TI1 CDCLVD1204 2:4 low additive jitter lvds buffer Datasheet

CDCLVD1204
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SCAS898A – MAY 2010 – REVISED JUNE 2010
2:4 Low Additive Jitter LVDS Buffer
Check for Samples: CDCLVD1204
FEATURES
DESCRIPTION
•
•
The CDCLVD1204 clock buffer distributes one of two
selectable clock inputs, (IN0, IN1), to 4 pairs of
differential LVDS clock outputs (OUT0, OUT3) with
minimum skew for clock distribution. The
CDCLVD1204 can accept two clock sources into an
input multiplexer. The inputs can either be LVDS,
LVPECL, or LVCMOS.
1
•
•
•
•
•
•
•
•
•
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2:4 Differential Buffer
Low Additive Jitter: <300 fs RMS in 10-kHz to
20-MHz
Low Output Skew of 20 ps (Max)
Universal Inputs Accept LVDS, LVPECL, and
LVCMOS
Selectable Clock Inputs through Control Pin
4 LVDS Outputs, ANSI EAI/TIA-644A Standard
Compatible
Clock Frequency up to 800 MHz
2.375 V–2.625 V Device Power Supply
LVDS Reference Voltage, VAC_REF, Available for
Capacitive Coupled Inputs
Industrial Temperature Range: –40°C to 85°C
Packaged in 3 mm × 3 mm 16-Pin QFN (RGT)
ESD Protection Exceeds 3 kV HBM, 1 kV CDM
The IN_SEL pin selects the input which is routed to
the outputs. If this pin is left open it disables the
outputs (static). The part supports a fail safe function.
The device incorporates an input hysteresis which
prevents random oscillation of the outputs in the
absence of an input signal.
The device operates in 2.5V supply environment and
is characterized from –40°C to 85°C (ambient
temperature). The CDCLVD1204 is packaged in
small 16-pin, 3-mm × 3-mm QFN package.
APPLICATIONS
•
•
•
•
•
The CDCLVD1204 is specifically designed for driving
50 Ω transmission lines. In case of driving the inputs
in single ended mode, the appropriate bias voltage
(VAC_REF) should be applied to the unused negative
input pin.
Telecommunications/Networking
Medical Imaging
Test and Measurement Equipment
Wireless Communications
General Purpose Clocking
ASIC
156.25 MHz
Oscillator
(156.25
MHz)
PHY1
CDCLVD1204
LVDS Buffer
IN_SEL
PHY2
FPGA
Figure 1. Application Example
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
CDCLVD1204
SCAS898A – MAY 2010 – REVISED JUNE 2010
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
VCC
Reference
Generator
VAC_REF
INP0
IN_MUX
INN0
INP1
OUTP [0..3]
LVDS
OUTN [0..3]
INN1
VCC
200 kW
IN_SEL
200 kW
GND
Figure 2. CDCLVD1204 Block Diagram
OUTP2
OUTN1
OUTP1
OUTN0
OUTP0
RGT PACKAGE
(TOP VIEW)
12
11
10
9
13
OUTN2
14
OUTP3
15
3mm x 3mm
16 pin QFN (RGT)
8
VAC_REF
7
INN0
6
INP0
5
VCC
Thermal Pad
2
1
2
3
4
IN_SEL
INP1
INN1
16
GND
OUTN3
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SCAS898A – MAY 2010 – REVISED JUNE 2010
PIN DESCRIPTIONS
CDCLVD1204 Pin Descriptions
PIN
NAME
TYPE
NO.
DESCRIPTION
VCC
5
Power
2.5 V supply for the device
GND
1
Ground
Device ground
INP0, INN0
6, 7
Input
Differential input pair or single ended input
INP1, INN1
3, 4
Input
Differential redundant input pair or single ended input
8
Output
Bias voltage output for capacitive coupled inputs. If used, it is recommended to use a
0.1µF to GND on this pin.
OUTP0, OUTN0
9, 10
Output
Differential LVDS output pair No. 0
OUTP1, OUTN1
11,12
Output
Differential LVDS output pair No. 1
OUTP2, OUTN2
13,14
Output
Differential LVDS output pair No. 2
OUTP3, OUTN3
15,16
Output
Differential LVDS output pair No. 3
2
Input with an
internal 200kΩ
pull-up and
pull-down
VAC_REF
IN_SEL
Thermal Pad
Input selection – selects input port; (See Table 1)
See thermal management recommendations
Table 1. Input Selection
(1)
IN_SEL
ACTIVE CLOCK INPUT
0
INP0, INN0
1
INP1, INN1
Open
None (1)
The input buffers are disabled and the outputs are static.
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted). (1)
VALUE
UNIT
–0.3 to 2.8
V
Input voltage range, VI
–0.2 to VCC +0.2
V
Output voltage range, VO
–0.2 to VCC+0.2
V
Supply voltage range, VCC
Driver short circuit current , IOSD
See Note
Electrostatic discharge (Human Body Model, 1.5 kΩ, 100 pF)
(1)
(2)
(2)
>3000
V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
The output can handle the permanent short.
RECOMMENDED OPERATING CONDITIONS
Over operating free-air temperature range (unless otherwise noted).
Device supply voltage, VCC
Ambient temperature, TA
MIN
TYP
MAX
2.375
2.5
2.625
V
85
°C
–40
UNIT
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THERMAL INFORMATION
CDCLVD1204
THERMAL METRIC (1)
RGT
UNITS
16 PINS
qJA
Junction-to-ambient thermal resistance
51.3
qJC(top)
Junction-to-case(top) thermal resistance
85.4
qJB
Junction-to-board thermal resistance
20.1
yJT
Junction-to-top characterization parameter
1.3
yJB
Junction-to-board characterization parameter
19.4
qJC(bottom)
Junction-to-case(bottom) thermal resistance
6
(1)
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
ELECTRICAL CHARACTERISTICS
At VCC = 2.375 V to 2.625 V and TA = –40°C to 85°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
IN_SEL CONTROL CHARACTERISTICS
VdI3
3-State
VdIH
Input high voltage
Open
VdIL
Input low voltage
IdIH
Input high current
VCC = 2.625 V, VIH = 2.625 V
IdIL
Input low current
VCC = 2.625 V, VIL = 0 V
Rpull(IN_SEL)
Input pull-up/ pull-down resistor
0.5×VCC
V
0.7×VCC
V
0.2×VCC
V
30
mA
–30
mA
200
kΩ
2.5V LVCMOS (see Figure 7) INPUT CHARACTERISTICS
fIN
Input frequency
External threshold voltage applied
to complementary input
Vth
Input threshold voltage
VIH
Input high voltage
VIL
Input low voltage
IIH
Input high current
VCC = 2.625 V, VIH = 2.625 V
IIL
Input low current
VCC = 2.625 V, VIL = 0 V
ΔV/ΔT
Input edge rate
20% – 80%
CIN
Input capacitance
200
MHz
1.5
V
Vth + 0.1
VCC
V
0
Vth – 0.1
V
10
mA
1.1
–10
1.5
mA
V/ns
2.5
pF
DIFFERENTIAL INPUT CHARACTERISTICS
fIN
Input frequency
Clock input
VIN,
Differential input voltage
peak-to-peak
VICM = 1.25 V
VICM
Input common-mode voltage range
VIN, DIFF, PP > 0.4V
IIH
Input high current
VCC = 2.625 V, VIH = 2.625 V
IIL
Input low current
VCC = 2.625 V, VIL = 0 V
ΔV/ΔT
Input edge rate
20% to 80%
CIN
Input capacitance
4
DIFF
800
MHz
0.3
1.6
VPP
1
VCC – 0.3
V
10
mA
–10
mA
0.75
V/ns
2.5
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pF
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SCAS898A – MAY 2010 – REVISED JUNE 2010
ELECTRICAL CHARACTERISTICS (continued)
At VCC = 2.375 V to 2.625 V and TA = –40°C to 85°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
250
450
mV
–15
15
mV
1.1
1.375
–15
15
LVDS OUTPUT CHARACTERISTICS
|VOD|
Differential output voltage magnitude
ΔVOD
Change in differential output voltage
magnitude
VOC(SS)
Steady-state common mode output
voltage
ΔVOC(SS)
Steady-state common mode output
voltage
VIN, DIFF, PP = 0.6 V,RL = 100 Ω
Vring
Output overshoot and undershoot
Percentage of output amplitude
VOD
VOS
Output ac common mode
VIN, DIFF, PP = 0.6 V, RL = 100 Ω
IOS
Short-circuit output current
VOD = 0 V
tPD
Propagation delay
VIN, DIFF, PP = 0.3 V
tSK, PP
Part-to-part skew
tSK, O
Output skew
tSK,P
Pulse skew(with 50% duty cycle
input)
Crossing-point-to-crossing-point
distortion
tRJIT
Random additive jitter (with 50% duty
cycle input)
Edge speed = 0.75V/ns
10 kHz – 20 MHz
tR/tF
Output rise/fall time
20% to 80%,100 Ω, 5 pF
ICCSTAT
Static supply current
Outputs unterminated, f = 0 Hz
ICC100
Supply current
All outputs, RL = 100 Ω,
f = 100 MHz
ICC800
Supply current
All outputs, RL = 100 Ω,
f = 800 MHz
VIN, DIFF, PP = 0.3 V,RL = 100 Ω
V
mV
10%
25
1.5
–50
70
mVPP
±24
mA
2.5
ns
600
ps
20
ps
50
ps
0.3 ps, RMS
50
300
ps
17
28
mA
40
58
mA
60
80
mA
1.25
1.35
VAC_REF CHARACTERISTICS
VAC_REF
Reference output voltage
VCC = 2.5 V, Iload = 100 µA
1.1
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V
5
CDCLVD1204
SCAS898A – MAY 2010 – REVISED JUNE 2010
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Typical Additive Phase Noise Characteristics for 100 MHz Clock
PARAMETER
MIN
TYP
MAX
UNIT
phn100
Phase noise at 100 Hz offset
-132.9
dBc/Hz
phn1k
Phase noise at 1 kHz offset
-138.8
dBc/Hz
phn10k
Phase noise at 10 kHz offset
-147.4
dBc/Hz
phn100k
Phase noise at 100 kHz offset
-153.6
dBc/Hz
phn1M
Phase noise at 1 MHz offset
-155.2
dBc/Hz
phn10M
Phase noise at 10 MHz offset
-156.2
dBc/Hz
phn20M
Phase noise at 20 MHz offset
-156.6
dBc/Hz
tRJIT
Random additive jitter from 10 kHz to 20 MHz
171
fs, RMS
Typical Additive Phase Noise Characteristics for 737.27 MHz Clock
PARAMETER
phn100
Phase noise at 100 Hz offset
phn1k
Phase noise at 1 kHz offset
phn10k
Phase noise at 10 kHz offset
phn100k
MIN
TYP
MAX
UNIT
-80.2
dBc/Hz
-114.3
dBc/Hz
-138
dBc/Hz
Phase noise at 100 kHz offset
-143.9
dBc/Hz
phn1M
Phase noise at 1 MHz offset
-145.2
dBc/Hz
phn10M
Phase noise at 10 MHz offset
-146.5
dBc/Hz
phn20M
Phase noise at 20 MHz offset
-146.6
dBc/Hz
tRJIT
Random additive jitter from 10 kHz to 20 MHz
65
fs, RMS
6
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SCAS898A – MAY 2010 – REVISED JUNE 2010
TYPICAL CHARACTERISTICS
INPUT CLOCK AND OUTPUT CLOCK PHASE NOISES
vs
FREQUENCY FROM THE CARRIER (TA = 25°C and VCC = 2.5V)
Input clock RMS jitter is 32 fs from 10 kHz to 20 MHz and additive RMS jitter is 152 fs
Figure 3. 100 MHz Input and Output Phase Noise Plot
Differential Output Voltage
vs
Frequency
VOD − Differential Output Voltage − mV
350
TA = 25oC
340
2.625V
330
320
2.5V
310
300
2.375V
290
280
270
260
250
0
100
200
300
400
500
600
700
800
Frequency − MHz
Figure 4.
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TEST CONFIGURATIONS
Oscilloscope
100 W
LVDS
Figure 5. LVDS Output DC Configuration During Device Test
Phase Noise
Analyzer
LVDS
50 W
Figure 6. LVDS Output AC Configuration During Device Test
Figure 7. DC Coupled LVCMOS Input During Device Test
VOH
OUTNx
VOD
OUTPx
VOL
80%
VOUT,DIFF,PP (= 2 x VOD)
20%
0V
tr
tf
Figure 8. Output Voltage and Rise/Fall Time
8
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SCAS898A – MAY 2010 – REVISED JUNE 2010
INNx
INPx
tPLH0
tPHL0
tPLH1
tPHL1
OUTN0
OUTP0
OUTN1
OUTP1
tPLH2
tPHL2
OUTN2
OUTP2
tPHL3
tPLH3
OUTN3
OUTP3
(1)
Output skew is calculated as the greater of the following: As the difference between the fastest and the slowest tPLHn
or the difference between the fastest and the slowest tPHLn (n = 0, 1, 2, 3).
(2)
Part-to-part skew is calculated as the greater of the following: As the difference between the fastest and the slowest
tPLHn or the difference between the fastest and the slowest tPHLn across multiple devices (n = 0, 1, 2, 3).
Figure 9. Output Skew and Part-to-Part Skew
Vring
OUTNx
VOD
0V Differential
OUTPx
Figure 10. Output Overshoot and Undershoot
VOS
GND
Figure 11. Output AC Common Mode
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APPLICATION INFORMATION
THERMAL MANAGEMENT
For reliability and performance reasons, the die temperature should be limited to a maximum of 125°C.
The device package has an exposed pad that provides the primary heat removal path to the printed circuit board
(PCB). To maximize the heat dissipation from the package, a thermal landing pattern including multiple vias to a
ground plane must be incorporated into the PCB within the footprint of the package. The Thermal Pad must be
soldered down to ensure adequate heat conduction to of the package. Figure 12 shows a recommended land
and via pattern.
Figure 12. Recommended PCB Layout
POWER-SUPPLY FILTERING
High-performance clock buffers are sensitive to noise on the power supply, which can dramatically increase the
additive jitter of the buffer. Thus, it is essential to reduce noise from the system power supply, especially when
jitter/phase noise is critical to applications.
Filter capacitors are used to eliminate the low-frequency noise from the power supply, where the bypass
capacitors provide the low impedance path for high-frequency noise and guard the power-supply system against
the induced fluctuations. These bypass capacitors also provide instantaneous current surges as required by the
device and should have low equivalent series resistance (ESR). To properly use the bypass capacitors, they
must be placed close to the power-supply pins and laid out with short loops to minimize inductance. It is
recommended to add as many high-frequency (for example, 0.1 mF) bypass capacitors as there are supply pins
in the package. It is recommended, but not required, to insert a ferrite bead between the board power supply and
the chip power supply that isolates the high-frequency switching noises generated by the clock driver; these
beads prevent the switching noise from leaking into the board supply. Choose an appropriate ferrite bead with
low dc resistance because it is imperative to provide adequate isolation between the board supply and the chip
supply, as well as to maintain a voltage at the supply pins that is greater than the minimum voltage required for
proper operation.
Board
Supply
Chip
Supply
Ferrite Bead
1 µF
10 µF
0.1 µF
Figure 13. Power-Supply Decoupling
10
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SCAS898A – MAY 2010 – REVISED JUNE 2010
LVDS OUTPUT TERMINATION
The proper LVDS termination for signal integrity over two 50 Ω lines is 100 Ω between the outputs on the
receiver end. Either dc-coupled termination or ac-coupled termination can be used for LVDS outputs. It is
recommended to place termination resister close to the receiver. If the receiver is internally biased to a voltage
different than the output common mode voltage of the CDCLVD1204, ac-coupling should be used. If the LVDS
receiver has internal 100 Ω termination, external termination must be omitted.
Unused outputs can be left open without connecting any trace to the output pins.
Z = 50 W
100 W
CDCLVD1204
LVDS
Z = 50 W
Figure 14. Output DC Termination
100 nF
Z = 50 W
100 W
CDCLVD1204
LVDS
Z = 50 W
100 nF
Figure 15. Output AC Termination (With the Receiver Internally Biased)
INPUT TERMINATION
The CDCLVD1204 inputs can be interfaced with LVDS, LVPECL, or LVCMOS drivers.
LVDS Driver can be connected to CDCLVD1204 inputs with dc or ac coupling as shown Figure 16 and
Figure 17, respectively.
Z = 50 W
100 W
LVDS
CDCLVD1204
Z = 50 W
Figure 16. LVDS Clock Driver Connected to CDCLVD1204 Input (DC Coupled)
100 nF
Z = 50 W
LVDS
CDCLVD1204
Z = 50 W
100 nF
50 W
50 W
VAC_REF
Figure 17. LVDS Clock Driver Connected to CDCLVD1204 Input (AC Coupled)
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CDCLVD1204
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Figure 18 shows how to connect LVPECL inputs to the CDCLVD1204. The series resistors are required to
reduce the LVPECL signal swing if the signal swing is >1.6 Vpp.
75 W
100 nF
Z = 50 W
CDCLVD1204
LVPECL
Z = 50 W
100 nF
75 W
150 W
150 W
50 W
50 W
VAC_REF
Figure 18. LVPECL Clock Driver Connected to CDCLVD1204 Input
Figure 19 illustrates how to couple a 2.5 V LVCMOS clock input to the CDCLVD1204 directly. The series
resistance (RS) should be placed close to the LVCMOS driver if needed. 3.3 V LVCMOS clock input swing needs
to be limited to VIH ≤ VCC.
RS
LVCMOS
(2.5V)
Z = 50 W
CDCLVD1204
V
V
Vth = IH + IL
2
Figure 19. 2.5V LVCMOS Clock Driver Connected to CDCLVD1204 Input
For unused input, it is recommended to ground both the input pins (INP, INN) using 1 kΩ resistors.
12
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SCAS898A – MAY 2010 – REVISED JUNE 2010
REVISION HISTORY
Changes from Original (May 2010) to Revision A
Page
•
Changed Features bullet - From: ESD Protection Exceeds 2 kV HBM, 500 V CDM To: ESD Protection Exceeds 3
kV HBM, 1 kV CDM .............................................................................................................................................................. 1
•
Updated the VAC_REF pin description ..................................................................................................................................... 3
•
Updated Table 1 - Input Selection ........................................................................................................................................ 3
•
Electrostatic discharge was >2000 ....................................................................................................................................... 3
•
ΔVOD values, MIN was-50, MAX was 50 .............................................................................................................................. 5
•
VOC(SS) MIN value was 1.125 ................................................................................................................................................ 5
•
ΔVOC(SS) values, MIN was-50, MAX was 50 .......................................................................................................................... 5
•
Vring MAX value was 20% ..................................................................................................................................................... 5
•
VOS values, TYP was 30, MAX was 100 ............................................................................................................................... 5
•
tPD MAX value was 2 ............................................................................................................................................................. 5
•
tSK, PP - deleted the TYP value of 300 ................................................................................................................................... 5
•
tR/tF MIN value was 200 ........................................................................................................................................................ 5
•
ICCSTAT MAX value was 25 .................................................................................................................................................... 5
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PACKAGE OPTION ADDENDUM
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11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
CDCLVD1204RGTR
ACTIVE
QFN
RGT
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
D1204
CDCLVD1204RGTT
ACTIVE
QFN
RGT
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
D1204
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Aug-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
CDCLVD1204RGTR
QFN
RGT
16
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
CDCLVD1204RGTT
QFN
RGT
16
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Aug-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CDCLVD1204RGTR
QFN
RGT
16
3000
338.1
338.1
20.6
CDCLVD1204RGTT
QFN
RGT
16
250
210.0
185.0
35.0
Pack Materials-Page 2
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