OUT 450 600 600 800 330 530 440 700 ∆VLIR 2.5 10 mV 15 mV VDROP OUT OUT OUT OUT Line Regulation 2.2 OUT OUT Dropout Voltage IIL OUT VIN = VOUT + 1V to 5.5V, IOUT =1mA mV Load Regulation IOUT =1mA to 2A ∆VLOR 5 Ripple Rejection f=1KHz, Ripple=0.5Vp-p, PSRR 70 dB Output Noise Voltage CBP = 22nF, f= 10~100KHz 24 µVrms TC 50 ppm/ TSD 150 ∆TSD 20 IADJ 10 100 nA Temperature Coefficient Thermal Shutdown Temperature VIN = VOUT + 1V Thermal Shutdown Hysteresis ℃ ℃ ℃ ADJ Pin Specifications ADJ Pin Current VADJ = VREF ADJ Pin Threshold VTH(ADJ) 0.05 0.1 0.2 V Reference Voltage Tolerance VREF 0.784 0.8 0.816 V 6 AIC1189 ELECTRICAL CHARACTERISTICS (Continued) PARAMETER TEST CONDITIONS SYMBOL Shutdown Pin Current VEN = VIN or GND Shutdown Exit Delay Time IOUT = 30mA MIN. TYP. MAX. UNIT IEN 0 100 nA ∆t 100 RDSON_ CLMP 20 Shutdown Pin Specifications Max Output Discharge Resistance to GND during Shutdown Chip Enable Low, Output OFF, VIN = 2.3V to 5.5V Shutdown Input Threshold Chip Enable High, Output ON, VIN = 2.3V to 5.5V Chip Enable Low, Output ON, VIN = 2.3V to 5.5V Chip Enable High, Output OFF, VIN = 2.3V to 5.5V VENH µS 100 Ω 1.6 V VENL 0.4 Note 1: Specifications are production tested at T =25°C. Specifications over the -40°C to 85°C operating A temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC). Note 2: For SOP-8 Package, VIN = 2.3V to 5.0V. 7 AIC1189 90 90 85 85 VIN = VOUT + 1V 80 VOUT = 1.8V VOUT = 3.3V 75 VOUT = 1.2V 70 65 2.5 3.0 3.5 4.0 4.5 5.0 Ground Current (µA) Quiescent Current (µA) TYPICAL PERFORMANCE CHARACTERISTICS VOUT = 1.8V VOUT = 1.2V 70 0.01 0.1 1 10 Input Voltage (V) Fig1. Quiescent Current vs. Input Voltage Fig2. Ground Current vs. Loading Current 90 VIN = VOUT + 1V 0.25 0.00 VOUT = 1.8V -0.25 -0.50 VOUT = 1.2V -0.75 -20 0 20 40 VIN = VOUT + 1V Quiescent Current (µA) 0.50 85 80 VOUT = 1.2V 70 65 60 60 -40 -20 0 o 20 40 60 80 o Temperature ( C) Fig3. Output Voltage Variation vs. Temperature Fig4. Quiescent Current vs. Temperature 800 600 VOUT = 1.8V VOUT = 3.3V 700 500 o o 400 T = 25 C 300 o T = -40 C 200 100 0.25 0.50 0.75 1.00 1.25 1.50 1.75 Output Current (A) Fig5. Dropout Voltage vs. Output Current 2.00 o Dropout Voltage (mV) T = 85 C Dropout Voltage (mV) VOUT = 3.3V 75 VOUT = 3.3V 80 VOUT = 1.8V Temperature ( C) 0 100 Loading Current (mA) 0.75 Output Voltage Variation (%) VOUT = 3.3V 75 65 1E-3 5.5 1.00 -1.00 -40 80 T = 85 C 600 o T = 25 C 500 o T = -40 C 400 Minimum Operation Voltage 300 200 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 Output Current (A) Fig6. Dropout Voltage vs. Output Current 8 AIC1189 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) 1.224 1.224 VIN = 2.3V 1.216 Output Voltage (V) Output Voltage (V) 1.216 1.208 1.200 1.192 1.184 1.176 1.208 1.200 1.192 1.184 2.5 3.0 3.5 4.0 4.5 5.0 1.176 1E-3 5.5 Input VOltage (V) 0.01 0.1 1 10 100 Loading Current (mA) Fig8. Output Voltage vs. Loading Current Fig7. Output Voltage vs. Input Voltage 1.836 1.836 VIN = 2.8V 1.824 Output Voltage (V) Output Voltage (V) 1.824 1.812 1.800 1.788 1.776 1.764 1.812 1.800 1.788 1.776 2.5 3.0 3.5 4.0 4.5 5.0 1.764 5.5 Input VOltage (V) Fig9. Output Voltage vs. Input Voltage 0.01 0.1 1 10 100 Loading Current (mA) Fig10. Output Voltage vs. Loading Current 3.366 3.366 VIN = 4.3V 3.344 Output Voltage (V) Output Voltage (V) 3.344 3.322 3.300 3.278 3.256 3.234 3.322 3.300 3.278 3.256 3.3 3.6 3.9 4.2 4.5 4.8 5.1 Input VOltage (V) Fig11. Output Voltage vs. Input Voltage 5.4 3.234 0.01 0.1 1 10 100 Loading Current (mA) Fig12. Output Voltage vs. Loading Current 9 AIC1189 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) IOUT = 1mA to 2A VOUT = 1.2V VOUT = 1.2V VOUT Ripple VIN IOUT = 1A IOUT VOUT Ripple Fig13. Load Transient Response at VIN=2.3V, VOUT=1.2V IOUT = 1mA to 2A VOUT = 1.8V Fig14. Line Transient Response at VOUT=1.2V, IOUT=1A IOUT = 1A VOUT = 1.8V VIN VOUT Ripple IOUT VOUT Ripple Fig15. Load Transient Response at VIN=2.8V, VOUT=1.8V VOUT = 3.3V IOUT = 1mA to 2A VOUT Ripple Fig16. Line Transient Response at VOUT=1.8V, IOUT=1A IOUT = 1A VOUT = 3.3V VIN IOUT VOUT Ripple Fig17. Load Transient Response at VIN=4.3V, VOUT=3.3V Fig18. Line Transient Response at VOUT=3.3V, IOUT=1A 10 AIC1189 TYPICAL PERFORMANCE CHARACTERISTICS (Continued) CBP = 0nF CBP = 0.1nF EN EN VOUT VOUT IIN IIN Fig19. Start-up waveform without bypass capacitor Fig20. Start-up waveform with 0.1nF bypass capacitor CBP = 22nF EN EN VOUT VOUT IIN Fig21. Start-up waveform with 22nF bypass capacitor Fig22. Shutdown Transient -20 -30 VIN = 5V, IOUT = 10mA CIN = COUT = 4.7µF PSRR (dB) -40 -50 -60 -70 -80 10 100 1k 10k 100k 1M Frequency (Hz) Fig23. PSRR vs. Frequency 11 AIC1189 BLOCK DIAGRAM PIN DESCRIPTION VIN – Power supply input pin. Bypass with a 4.7µF capacitor to GND GND – Ground. VOUT – Regulator Output pin. Sources up to 2A. EN (5 Pin and 8 Pin) – Chip Enable (Active Low). This pin isn’t allowed to float. EN (5 Pin and 8 Pin) – Chip Enable (Active High). This pin isn’t allowed to float. BP (5 Pin and 8 Pin) – Bypass pin. It should be connected to external 22nF capacitor to GND to reduce output noise. The bypass pin could be floating if it’s unnecessary. ADJ (5 Pin and 8 Pin) – The output voltage can either be set by the internal feedback resistors when this pin is grounded, or be set by the external feedback resistors when using a resistive divider. 12 AIC1189 APPLICATION INFORMATION The AIC1189 is a high performance linear regulator The output voltage of AIC1189 linear regulator can be that provides low-dropout voltage and low quiescent- set by its internal feedback resistors when the ADJ pin current. The device is available in an adjustable is grounded. In addition, the output voltage of AIC1189 version and fixed output voltages ranging from 1.2V to linear regulator can be set by the external feedback 3.8V, and the device can supply loads up to 2A. resistors when connecting a resistive divider R1 and R2. While connecting a resistive divider, VOUT can be SHUTDOWN By connecting EN(EN) pin to VIN(ground), the AIC1189 can be shut down to reduce the supply current to 0.01µA(typ.). At this operation mode, the output calculated as: R VOUT = 0.8 × 1 + 1 R 2 The resistive divider should sit as close to ADJ pin as voltage of AIC1189 is equal to 0V. possible. CURRENT LIMIT The AIC1189 includes a current limiter, which monitors POWER DISSIPATION and controls the maximum output current. If the output The maximum power dissipation of AIC1189 depends is overloaded or shorted to ground, this can protect the on the thermal resistance of its case and circuit board, device from being damaged. the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of THERMAL PROTECTION temperature rise is greatly affected by the mounting The AIC1189 includes a thermal-limiting circuit, which pad configuration on the PCB, the board material, and is designed to protect the device against overload the ambient temperature. When the IC mounting with condition. When the junction temperature exceeds good thermal conductivity is used, the junction TJ=150ºC, the thermal-limiting circuit turns off the pass temperature will be low even when large power transistor and allows the IC to cool. For continuous dissipation applies. load condition, maximum rating of junction temperature The power dissipation across the device is must not be exceeded. P = IOUT (VIN-VOUT) INPUT-OUTPUT CAPACITORS The maximum power dissipation is: Linear regulators require input and output capacitors to PMAX = maintain stability. Input capacitor at 4.7µF with a 4.7µF (TJ-max - TA ) Rθ JA ceramic output capacitor is recommended. To avoid Where TJ-max is the maximum allowable junction oscillation, it is recommended to follow the figure of temperature “Region of Stable COUT ESR vs. Load Current” to temperature suitable in application. choose proper capacitor specifications. As a general rule, the lower temperature is, the better When choosing the input and output (150°C), and TA is the ambient ceramic reliability of the device is. So the PCB mounting pad capacitors, X5R and X7R types are recommended should provide maximum thermal conductivity to because they retain their capacitance over wider maintain low device temperature. ranges of voltage and temperature than other types. LAYOUT CONSIDERATION NOISE BYPASS CAPACITOR A 22nF bypass capacitor at BP pin can reduce output voltage noise. The bypass pin can be floating if it’s unnecessary. Connect the bottom-side pad (available in SOP-8 Exposed Pad) to a large ground plane. Use as much copper as possible to decrease the thermal resistance of the device. OUTPUT VOLTAGE PROGRAMMING 13 AIC1189 PHYSICAL DIMENSIONS SOT-223 PACKAGE OUTLINE DRAWING D b2 1 E A A E SEE VIEW B e e1 b WITH PLATING 2 A A BASE METAL 1 A L VIEW B c SECTION A-A GAUGE PLANE SEATING PLANE θ 5 2 . 0 Note: 1. Refer to JEDEC TO-261AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. S Y M B O L SOT-223 MILLIMETERS MIN. MAX. A 1.80 A1 0.02 0.10 A2 1.55 1.65 b 0.66 0.84 b2 2.90 3.10 c 0.23 0.33 D 6.30 6.70 E 6.70 7.30 E1 3.30 e e1 L θ 3.70 2.30 BSC 4.60 BSC 0.90 0° 8° 14 AIC1189 TO-252-3L PACKAGE OUTLINE DRAWING E A c2 b3 3L D H 4L A A e SEE VIEW B b WITH PLATING BASE METAL c SECTION A-A θ GAUGE PLANE 2L SEATING PLANE L L1 VIEW B 1A Note: 1. Refer to JEDEC TO-252AA and AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. S Y M B O L A A1 b b3 c c2 D E e H L L1 L2 L3 L4 θ MIN. 2.19 0.00 0.64 4.95 0.46 0.46 5.33 6.35 9.40 1.40 0.89 -0° TO-252-3L MILLIMETERS 2.28 BSC 2.67 REF 0.51 BSC MAX. 2.38 0.13 0.89 5.46 0.61 0.89 6.22 6.73 10.41 1.78 2.03 1.02 8° 15 AIC1189 TO-252-5L PACKAGE OUTLINE DRAWING E A c2 b3 3L D e H A A SEE VIEW B b WITH PLATING c BASE METAL SECTION A-A S Y M B O L θ GAUGE PLANE L 2L SEATING PLANE L1 VIEW B 1 A Note: 1. Refer to JEDEC TO-252AD and AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. TO-252-5L MILLIMETERS MIN. MAX. A 2.19 2.38 A1 0.00 0.13 b 0.51 0.71 b3 4.32 5.46 c 0.46 0.61 c2 0.46 0.89 D 5.33 6.22 E 6.35 e 6.73 1.27 BSC H 9.40 L 1.40 L1 10.41 1.78 2.67 REF L2 0.51 BSC L3 0.89 2.03 q 0° 8° 16 AIC1189 TO-263-3L PIN PACKAGE OUTLINE DRAWING A c2 E 1 L D H 2 L A A b2 SEE VIEW B e b WITH PLATING c BASE METAL SECTION A-A θ S Y M B O L GAUGE PLANE L 3 L VIEW B SEATING PLANE 1 A Note: 1. Refer to JEDEC TO-263AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. TO-263-3L MILLIMETERS MIN. MAX. A 4.06 4.83 A1 0.00 0.25 b 0.51 0.99 b2 1.14 1.78 c 0.38 0.74 c2 1.14 1.65 D 8.38 9.65 E 9.65 10.67 e 2.54 BSC H 14.61 15.88 L L1 1.78 -- 1.68 L2 -- 1.78 0.25 BSC L3 q 2.79 0° 8° 17 AIC1189 TO-263-5L PACKAGE OUTLINE DRAWING A c2 E 1L D H A A e SEE VIEW B b WITH PLATING c BASE METAL SECTION A-A θ GAUGE PLANE L 3 L VIEW B SEATING PLANE 1 A Note: 1. Refer to JEDEC TO-263BA. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. S Y M B O L TO-263-5L MILLIMETERS MIN. MAX. A 4.06 4.83 A1 0.00 0.25 b 0.51 0.99 c 0.38 0.74 c2 1.14 1.65 D 8.38 9.65 E 9.65 10.67 e 1.70 BSC H 14.61 15.88 L 1.78 -- 1.68 L1 0.25 BSC L3 q 2.79 0° 8° 18 AIC1189 TO-220 PACKAGE OUTLINE DRAWING A E A1 Q P 1 H D 1 D b WITH PLATING BASE METAL 1L c SECTION A-A L A b2 e A A2 S Y M B O L Note: 1. Refer to JEDEC TO-220AB. 2. Dimension "E" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "D1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. TO-220 MILLIMETERS MIN. MAX. A 3.56 4.82 A1 0.51 1.39 A2 2.04 2.92 b 0.38 1.01 b2 1.15 1.77 c 0.35 0.61 D 14.23 16.51 D1 8.38 9.02 E 9.66 10.66 2.54 BSC e H1 5.85 6.85 L 14.73 L1 12.70 -- P 3.54 4.08 Q 2.54 3.42 6.35 19 AIC1189 SOP-8 Exposed Pad (Heat Sink) PACKAGE OUTLINE DRAWING D D1 E X P O S E D T H E R M A L P A D (H e a t S in k ) (B O T T O M C E N T E R O F P A C K A G E ) E1 e A E H 5°4 X h A S E E V IE W B A B 1A W IT H P L A T IN G BASE M ETAL 25. 0 S E C T IO N A -A GAUG E PLAN E S E A T IN G P L A N E S Y M B O L θ L V IE W B C Note : 1. Refer to JEDEC MS-012E. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. SOP-8 Exposed Pad(Heat Sink) MILLIMETERS MIN. MAX. A 1.35 1.75 A1 0.00 0.15 B 0.31 0.51 C 0.17 0.25 D 4.80 5.00 E 3.80 e 4.00 1.27 BSC H 5.80 6.20 h 0.25 0.50 L 0.40 1.27 q 0° 8° D1 E1 1.5 1.0 3.5 2.55 Note: Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result from its use. We reserve the right to change the circuitry and specifications without notice. Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 20