D1 ARF1510 D3 G1 S1D2 G3 G1 S3D4 ARF1510 S1D2 G2 RF POWER MOSFET D3 D1 G3 S3D4 G4 S2 G2 G4 S2 S4 S4 FULL-BRIDGE 400V 750W 40MHz The ARF1510 is four RF power transistor arranged in an H-Bridge configuration. It is intended for off-line 300V operation in high power scientific, medical and, industrial RF power generator and amplifier applications up to 40 MHz. • Specified 300 Volt, 27.12 MHz Characteristics: • Output Power = 750 Watts. • Gain = 17dB (Class D) • Efficiency > 80% MAXIMUM RATINGS Symbol VDSS ID • High Performance Power RF Package. • Very High Breakdown for Improved Ruggedness. • Low Thermal Resistance. • Nitride Passivated Die for Improved Reliability. All Ratings Per Die: TC = 25°C unless otherwise specified. Parameter Drain-Source Voltage ARF 1510 UNIT 1000 Volts Continuous Drain Current @ TC = 25°C 6.5 Amps VGS Gate-Source Voltage ±30 Volts PD Total Device Dissipation @ TC = 25°C 1500 Watts TJ,TSTG TL -55 to 200 Operating and Storage Junction Temperature Range °C 300 Lead Temperature: 0.063" from Case for 10 Sec. STATIC ELECTRICAL CHARACTERISTICS Characteristic / Test Conditions MIN BVDSS Drain-Source Breakdown Voltage (VGS = 0V, ID = 250 µA) 1000 VDS(ON) On State Drain Voltage Symbol IDSS 1 (ID(ON) = 3.25A, VGS = 10V) TYP MAX 6.8 7.5 Zero Gate Voltage Drain Current (VDS = 1000V, VGS = 0V) 25 Zero Gate Voltage Drain Current (VDS = 800V, VGS = 0V, TC = 125°C) 250 IGSS Gate-Source Leakage Current (VGS = ±30V, VDS = 0V) g fs Forward Transconductance (VDS = 25V, ID = 3.25A) V isolation RMS Voltage (60Hz Sinewave from terminals to mounting surface for 1 minute) VGS(TH) Gate Threshold Voltage (VDS = VGS, ID = 50mA) ±100 3 4 UNIT Volts µA nA mhos 2500 Volts 3 5 Volts MAX UNIT Characteristic (per package unless otherwise noted) RθJC Junction to Case RθCS Case to Sink (Use High Efficiency Thermal Joint Compound and Planar Heat Sink Surface.) MIN TYP 0.12 0.08 CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. APT Website - http://www.advancedpower.com °C/W 050-4926 Rev B Symbol 1-2005 THERMAL CHARACTERISTICS ARF1510 DYNAMIC CHARACTERISTICS Symbol Test Conditions Characteristic Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance td(on) Turn-on Delay Time tr Turn-off Delay Time tf TYP MAX 1200 1800 VDS = 200V 100 130 f = 1 MHz 20 26 VGS = 15V 8 VDD = 500V 5 ID = 6.5A @ 25°C 18 RG = 1.6 Ω 10 VGS = 0V Rise Time td(off) MIN Fall Time UNIT pF ns FUNCTIONAL CHARACTERISTICS Symbol Characteristic GPS Common Source Amplifier Power Gain η MIN TYP f = 40.7 MHz 13 15 dB 75 % VGS = 0V Drain Efficiency ψ Test Conditions VDD = 400V Pout = 750W Electrical Ruggedness VSWR 6:1 MAX UNIT No Degradation in Output Power 1 Pulse Test: Pulse width < 380 µS, Duty Cycle < 2%. APT Reserves the right to change, without notice, the specifications and information contained herein. D3 D1 D1 .100 D3 HAZARDOUS MATERIAL WARNING .175 G3 G1 1.065" 27.05 mm S1D2 ARF1510 S3D4 .100 .075 .100 G1 G3 S1D2 .175 G2 G4 S2 S4 .300 1.065" 27.05 mm .300 .100 .075 .100 S3D4 G2 G4 S2 S4 The ceramic portion of the device between leads and mounting surface is beryllium oxide, BeO. Beryllium oxide dust is toxic when inhaled. Care must be taken during handling and mounting to avoid damage to this area. These devices must never be thrown away with general industrial or domestic waste. .254 .045 .005 050-4926 Rev B 1-2005 Thermal Considerations and Package Mounting: Clamp ARF 1510 Heat Sink The rated 1500W power dissipation is only available when the package mounting surface is at 25°C and the junction temperature is 200°C. The thermal resistance between junctions and case mounting surface is 0.12°C/W. When installed, and additional thermal impedance of 0.08°C/W between the package base and the mounting surface is typical. Insure that the mounting surface is smooth and flat. Thermal joint compound must be used to reduce the effects of small surface irregularities. The heat sink should incorporate a copper heat spreader to obtain best results. The package is designed to be clamped to a heatsink. A clamped joint maintains the required mounting pressure while allowing for thermal expansion of both the device and the heat sink. A simple clamp and two 6-32 (M3.5) screw can provide the minimum 125lb required mounting force. T = 12 in-lb.