EVB71120 300 to 930MHz Receiver Evaluation Board Description Features Dual RF input for antenna space and frequency diversity, LNA cascading or differential feeding Fully integrated PLL-based synthesizer nd 2 mixer with image rejection Reception of ASK or FSK modulated signals Wide operating voltage and temperature ranges Very low standby current consumption Low operating current consumption External IF filters 455kHz or 10.7MHz Internal FSK demodulator Average or peak detection data slicer mode RSSI output with high dynamic range for RF level indication Output noise cancellation filter MCU clock output High over-all frequency accuracy Ordering Information Part No. (see paragraph 4) EVB71120-315-C EVB71120-433-C EVB71120-868-C EVB71120-915-C Note 1: Peak detection mode, IF2 selection = 10.7MHz is default population. Application Examples General digital and analog RF receivers at 300 to 930MHz Tire pressure monitoring systems (TPMS) Remote keyless entry (RKE) Low power telemetry systems Alarm and security systems Active RFID tags Remote controls Garage door openers Home and building automation General Description The MLX71120 is a multi-band, single-channel RF receiver based on a double-conversion super-heterodyne architecture. It can receive FSK and ASK modulated signals. The IC is designed for general purpose applications for example in the European bands at 433MHz and 868MHz or for similar applications in North America or Asia, e.g. at 315MHz or 915MHz. It is also well-suited for narrow-band applications according to the ARIB STD-T67 standard in the frequency range 426MHz to 470MHz. The receiver’s extended temperature and supply voltage ranges make the device a perfect fit for automotive or similar applications where harsh environmental conditions are expected. 39012 71120 01 Rev. 006 Page 1 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description Document Content 1 2 3 Theory of Operation ................................................................................................... 3 1.1 General ........................................................................................................................... 3 1.2 Technical Data Overview ................................................................................................ 3 1.3 Block Diagram ................................................................................................................ 4 1.4 Operating Modes ............................................................................................................ 5 1.5 Frequency Range ........................................................................................................... 5 1.6 LNA Selection ................................................................................................................. 5 1.7 External IF2 Selection ..................................................................................................... 5 1.8 Demodulation Selection .................................................................................................. 5 1.9 Data Slicer ...................................................................................................................... 5 Frequency Planning ................................................................................................... 6 2.1 Calculation of Frequency Settings .................................................................................. 7 2.2 Standard Frequency Plans ............................................................................................. 8 2.3 433/868MHz Frequency Diversity ................................................................................... 8 Dual-Channel Application Circuits for FSK & ASK Reception ............................... 9 3.1 3.1.1 3.1.2 3.2 3.2.1 Peak Detector Data Slicer ............................................................................................... 9 Component Arrangement Top Side (Peak Detection Data Slicer, IF2 = 10.7MHz) ....................10 Component Arrangement Top Side (Peak Detection Data Slicer, IF2 = 455kHz) ......................11 Averaging Data Slicer Configured for-Bi Phase Codes ................................................. 12 Component Arrangement Top Side (Averaging Data Slicer, IF2 = 10.7MHz).............................13 3.3 Component List for Dual-Channel Application............................................................... 14 3.4 PCB Layouts for Antenna Space Diversity .................................................................... 15 4 Board Variants.......................................................................................................... 15 5 Package Description ................................................................................................ 16 5.1 Soldering Information .................................................................................................... 16 6 Reliability Information ............................................................................................. 17 7 ESD Precautions ...................................................................................................... 17 8 Disclaimer ................................................................................................................. 18 39012 71120 01 Rev. 006 Page 2 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 1 Theory of Operation 1.1 General The MLX71120 receiver architecture is based on a double-conversion super-heterodyne approach. The two LO signals are derived from an on-chip integer-N PLL frequency synthesizer. The PLL reference frequency is derived from a crystal (XTAL). As the first intermediate frequency (IF1) is very high, a reasonably high degree of image rejection is provided even without using an RF front-end filter. At applications asking for very high image rejections, cost-efficient RF front-end filtering can be realized by using a SAW filter in front of the LNA. The second mixer MIX2 is an image-reject mixer. The receiver signal chain is setup by one (or two) low noise amplifier(s) (LNA1, LNA2), two down-conversion mixers (MIX1, MIX2) and an external IF filter with an on-chip amplifier (IFA). By choosing the required modulation via an FSK/ASK switch (at pin MODSEL), either the on-chip FSK demodulator (FSK DEMOD) or the RSSI-based ASK detector is selected. A second order data filter (OA1) and a data slicer (OA2) follow the demodulator. The data slicer threshold can be generated from the mean-value of the data stream or by means of the positive and negative peak detectors (PKDET+/-). A digital post-processing of the sliced data signal can be performed by a noise filter (NF) building block. The dual LNA configuration can be used for antenna space diversity or antenna frequency diversity or to setup an LNA cascade (to further improve the input sensitivity). The two LNAs can also be setup to feed the RF signal differentially. A sequencer circuit (SEQ) controls the timing during start-up. This is to reduce start-up time and to minimize power dissipation. A clock output, which is a divide-by-8 version of the crystal oscillator signal, can be used to drive a microcontroller. The clock output is open drain and gets activated through a load connected to positive supply. 1.2 Technical Data Overview Input frequency ranges: 300 to 470MHz 610 to 930MHz Power supply range: 2.1 to 5.5V Temperature range: -40 to +125°C Shutdown current: 50 nA Operating current: 6.5 to 8.1mA Selectable IF2 frequency: 10.7MHz or 455kHz FSK deviation range: ±10kHz to ±100kHz (WB) ±2kHz to ±10kHz (NB) Image rejection: st 65dB 1 IF (with external RF front-end filter) nd 25dB 2 IF (internal image rejection) Maximum data rate: 50kps RZ (bi-phase) code, 100kps NRZ Spurious emission: < -54dBm Linear RSSI range: > 70dB Crystal reference frequency: 16 to 27MHz MCU clock frequency: 2.0 to 3.4 -3 Input Sensitivity: at 4kbps NRZ, BER = 3·10 Frequency FSK ASK Note: 315 MHz 433.92 MHz 868.3 MHz 915 MHz wide band 180kHz BW, IF2=10.7MHz f = ±20kHz -109dBm -108dBm -106dBm -104dBm narrow band 20kHz BW, IF2=455kHz f = ±5kHz -114dBm -112dBm -111dBm -109dBm wide band 180kHz BW, IF2=10.7MHz -113dBm -113dBm -111dBm -109dBm - Sensitivities given for RF input 1 (without SAW filter) - Sensitivity for RF input 2 is about 2 to 3dB worse (because of SAW filter loss) 39012 71120 01 Rev. 006 Page 3 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 24 14 2 MIX2 IFA OA1 LO1 FSK DEMOD LO2 VCO 31 TEST BIAS 30 LF ENRX 26 25 Fig. 1: PKDET_ 28 OA2 15 20 PDN 21 DIV 8 CP 18 PDP SW2 RO SLCSEL SEQ PFD CLKO RFSEL N2 counter ROI 7 N1 counter PKDET+ 100k LNA2 VEE DFO SW1 NCF DTAO 29 CINT 22 19 SLC MIX1 FSK 32 8 100k 100k LNA1 LNASEL LNAI2 100k 100k 1 16 ASK VCC LNAI1 17 DF2 27 DF1 13 RSSI 12 IFSEL 11 VEE 10 MIXO 9 VCC 5 MIXN 4 MODSEL VEE 6 MIXP 3 LNAO2 Block Diagram LNAO1 1.3 23 MLX71120 block diagram The MLX71120 receiver IC consists of the following building blocks: PLL synthesizer (PLL SYNTH) to generate the first and second local oscillator signals LO1 and LO2. The PLL SYNTH consists of a fully integrated voltage-controlled oscillator (VCO), a distributed feedback divider chain (N1, N2), a phase-frequency detector (PFD) a charge pump (CP), a loop filter (LF) and a crystal-based reference oscillator (RO). Two low-noise amplifiers (LNA) for high-sensitivity RF signal reception First mixer (MIX1) for down-conversion of the RF signal to the first IF (intermediate frequency) Second mixer (MIX2) with image rejection for down-conversion from the first to the second IF IF amplifier (IFA) to provide a high voltage gain and an RSSI signal output FSK demodulator (FSK DEMOD) Operational amplifiers OA1 and OA2 for low-pass filtering and data slicing, respectively Positive (PKDET+) and negative (PKDET-) peak detectors Switches SW1 to select between FSK and ASK as well as SW2 to chose between averaging or peak detection mode. Noise cancellation filter (NF) Sequencer circuit (SEQ) and biasing (BIAS) circuit Clock output (DIV8) 39012 71120 01 Rev. 006 Page 4 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 1.4 Operating Modes ENRX Description 0 Shutdown mode 1 Receive mode Note: ENRX is pulled down internally. 1.5 Frequency Range Two different receive frequency ranges can be selected by the control signal RFSEL. 1.6 RFSEL Description 0 Input frequency range 300 to 470MHz 1 Input frequency range 610 to 930MHz LNA Selection LNASEL Description 0 LNA1 active, LNA2 shutdown Hi-Z LNA1 and LNA2 active 1 LNA1 shutdown, LNA2 active Note: Hi-Z state means pin LNASEL is left floating (pin is internally pulled to VCC/2 in this case). 1.7 1.8 1.9 External IF2 Selection IFSEL Description 0 IF2 = 455 kHz 1 IF2 = 10.7 MHz Demodulation Selection MODSEL Description 0 ASK demodulation 1 FSK demodulation Data Slicer SLCSEL Description 0 Averaging detection mode 1 Peak detection mode 39012 71120 01 Rev. 006 Page 5 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 2 Frequency Planning Because of the double conversion architecture that employs two mixers and two IF signals, there are four different combinations for injecting the LO1 and LO2 signals: LO1 high side and LO2 high side: LO1 high side and LO2 low side: LO1 low side and LO2 high side: LO1 low side and LO2 low side: receiving at fRF(high-high) receiving at fRF(high-low) receiving at fRF(low-high) receiving at fRF(low-low) As a result, four different radio frequencies (RFs) could yield one and the same second IF (IF2). Fig. 2 shows this for the case of receiving at fRF(high-high). In the example of Fig. 2, the image signals at f RF(low-high) and fRF(low-low) are suppressed by the bandpass characteristic provided by the RF front-end. The bandpass shape can be achieved either with a SAW filter (featuring just a couple of MHz bandwidth), or by the tank circuits at the LNA input and output (this typically yields 30 to 60MHz bandwidth). In any case, the high value of the first IF (IF1) helps to suppress the image signals at fRF(low-high) and fRF(low-low). The two remaining signals at IF1 resulting from f RF(high-high) and fRF(high-low) are entering the second mixer MIX2. This mixer features image rejection with so-called single-sideband (SSB) selection. This means either the upper or lower sideband of IF1 can be selected. In the example of Fig. 2, LO2 high-side injection has been chosen to select the IF2 signal resulting from fRF(high-high). f LO2 f RF Fig. 2: f RF f LO2 f LO1 f RF f RF The four receiving frequencies in a double conversion superhet receiver It can be seen from the block diagram of Fig. 1 that there is a fixed relationship between the LO signal frequencies (fLO1 , fLO2) and the reference oscillator frequency fRO. f LO1 N1 f LO2 f LO2 N 2 f RO The IF2 frequency can be selected to 455kHz or 10.7MHz via the logic level at the IFSEL control pin. At the nd same time the output impedance of the 2 mixer at pin MIXO is set according to the IF2 (please refer to pin description for details). Of course, also the operating frequency of the FSK demodulator (FSK DEMOD) is set accordingly. 39012 71120 01 Rev. 006 Page 6 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 2.1 Calculation of Frequency Settings The receiver has two predefined receive frequency plans which can be selected by the RFSEL control pin. Depending on the logic level of RFSEL pin the sideband selection of the second mixer and the counter settings for N1 and N2 are changed accordingly. (see in 1.5) RFSEL Injection fRFmin [MHz] fRFmax [MHz] N1 N2 0 high-low 300 470 4 6 1 low-high 610 930 2 12 The following table shows the relationships of several internal receiver frequencies for the two input frequency ranges. fRF [MHz] fIF1 fLO1 fLO2 fRO 300 to 470 f RF N1f IF2 N1 1 N1 (f RF f IF2 ) N1 1 f RF f IF2 N1 1 f RF f IF2 N 2 (N1 1) 610 to 930 f RF N1f IF2 N1 1 N1 (f RF f IF2 ) N1 1 f RF f IF2 N1 1 f RF f IF2 N 2 (N1 1) Given IF2 is selectable at either 455kHz or 10.7MHz and the corresponding N1, N2 counter settings, above equations can be transferred into the following table. IF2=455kHz fRF [MHz] fIF1 fLO1 300 to 470 f RF 1.82MHz 3 4(f RF 0.455MHz) 3 610 to 930 f RF 0.91MHz 3 2(f RF 0.455MHz) 3 fRF [MHz] fIF1 fLO1 300 to 470 f RF 42.8MHz 3 4(f RF 10.7MHz) 3 610 to 930 f RF 21.4MHz 3 2(f RF 10.7MHz) 3 fLO2 f RF 0.455MHz 3 fRO f RF 0.455MHz 18 f RF 0.455MHz 36 IF2=10.7MHz 39012 71120 01 Rev. 006 Page 7 of 18 fLO2 f RF 10.7MHz 3 fRO f RF 10.7MHz 18 f RF 10.7MHz 36 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 2.2 Standard Frequency Plans IF2 = 455kHz fRF [MHz] fIF1 [MHz] fLO1 [MHz] fLO2 [MHz] fRO [MHz] 315 105.6067 420.6067 105.1517 17.525277 433.92 145.2467 579.1667 144.7917 24.131944 868.3 289.1300 579.1700 289.5850 24.132083 915 304.6967 610.3033 305.1517 25.429305 fRF [MHz] fIF1 [MHz] fLO1 [MHz] fLO2 [MHz] fRO [MHz] 315 119.2667 434.2667 108.5667 18.094444 433.92 158.0667 592.8267 148.2067 24.701111 868.3 282.3000 586.0000 293.0000 24.416666 915 297.8667 617.1333 308.5667 25.713888 IF2 = 10.7MHz 2.3 433/868MHz Frequency Diversity The receiver’s multi-band functionality can be used to operate at two different frequency bands just by changing the logic level at pin RFSEL and without changing the crystal. This feature is applicable for common use of the 433 and 868MHz bands. Below table shows the corresponding frequency plans. IF2 = 455kHz RFSEL fRF [MHz] fIF1 [MHz] fLO1 [MHz] fLO2 [MHz] 0 433.9225 145.2483 579.17 144.7925 1 868.3 289.1300 579.17 289.5850 39012 71120 01 Rev. 006 Page 8 of 18 fRO [MHz] 24.132083 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 3 Dual-Channel Application Circuits for FSK & ASK Reception 3.1 Peak Detector Data Slicer jumpers LNA1 LNA2 ENRX 1 2 3 DTAO CLKO ROI RSSI 1 2 3 1 2 3 4 5 6 CRO RCL VCC RFSEL 7 8 XTAL 10.7MHz 0 jumper pads 455kHz L2 C4 C5 MODSEL SLCSEL DF2 11 12 13 14 15 16 DF1 17 CF2 CF1 SCLSEL VCC CB0 VCC GND DFO 5 6 7 CERFIL Fig. 3: CP1 DFO 18 10 CB1 CB2 3 4 9 CP2 1 2 C8 SLC 19 CIF 39012 71120 01 Rev. 006 ROI 25 32L QFN 5x5 IFAN LNAI2 CF3 PDP 20 IFAP 8 PDN 21 MLX71120 VEE L4 TEST 26 VCC 22 7 VEE 1 3 SAWFIL 4 6 IFSEL 27 CLKO 28 3 LNAO1 6 LNAO2 L3 50 CINT 23 5 MIXN C6 C7 2 VEE 4 MIXP CB3 CRS RSSI 24 MIXO VCC DTAO 29 1 LNAI1 ENRX 30 C3 RFSEL 31 L1 VCC 50 32 CX ASK jumpers FSK Circuit schematic Page 9 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 3.1.1 Component Arrangement Top Side (Peak Detection Data Slicer, IF2 = 10.7MHz) Fig. 4: 39012 71120 01 Rev. 006 PCB top-side view Page 10 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 3.1.2 Component Arrangement Top Side (Peak Detection Data Slicer, IF2 = 455kHz) Fig. 5: 39012 71120 01 Rev. 006 PCB top-side view Page 11 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 3.2 Averaging Data Slicer Configured for Bi-Phase Codes jumpers LNA1 LNA2 DTAO CLKO ROI RSSI ENRX 1 2 3 1 2 3 1 2 3 4 5 6 CRO RCL VCC RFSEL 7 8 XTAL 10.7MHz 0 jumper pads 455kHz L2 C4 C5 ROI 25 TEST 26 32L QFN 5x5 IFAN MODSEL SLCSEL DF2 DFO 18 10 11 12 13 14 15 16 CIF CERFIL Fig. 6: 39012 71120 01 Rev. 006 CF2 CF1 SCLSEL CB0 VCC GND DFO 5 6 7 CB1 DF1 17 VCC 3 4 9 CSL 1 2 C8 CB2 SLC 19 IFAP 8 LNAI2 PDP 20 VEE L4 CF3 PDN 21 MLX71120 7 VEE 1 3 SAWFIL 4 6 IFSEL 27 CLKO 28 VCC 22 6 LNAO2 L3 50 CINT 23 5 MIXN C6 C7 2 VEE 3 LNAO1 4 MIXP CB3 CRS RSSI 24 MIXO VCC DTAO 29 1 LNAI1 ENRX 30 C3 RFSEL 31 L1 VCC 50 32 CX ASK jumpers FSK Circuit schematic Page 12 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 3.2.1 Component Arrangement Top Side (Averaging Data Slicer, IF2 = 10.7MHz) Fig. 7: 39012 71120 01 Rev. 006 PCB top-side view Page 13 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 3.3 Component List for Dual-Channel Application Below table is valid for test circuits shown in Figures 3.1 to 3.2. Part Size Value @ 315 MHz Value @ 915 MHz Tol. C3 0603 100 pF 100 pF C4 0603 4.7 pF 3.9 pF 100 pF 100 pF 5% LNA input filtering capacitor 2.2 pF 1.5 pF 5% C5 0603 100 pF LNA output tank capacitor 100 pF 100 pF 100 pF 5% C6 0603 MIX1 positive input matching capacitor 100 pF 100 pF 100 pF 100 pF 5% MIX1 negative input matching capacitor C7 C8 0603 NIP 4.7 pF 3.9 pF NIP 5% matching capacitor 0603 NIP NIP 1.0 pF NIP 5% matching capacitor CB0 0805 330 nF 330 nF 330 nF 330 nF 10% decoupling capacitor CB1 0603 330 pF 330 pF 330 pF 330 pF 10% decoupling capacitor CB2 0603 330 pF 330 pF 330 pF 330 pF 10% decoupling capacitor CB3 0603 330 pF 330 pF 330 pF 330 pF CF1 0603 680 pF 680 pF 680 pF 680 pF CF2 0603 330 pF 330 pF 330 pF 330 pF 10% decoupling capacitor data low-pass filter capacitor, 10% for data rate of 4 kbps NRZ data low-pass filter capacitor, 10% for data rate of 4 kbps NRZ CF3 0603 CIF 0603 1 nF 1 nF 1 nF 1 nF CP1 0603 33 nF 33 nF 33 nF 33 nF CP2 0603 33 nF 33 nF 33 nF 33 nF CRS 0603 1 nF 1 nF 1 nF 1 nF CRO 0603 1 nF 1 nF 1 nF 1 nF CSL 0603 CX 0603 27 pF 27 pF 27 pF L1 0603 56 nH 27 nH 0 L2 0603 27 nH 15 nH L3 0603 0 L4 0603 56 nH RCL 0603 SAW FIL SMD 3x3 CER FIL SMD 3.45x3.1 SMD 6.5x6.0 XTAL SMD 5x3.2 Value @ Value @ 433.92 MHz 868.3 MHz value according to the data rate connected to ground if noise filter not used 100 nF 100 nF 100 nF for averaging detection mode only 10% 100 nF Description optional capacitor for noise cancellation filter 10% IFA feedback capacitor positive PKDET capacitor, 10% for data rate of 4 kbps NRZ negative PKDET capacitor, 10% for data rate of 4 kbps NRZ 10% RSSI output low pass capacitor optional capacitor, 5% to couple external RO signal 10% data slicer capacitor, for data rate of 4 kbps NRZ 27 pF 5% crystal series capacitor 0 5% matching inductor 3.9 nH 3.9 nH 5% LNA output tank inductor 47 nH 22 nH 0 5% matching inductor 68 nH 22 nH 0 5% matching inductor 3.3 k 3.3 k 3.3 k 3.3 k 5% optional CLK output resistor, to clock output signal generated SAFDC315M SM0T00 (315 MHz) RF3446 (433.92 MHz) 18.094444 MHz HEX2418.094444M HZ-12-50-FH20-T2075W2-T 17.525278 MHz SAFCC868M SAFCC915M SL0X00 AL0N00 (868.3 MHz) (915 MHz) SFECF10M7HA00 B3dB = 180 kHz CFUKG455KD4A B6dB = 20 kHz 24.701111 24.416667 25.713889 MHz MHz MHz HEX24HEX24HEX2424.416667MH 25.713889M 24.701111MHZ Z-12-50-FHZ-12-50-F-12-50-F-H20H20-T2075H20-T2075T2075-W2-T W2-T W2-T 24.132083 25.429306 MHz MHz low-loss SAW filter from Murata or equivalent part IF2=10.7MHz ceramic filter from Murata, or equivalent part IF2=455kHz IF2=10.7MHz crystal from Telcona, or equivalent part IF2=455kHz 20ppm cal., 30ppm temp. Note: NIP – not in place, may be used optionally 39012 71120 01 Rev. 006 Page 14 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description PCB Layouts for Antenna Space Diversity FSK MOD SEL ASK GND DFO Board layout data in Gerber format is available, board size is 40mm x 44.5mm. GND VCC 3.4 Melexis GND RSSI GND ROI GND CLKO GND DTAO VCC ENRX LNA2 RFI1 RFI2 GND LNA SEL LNA1 PCB bottom view PCB top view 4 Board Variants Type EVB71120 Frequency/MHz Board Execution –315 –A antenna version –433 –C connector version –868 –915 Note: 39012 71120 01 Rev. 006 available EVB setups Page 15 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 5 Package Description The device MLX71120 is RoHS compliant. D A3 24 17 25 16 32 9 E A1 8 b 1 e A exposed pad E2 L D2 The “exposed pad” is not connected to internal ground, it should not be connected to the PCB. Fig. 8: 32L QFN 5x5 Quad all Dimension in mm min max D E D2 E2 A A1 A3 L e b 4.75 5.25 4.75 5.25 3.00 3.25 3.00 3.25 0.80 1.00 0 0.05 0.20 0.3 0.5 0.50 0.18 0.30 0.118 0.128 0.118 0.128 0.0315 0.0393 0 0.002 0.0079 0.0118 0.0197 0.0197 0.0071 0.0118 all Dimension in inch min max 5.1 0.187 0.207 0.187 0.207 Soldering Information The device MLX71120 is qualified for MSL3 with soldering peak temperature 260 deg C according to JEDEC J-STD-20 39012 71120 01 Rev. 006 Page 16 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 6 Reliability Information This Melexis device is classified and qualified regarding soldering technology, solderability and moisture sensitivity level, as defined in this specification, according to following test methods: Reflow Soldering SMD’s (Surface Mount Devices) IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices (classification reflow profiles according to table 5-2)” EIA/JEDEC JESD22-A113 “Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing (reflow profiles according to table 2)” Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) EN60749-20 “Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat” EIA/JEDEC JESD22-B106 and EN60749-15 “Resistance to soldering temperature for through-hole mounted devices” Iron Soldering THD’s (Through Hole Devices) EN60749-15 “Resistance to soldering temperature for through-hole mounted devices” Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices) EIA/JEDEC JESD22-B102 and EN60749-21 “Solderability” For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature, temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with Melexis. The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive strength between device and board. Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on qualification of RoHS compliant products (RoHS = European directive on the Restriction Of the Use of Certain Hazardous Substances) please visit the quality page on our website: http://www.melexis.com/quality_leadfree.aspx 7 ESD Precautions Electronic semiconductor products are sensitive to Electro Static Discharge (ESD). Always observe Electro Static Discharge control procedures whenever handling semiconductor products. 39012 71120 01 Rev. 006 Page 17 of 18 EVB Description Nov/15 EVB71120 300 to 930MHz Receiver Evaluation Board Description 8 Disclaimer 1) The information included in this documentation is subject to Melexis intellectual and other property rights. Reproduction of information is permissible only if the information will not be altered and is accompanied by all associated conditions, limitations and notices. 2) Any use of the documentation without the prior written consent of Melexis other than the one set forth in clause 1 is an unfair and deceptive business practice. Melexis is not responsible or liable for such altered documentation. 3) The information furnished by Melexis in this documentation is provided ’as is’. Except as expressly warranted in any other applicable license agreement, Melexis disclaims all warranties either express, implied, statutory or otherwise including but not limited to the merchantability, fitness for a particular purpose, title and non-infringement with regard to the content of this documentation. 4) Notwithstanding the fact that Melexis endeavors to take care of the concept and content of this documentation, it may include technical or factual inaccuracies or typographical errors. Melexis disclaims any responsibility in connection herewith. 5) Melexis reserves the right to change the documentation, the specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with Melexis for current information. 6) Melexis shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the information in this documentation. 7) The product described in this documentation is intended for use in normal commercial applications. Applications requiring operation beyond ranges specified in this documentation, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by Melexis for each application. 8) Any supply of products by Melexis will be governed by the Melexis Terms of Sale, published on www.melexis.com. © Melexis NV. All rights reserved. For the latest version of this document, go to our website at: www.melexis.com Or for additional information contact Melexis Direct: Europe, Africa: Americas: Asia: Phone: +32 1367 0495 E-mail: [email protected] Phone: +1 603 223 2362 E-mail: [email protected] Phone: +32 1367 0495 E-mail: [email protected] ISO/TS 16949 and ISO14001 Certified 39012 71120 01 Rev. 006 Page 18 of 18 EVB Description Nov/15