AIC AIC1189-XXGY3 Ultra ldo 2a linear regulator with adjustable & bypass pin Datasheet

AIC1189
Ultra LDO 2A Linear Regulator With
Adjustable & Bypass Pin
FEATURES
DESCRIPTION
Guaranteed 2A Output Current.
Fast Response in Line/Load Transient.
Wide Operating Voltage Ranges: 2.3V to 5.5V.
0.01µA Shutdown Standby Current .
Low Quiescent Current: 80µA.
Fixed: 1.2V, 1.5V, 1.8V, 2.0V, 2.5V, 2.7V, 3.0V,
3.3V, 3.5V, 3.7V, 3.8V Output Voltage.
Adjustable Output Voltage are available from
0.8~4.5V.
Low Dropout 330mV at 1.5A and 2.8V output
voltage, 440mV at 2A and 2.8V output voltage.
High PSRR 70dB at 1kHz.
:
:
Active Low or High Shutdown Control.Current
Limit and Thermal Protection.
±
Available in 2% Output Tolerance.
Available in SOT-223 & TO-220 (3 pin) & SOP8 (8 pin) and TO-252 &TO-263 (3 & 5 pin)
Package.
APPLICATIONS
A low noise, high PSRR and ultra low dropout
linear regulator AIC1189 is optimized for low ESR
ceramic capacitors operation with 2A continuous
current. The AIC1189 is designed for portable and
wireless devices with demanding performance
and space requirements.
The AIC1189 offers high precision output voltage
of ±2% tolerance. Output voltage can also be
adjusted for those other than the preset values.
A noise bypass pin is available for further
reduction of output noise. The bypass pin could
be floating if it’s unnecessary. At 2A load current
and 2.8V output voltage, a 440mV dropout is
performed. The quality of low quiescent current
and low dropout voltage makes this device ideal
for battery power applications. The high ripple
rejection and low noise of the AIC1189 provide
enhanced performances for critical applications
such as cellular phones, and PDAs.
In addition, a logic-level shutdown input is
included, which reduce supply current to 0.01µA
(typ.) in shutdown mode with fast turn-on time
less than 100µs. The AIC1189’s current limit and
thermal protection provide protection against any
overload condition that would create excessive
junction temperatures.
LCD TV, LCD Monitor, DPF.
Networking, STB.
Portable AV Equipment.
Note Book PC Applications.
PC Peripherals.
TYPICAL APPLICATION CIRCUIT
AIC1189AL-33
AIC1189-33
Vin
1
VIN
VOUT
3
GND
1
ENABLE
VOUT
EN
ADJ
4
5
Cin
4.7uF
R1
300k
R2
120k
3
Cout
4.7uF
Fixed Linear Regulator
Analog Integrations Corporation
Vout
3.3V
VIN
Vout
2.8V
GND
2
Cin
4.7uF
2
Vin
Cout
4.7uF
Adjustable Linear Regulator
Si-Soft Research Center
3A1, No.1, Li-Hsin Rd. I, Science Park, Hsinchu 300, Taiwan, R.O.C.
TEL: 886-3-5772500,
FAX: 886-3-5772510
www.analog.com.tw
DS-1189G-02 011909
1
AIC1189
TYPICAL APPLICATION CIRCUIT
(Continued)
EN/SD
SW1
AIC1189L
1
2
Vin
Vout
2.8V
Cin
4.7uF
3
R1
300K
4
EN/SD
GND
VIN
GND
VOUT
BP
ADJ
GND
8
7
6
5
Cbp
22nF
Cout
4.7uF
R2
120K
Adjustable Linear Regulator in SOP-8 Package
ORDERING INFORMATION
AIC1189-XXXXX XX
3 PIN CONFIGURATION
PACKING TYPE
TR: TAPE & REEL
TB: TUBE
PACKAGE TYPE
Y3: SOT-223
E3: TO-252
M3: TO-263
T3: TO-220
P: Lead Free Commercial
G: Green Package
OUTPUT VOLTAGE
12: 1.2V
15: 1.5V
18: 1.8V
20: 2.0V
25: 2.5V
27: 2.7V
30: 3.0V
33: 3.3V
35: 3.5V
37: 3.7V
38: 3.8V
(Of a unit of 0.1V within
0.8~4.5V, additional voltage
versions are available on
demand)
SOT-223 (Y3)
TOP VIEW
1: VIN
2: GND (TAB)
3: VOUT
1
2
3
TO-252 (E3)
TOP VIEW
1: VIN
2: GND (TAB)
3: VOUT
1
2
3
1
2
3
1 2
3
TO-263 (M3)
TOP VIEW
1: VIN
2: GND (TAB)
3: VOUT
TO-220 (T3)
TOP VIEW
1: VIN
2: GND (TAB)
3: VOUT
Example: AIC1189-18PE3TR
1.8V Version, in TO-252 Lead Free
Package & Tape & Reel Packing Type
2
AIC1189
ORDERING INFORMATION
(Continued)
AIC1189XX-XXXXX XX
5 PIN CONFIGURATION
PACKING TYPE
TR: TAPE & REEL
TB: TUBE
PACKAGE TYPE
E5: TO-252-5
M5: TO-263-5
P: Lead Free Commercial
G: Green Package
OUTPUT VOLTAGE
12: 1.2V
15: 1.5V
18: 1.8V
20: 2.0V
25: 2.5V
27: 2.7V
30: 3.0V
33: 3.3V
35: 3.5V
37: 3.7V
38: 3.8V
TO-252-5 (E5)
TOP VIEW
1: EN / EN
2: VIN
3: GND (TAB)
4: VOUT
5: BP/ ADJ
12345
TO-263-5 (M5)
TOP VIEW
1: EN / EN
2: VIN
3: GND (TAB)
4: VOUT
5: BP/ ADJ
1 2 3 4 5
(Of a unit of 0.1V within
0.8~4.5V, additional voltage
versions are available on
demand)
ENABLE TYPE
L: Chip Enable Low
H: Chip Enable High
B: Bypass
A: ADJ
Example:
AIC1189BH-18PM5TR
With Bypass Pin, Chip Enable High,
1.8V Version, in TO-263-5 Lead Free
Package & Tape & Reel Packing Type
3
AIC1189
ORDERING INFORMATION
(Continued)
AIC1189X-XXXXX XX
8 PIN CONFIGURATION
PACKING TYPE
TR: TAPE & REEL
TB: TUBE
PACKAGE TYPE
R8: SOP-8
G: Green Package
SOP-8 (R8) Exposed Pad (Heat Sink)
TOP VIEW
1: EN / EN
2: VIN
3: VOUT
4: ADJ
5: GND (TAB)
6: BP
7: GND (TAB)
8: GND (TAB)
1
8
2
7
3
6
4
5
OUTPUT VOLTAGE
12: 1.2V
15: 1.5V
18: 1.8V
20: 2.0V
25: 2.5V
27: 2.7V
30: 3.0V
33: 3.3V
35: 3.5V
37: 3.7V
38: 3.8V
(Of a unit of 0.1V within
0.8~4.5V, additional voltage
versions are available on
demand)
ENABLE TYPE
L: Chip Enable Low
H: Chip Enable High
Example:
AIC1189H-18GR8TR
Chip Enable High, 1.8V Version, in
SOP-8 Green Package & Tape & Reel
Packing Type
Marking
Part No
Marking
Part No
Marking
AIC1189-xxPY3
HAxxP
AIC1189-xxGY3
HAxxG
xx represents output voltage. (08=0.8V, 09=0.9V, ….…, 44=4.4V, 45=4.5V)
4
AIC1189
ABSOLUTE MAXIMUM RATINGS
Input Voltage ....................................................................................................................................... 6V
EN Pin Voltage .................................................................................................................................... 6V
Noise Bypass Terminal Voltage .......................................................................................................... 6V
Operating Temperature Range ............................................................................................ -40ºC~85ºC
Maximum Junction Temperature .................................................................................................. 150ºC
Storage Temperature Range ............................................................................................. -65ºC~150ºC
Lead Temperature (Soldering, 10 sec) ......................................................................................... 260ºC
Thermal Resistance (Junction to Case)
SOT-223 ............................................................... 15ºC /W
TO-252 .................................................................... 8ºC /W
TO-263 .................................................................... 3ºC /W
TO-220 .................................................................... 3ºC /W
SOP-8 (Exposed Pad) .......................................... 15ºC /W
Thermal Resistance (Junction to Ambient) SOT-223 ............................................................. 130ºC /W
(Assume no ambient airflow, no heat sink) TO-252 ................................................................ 100ºC /W
TO-263 .................................................................. 60ºC /W
TO-220 .................................................................. 50ºC /W
SOP-8 (Exposed Pad)
60ºC /W
Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.
5
AIC1189
ELECTRICAL CHARACTERISTICS
(CIN = Cout = 4.7µF, CBP = 22nF, VIN = VOUT + 1V, TJ=25°°C, unless otherwise specified) (Note 1)
PARAMETER
TEST CONDITIONS
Input Voltage (Note 2)
Output Voltage Tolerance
IOUT =1mA
Continuous Output Current
Quiescent Current
GND Pin Current
Standby Current
Chip Enable Low, VEN
IOUT = 0 mA
Chip Enable High, VEN
IOUT = 0 mA
Chip Enable Low, VEN
IOUT = 2A
Chip Enable High, VEN
IOUT = 2A
≦0.4V,
≧1.6V,
SYMBOL
MIN.
VIN
TYP.
MAX.
UNIT
2.3
5.5
V
VOUT
-2
2
%
IOUT
2
A
IQ
80
110
µA
IGND
90
120
µA
ISTBY
0.01
0.5
µA
3.2
3.9
A
≦0.4V,
≧1.6V,
=V
Chip Enable High, V = 0
R
= 0.1Ω
I
= 1.5A, 0.8V≦V <2V
I
= 2A, 0.8V≦V <2V
I
= 1.5A, 2V≦V <2.8V
I
= 2A, 2V≦V <2.8V
I
= 1.5A, V ≧2.8V
I
= 2A, V ≧2.8V
Chip Enable Low, VEN
IN
EN
Output Current Limit
LOAD
OUT
1500
1500
OUT
OUT
OUT
OUT
450
600
600
800
330
530
440
700
∆VLIR
2.5
10
mV
15
mV
VDROP
OUT
OUT
OUT
OUT
Line Regulation
2.2
OUT
OUT
Dropout Voltage
IIL
OUT
VIN = VOUT + 1V to 5.5V,
IOUT =1mA
mV
Load Regulation
IOUT =1mA to 2A
∆VLOR
5
Ripple Rejection
f=1KHz, Ripple=0.5Vp-p,
PSRR
70
dB
Output Noise Voltage
CBP = 22nF, f= 10~100KHz
24
µVrms
TC
50
ppm/
TSD
150
∆TSD
20
IADJ
10
100
nA
Temperature Coefficient
Thermal Shutdown
Temperature
VIN = VOUT + 1V
Thermal Shutdown
Hysteresis
℃
℃
℃
ADJ Pin Specifications
ADJ Pin Current
VADJ = VREF
ADJ Pin Threshold
VTH(ADJ)
0.05
0.1
0.2
V
Reference Voltage
Tolerance
VREF
0.784
0.8
0.816
V
6
AIC1189
ELECTRICAL CHARACTERISTICS (Continued)
PARAMETER
TEST CONDITIONS
SYMBOL
Shutdown Pin Current
VEN = VIN or GND
Shutdown Exit Delay Time
IOUT = 30mA
MIN.
TYP.
MAX.
UNIT
IEN
0
100
nA
∆t
100
RDSON_
CLMP
20
Shutdown Pin Specifications
Max Output Discharge
Resistance to GND during
Shutdown
Chip Enable Low, Output OFF,
VIN = 2.3V to 5.5V
Shutdown Input Threshold
Chip Enable High, Output ON,
VIN = 2.3V to 5.5V
Chip Enable Low, Output ON,
VIN = 2.3V to 5.5V
Chip Enable High, Output OFF,
VIN = 2.3V to 5.5V
VENH
µS
100
Ω
1.6
V
VENL
0.4
Note 1: Specifications are production tested at T =25°C. Specifications over the -40°C to 85°C operating
A
temperature range are assured by design, characterization and correlation with Statistical Quality
Controls (SQC).
Note 2: For SOP-8 Package, VIN = 2.3V to 5.0V.
7
AIC1189
90
90
85
85
VIN = VOUT + 1V
80
VOUT = 1.8V
VOUT = 3.3V
75
VOUT = 1.2V
70
65
2.5
3.0
3.5
4.0
4.5
5.0
Ground Current (µA)
Quiescent Current (µA)
TYPICAL PERFORMANCE CHARACTERISTICS
VOUT = 1.8V
VOUT = 1.2V
70
0.01
0.1
1
10
Input Voltage (V)
Fig1. Quiescent Current vs. Input Voltage
Fig2. Ground Current vs. Loading Current
90
VIN = VOUT + 1V
0.25
0.00
VOUT = 1.8V
-0.25
-0.50
VOUT = 1.2V
-0.75
-20
0
20
40
VIN = VOUT + 1V
Quiescent Current (µA)
0.50
85
80
VOUT = 1.2V
70
65
60
60
-40
-20
0
o
20
40
60
80
o
Temperature ( C)
Fig3. Output Voltage Variation vs. Temperature
Fig4. Quiescent Current vs. Temperature
800
600
VOUT = 1.8V
VOUT = 3.3V
700
500
o
o
400
T = 25 C
300
o
T = -40 C
200
100
0.25
0.50
0.75
1.00
1.25
1.50
1.75
Output Current (A)
Fig5. Dropout Voltage vs. Output Current
2.00
o
Dropout Voltage (mV)
T = 85 C
Dropout Voltage (mV)
VOUT = 3.3V
75
VOUT = 3.3V
80
VOUT = 1.8V
Temperature ( C)
0
100
Loading Current (mA)
0.75
Output Voltage Variation (%)
VOUT = 3.3V
75
65
1E-3
5.5
1.00
-1.00
-40
80
T = 85 C
600
o
T = 25 C
500
o
T = -40 C
400
Minimum Operation Voltage
300
200
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
Output Current (A)
Fig6. Dropout Voltage vs. Output Current
8
AIC1189
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
1.224
1.224
VIN = 2.3V
1.216
Output Voltage (V)
Output Voltage (V)
1.216
1.208
1.200
1.192
1.184
1.176
1.208
1.200
1.192
1.184
2.5
3.0
3.5
4.0
4.5
5.0
1.176
1E-3
5.5
Input VOltage (V)
0.01
0.1
1
10
100
Loading Current (mA)
Fig8. Output Voltage vs. Loading Current
Fig7. Output Voltage vs. Input Voltage
1.836
1.836
VIN = 2.8V
1.824
Output Voltage (V)
Output Voltage (V)
1.824
1.812
1.800
1.788
1.776
1.764
1.812
1.800
1.788
1.776
2.5
3.0
3.5
4.0
4.5
5.0
1.764
5.5
Input VOltage (V)
Fig9. Output Voltage vs. Input Voltage
0.01
0.1
1
10
100
Loading Current (mA)
Fig10. Output Voltage vs. Loading Current
3.366
3.366
VIN = 4.3V
3.344
Output Voltage (V)
Output Voltage (V)
3.344
3.322
3.300
3.278
3.256
3.234
3.322
3.300
3.278
3.256
3.3
3.6
3.9
4.2
4.5
4.8
5.1
Input VOltage (V)
Fig11. Output Voltage vs. Input Voltage
5.4
3.234
0.01
0.1
1
10
100
Loading Current (mA)
Fig12. Output Voltage vs. Loading Current
9
AIC1189
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
IOUT = 1mA to 2A
VOUT = 1.2V
VOUT = 1.2V
VOUT Ripple
VIN
IOUT = 1A
IOUT
VOUT Ripple
Fig13. Load Transient Response at VIN=2.3V, VOUT=1.2V
IOUT = 1mA to 2A
VOUT = 1.8V
Fig14. Line Transient Response at VOUT=1.2V, IOUT=1A
IOUT = 1A
VOUT = 1.8V
VIN
VOUT Ripple
IOUT
VOUT Ripple
Fig15. Load Transient Response at VIN=2.8V, VOUT=1.8V
VOUT = 3.3V
IOUT = 1mA to 2A
VOUT Ripple
Fig16. Line Transient Response at VOUT=1.8V, IOUT=1A
IOUT = 1A
VOUT = 3.3V
VIN
IOUT
VOUT Ripple
Fig17. Load Transient Response at VIN=4.3V, VOUT=3.3V
Fig18. Line Transient Response at VOUT=3.3V, IOUT=1A
10
AIC1189
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
CBP = 0nF
CBP = 0.1nF
EN
EN
VOUT
VOUT
IIN
IIN
Fig19. Start-up waveform without bypass capacitor
Fig20. Start-up waveform with 0.1nF bypass capacitor
CBP = 22nF
EN
EN
VOUT
VOUT
IIN
Fig21. Start-up waveform with 22nF bypass capacitor
Fig22. Shutdown Transient
-20
-30
VIN = 5V, IOUT = 10mA
CIN = COUT = 4.7µF
PSRR (dB)
-40
-50
-60
-70
-80
10
100
1k
10k
100k
1M
Frequency (Hz)
Fig23. PSRR vs. Frequency
11
AIC1189
BLOCK DIAGRAM
PIN DESCRIPTION
VIN
– Power supply input pin. Bypass with a 4.7µF capacitor to GND
GND
– Ground.
VOUT
– Regulator Output pin. Sources up to 2A.
EN (5 Pin and 8 Pin) – Chip Enable (Active Low). This pin isn’t allowed to float.
EN (5 Pin and 8 Pin) – Chip Enable (Active High). This pin isn’t allowed to float.
BP (5 Pin and 8 Pin) – Bypass pin. It should be connected to external 22nF capacitor to GND to reduce output
noise. The bypass pin could be floating if it’s unnecessary.
ADJ (5 Pin and 8 Pin) – The output voltage can either be set by the internal feedback resistors when this pin is
grounded, or be set by the external feedback resistors when using a resistive divider.
12
AIC1189
APPLICATION INFORMATION
The AIC1189 is a high performance linear regulator
The output voltage of AIC1189 linear regulator can be
that provides low-dropout voltage and low quiescent-
set by its internal feedback resistors when the ADJ pin
current. The device is available in an adjustable
is grounded. In addition, the output voltage of AIC1189
version and fixed output voltages ranging from 1.2V to
linear regulator can be set by the external feedback
3.8V, and the device can supply loads up to 2A.
resistors when connecting a resistive divider R1 and R2.
While connecting a resistive divider, VOUT can be
SHUTDOWN
By connecting EN(EN) pin to VIN(ground), the AIC1189
can be shut down to reduce the supply current to
0.01µA(typ.). At this operation mode, the output
calculated as:

R 
VOUT = 0.8 × 1 + 1 
R
2 

The resistive divider should sit as close to ADJ pin as
voltage of AIC1189 is equal to 0V.
possible.
CURRENT LIMIT
The AIC1189 includes a current limiter, which monitors
POWER DISSIPATION
and controls the maximum output current. If the output
The maximum power dissipation of AIC1189 depends
is overloaded or shorted to ground, this can protect the
on the thermal resistance of its case and circuit board,
device from being damaged.
the temperature difference between the die junction
and ambient air, and the rate of airflow. The rate of
THERMAL PROTECTION
temperature rise is greatly affected by the mounting
The AIC1189 includes a thermal-limiting circuit, which
pad configuration on the PCB, the board material, and
is designed to protect the device against overload
the ambient temperature. When the IC mounting with
condition. When the junction temperature exceeds
good thermal conductivity is used, the junction
TJ=150ºC, the thermal-limiting circuit turns off the pass
temperature will be low even when large power
transistor and allows the IC to cool. For continuous
dissipation applies.
load condition, maximum rating of junction temperature
The power dissipation across the device is
must not be exceeded.
P = IOUT (VIN-VOUT)
INPUT-OUTPUT CAPACITORS
The maximum power dissipation is:
Linear regulators require input and output capacitors to
PMAX =
maintain stability. Input capacitor at 4.7µF with a 4.7µF
(TJ-max - TA )
Rθ JA
ceramic output capacitor is recommended. To avoid
Where TJ-max is the maximum allowable junction
oscillation, it is recommended to follow the figure of
temperature
“Region of Stable COUT ESR vs. Load Current” to
temperature suitable in application.
choose proper capacitor specifications.
As a general rule, the lower temperature is, the better
When
choosing
the
input
and
output
(150°C),
and
TA
is
the
ambient
ceramic
reliability of the device is. So the PCB mounting pad
capacitors, X5R and X7R types are recommended
should provide maximum thermal conductivity to
because they retain their capacitance over wider
maintain low device temperature.
ranges of voltage and temperature than other types.
LAYOUT CONSIDERATION
NOISE BYPASS CAPACITOR
A 22nF bypass capacitor at BP pin can reduce output
voltage noise. The bypass pin can be floating if it’s
unnecessary.
Connect the bottom-side pad (available in SOP-8
Exposed Pad) to a large ground plane. Use as much
copper
as
possible
to
decrease
the
thermal
resistance of the device.
OUTPUT VOLTAGE PROGRAMMING
13
AIC1189
PHYSICAL DIMENSIONS
SOT-223 PACKAGE OUTLINE DRAWING
D
b2
1
E
A
A
E
SEE VIEW B
e
e1
b
WITH PLATING
2
A
A
BASE METAL
1
A
L
VIEW B
c
SECTION A-A
GAUGE PLANE
SEATING PLANE
θ
5
2
.
0
Note: 1. Refer to JEDEC TO-261AA.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "E1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
S
Y
M
B
O
L
SOT-223
MILLIMETERS
MIN.
MAX.
A
1.80
A1
0.02
0.10
A2
1.55
1.65
b
0.66
0.84
b2
2.90
3.10
c
0.23
0.33
D
6.30
6.70
E
6.70
7.30
E1
3.30
e
e1
L
θ
3.70
2.30 BSC
4.60 BSC
0.90
0°
8°
14
AIC1189
TO-252-3L PACKAGE OUTLINE DRAWING
E
A
c2
b3
3L
D
H
4L
A
A
e
SEE VIEW B
b
WITH PLATING
BASE METAL
c
SECTION A-A
θ
GAUGE PLANE
2L
SEATING PLANE
L
L1
VIEW B
1A
Note: 1. Refer to JEDEC TO-252AA and AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
S
Y
M
B
O
L
A
A1
b
b3
c
c2
D
E
e
H
L
L1
L2
L3
L4
θ
MIN.
2.19
0.00
0.64
4.95
0.46
0.46
5.33
6.35
9.40
1.40
0.89
-0°
TO-252-3L
MILLIMETERS
2.28 BSC
2.67 REF
0.51 BSC
MAX.
2.38
0.13
0.89
5.46
0.61
0.89
6.22
6.73
10.41
1.78
2.03
1.02
8°
15
AIC1189
TO-252-5L PACKAGE OUTLINE DRAWING
E
A
c2
b3
3L
D
e
H
A
A
SEE VIEW B
b
WITH PLATING
c
BASE METAL
SECTION A-A
S
Y
M
B
O
L
θ
GAUGE PLANE
L
2L
SEATING PLANE
L1
VIEW B
1
A
Note: 1. Refer to JEDEC TO-252AD and AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
TO-252-5L
MILLIMETERS
MIN.
MAX.
A
2.19
2.38
A1
0.00
0.13
b
0.51
0.71
b3
4.32
5.46
c
0.46
0.61
c2
0.46
0.89
D
5.33
6.22
E
6.35
e
6.73
1.27 BSC
H
9.40
L
1.40
L1
10.41
1.78
2.67 REF
L2
0.51 BSC
L3
0.89
2.03
q
0°
8°
16
AIC1189
TO-263-3L PIN PACKAGE OUTLINE DRAWING
A
c2
E
1
L
D
H
2
L
A
A
b2
SEE VIEW B
e
b
WITH PLATING
c
BASE METAL
SECTION A-A
θ
S
Y
M
B
O
L
GAUGE PLANE
L
3
L
VIEW B
SEATING PLANE
1
A
Note: 1. Refer to JEDEC TO-263AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
TO-263-3L
MILLIMETERS
MIN.
MAX.
A
4.06
4.83
A1
0.00
0.25
b
0.51
0.99
b2
1.14
1.78
c
0.38
0.74
c2
1.14
1.65
D
8.38
9.65
E
9.65
10.67
e
2.54 BSC
H
14.61
15.88
L
L1
1.78
--
1.68
L2
--
1.78
0.25 BSC
L3
q
2.79
0°
8°
17
AIC1189
TO-263-5L PACKAGE OUTLINE DRAWING
A
c2
E
1L
D
H
A
A
e
SEE VIEW B
b
WITH PLATING
c
BASE METAL
SECTION A-A
θ
GAUGE PLANE
L
3
L
VIEW B
SEATING PLANE
1
A
Note: 1. Refer to JEDEC TO-263BA.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
S
Y
M
B
O
L
TO-263-5L
MILLIMETERS
MIN.
MAX.
A
4.06
4.83
A1
0.00
0.25
b
0.51
0.99
c
0.38
0.74
c2
1.14
1.65
D
8.38
9.65
E
9.65
10.67
e
1.70 BSC
H
14.61
15.88
L
1.78
--
1.68
L1
0.25 BSC
L3
q
2.79
0°
8°
18
AIC1189
TO-220 PACKAGE OUTLINE DRAWING
A
E
A1
Q
P
1
H
D
1
D
b
WITH PLATING
BASE METAL
1L
c
SECTION A-A
L
A
b2
e
A
A2
S
Y
M
B
O
L
Note: 1. Refer to JEDEC TO-220AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D1" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
TO-220
MILLIMETERS
MIN.
MAX.
A
3.56
4.82
A1
0.51
1.39
A2
2.04
2.92
b
0.38
1.01
b2
1.15
1.77
c
0.35
0.61
D
14.23
16.51
D1
8.38
9.02
E
9.66
10.66
2.54 BSC
e
H1
5.85
6.85
L
14.73
L1
12.70
--
P
3.54
4.08
Q
2.54
3.42
6.35
19
AIC1189
SOP-8 Exposed Pad (Heat Sink) PACKAGE OUTLINE DRAWING
D
D1
E X P O S E D T H E R M A L P A D (H e a t S in k )
(B O T T O M C E N T E R O F P A C K A G E )
E1
e
A
E
H
5°4
X
h
A
S E E V IE W B
A
B
1A
W IT H P L A T IN G
BASE M ETAL
25.
0
S E C T IO N A -A
GAUG E PLAN E
S E A T IN G P L A N E
S
Y
M
B
O
L
θ
L
V IE W B
C
Note : 1. Refer to JEDEC MS-012E.
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "E" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
SOP-8 Exposed Pad(Heat Sink)
MILLIMETERS
MIN.
MAX.
A
1.35
1.75
A1
0.00
0.15
B
0.31
0.51
C
0.17
0.25
D
4.80
5.00
E
3.80
e
4.00
1.27 BSC
H
5.80
6.20
h
0.25
0.50
L
0.40
1.27
q
0°
8°
D1
E1
1.5
1.0
3.5
2.55
Note:
Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry
other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result
from its use. We reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or
systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to
perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a
significant injury to the user.
20
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