LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R − JUNE 1976 − REVISED JULY 2010 D D D D D 1OUT 1IN− 1IN+ GND 1 8 2 7 3 6 4 5 VCC 2OUT 2IN− 2IN+ LM158, LM158A . . . FK PACKAGE (TOP VIEW) NC 1IN− NC 1IN+ NC 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 NC 2OUT NC 2IN− NC NC GND NC 2IN+ NC D − Single Supply . . . 3 V to 32 V (26 V for LM2904) − or Dual Supplies . . . +1.5 V to +16 V (+13 V for LM2904) Low Supply-Current Drain, Independent of Supply Voltage . . . 0.7 mA Typ Common-Mode Input Voltage Range Includes Ground, Allowing Direct Sensing Near Ground Low Input Bias and Offset Parameters: − Input Offset Voltage . . . 3 mV Typ A Versions . . . 2 mV Typ − Input Offset Current . . . 2 nA Typ − Input Bias Current . . . 20 nA Typ A Versions . . . 15 nA Typ Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage . . . 32 V (26 V for LM2904) Open-Loop Differential Voltage Amplification . . . 100 V/mV Typ Internal Frequency Compensation LM158, LM158A . . . JG PACKAGE LM258, LM258A . . . D, DGK, OR P PACKAGE LM358 . . . D, DGK, P, PS, OR PW PACKAGE LM358A . . . D, DGK, P, OR PW PACKAGE LM2904 . . . D, DGK, P, PS, OR PW PACKAGE (TOP VIEW) NC 1OUT NC V CC+ NC D Wide Supply Range: description/ordering information NC − No internal connection These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the difference between the two supplies is 3 V to 32 V (3 V to 26 V for the LM2904), and VCC is at least 1.5 V more positive than the input common-mode voltage. The low supply-current drain is independent of the magnitude of the supply voltage. Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required interface electronics without additional ±5-V supplies. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2010, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R − JUNE 1976 − REVISED JULY 2010 ORDERING INFORMATION{ TA VIOmax AT 25°C MAX TESTED VCC PDIP (P) 30 V LM358P Tube of 75 LM358D Reel of 2500 LM358DR Reel of 2500 LM358DRG3 Reel of 2000 LM358PSR Tube of 150 LM358PW Reel of 2000 LM358PWR Reel of 2000 LM358PWRG3 MSOP/VSSOP (DGK) Reel of 2500 LM358DGKR M5_§ PDIP (P) Tube of 50 LM358AP LM358AP Tube of 75 LM358AD Reel of 2500 LM358ADR Tube of 150 LM358APW Reel of 2000 LM358APWR MSOP/VSSOP (DGK) Reel of 2500 LM358ADGKR M6_§ PDIP (P) Tube of 50 LM258P LM258P Tube of 75 LM258D Reel of 2500 LM258DR Reel of 2500 LM258DRG3 MSOP/VSSOP (DGK) Reel of 2500 LM258DGKR M2_§ PDIP (P) Tube of 50 LM258AP LM258AP Tube of 75 LM258AD Reel of 2500 LM258ADR MSOP/VSSOP (DGK) Reel of 2500 LM258ADGKR M3_§ PDIP (P) Tube of 50 LM2904P LM2904P Tube of 75 LM2904D Reel of 2500 LM2904DR Reel of 2500 LM2904DRG3 Reel of 2000 LM2904PSR Tube of 150 LM2904PW Reel of 2000 LM2904PWR Reel of 2000 LM2904PWRG3 MSOP/VSSOP (DGK) Reel of 2500 LM2904DGKR MB_§ SOIC (D) Reel of 2500 LM2904VQDR L2904V TSSOP (PW) Reel of 2000 LM2904VQPWR L2904V SOIC (D) Reel of 2500 LM2904AVQDR L2904AV TSSOP (PW) Reel of 2000 LM2904AVQPWR L2904AV CDIP (JG) Tube of 50 LM158JG LM158JG LCCC (FK) Tube of 55 LM158FK LM158FK CDIP (JG) Tube of 50 LM158AJG LM158AJG LCCC (FK) Tube of 55 LM158AFK LM158AFK SOP (PS) TSSOP (PW) 0°C 0 C to 70°C 70 C SOIC (D) 3 mV 30 V TSSOP (PW) 5 mV 30 V −25°C 25 C to 85°C 85 C 3 mV 30 V SOIC (D) SOIC (D) SOIC (D) 7 mV 26 V −40°C 40 C to 125 125°C C SOP (PS) TSSOP (PW) 7 mV 2 mV 32 V 32 V 5 mV 30 V 2 mV 30 V −55°C 55°C to 125°C TOP-SIDE MARKING Tube of 50 SOIC (D) 7 mV ORDERABLE PART NUMBER PACKAGE} † LM358P LM358 L358 L358 LM358A L358A LM258 LM258A LM2904 L2904 L2904 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. ‡ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R − JUNE 1976 − REVISED JULY 2010 § The actual top-side marking has one additional character that designates the wafer fab/assembly site. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R − JUNE 1976 − REVISED JULY 2010 symbol (each amplifier) IN+ + − IN− OUT schematic (each amplifier) VCC+ ≈6-µA Current Regulator ≈6-µA Current Regulator ≈100-µA Current Regulator OUT IN− ≈50-µA Current Regulator IN+ GND (or VCC−) To Other Amplifier COMPONENT COUNT Epi-FET Diodes Resistors Transistors Capacitors 4 POST OFFICE BOX 655303 1 2 7 51 2 • DALLAS, TEXAS 75265 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R − JUNE 1976 − REVISED JULY 2010 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† LM158, LM158A LM258, LM258A LM358, LM358A LM2904V ±16 or 32 Supply voltage, VCC (see Note 1) ±32 Differential input voltage, VID (see Note 2) LM2904 ±13 or 26 V ±26 V V Input voltage, VI (either input) −0.3 to 32 −0.3 to 26 Duration of output short circuit (one amplifier) to ground at (or below) 25°C free-air temperature (VCC ≤ 15 V) (see Note 3) Unlimited Unlimited D package 97 97 172 172 P package 85 85 PS package 95 95 PW package 149 149 FK package 5.61 JG package 14.5 DGK package Package thermal impedance, qJA (see Notes 4 and 5) impedance qJC (see Notes 6 and 7) Package thermal impedance, Operating free-air free air temperature range, range TA LM158, LM158A −55 to 125 LM258, LM258A −25 to 85 LM358, LM358A 0 to 70 LM2904 Operating virtual junction temperature, TJ −40 to 125 150 Case temperature for 60 seconds FK package Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds JG package Storage temperature range, Tstg 300 °C/W C/W °C/W °C −40 to 125 150 °C °C 260 −65 to 150 UNIT 300 °C −65 to 150 °C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages and VCC specified for measurement of IOS, are with respect to the network ground terminal. 2. Differential voltages are at IN+ with respect to IN−. 3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 4. Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/qJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 5. The package thermal impedance is calculated in accordance with JESD 51-7. 6. Maximum power dissipation is a function of TJ(max), qJC, and TC. The maximum allowable power dissipation at any allowable case temperature is PD = (TJ(max) − TC)/qJC. Operating at the absolute maximum TJ of 150°C can affect reliability. 7. The package thermal impedance is calculated in accordance with MIL-STD-883. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R − JUNE 1976 − REVISED JULY 2010 electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER LM158 LM258 TA‡ TEST CONDITIONS† MIN VIO Input offset voltage aV Average temperature coefficient of input offset voltage IO IIO Input offset current aI Average temperature coefficient of input offset current IO IIB VICR C VOH Input bias current Common mode Common-mode input voltage range High level High-level output p voltage g VCC = 5 V to MAX, VIC = VICR(min), VO = 1.4 V VO = 1.4 14V 2 10 25°C −20 3 7 9 30 2 10 −150 −20 0 to VCC − 2 0 to VCC − 2 VCC − 1.5 VCC − 1.5 RL ≥ 10 kΩ Full range 27 Full range −250 5 27 20 100 V 28 5 25 nA V 26 28 nA pA/°C −500 0 to VCC − 1.5 26 50 150 0 to VCC − 1.5 Full range µV/°C 7 −300 RL = 2 kΩ Crosstalk attenuation MAX 100 Full range 25°C VO1/VO2 Output current 25°C 25°C Supply-voltage rejection ratio (∆VDD/∆VIO) IO 7 RL ≥ 2 kΩ kSVR UNIT TYP§ 7 Full range RL ≥ 10 kΩ VCC = 15 V, VO = 1 V to 11 V V, RL ≥ 2 kΩ VCC = 5 V to MAX, VIC = VICR(min) MIN mV Full range Large-signal differential voltage amplification Common-mode rejection ratio CMRR 5 Full range VCC = 5 V to MAX RL ≤ 10 kΩ AVD 3 Full range Low-level output voltage VOL MAX 25°C 25°C VCC = MAX TYP§ Full range VO = 1.4 14V LM358 20 mV 25°C 50 100 Full range 25 25°C 70 80 65 80 dB VCC = 5 V to MAX 25°C 65 100 65 100 dB f = 1 kHz to 20 kHz 25°C 120 dB VCC = 15 V, VID = 1 V, V VO = 0 25°C −20 Full range −10 V/mV 15 120 −30 −20 −30 Source IO Output current VCC = 15 V, Sink VID = −1 1 V, V VO = 15 V VID = −1 V, VO = 200 mV IOS Short-circuit output current VCC at 5 V, GND at −5 V, VO = 0 ICC Supply current (two amplifiers) −10 mA 25°C 10 Full range 5 25°C 12 25°C ±40 ±60 ±40 ±60 VO = 2.5 V, No load Full range 0.7 1.2 0.7 1.2 VCC = MAX, VO = 0.5 V, No load Full range 1 2 1 2 † 20 10 20 5 30 12 µA 30 mA mA All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for testing purposes is 26 V for the LM2904 and 30 V for others. ‡ Full range is −55°C to 125°C for LM158, −25°C to 85°C for LM258, 0°C to 70°C for LM358, and −40°C to 125°C for LM2904. § All typical values are at T = 25°C. A 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R − JUNE 1976 − REVISED JULY 2010 electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS† TA‡ LM2904 MIN 25°C VIO aV IO Input offset voltage VCC = 5 V to MAX, VIC = VICR(min), VO = 1.4 V Non A devices Non-A Average temperature coefficient of input offset voltage Non V device Non-V IIO Input offset current VO = 1.4 14V IO Average temperature coefficient of input offset current IIB Input bias current VICR Common mode input voltage Common-mode range 14V VO = 1.4 VOL High-level High level output voltage Low-level output voltage Full range 7 25°C 2 Full range 2 10 25°C −20 25°C 22 Full range 23 VCC = MAX, V-suffix device RL = 2 kΩ Full range 26 RL ≥ 10 kΩ Full range 27 28 25°C 25 100 Full range 15 Non-V device 25°C 50 80 V-suffix device 25°C 65 80 65 100 Full range CMRR Common mode rejection ratio Common-mode VCC = 5 V to MAX, VIC = VICR(min) kSVR Supply-voltage rejection ratio (∆VDD/∆VIO) VCC = 5 V to MAX 25°C VO1/VO2 Crosstalk attenuation f = 1 kHz to 20 kHz 25°C VCC = 15 V, VID = 1 V, VO = 0 25°C −20 Full range −10 25°C 10 Full range 5 IOS Short-circuit output current ICC Supply current (two amplifiers) −250 24 5 VCC = 15 V, VO = 1 V to 11 V, RL ≥ 2 kΩ VID = −1 1 V, VO = 200 mV pA/°C nA V Full range Large signal differential Large-signal voltage amplification Output current nA VCC − 1.5 AVD IO 50 0 to VCC − 2 RL ≥ 10 kΩ VCC = 15 V, VID = −1 1 V, V VO = 15 V 50 0 to VCC − 1.5 RL = 2 kΩ Source mV µV/°C −500 VCC = MAX, Non-V device RL ≤ 10 kΩ 2 150 Full range Full range 7 300 Full range VCC = 5 V to MAX UNIT 4 Full range RL ≥ 10 kΩ VOH 1 Full range 25°C MAX 10 25°C V suffix device V-suffix aI 3 Full range 25°C A suffix devices A-suffix TYP§ V 20 mV V/mV dB dB 120 dB −30 mA mA 20 mA Sink Non-V device 25°C V-suffix device 25°C mA 30 12 µA A 40 25°C ±40 ±60 VO = 2.5 V, No load Full range 0.7 1.2 VCC = MAX, VO = 0.5 V, No load Full range 1 2 VCC at 5 V, GND at −5 V, VO = 0 mA mA † All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for testing purposes is 26 V for the LM2904, 32 V for the LM2904V, and 30 V for others. ‡ Full range is −55°C to 125°C for LM158, −25°C to 85°C for LM258, 0°C to 70°C for LM358, and −40°C to 125°C for LM2904. § All typical values are at T = 25°C. A POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R − JUNE 1976 − REVISED JULY 2010 electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER VIO Input offset voltage aV Average temperature coefficient of input offset voltage IO IIO Input offset current aI Average temperature coefficient of input offset current IO IIB Input bias current VICR C Common mode Common-mode input voltage range VOH VOL AVD CMRR High-level High level output voltage VCC = 5 V to 30 V, VIC = VICR(min), VO = 1.4 V VO = 1.4 14V VO = 1.4 14V Crosstalk attenuation Output current IOS Short-circuit output current ICC Supply current (two amplifiers) Full range 4 MIN TYP§ MAX 2 3 UNIT mV 4 Full range 7 15* 7 15 25°C 2 10 2 15 30 30 Full range 10 200 10 200 25°C −15 −50 −15 −80 −100 −100 25°C 0 to VCC − 1.5 0 to VCC − 1.5 Full range 0 to VCC − 2 0 to VCC − 2 VCC − 1.5 VCC − 1.5 25°C RL = 2 kΩ Full range 26 RL ≥ 10 kΩ Full range 27 VCC = 15 V, VO = 1 V to 11 V V, RL ≥ 2 kΩ LM258A MAX 2 RL ≥ 2 kΩ Large-signal differential voltage amplification Common-mode rejection ratio VO1/VO2 TYP§ 25°C VCC = 30 V VCC = 30 V LM158A MIN Full range RL ≤ 10 kΩ Supply-voltage rejection ratio (∆VDD/∆VIO) TA‡ Full range Low-level output voltage kSVR IO TEST CONDITIONS† Full range 5 27 20 100 pA/°C nA V 28 5 50 nA V 26 28 µV/°C 20 mV 25°C 50 100 Full range 25 25°C 70 80 70 80 dB 25°C 65 100 65 100 dB 120 dB V/mV f = 1 kHz to 20 kHz 25°C VCC = 15 V, VID = 1 V, V VO = 0 25°C −20 Full range −10 25 120 −30 −60 −20 −30 −60 Source −10 mA VCC = 15 V, Sink VID = −1 1 V, V VO = 15 VID = −1 V, VO = 200 mV 25°C 10 Full range 5 25°C 12 VCC at 5 V, GND at −5 V, VO = 0 25°C ±40 ±60 ±40 ±60 VO = 2.5 V, No load Full range 0.7 1.2 0.7 1.2 VCC = MAX, VO = 0.5 V, No load Full range 1 2 1 2 20 10 20 5 30 12 µA 30 mA mA *On products compliant to MIL-PRF-38535, this parameter is not production tested. † All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX V CC for testing purposes is 26 V for LM2904 and 30 V for others. ‡ Full range is −55°C to 125°C for LM158A, −25°C to 85°C for LM258A, and 0°C to 70°C for LM358A. § All typical values are at T = 25°C. A 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R − JUNE 1976 − REVISED JULY 2010 electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) TEST CONDITIONS† PARAMETER VCC = 5 V to 30 V, VIC = VICR(min), VO = 1.4 V VIO Input offset voltage aV Average temperature coefficient of input offset voltage IO IIO Input offset current aI Average temperature coefficient of input offset current IO IIB VO = 1.4 14V Input bias current TA‡ 25°C VOL Low-level output voltage 3 5 7 20 25°C 2 30 75 Full range 10 300 25°C −15 −100 Full range VCC = 30 V RL ≥ 2 kΩ High-level High level output voltage 2 Full range Full range VOH MAX Full range VO = 1.4 14V Common mode input voltage range Common-mode TYP§ Full range 25°C VICR LM358A MIN 25°C VCC = 30 V −200 0 to VCC − 1.5 µV/°C nA pA/°C nA VCC − 1.5 Full range 26 RL ≥ 10 kΩ Full range 27 28 25°C 25 100 Full range 15 Full range VCC = 15 V, VO = 1 V to 11 V, RL ≥ 2 kΩ mV V 0 to VCC − 2 RL = 2 kΩ RL ≤ 10 kΩ UNIT V 5 20 mV AVD Large signal differential Large-signal voltage amplification CMRR Common-mode rejection ratio 25°C 65 80 dB kSVR Supply-voltage rejection ratio (∆VDD/∆VIO) 25°C 65 100 dB VO1/VO2 Crosstalk attenuation 120 dB f = 1 kHz to 20 kHz VCC = 15 V, VID = 1 V, V VO = 0 IO Output current IOS Short-circuit output current ICC Supply current (two amplifiers) 25°C 25°C −20 Full range −10 25°C 10 Full range 5 V/mV −30 −60 Source mA VCC = 15 V, VID = −1 1 V, V VO = 15 V 20 Sink µA VID = −1 V, VO = 200 mV 25°C 30 VCC at 5 V, GND at −5 V, VO = 0 25°C ±40 ±60 VO = 2.5 V, No load Full range 0.7 1.2 VCC = MAX, VO = 0.5 V, No load Full range 1 2 mA mA † All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for testing purposes is 26 V for LM2904 and 30 V for others. ‡ Full range is −55°C to 125°C for LM158A, −25°C to 85°C for LM258A, and 0°C to 70°C for LM358A. § All typical values are at T = 25°C. A POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 LM158, LM158A, LM258, LM258A LM358, LM358A, LM2904, LM2904V DUAL OPERATIONAL AMPLIFIERS SLOS068R − JUNE 1976 − REVISED JULY 2010 operating conditions, VCC = ±15 V, TA = 25°C PARAMETER TEST CONDITIONS TYP UNIT 0.3 V/µs SR Slew rate at unity gain RL = 1 MΩ, CL = 30 pF, VI = ±10 V (see Figure 1) B1 Unity-gain bandwidth RL = 1 MΩ, CL = 20 pF (see Figure 1) 0.7 MHz Vn Equivalent input noise voltage RS = 100 Ω, VI = 0 V, f = 1 kHz (see Figure 2) 40 nV/√Hz VCC+ − VI VO + CL VCC− RL Figure 1. Unity-Gain Amplifier 900 Ω VCC+ 100 Ω − VI = 0 V RS VO + VCC− Figure 2. Noise-Test Circuit 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-87710012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596287710012A LM158FKB 5962-8771001PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771001PA LM158 5962-87710022A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596287710022A LM158AFKB 5962-8771002PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771002PA LM158A LM158AFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596287710022A LM158AFKB LM158AJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 LM158AJG LM158AJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771002PA LM158A LM158FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 596287710012A LM158FKB LM158JG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 LM158JG LM158JGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771001PA LM158 LM258AD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258ADE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258ADG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M3L ~ M3P ~ M3S ~ M3U) LM258ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 (M3L ~ M3P ~ M3S ~ M3U) LM258ADR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -25 to 85 LM258A Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM258ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A LM258AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM258AP LM258APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM258AP LM258D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M2L ~ M2P ~ M2S ~ M2U) LM258DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 (M2L ~ M2P ~ M2S ~ M2U) LM258DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -25 to 85 LM258 LM258DRE4 ACTIVE SOIC D 8 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258DRG3 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 85 LM258 LM258DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258 LM258P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM258P LM258PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM258P LM2904AVQDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904AVQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM2904AVQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV LM2904D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 (MBL ~ MBP ~ MBS ~ MBU) LM2904DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (MBL ~ MBP ~ MBS ~ MBU) LM2904DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DRG3 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM2904 LM2904DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904 LM2904P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 LM2904P LM2904PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 LM2904P LM2904PSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904PSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904PSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904PWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 LM2904PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904 Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM2904PWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125 LM2904PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L2904 LM2904PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L2904 LM2904QD OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125 LM2904QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1 LM2904QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1 LM2904QP OBSOLETE PDIP P 8 TBD Call TI Call TI -40 to 125 LM2904VQDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM2904VQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V LM358AD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358ADE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358ADG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M6L ~ M6P ~ M6S ~ M6U) LM358ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M6L ~ M6P ~ M6S ~ M6U) LM358ADR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 LM358A LM358ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A LM358ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM358AP ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM358AP LM358APE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM358AP LM358APW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A LM358APWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A LM358APWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A LM358APWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 L358A LM358APWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A LM358APWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A LM358D ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358DE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358DG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M5L ~ M5P ~ M5S ~ M5U) LM358DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M5L ~ M5P ~ M5S ~ M5U) LM358DR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 LM358 LM358DRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358DRG3 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM358 LM358DRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358 LM358P ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU | CU SN N / A for Pkg Type 0 to 70 LM358P Addendum-Page 5 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM358PE3 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 LM358P LM358PE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM358P LM358PSLE OBSOLETE SO PS 8 TBD Call TI Call TI 0 to 70 LM358PSR ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PSRE4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PSRG4 ACTIVE SO PS 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI 0 to 70 LM358PWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 L358 LM358PWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358 LM358PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 L358 LM358PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 6 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM258A, LM2904 : • Automotive: LM2904-Q1 • Enhanced Product: LM258A-EP NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 7 PACKAGE MATERIALS INFORMATION www.ti.com 10-Jan-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM258ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM258ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM258DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM258DR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904AVQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904AVQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2904DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Jan-2014 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM2904DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM2904DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 LM2904PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM2904QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM2904VQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM358ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358ADR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM358ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM358DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 4.0 12.0 Q1 LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 LM358DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM358PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 LM358PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM358PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 10-Jan-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM258ADGKR VSSOP DGK 8 2500 332.0 358.0 35.0 LM258ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM258ADR SOIC D 8 2500 367.0 367.0 35.0 LM258ADR SOIC D 8 2500 340.5 338.1 20.6 LM258ADRG4 SOIC D 8 2500 367.0 367.0 35.0 LM258DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM258DGKR VSSOP DGK 8 2500 332.0 358.0 35.0 LM258DR SOIC D 8 2500 364.0 364.0 27.0 LM258DR SOIC D 8 2500 367.0 367.0 35.0 LM258DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM258DRG4 SOIC D 8 2500 367.0 367.0 35.0 LM2904AVQPWR TSSOP PW 8 2000 367.0 367.0 35.0 LM2904AVQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0 LM2904DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM2904DGKR VSSOP DGK 8 2500 332.0 358.0 35.0 LM2904DR SOIC D 8 2500 340.5 338.1 20.6 LM2904DR SOIC D 8 2500 367.0 367.0 35.0 LM2904DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM2904DRG4 SOIC D 8 2500 340.5 338.1 20.6 Pack Materials-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 10-Jan-2014 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM2904DRG4 SOIC D 8 2500 367.0 367.0 35.0 LM2904PSR SO PS 8 2000 367.0 367.0 38.0 LM2904PWR TSSOP PW 8 2000 364.0 364.0 27.0 LM2904PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0 LM2904QDR SOIC D 8 2500 367.0 367.0 35.0 LM2904VQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0 LM358ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM358ADGKR VSSOP DGK 8 2500 332.0 358.0 35.0 LM358ADR SOIC D 8 2500 340.5 338.1 20.6 LM358ADR SOIC D 8 2500 364.0 364.0 27.0 LM358ADRG4 SOIC D 8 2500 340.5 338.1 20.6 LM358ADRG4 SOIC D 8 2500 367.0 367.0 35.0 LM358APWR TSSOP PW 8 2000 364.0 364.0 27.0 LM358APWR TSSOP PW 8 2000 367.0 367.0 35.0 LM358DGKR VSSOP DGK 8 2500 364.0 364.0 27.0 LM358DGKR VSSOP DGK 8 2500 332.0 358.0 35.0 LM358DR SOIC D 8 2500 367.0 367.0 35.0 LM358DR SOIC D 8 2500 367.0 367.0 35.0 LM358DR SOIC D 8 2500 340.5 338.1 20.6 LM358DRG3 SOIC D 8 2500 364.0 364.0 27.0 LM358DRG4 SOIC D 8 2500 340.5 338.1 20.6 LM358PSR SO PS 8 2000 367.0 367.0 38.0 LM358PWR TSSOP PW 8 2000 364.0 364.0 27.0 LM358PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0 Pack Materials-Page 4 MECHANICAL DATA MCER001A – JANUARY 1995 – REVISED JANUARY 1997 JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE 0.400 (10,16) 0.355 (9,00) 8 5 0.280 (7,11) 0.245 (6,22) 1 0.063 (1,60) 0.015 (0,38) 4 0.065 (1,65) 0.045 (1,14) 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN 0.023 (0,58) 0.015 (0,38) 0°–15° 0.100 (2,54) 0.014 (0,36) 0.008 (0,20) 4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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