Freescale Semiconductor Technical Data Document Number: MPC8260AEC Rev. 1.1, 03/2006 MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications for .25µm (HiP4) devices in the PowerQUICC II™ MPC8260 communications processor family. These devices include the MPC8260, the MPC8255, the MPC8264, the MPC8265, and the MPC8266. Throughout this document, these devices are collectively referred to as the MPC826xA. © Freescale Semiconductor, Inc., 2003, 2006. All rights reserved. 1. 2. 3. 4. 5. 6. 7. Contents Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Electrical and Thermal Characteristics . . . . . . . . . . . . 7 Clock Configuration Modes . . . . . . . . . . . . . . . . . . . 23 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 46 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 48 Document Revision History . . . . . . . . . . . . . . . . . . . 48 Features Figure 1 shows the block diagram for the MPC8266, the HiP4 superset device. Shaded portions indicate functionality that is not available on all devices; refer to the notes. 16 Kbytes I-Cache I-MMU System Interface Unit (SIU) G2 Core 16 Kbytes D-Cache Bus Interface Unit Communication Processor Module (CPM) PCI Bus2,3 32 bits, up to 66 MHz 60x-to-PCI Bridge2,3 60x-to-Local Bridge D-MMU 60x Bus or Local Bus 32 bits, up to 83 MHz Memory Controller Timers Serial DMAs 32 Kbytes Dual-Port RAM Interrupt Controller Clock Counter Parallel I/O 32-bit RISC Microcontroller and Program ROM Baud Rate Generators System Functions Microcode 4 MCC1 4 Virtual IDMAs IMA1,3 4 MCC2 FCC1 FCC2 FCC3 TC Layer Hardware1,3 SCC1 SCC2 SCC3 SCC4 SMC1 SMC2 SPI I2C Time Slot Assigner Serial Interface 8 TDM Ports5 Notes: 1 MPC8264 2 MPC8265 3 MPC8266 3 MII Ports6 2 UTOPIA Ports Non-Multiplexed I/O 4 Not on MPC8255 4 TDM ports on the MPC8255 6 2 MII ports on the MPC8255 5 Figure 1. MPC8266 Block Diagram 1 Features The major features of the MPC826xA family are as follows: • Dual-issue integer core — A core version of the EC603e microprocessor — System core microprocessor supporting frequencies of 150–300 MHz — Separate 16-Kbyte data and instruction caches: – Four-way set associative – Physically addressed – LRU replacement algorithm MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 2 Freescale Semiconductor Features • • • • • • • — PowerPC architecture-compliant memory management unit (MMU) — Common on-chip processor (COP) test interface — High-performance (6.6–7.65 SPEC95 benchmark at 300 MHz; 1.68 MIPs/MHz without inlining and 1.90 Dhrystones MIPS/MHz with — Supports bus snooping for data cache coherency — Floating-point unit (FPU) Separate power supply for internal logic and for I/O Separate PLLs for G2 core and for the CPM — G2 core and CPM can run at different frequencies for power/performance optimization — Internal core/bus clock multiplier that provides 1.5:1, 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios — Internal CPM/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios 64-bit data and 32-bit address 60x bus — Bus supports multiple master designs — Supports single- and four-beat burst transfers — 64-, 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller — Supports data parity or ECC and address parity 32-bit data and 18-bit address local bus — Single-master bus, supports external slaves — Eight-beat burst transfers — 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller 60x-to-PCI bridge (MPC8265 and MPC8266 only) — Programmable host bridge and agent — 32-bit data bus, 66 MHz, 3.3 V — Synchronous and asynchronous 60x and PCI clock modes — All internal address space available to external PCI host — DMA for memory block transfers — PCI-to-60x address remapping System interface unit (SIU) — Clock synthesizer — Reset controller — Real-time clock (RTC) register — Periodic interrupt timer — Hardware bus monitor and software watchdog timer — IEEE 1149.1 JTAG test access port Twelve-bank memory controller — Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash and other userdefinable peripherals — Byte write enables and selectable parity generation MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 3 Features • • — 32-bit address decodes with programmable bank size — Three user programmable machines, general-purpose chip-select machine, and page-mode pipeline SDRAM machine — Byte selects for 64 bus width (60x) and byte selects for 32 bus width (local) — Dedicated interface logic for SDRAM CPU core can be disabled and the device can be used in slave mode to an external core Communications processor module (CPM) — Embedded 32-bit communications processor (CP) uses a RISC architecture for flexible support for communications protocols — Interfaces to G2 core through on-chip 32-Kbyte dual-port RAM and DMA controller — Serial DMA channels for receive and transmit on all serial channels — Parallel I/O registers with open-drain and interrupt capability — Virtual DMA functionality executing memory-to-memory and memory-to-I/O transfers — Three fast communications controllers supporting the following protocols (only FCC1 and FCC2 on the MPC8255): – 10/100-Mbit Ethernet/IEEE 802.3 CDMA/CS interface through media independent interface (MII) – ATM—Full-duplex SAR protocols at 155 Mbps, through UTOPIA interface, AAL5, AAL1, AAL0 protocols, TM 4.0 CBR, VBR, UBR, ABR traffic types, up to 16 K external connections – Transparent – HDLC—Up to T3 rates (clear channel) — Two multichannel controllers (MCCs) (only MCC2 on the MPC8255) – Each MCC handles 128 serial, full-duplex, 64-Kbps data channels.Each MCC can be split into four subgroups of 32 channels each. – Almost any combination of subgroups can be multiplexed to single or multiple TDM interfaces up to four TDM interfaces per MCC — Four serial communications controllers (SCCs) identical to those on the MPC860, supporting the digital portions of the following protocols: – Ethernet/IEEE 802.3 CDMA/CS – HDLC/SDLC and HDLC bus – Universal asynchronous receiver transmitter (UART) – Synchronous UART – Binary synchronous (BISYNC) communications – Transparent — Two serial management controllers (SMCs), identical to those of the MPC860 – Provide management for BRI devices as general circuit interface (GCI) controllers in timedivision-multiplexed (TDM) channels MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 4 Freescale Semiconductor Features — — — — — – Transparent – UART (low-speed operation) One serial peripheral interface identical to the MPC860 SPI One inter-integrated circuit (I2C) controller (identical to the MPC860 I2C controller) – Microwire compatible – Multiple-master, single-master, and slave modes Up to eight TDM interfaces (four on the MPC8255) – Supports two groups of four TDM channels for a total of eight TDMs – 2,048 bytes of SI RAM – Bit or byte resolution – Independent transmit and receive routing, frame synchronization – Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN primary rate, Freescale interchip digital link (IDL), general circuit interface (GCI), and user-defined TDM serial interfaces Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs, SCCs, SMCs, and serial channels Four independent 16-bit timers that can be interconnected as two 32-bit timers Additional features of the MPC826xA family are as follows: • CPM — 32-Kbyte dual-port RAM — Additional MCC host commands — Eight transfer transmission convergence (TC) layers between the TDMs and FCC2 to support inverse multiplexing for ATM capabilities (IMA) (MPC8264 and MPC8266 only) • CPM multiplexing — FCC2 can also be connected to the TC layer. • TC layer (MPC8264 and MPC8266 only) — Each of the 8 TDM channels is routed in hardware to a TC layer block – Protocol-specific overhead bits may be discarded or routed to other controllers by the SI – Performing ATM TC layer functions (according to ITU-T I.432) – Transmit (Tx) updates - Cell HEC generation - Payload scrambling using self synchronizing scrambler (programmable by the user) - Coset generation (programmable by the user) - Cell rate by inserting idle/unassigned cells – Receive (Rx) updates - Cell delineation using bit by bit HEC checking and programmable ALPHA and DELTA parameters for the delineation state machine - Payload descrambling using self synchronizing scrambler (programmable by the user) MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 5 Features • - Coset removing (programmable by the user) - Filtering idle/unassigned cells (programmable by the user) - Performing HEC error detection and single bit error correction (programmable by user) - Generating loss of cell delineation status/interrupt (LOC/LCD) — Operates with FCC2 (UTOPIA 8) — Provides serial loop back mode — Cell echo mode is provided — Supports both FCC transmit modes – External rate mode—Idle cells are generated by the FCC (microcode) to control data rate. – Internal rate mode (sub-rate)—FCC transfers only the data cells using the required data rate. The TC layer generates idle/unassigned cells to maintain the line bit rate. — Supports TC-layer and PMD-WIRE interface (according to the ATM-Forum af-phy-0063.000) — Cell counters for performance monitoring – 16-bit counters count - HEC error cells - HEC single bit error and corrected cells - Idle/unassigned cells filtered - Idle/unassigned cells transmitted - Transmitted ATM cells - Received ATM cells – Maskable interrupt is sent to the host when a counter expires — Overrun (Rx cell FIFO) and underrun (Tx cell FIFO) condition produces maskable interrupt — May be operated at E1 and DS-1 rates. In addition, xDSL applications at bit rates up to 10 Mbps are supported PCI bridge (MPC8265 and MPC8266 only) — PCI Specification Revision 2.2 compliant and supports frequencies up to 66 MHz — On-chip arbitration — Support for PCI to 60x memory and 60x memory to PCI streaming — PCI Host Bridge or Peripheral capabilities — Includes 4 DMA channels for the following transfers: – PCI-to-60x to 60x-to-PCI – 60x-to-PCI to PCI-to-60x – PCI-to-60x to PCI-to-60x – 60x-to-PCI to 60x-to-PCI — Includes all of the configuration registers (which are automatically loaded from the EPROM and used to configure the MPC8265) required by the PCI standard as well as message and doorbell registers — Supports the I2O standard MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 6 Freescale Semiconductor Electrical and Thermal Characteristics — Hot-Swap friendly (supports the Hot Swap Specification as defined by PICMG 2.1 R1.0 August 3, 1998) — Support for 66 MHz, 3.3 V specification — 60x-PCI bus core logic which uses a buffer pool to allocate buffers for each port — Makes use of the local bus signals, so there is no need for additional pins 2 Electrical and Thermal Characteristics This section provides AC and DC electrical specifications and thermal characteristics for the MPC826xA. 2.1 DC Electrical Characteristics This section describes the DC electrical characteristics for the MPC826xA. Table 1 shows the maximum electrical ratings. Table 1. Absolute Maximum Ratings (1) Rating Core supply voltage(2) PLL supply voltage I/O supply 2. voltage(3) Input voltage(4) Junction temperature Storage temperature range Symbol Value Unit VDD -0.3 – 2.5 V VCCSYN -0.3 – 2.5 V VDDH -0.3 – 4.0 V VIN GND(-0.3) – 3.6 V Tj 120 °C TSTG (-55) – (+150) °C Notes: 1. Absolute maximum ratings are stress ratings only; functional operation (see Table 2) at the maximums is not guaranteed. Stress beyond those listed may affect device reliability or cause permanent damage. 2. Caution: VDD/VCCSYN must not exceed VDDH by more than 0.4 V at any time, including during power-on reset. 3. Caution: VDDH can exceed VDD/VCCSYN by 3.3 V during power on reset by no more than 100 mSec. VDDH should not exceed VDD/VCCSYN by more than 2.5 V during normal operation. 4. Caution: VIN must not exceed VDDH by more than 2.5 V at any time, including during power-on reset. MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 7 Electrical and Thermal Characteristics Table 2 lists recommended operational voltage conditions. Table 2. Recommended Operating Conditions(1) Rating Symbol Value Unit Core supply voltage VDD 1.7 – 1.9(2) 1.7–2.1(3) 1.9 –2.2(4) V PLL supply voltage VCCSYN 1.7 – 1.92 1.7–2.13 1.9–2.24 V I/O supply voltage VDDH 3.135 – 3.465 V VIN GND (-0.3) – 3.465 V Junction temperature (maximum) Tj 105(5) °C Ambient temperature TA 0–705 °C Input voltage Notes: 1. Caution: These are the recommended and tested operating conditions. Proper device operating outside of these conditions is not guaranteed. 2. CPU frequency less than or equal to 200 MHz. 3. CPU frequency greater than 200 MHz but less than 233 MHz. 4. CPU frequency greater than or equal to 233 MHz. 5. Note that for extended temperature parts the range is (-40)T – 105Tj. A NOTE: Core, PLL, and I/O Supply Voltages VDDH, VCCSYN, and VDD must track each other and both must vary in the same direction—in the positive direction (+5% and +0.1 Vdc) or in the negative direction (-5% and -0.1 Vdc). This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (either GND or VCC). Figure 2 shows the undershoot and overshoot voltage of the 60x and local bus memory interface of the MPC8280. Note that in PCI mode the I/O interface is different. VIH VIL 4V GVDD + 5% GVDD GND GND – 0.3 V GND – 1.0 V Not to exceed 10% of tSDRAM_CLK Figure 2. Overshoot/Undershoot Voltage MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 8 Freescale Semiconductor Electrical and Thermal Characteristics Table 3 shows DC electrical characteristics. Table 3. DC Electrical Characteristics(1) Characteristic Symbol Min Max Unit Input high voltage, all inputs except CLKIN VIH 2.0 3.465 V Input low voltage VIL GND 0.8 V VIHC 2.4 3.465 V VILC GND 0.4 V CLKIN input high voltage CLKIN input low voltage Input leakage current, VIN = VDDH (2) IIN — 10 µA IOZ — 10 µA Signal low input current, VIL = 0.8 V IL — 1 µA Signal high input current, VIH = 2.0 V IH — 1 µA VOH 2.4 — V VOL — 0.5 V Hi-Z (off state) leakage current, VIN = VDDH 2 Output high voltage, IOH = –2 mA except XFC, UTOPIA mode, and open drain pins In UTOPIA mode: IOH = -8.0mA PA[0-31] PB[4-31] PC[0-31] PD[4-31] In UTOPIA mode: IOL = 8.0mA PA[0-31] PB[4-31] PC[0-31] PD[4-31] MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 9 Electrical and Thermal Characteristics Table 3. DC Electrical Characteristics(1) (continued) Characteristic IOL = 7.0mA BR BG ABB/IRQ2 TS A[0-31] TT[0-4] TBST TSIZE[0–3] AACK ARTRY DBG DBB/IRQ3 D[0-63] DP(0)/RSRV/EXT_BR2 DP(1)/IRQ1/EXT_BG2 DP(2)/TLBISYNC/IRQ2/EXT_DBG2 DP(3)/IRQ3/EXT_BR3/CKSTP_OUT DP(4)/IRQ4/EXT_BG3/CORE_SREST DP(5)/TBEN/IRQ5/EXT_DBG3 DP(6)/CSE(0)/IRQ6 DP(7)/CSE(1)/IRQ7 PSDVAL TA TEA GBL/IRQ1 CI/BADDR29/IRQ2 WT/BADDR30/IRQ3 L2_HIT/IRQ4 CPU_BG/BADDR31/IRQ5 CPU_DBG CPU_BR IRQ0/NMI_OUT IRQ7/INT_OUT/APE PORESET HRESET SRESET RSTCONF QREQ Symbol Min Max Unit VOL — 0.4 V MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 10 Freescale Semiconductor Electrical and Thermal Characteristics Table 3. DC Electrical Characteristics(1) (continued) Characteristic IOL = 5.3mA CS[0-9] CS(10)/BCTL1 CS(11)/AP(0) BADDR[27–28] ALE BCTL0 PWE(0:7)/PSDDQM(0:7)/PBS(0:7) PSDA10/PGPL0 PSDWE/PGPL1 POE/PSDRAS/PGPL2 PSDCAS/PGPL3 PGTA/PUPMWAIT/PGPL4/PPBS PSDAMUX/PGPL5 LWE[0–3]LSDDQM[0–3]/LBS[0–3]/PCI_CFG[0–3(3) LSDA10/LGPL0/PCI_MODCKH03 LSDWE/LGPL1/PCI_MODCKH13 LOE/LSDRAS/LGPL2/PCI_MODCKH23 LSDCAS/LGPL3/PCI_MODCKH33 LGTA/LUPMWAIT/LGPL4/LPBS LSDAMUX/LGPL5/PCI_MODCK3 LWR MODCK1/AP(1)/TC(0)/BNKSEL(0) MODCK2/AP(2)/TC(1)/BNKSEL(1) MODCK3/AP(3)/TC(2)/BNKSEL(2) IOL = 3.2mA L_A14/PAR3 L_A15/FRAME3/SMI L_A16/TRDY 3 L_A17/IRDY3/CKSTP_OUT L_A18/STOP 3 L_A19/DEVSEL3 L_A20/IDSEL3 L_A21/PERR3 L_A22/SERR3 L_A23/REQ03 L_A24/REQ13/HSEJSW3 L_A25/GNT03 L_A26/GNT13/HSLED3 L_A27/GNT23/HSENUM3 L_A28/RST3/CORE_SRESET L_A29/INTA3 L_A30/REQ23 L_A31 LCL_D(0-31)/AD(0-31)3 LCL_DP(0-3)/C/BE(0-3)3 PA[0–31] PB[4–31] PC[0–31] PD[4–31] TDO Symbol Min Max Unit VOL — 0.4 V MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 11 Electrical and Thermal Characteristics Notes: 1. The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs. 2. The leakage current is measured for nominal VDD, VCCSYN, and VDD. 3. MPC8265 and MPC8266 only. 2.2 Thermal Characteristics Table 4 describes thermal characteristics. Table 4. Thermal Characteristics for 480 TBGA Package Characteristics Symbol Value Unit Air Flow 13(1) Junction to ambient θJA 101 NC(2) 1 m/s °C/W 11(3) NC 83 1 m/s Junction to board(4) θJB 4 °C/W — Junction to case(5) θJC 1.1 °C/W — Notes: 1. Assumes a single layer board with no thermal vias 2. Natural convection 3. Assumes a four layer board 4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). 2.3 Power Considerations The average chip-junction temperature, TJ, in °C can be obtained from the following: TJ = TA + (PD x θJA) (1) where TA = ambient temperature °C θJA = package thermal resistance, junction to ambient, °C/W PD = PINT + PI/O PINT = IDD x VDD Watts (chip internal power) PI/O = power dissipation on input and output pins (determined by user) For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and TJ is the following: MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 12 Freescale Semiconductor Electrical and Thermal Characteristics PD = K/(T J + 273° C) (2) Solving equations (1) and (2) for K gives: K = PD x (TA + 273° C) + θJA x PD2 (3) where K is a constant pertaining to the particular part. K can be determined from equation (3) by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for any value of TA. 2.3.1 Layout Practices Each VCC pin should be provided with a low-impedance path to the board’s power supply. Each ground pin should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct groups of logic on chip. The VCC power supply should be bypassed to ground using at least four 0.1 µF by-pass capacitors located as close as possible to the four sides of the package. The capacitor leads and associated printed circuit traces connecting to chip VCC and ground should be kept to less than half an inch per capacitor lead. A four-layer board is recommended, employing two inner layers as VCC and GND planes. All output pins on the MPC826xA have fast rise and fall times. Printed circuit (PC) trace interconnection length should be minimized in order to minimize overdamped conditions and reflections caused by these fast output switching times. This recommendation particularly applies to the address and data buses. Maximum PC trace lengths of six inches are recommended. Capacitance calculations should consider all device loads as well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher capacitive loads because these loads create higher transient currents in the VCC and GND circuits. Pull up all unused inputs or signals that will be inputs during reset. Special care should be taken to minimize the noise levels on the PLL supply pins. Table 5 provides preliminary, estimated power dissipation for various configurations. Note that suitable thermal management is required for conditions above PD = 3W (when the ambient temperature is 70° C or greater) to ensure the junction temperature does not exceed the maximum specified value. Also note that the I/O power should be included when determining whether to use a heat sink. Table 5. Estimated Power Dissipation for Various Configurations(1) PINT(W)(2) Bus (MHz) CPM Core CPU Multiplier Multiplier CPM (MHz) CPU (MHz) Vddl 1.8 Volts Vddl 2.0 Volts Nominal Maximum Nominal Maximum 66.66 2 3 133 200 1.2 2 1.8 2.3 66.66 2.5 3 166 200 1.3 2.1 1.9 2.3 66.66 3 4 200 266 — — 2.3 2.9 66.66 3 4.5 200 300 — — 2.4 3.1 83.33 2 3 166 250 — — 2.2 2.8 83.33 2 3 166 250 — — 2.2 2.8 83.33 2.5 3.5 208 291 — — 2.4 3.1 MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 13 Electrical and Thermal Characteristics Notes: 1. Test temperature = room temperature (25° C) 2. PINT = IDD x VDD Watts 2.4 AC Electrical Characteristics The following sections include illustrations and tables of clock diagrams, signals, and CPM outputs and inputs for the 66 MHz MPC826xA device. Note that AC timings are based on a 50-pf load. Typical output buffer impedances are shown in Table 6. Table 6. Output Buffer Impedances(1) Output Buffers Typical Impedance (Ω) 60x bus 40 Local bus 40 Memory controller 40 Parallel I/O 46 PCI 25 Notes: 1. These are typical values at 65° C. The impedance may vary by ±25% with process and temperature. Table 7 lists CPM output characteristics. Table 7. AC Characteristics for CPM Outputs(1) Spec Number Max Delay (ns) Min Delay (ns) Characteristic Max Min 66 MHz 83 MHz 66 MHz 83 MHz sp36a sp37a FCC outputs—internal clock (NMSI) 6 5.5 1 1 sp36b sp37b FCC outputs—external clock (NMSI) 14 12 2 1 sp40 sp41 TDM outputs/SI 25 16 5 4 sp38a sp39a SCC/SMC/SPI/I2C outputs—internal clock (NMSI) 19 16 1 0.5 sp38b sp39b Ex_SCC/SMC/SPI/I2C outputs—external clock (NMSI) 19 16 2 1 sp42 sp43 TIMER/IDMA outputs 14 11 1 0.5 sp42a sp43a PIO outputs 14 11 0.5 0.5 Notes: 1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are measured at the pin. MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 14 Freescale Semiconductor Electrical and Thermal Characteristics Table 8 lists CPM input characteristics. Table 8. AC Characteristics for CPM Inputs(1) Spec Number Setup (ns) Hold (ns) Characteristic Max Min 66 MHz 83 MHz 66 MHz 83 MHz sp16a sp17a FCC inputs—internal clock (NMSI) 10 8 0 0 sp16b sp17b FCC inputs—external clock (NMSI) 3 2.5 3 2 sp20 sp21 TDM inputs/SI 15 12 12 10 sp18a sp19a SCC/SMC/SPI/I2C inputs—internal clock (NMSI) 20 16 0 0 sp18b sp19b SCC/SMC/SPI/I2C inputs—external clock (NMSI) 5 4 5 4 sp22 sp23 PIO/TIMER/IDMA inputs 10 8 3 3 Notes: 1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN. Timings are measured at the pin. Note that although the specifications generally reference the rising edge of the clock, the following AC timing diagrams also apply when the falling edge is the active edge. Figure 3 shows the FCC external clock. Serial ClKin sp17b sp16b FCC input signals sp36b/sp37b FCC output signals Note: When GFMR[TCI] = 0 sp36b/sp37b FCC output signals Note: When GFMR[TCI] = 1 Figure 3. FCC External Clock Diagram MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 15 Electrical and Thermal Characteristics Figure 4 shows the FCC internal clock. BRG_OUT sp17a sp16a FCC input signals sp36a/sp37a FCC output signals Note: When GFMR[TCI] = 0 sp36a/sp37a FCC output signals Note: When GFMR[TCI] = 1 Figure 4. FCC Internal Clock Diagram Figure 5 shows the SCC/SMC/SPI/I2C external clock. Serial CLKin sp18b sp19b SCC/SMC/SPI/I2C input signals (See note.) sp38b/sp39b SCC/SMC/SPI/I2C output signals (See note.) Note: There are four possible timing conditions for SCC and SPI: 1. Input sampled on the rising edge and output driven on the rising edge (shown). 2. Input sampled on the rising edge and output driven on the falling edge. 3. Input sampled on the falling edge and output driven on the falling edge. 4. Input sampled on the falling edge and output driven on the rising edge. Figure 5. SCC/SMC/SPI/I2C External Clock Diagram MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 16 Freescale Semiconductor Electrical and Thermal Characteristics Figure 6 shows the SCC/SMC/SPI/I2C internal clock. BRG_OUT sp19a sp18a SCC/SMC/SPI/I2C input signals (See note.) sp38a/sp39a SCC/SMC/SPI/I2C output signals (See note.) Note: There are four possible timing conditions for SCC and SPI: 1. Input sampled on the rising edge and output driven on the rising edge (shown). 2. Input sampled on the rising edge and output driven on the falling edge. 3. Input sampled on the falling edge and output driven on the falling edge. 4. Input sampled on the falling edge and output driven on the rising edge. Figure 6. SCC/SMC/SPI/I2C Internal Clock Diagram Figure 7 shows TDM input and output signals. Serial CLKin sp20 sp21 TDM input signals sp40/sp41 TDM output signals Note: There are four possible TDM timing conditions: 1. Input sampled on the rising edge and output driven on the rising edge (shown). 2. Input sampled on the rising edge and output driven on the falling edge. 3. Input sampled on the falling edge and output driven on the falling edge. 4. Input sampled on the falling edge and output driven on the rising edge. Figure 7. TDM Signal Diagram MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 17 Electrical and Thermal Characteristics Figure 8 shows PIO, timer, and DMA signals. Sys clk sp23 sp22 PIO/IDMA/TIMER[TGATE assertion] input signals (See note) sp23 sp22 TIMER input signal [TGATE deassertion] (See note) sp42/sp43 IDMA output signals sp42/sp43 sp42a/sp43a TIMER(sp42/43)/ PIO(sp42a/sp43a) output signals Note: TGATE is asserted on the rising edge of the clock; it is deasserted on the falling edge. Figure 8. PIO, Timer, and DMA Signal Diagram Table 10 lists SIU input characteristics. Table 9. AC Characteristics for SIU Inputs(1) Spec Number Setup (ns) Hold (ns) Characteristic Max Min 66 MHz 83 MHz 66 MHz 83 MHz sp11 sp10 AACK/ARTRY/TA/TS/TEA/DBG/BG/BR 6 5 0.5 0.5 sp12 sp10 Data bus in normal mode 5 4 0.5 0.5 sp13 sp10 Data bus in ECC and PARITY modes 8 6 0.5 0.5 sp14 sp10 DP pins 7 6 0.5 0.5 sp15 sp10 All other pins 5 4 0.5 0.5 Notes: 1. Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN. Timings are measured at the pin. MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 18 Freescale Semiconductor Electrical and Thermal Characteristics Table 10 lists SIU output characteristics. Table 10. AC Characteristics for SIU Outputs(1) Spec Number Max Delay (ns) Min Delay (ns) Characteristic Max Min 66 MHz 83 MHz 66 MHz 83 MHz sp31 sp30 PSDVAL/TEA/TA 7 6 0.5 0.5 sp32 sp30 ADD/ADD_atr./BADDR/CI/GBL/WT 8 6.5 0.5 0.5 sp33a sp30 Data bus 6.5 6.5 0.5 0.5 sp33b sp30 DP 8 7 0.5 0.5 sp34 sp30 Memory controller signals/ALE 6 5 0.5 0.5 sp35 sp30 All other signals 6 5.5 0.5 0.5 Notes: 1. Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal. Timings are measured at the pin. NOTE Activating data pipelining (setting BRx[DR] in the memory controller) improves the AC timing. When data pipelining is activated, sp12 can be used for data bus setup even when ECC or PARITY are used. Also, sp33a can be used as the AC specification for DP signals. MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 19 Electrical and Thermal Characteristics Figure 9 shows the interaction of several bus signals. CLKin sp11 sp10 AACK/ARTRY/TA/TS/TEA/ DBG/BG/BR input signals sp12 sp10 sp15 sp10 DATA bus normal mode input signal All other input signals sp30 sp31 PSDVAL/TEA/TA output signals sp32 sp30 sp33a sp30 sp35 sp30 ADD/ADD_atr/BADDR/CI/ GBL/WT output signals DATA bus output signals All other output signals Figure 9. Bus Signals Figure 10 shows signal behavior for all parity modes (including ECC, RMW parity, and standard parity). CLKin sp10 sp13 DATA bus, ECC, and PARITY mode input signals sp10 sp14 DP mode input signal sp33b/sp30 DP mode output signal Figure 10. Parity Mode Diagram MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 20 Freescale Semiconductor Electrical and Thermal Characteristics Figure 11 shows signal behavior in MEMC mode. CLKin V_CLK sp34/sp30 Memory controller signals Figure 11. MEMC Mode Diagram NOTE Generally, all MPC826xA bus and system output signals are driven from the rising edge of the input clock (CLKin). Memory controller signals, however, trigger on four points within a CLKin cycle. Each cycle is divided by four internal ticks: T1, T2, T3, and T4. T1 always occurs at the rising edge, and T3 at the falling edge, of CLKin. However, the spacing of T2 and T4 depends on the PLL clock ratio selected, as shown in Table 11. Table 11. Tick Spacing for Memory Controller Signals Tick Spacing (T1 Occurs at the Rising Edge of CLKin) PLL Clock Ratio T2 T3 T4 1:2, 1:3, 1:4, 1:5, 1:6 1/4 CLKin 1/2 CLKin 3/4 CLKin 1:2.5 3/10 CLKin 1/2 CLKin 8/10 CLKin 1:3.5 4/14 CLKin 1/2 CLKin 11/14 CLKin Figure 12 is a graphical representation of Table 11. CLKin for 1:2, 1:3, 1:4, 1:5, 1:6 T1 T2 T3 T4 CLKin for 1:2.5 T1 T2 T3 T4 for 1:3.5 CLKin T1 T2 T3 T4 Figure 12. Internal Tick Spacing for Memory Controller Signals MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 21 Electrical and Thermal Characteristics Table 12 lists the JTAG timings. Table 12. JTAG Timings1 Symbol2 Min Max Unit JTAG external clock frequency of operation fJTG 0 25 MHz JTAG external clock cycle time tJTG 40 — ns tJTKHKL 20 — ns tJTGR and tJTGF 0 5 ns 6 tTRST 25 — ns 3, 6 Boundary-scan data TMS, TDI tJTDVKH tJTIVKH 4 4 — — ns ns 4 7 , Boundary-scan data TMS, TDI tJTDXKH tJTIXKH 10 10 — — ns ns 4 7 , Boundary-scan data TDO tJTKLDV tJTKLOV — — 25 25 ns ns 5 7 Boundary-scan data TDO tJTKLDX tJTKLOX 1 1 — — ns ns 5 7 JTAG external clock to output high impedance Boundary-scan data TDO tJTKLDZ tJTKLOZ 1 1 25 25 ns ns Parameter JTAG external clock pulse width measured at 1.4V JTAG external clock rise and fall times TRST assert time Notes Input setup times 4, 7 Input hold times 4, 7 Output valid times 5, 7 . Output hold times 1 2 3 4 5 6 7 5 7 , , 5 6 , 5 6 , All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal in question. The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load. Time-of-flight delays must be added for trace lengths, vias, and connectors in the system. The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state) (reference)(state) for inputs and t((first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tJTDVKH symbolizes JTAG device timing (JT) with respect to the time data input signals (D) reaching the valid state (V) relative to the tJTG clock reference (K) going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG timing (JT) with respect to the time data input signals (D) went invalid (X) relative to the tJTG clock reference (K) going to the high (H) state. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). TRST is an asynchronous level sensitive signal. The setup time is for test purposes only. Non-JTAG signal input timing with respect to tTCLK. Non-JTAG signal output timing with respect to tTCLK. Guaranteed by design. Guaranteed by design and device characterization. NOTE The UPM machine outputs change on the internal tick determined by the memory controller programming; the AC specifications are relative to the internal tick. Note that SDRAM and GPCM machine outputs change on CLKin’s rising edge. MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 22 Freescale Semiconductor Clock Configuration Modes 3 Clock Configuration Modes To configure the main PLL multiplication factor and the core, CPM, and 60x bus frequencies, the MODCK[1–3] pins are sampled while HRESET is asserted. Table 13 lists the eight basic configuration modes. Table 14 lists the other modes that are available by using the configuration pin (RSTCONF) and driving four bits from hardware configuration word on the data bus. Note that the MPC8265 and the MPC8266 have two additional clocking modes—PCI agent and PCI host. Refer to Section 3.2, “PCI Mode” on page 26 for information. NOTE Clock configurations change only after POR is asserted. 3.1 Local Bus Mode Table 13 describes default clock modes for the MPC826xA. Table 13. Clock Default Modes MODCK[1–3] Input Clock Frequency CPM Multiplication Factor CPM Frequency Core Multiplication Factor Core Frequency 000 33 MHz 3 100 MHz 4 133 MHz 001 33 MHz 3 100 MHz 5 166 MHz 010 33 MHz 4 133 MHz 4 133 MHz 011 33 MHz 4 133 MHz 5 166 MHz 100 66 MHz 2 133 MHz 2.5 166 MHz 101 66 MHz 2 133 MHz 3 200 MHz 110 66 MHz 2.5 166 MHz 2.5 166 MHz 111 66 MHz 2.5 166 MHz 3 200 MHz Table 14 describes all possible clock configurations when using the hard reset configuration sequence. Note that basic modes are shown in boldface type. The frequencies listed are for the purpose of illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not exceed the frequency rating of the user’s device. Table 14. Clock Configuration Modes(1) Input Clock MODCK_H–MODCK[1–3] Frequency(2) ,(3) CPM Multiplication Factor2 Core Multiplication CPM Core Factor2 Frequency2 Frequency2 0001_000 33 MHz 2 66 MHz 4 133 MHz 0001_001 33 MHz 2 66 MHz 5 166 MHz 0001_010 33 MHz 2 66 MHz 6 200 MHz 0001_011 33 MHz 2 66 MHz 7 233 MHz 0001_100 33 MHz 2 66 MHz 8 266 MHz MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 23 Clock Configuration Modes Table 14. Clock Configuration Modes(1) (continued) Input Clock MODCK_H–MODCK[1–3] Frequency(2) ,(3) CPM Multiplication Factor2 0001_101 33 MHz 3 100 MHz 4 133 MHz 0001_110 33 MHz 3 100 MHz 5 166 MHz 0001_111 33 MHz 3 100 MHz 6 200 MHz 0010_000 33 MHz 3 100 MHz 7 233 MHz 0010_001 33 MHz 3 100 MHz 8 266 MHz 0010_010 33 MHz 4 133 MHz 4 133 MHz 0010_011 33 MHz 4 133 MHz 5 166 MHz 0010_100 33 MHz 4 133 MHz 6 200 MHz 0010_101 33 MHz 4 133 MHz 7 233 MHz 0010_110 33 MHz 4 133 MHz 8 266 MHz 0010_111 33 MHz 5 166 MHz 4 133 MHz 0011_000 33 MHz 5 166 MHz 5 166 MHz 0011_001 33 MHz 5 166 MHz 6 200 MHz 0011_010 33 MHz 5 166 MHz 7 233 MHz 0011_011 33 MHz 5 166 MHz 8 266 MHz 0011_100 33 MHz 6 200 MHz 4 133 MHz 0011_101 33 MHz 6 200 MHz 5 166 MHz 0011_110 33 MHz 6 200 MHz 6 200 MHz 0011_111 33 MHz 6 200 MHz 7 233 MHz 0100_000 33 MHz 6 200 MHz 8 266 MHz 0100_001 Core Multiplication CPM Core Factor2 Frequency2 Frequency2 Reserved 0100_010 0100_011 0100_100 0100_101 0100_110 MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 24 Freescale Semiconductor Clock Configuration Modes Table 14. Clock Configuration Modes(1) (continued) Input Clock MODCK_H–MODCK[1–3] Frequency(2) ,(3) CPM Multiplication Factor2 0100_111 Core Multiplication CPM Core Factor2 Frequency2 Frequency2 Reserved 0101_000 0101_001 0101_010 0101_011 0101_100 0101_101 66 MHz 2 133 MHz 2 133 MHz 0101_110 66 MHz 2 133 MHz 2.5 166 MHz 0101_111 66 MHz 2 133 MHz 3 200 MHz 0110_000 66 MHz 2 133 MHz 3.5 233 MHz 0110_001 66 MHz 2 133 MHz 4 266 MHz 0110_010 66 MHz 2 133 MHz 4.5 300 MHz 0110_011 66 MHz 2.5 166 MHz 2 133 MHz 0110_100 66 MHz 2.5 166 MHz 2.5 166 MHz 0110_101 66 MHz 2.5 166 MHz 3 200 MHz 0110_110 66 MHz 2.5 166 MHz 3.5 233 MHz 0110_111 66 MHz 2.5 166 MHz 4 266 MHz 0111_000 66 MHz 2.5 166 MHz 4.5 300 MHz 0111_001 66 MHz 3 200 MHz 2 133 MHz 0111_010 66 MHz 3 200 MHz 2.5 166 MHz 0111_011 66 MHz 3 200 MHz 3 200 MHz 0111_100 66 MHz 3 200 MHz 3.5 233 MHz 0111_101 66 MHz 3 200 MHz 4 266 MHz 0111_110 66 MHz 3 200 MHz 4.5 300 MHz 0111_111 66 MHz 3.5 233 MHz 2 133 MHz 1000_000 66 MHz 3.5 233 MHz 2.5 166 MHz MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 25 Clock Configuration Modes Table 14. Clock Configuration Modes(1) (continued) Input Clock MODCK_H–MODCK[1–3] Frequency(2) ,(3) CPM Multiplication Factor2 Core Multiplication CPM Core Factor2 Frequency2 Frequency2 1000_001 66 MHz 3.5 233 MHz 3 200 MHz 1000_010 66 MHz 3.5 233 MHz 3.5 233 MHz 1000_011 66 MHz 3.5 233 MHz 4 266 MHz 1000_100 66 MHz 3.5 233 MHz 4.5 300 MHz Notes: 1. Because of speed dependencies, not all of the possible configurations in Table 14 are applicable. 2. The user should choose the input clock frequency and the multiplication factors such that the frequency of the CPU is equal to or greater than150 MHz and the CPM ranges between 66–233 MHz. 3. Input clock frequency is given only for the purpose of reference. User should set MODCK_H–MODCK_L so that the resulting configuration does not exceed the frequency rating of the user’s part. 3.2 PCI Mode The MPC8265 and the MPC8266 have three clocking modes: local, PCI host, and PCI agent. The clocking mode is set according to three input pins—PCI_MODE, PCI_CFG[0], PCI_MODCK—as shown in Table 15. Table 15. MPC8265 and MPC8266 Clocking Modes Pins Clocking Mode PCI Clock Frequency Range (MHZ) PCI_MODE PCI_CFG[0] PCI_MODCK 1 — — Local bus — 0 0 0 PCI host 50–66 0 0 1 0 1 0 0 1 1 25–50 PCI agent 50–66 25–50 In addition, note the following: NOTE: PCI_MODCK In PCI mode only, PCI_MODCK comes from the LGPL5 pin and MODCK_H[0–3] comes from {LGPL0, LGPL1, LGPL2, LGPL3}. NOTE: Tval (Output Hold) The minimum Tval = 2 when PCI_MODCK = 1, and the minimum Tval = 1 when PCI_MODCK = 0. Therefore, designers should use clock configurations that fit this condition to achieve PCI-compliant AC timing. NOTE Clock configurations change only after POR is asserted. MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 26 Freescale Semiconductor Clock Configuration Modes 3.2.1 PCI Host Mode The frequencies listed in Table 16 and Table 17 are for the purpose of illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not exceed the frequency rating of the user’s device. I Table 16. Clock Default Configurations in PCI Host Mode (MODCK_HI = 0000) MODCK[1–3] (1) Core CPM Input Clock Core PCI Division CPM PCI Multiplication Frequency Multiplication Frequency Factor(2) Frequency Frequency2 Factor Factor (Bus) 000 66 MHz 2 133 MHz 2.5 166 MHz 2/4 66/33 MHz 001 66 MHz 2 133 MHz 3 200 MHz 2/4 66/33 MHz 010 66 MHz 2.5 166 MHz 3 200 MHz 3/6 55/28 MHz 011 66 MHz 2.5 166 MHz 3.5 233 MHz 3/6 55/28 MHz 100 66 MHz 2.5 166 MHz 4 266 MHz 3/6 55/28 MHz 101 66 MHz 3 200 MHz 3 200 MHz 3/6 66/33 MHz 110 66 MHz 3 200 MHz 3.5 233 MHz 3/6 66/33 MHz 111 66 MHz 3 200 MHz 4 266 MHz 3/6 66/33 MHz Notes: 1. Assumes MODCK_HI = 0000. 2. The frequency depends on the value of PCI_MODCK. If PCI_MODCK is high (logic ‘1’), the PCI frequency is divided by 2 (33 instead of 66 MHz, etc.) Refer to Table 15. Table 17 describes all possible clock configurations when using the MPC8265 or the MPC8266’s internal PCI bridge in host mode. Table 17. Clock Configuration Modes in PCI Host Mode Core Input Clock CPM Core PCI Division CPM MODCK_H – PCI Multiplication Frequency(1) Multiplication Frequency Factor(2) Frequency MODCK[1–3] Frequency2 Factor Factor (Bus) 0001_000 33 MHz 3 100 MHz 5 166 MHz 3/6 33/16 MHz 0001_001 33 MHz 3 100 MHz 6 200 MHz 3/6 33/16 MHz 0001_010 33 MHz 3 100 MHz 7 233 MHz 3/6 33/16 MHz 0001_011 33 MHz 3 100 MHz 8 266 MHz 3/6 33/16 MHz 0010_000 33 MHz 4 133 MHz 5 166 MHz 4/8 33/16 MHz 0010_001 33 MHz 4 133 MHz 6 200 MHz 4/8 33/16 MHz 0010_010 33 MHz 4 133 MHz 7 233 MHz 4/8 33/16 MHz 0010_011 33 MHz 4 133 MHz 8 266 MHz 4/8 33/16 MHz 0011_000(3) 33 MHz 5 166 MHz 5 166 MHz 5 33 MHz 0011_0013 33 MHz 5 166 MHz 6 200 MHz 5 33 MHz MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 27 Clock Configuration Modes Table 17. Clock Configuration Modes in PCI Host Mode (continued) Core Input Clock CPM Core PCI Division CPM MODCK_H – PCI Multiplication Frequency(1) Multiplication Frequency Factor(2) Frequency MODCK[1–3] Frequency2 Factor Factor (Bus) 0011_0103 33 MHz 5 166 MHz 7 233 MHz 5 33 MHz 0011_0113 33 MHz 5 166 MHz 8 266 MHz 5 33 MHz 0100_0003 33 MHz 6 200 MHz 5 166 MHz 6 33 MHz 0100_0013 33 MHz 6 200 MHz 6 200 MHz 6 33 MHz 0100_0103 33 MHz 6 200 MHz 7 233 MHz 6 33 MHz 0100_0113 33 MHz 6 200 MHz 8 266 MHz 6 33 MHz 0101_000 66 MHz 2 133 MHz 2.5 166 MHz 2/4 66/33 MHz 0101_001 66 MHz 2 133 MHz 3 200 MHz 2/4 66/33 MHz 0101_010 66 MHz 2 133 MHz 3.5 233 MHz 2/4 66/33 MHz 0101_011 66 MHz 2 133 MHz 4 266 MHz 2/4 66/33 MHz 0101_100 66 MHz 2 133 MHz 4.5 300 MHz 2/4 66/33 MHz 0110_000 66 MHz 2.5 166 MHz 2.5 166 MHz 3/6 55/28 MHz 0110_001 66 MHz 2.5 166 MHz 3 200 MHz 3/6 55/28 MHz 0110_010 66 MHz 2.5 166 MHz 3.5 233 MHz 3/6 55/28 MHz 0110_011 66 MHz 2.5 166 MHz 4 266 MHz 3/6 55/28 MHz 0110_100 66 MHz 2.5 166 MHz 4.5 300 MHz 3/6 55/28 MHz 0111_000 66 MHz 3 200 MHz 2.5 166 MHz 3/6 66/33 MHz 0111_001 66 MHz 3 200 MHz 3 200 MHz 3/6 66/33 MHz 0111_010 66 MHz 3 200 MHz 3.5 233 MHz 3/6 66/33 MHz 0111_011 66 MHz 3 200 MHz 4 266 MHz 3/6 66/33 MHz 0111_100 66 MHz 3 200 MHz 4.5 300 MHz 3/6 66/33 MHz 1000_000 66 MHz 3 200 MHz 2.5 166 MHz 4/8 50/25 MHz 1000_001 66 MHz 3 200 MHz 3 200 MHz 4/8 50/25 MHz 1000_010 66 MHz 3 200 MHz 3.5 233 MHz 4/8 50/25 MHz 1000_011 66 MHz 3 200 MHz 4 266 MHz 4/8 50/25 MHz 1000_100 66 MHz 3 200 MHz 4.5 300 MHz 4/8 50/25 MHz 1001_000 66 MHz 3.5 233 MHz 2.5 166 MHz 4/8 58/29 MHz MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 28 Freescale Semiconductor Clock Configuration Modes Table 17. Clock Configuration Modes in PCI Host Mode (continued) Core Input Clock CPM Core PCI Division CPM MODCK_H – PCI Multiplication Frequency(1) Multiplication Frequency Factor(2) Frequency MODCK[1–3] Frequency2 Factor Factor (Bus) 1001_001 66 MHz 3.5 233 MHz 3 200 MHz 4/8 58/29 MHz 1001_010 66 MHz 3.5 233 MHz 3.5 233 MHz 4/8 58/29 MHz 1001_011 66 MHz 3.5 233 MHz 4 266 MHz 4/8 58/29 MHz 1001_100 66 MHz 3.5 233 MHz 4.5 300 MHz 4/8 58/29 MHz 1010_000 100 MHz 2 200 MHz 2 200 MHz 3/6 66/33 MHz 1010_001 100 MHz 2 200 MHz 2.5 250 MHz 3/6 66/33 MHz 1010_010 100 MHz 2 200 MHz 3 300 MHz 3/6 66/33 MHz 1010_011 100 MHz 2 200 MHz 3.5 350 MHz 3/6 66/33 MHz 1010_100 100 MHz 2 200 MHz 4 400 MHz 3/6 66/33 MHz 1011_000 100 MHz 2.5 250 MHz 2 200 MHz 4/8 62/31 MHz 1011_001 100 MHz 2.5 250 MHz 2.5 250 MHz 4/8 62/31MHz 1011_010 100 MHz 2.5 250 MHz 3 300 MHz 4/8 62/31 MHz 1011_011 100 MHz 2.5 250 MHz 3.5 350 MHz 4/8 62/31 MHz 1011_100 100 MHz 2.5 250 MHz 4 400 MHz 4/8 62/31 MHz Notes: 1. Input clock frequency is given only for the purpose of reference. User should set MODCK_H–MODCK_L so that the resulting configuration does not exceed the frequency rating of the user’s part. 2. The frequency depends on the value of PCI_MODCK. If PCI_MODCK is high (logic ‘1’), the PCI frequency is divided by 2 (33 instead of 66 MHz, etc.). Refer to Table 15. 3. In this mode, PCI_MODCK must be “0”. 3.2.2 PCI Agent Mode The frequencies listed in Table 18 and Table 19 are for the purpose of illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not exceed the frequency rating of the user’s device. Table 18. Clock Default Configurations in PCI Agent Mode (MODCK_HI = 0000) MODCK[1–3] (1) Core 60x Bus Core Input Clock CPM Bus Division CPM Frequency Multiplication Frequency Frequency Multiplication Factor Frequency (3) (4) Factor (PCI)2 Factor(2) 000 66/33 MHz 2/4 133 MHz 2.5 166 MHz 2 66 MHz 001 66/33 MHz 2/4 133 MHz 3 200 MHz 2 66 MHz 010 66/33 MHz 3/6 200 MHz 3 200 MHz 3 66 MHz 011 66/33 MHz 3/6 200 MHz 4 266 MHz 3 66 MHz MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 29 Clock Configuration Modes Table 18. Clock Default Configurations in PCI Agent Mode (MODCK_HI = 0000) (continued) MODCK[1–3] (1) Core 60x Bus Core Input Clock CPM Bus Division CPM Frequency Multiplication Frequency Frequency Multiplication Factor Frequency (3) (4) Factor (PCI)2 Factor(2) 100 66/33 MHz 3/6 200 MHz 3 240 MHz 2.5 80 MHz 101 66/33 MHz 3/6 200 MHz 3.5 280 MHz 2.5 80 MHz 110 66/33 MHz 4/8 266 MHz 3.5 300 MHz 3 88 MHz 111 66/33 MHz 4/8 266 MHz 3 300 MHz 2.5 100 MHz Notes: 1. Assumes MODCK_HI = 0000. 2. The frequency depends on the value of PCI_MODCK. If PCI_MODCK is high (logic ‘1’), the PCI frequency is divided by 2 (33 instead of 66 MHz, etc.) and the CPM multiplication factor is multiplied by 2. Refer to Table 15. 3. Core frequency = (60x bus frequency)(core multiplication factor) 4. Bus frequency = CPM frequency / bus division factor Table 19 describes all possible clock configurations when using the MPC8265 or the MPC8266’s internal PCI bridge in agent mode. Table 19. Clock Configuration Modes in PCI Agent Mode Core CPM Input Clock Core 60x Bus MODCK_H – CPM Bus Division Frequency Multiplication Multiplication Frequency Frequency MODCK[1–3] Frequency Factor (3) (4) Factor1 (PCI)(1),(2) Factor 0001_001 66/33 MHz 2/4 133 MHz 5 166 MHz 4 33 MHz 0001_010 66/33 MHz 2/4 133 MHz 6 200 MHz 4 33 MHz 0001_011 66/33 MHz 2/4 133 MHz 7 233 MHz 4 33 MHz 0001_100 66/33 MHz 2/4 133 MHz 8 266 MHz 4 33 MHz 0010_001 50/25 MHz 3/6 150 MHz 3 180 MHz 2.5 60 MHz 0010_010 50/25 MHz 3/6 150 MHz 3.5 210 MHz 2.5 60 MHz 0010_011 50/25 MHz 3/6 150 MHz 4 240 MHz 2.5 60 MHz 0010_100 50/25 MHz 3/6 150 MHz 4.5 270 MHz 2.5 60 MHz 0011_000 66/33 MHz 2/4 133 MHz 2.5 110MHz 3 44 MHz 0011_001 66/33 MHz 2/4 133 MHz 3 132 MHz 3 44 MHz 0011_010 66/33 MHz 2/4 133 MHz 3.5 154 MHz 3 44 MHz 0011_011 66/33 MHz 2/4 133 MHz 4 176MHz 3 44 MHz 0011_100 66/33 MHz 2/4 133 MHz 4.5 198 MHz 3 44 MHz 0100_000 66/33 MHz 3/6 200 MHz 2.5 166 MHz 3 66 MHz 0100_001 66/33 MHz 3/6 200 MHz 3 200 MHz 3 66 MHz 0100_010 66/33 MHz 3/6 200 MHz 3.5 233 MHz 3 66 MHz MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 30 Freescale Semiconductor Clock Configuration Modes Table 19. Clock Configuration Modes in PCI Agent Mode (continued) Core Input Clock Core 60x Bus CPM MODCK_H – CPM Bus Division Frequency Multiplication Multiplication Frequency Frequency MODCK[1–3] Frequency Factor (3) (4) (PCI)(1),(2) Factor Factor1 0100_011 66/33 MHz 3/6 200 MHz 4 266 MHz 3 66 MHz 0100_100 66/33 MHz 3/6 200 MHz 4.5 300 MHz 3 66 MHz 0101_000(5) 33 MHz 5 166 MHz 2.5 166 MHz 2.5 66 MHz 0101_0015 33 MHz 5 166 MHz 3 200 MHz 2.5 66 MHz 0101_0105 33 MHz 5 166 MHz 3.5 233 MHz 2.5 66 MHz 0101_0115 33 MHz 5 166 MHz 4 266 MHz 2.5 66 MHz 0101_1005 33 MHz 5 166 MHz 4.5 300 MHz 2.5 66 MHz 0110_000 50/25 MHz 4/8 200 MHz 2.5 166 MHz 3 66 MHz 0110_001 50/25 MHz 4/8 200 MHz 3 200 MHz 3 66 MHz 0110_010 50/25 MHz 4/8 200 MHz 3.5 233 MHz 3 66 MHz 0110_011 50/25 MHz 4/8 200 MHz 4 266 MHz 3 66 MHz 0110_100 50/25 MHz 4/8 200 MHz 4.5 300 MHz 3 66 MHz 0111_000 66/33 MHz 3/6 200 MHz 2 200 MHz 2 100 MHz 0111_001 66/33 MHz 3/6 200 MHz 2.5 250 MHz 2 100 MHz 0111_010 66/33 MHz 3/6 200 MHz 3 300 MHz 2 100 MHz 0111_011 66/33 MHz 3/6 200 MHz 3.5 350 MHz 2 100 MHz 1000_000 66/33 MHz 3/6 200 MHz 2 160 MHz 2.5 80 MHz 1000_001 66/33 MHz 3/6 200 MHz 2.5 200 MHz 2.5 80 MHz 1000_010 66/33 MHz 3/6 200 MHz 3 240 MHz 2.5 80 MHz 1000_011 66/33 MHz 3/6 200 MHz 3.5 280 MHz 2.5 80 MHz 1000_100 66/33 MHz 3/6 200 MHz 4 320 MHz 2.5 80 MHz 1000_101 66/33 MHz 3/6 200 MHz 4.5 360 MHz 2.5 80 MHz 1001_000 66/33 MHz 4/8 266 MHz 2.5 166 MHz 4 66 MHz 1001_001 66/33 MHz 4/8 266 MHz 3 200 MHz 4 66 MHz 1001_010 66/33 MHz 4/8 266 MHz 3.5 233 MHz 4 66 MHz 1001_011 66/33 MHz 4/8 266 MHz 4 266 MHz 4 66 MHz 1001_100 66/33 MHz 4/8 266 MHz 4.5 300 MHz 4 66 MHz MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 31 Clock Configuration Modes Table 19. Clock Configuration Modes in PCI Agent Mode (continued) Core Input Clock Core 60x Bus CPM MODCK_H – CPM Bus Division Frequency Multiplication Multiplication Frequency Frequency MODCK[1–3] Frequency Factor (3) (4) (PCI)(1),(2) Factor Factor1 1010_000 66/33 MHz 4/8 266 MHz 2.5 222 MHz 3 88 MHz 1010_001 66/33 MHz 4/8 266 MHz 3 266 MHz 3 88 MHz 1010_010 66/33 MHz 4/8 266 MHz 3.5 300 MHz 3 88 MHz 1010_011 66/33 MHz 4/8 266 MHz 4 350 MHz 3 88 MHz 1010_100 66/33 MHz 4/8 266 MHz 4.5 400 MHz 3 88 MHz 1011_000 66/33 MHz 4/8 266 MHz 2 212MHz 2.5 106 MHz 1011_001 66/33 MHz 4/8 266 MHz 2.5 265 MHz 2.5 106 MHz 1011_010 66/33 MHz 4/8 266 MHz 3 318 MHz 2.5 106 MHz 1011_011 66/33 MHz 4/8 266 MHz 3.5 371 MHz 2.5 106 MHz 1011_100 66/33 MHz 4/8 266 MHz 4 424 MHz 2.5 106 MHz Notes: 1. The frequency depends on the value of PCI_MODCK. If PCI_MODCK is high (logic ‘1’), the PCI frequency is divided by 2 (33 instead of 66 MHz, etc.) and the CPM multiplication factor is multiplied by 2. Refer to Table 15. 2. Input clock frequency is given only for the purpose of reference. User should set MODCK_H–MODCK_L so that the resulting configuration does not exceed the frequency rating of the user’s part. 3. Core frequency = (60x bus frequency)(core multiplication factor) 4. Bus frequency = CPM frequency / bus division factor 5. In this mode, PCI_MODCK must be “1”. MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 32 Freescale Semiconductor Pinout 4 Pinout This section provides the pin assignments and pinout list for the MPC826xA. 4.1 Pin Assignments Figure 13 shows the pinout of the MPC826xA’s 480 TBGA package as viewed from the top surface. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 A A B C B C D D E F E F G G H H J K J K L L M N M N P P R R T U T U V W V W Y Y AA AA AB AC AB AC AD AD AE AF AE AF AG AG AH AH AJ AJ 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 Not to Scale Figure 13. Pinout of the 480 TBGA Package as Viewed from the Top Surface MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 33 Pinout Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view. View Copper Heat Spreader (Oxidized for Insulation) Etched Cavity Die Attach Polymide Tape Pressure Sensitive Adhesive Die Soldermask Glob-Top Filled Area Glob-Top Dam Copper Traces 1.27 mm Pitch Wire Bonds Figure 14. Side View of the TBGA Package Table 20 shows the pinout list of the MPC826xA. Table 21 defines conventions and acronyms used in Table 20. Table 20. Pinout List Pin Name Ball BR W5 BG F4 ABB/IRQ2 E2 TS E3 A0 G1 A1 H5 A2 H2 A3 H1 A4 J5 A5 J4 A6 J3 A7 J2 A8 J1 A9 K4 A10 K3 A11 K2 A12 K1 A13 L5 A14 L4 A15 L3 A16 L2 A17 L1 MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 34 Freescale Semiconductor Pinout Table 20. Pinout List (continued) Pin Name Ball A18 M5 A19 N5 A20 N4 A21 N3 A22 N2 A23 N1 A24 P4 A25 P3 A26 P2 A27 P1 A28 R1 A29 R3 A30 R5 A31 R4 TT0 F1 TT1 G4 TT2 G3 TT3 G2 TT4 F2 TBST D3 TSIZ0 C1 TSIZ1 E4 TSIZ2 D2 TSIZ3 F5 AACK F3 ARTRY E1 DBG V1 DBB/IRQ3 V2 D0 B20 D1 A18 D2 A16 D3 A13 D4 E12 D5 D9 D6 A6 MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 35 Pinout Table 20. Pinout List (continued) Pin Name Ball D7 B5 D8 A20 D9 E17 D10 B15 D11 B13 D12 A11 D13 E9 D14 B7 D15 B4 D16 D19 D17 D17 D18 D15 D19 C13 D20 B11 D21 A8 D22 A5 D23 C5 D24 C19 D25 C17 D26 C15 D27 D13 D28 C11 D29 B8 D30 A4 D31 E6 D32 E18 D33 B17 D34 A15 D35 A12 D36 D11 D37 C8 D38 E7 D39 A3 D40 D18 D41 A17 MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 36 Freescale Semiconductor Pinout Table 20. Pinout List (continued) Pin Name Ball D42 A14 D43 B12 D44 A10 D45 D8 D46 B6 D47 C4 D48 C18 D49 E16 D50 B14 D51 C12 D52 B10 D53 A7 D54 C6 D55 D5 D56 B18 D57 B16 D58 E14 D59 D12 D60 C10 D61 E8 D62 D6 D63 C2 DP0/RSRV/EXT_BR2 B22 IRQ1/DP1/EXT_BG2 A22 IRQ2/DP2/TLBISYNC/EXT_DBG2 E21 IRQ3/DP3/CKSTP_OUT/EXT_BR3 D21 IRQ4/DP4/CORE_SRESET/EXT_BG3 C21 IRQ5/DP5/TBEN/EXT_DBG3 B21 IRQ6/DP6/CSE0 A21 IRQ7/DP7/CSE1 E20 PSDVAL V3 TA C22 TEA V5 GBL/IRQ1 W1 CI/BADDR29/IRQ2 U2 MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 37 Pinout Table 20. Pinout List (continued) Pin Name Ball WT/BADDR30/IRQ3 U3 L2_HIT/IRQ4 Y4 CPU_BG/BADDR31/IRQ5 U4 CPU_DBG R2 CPU_BR Y3 CS0 F25 CS1 C29 CS2 E27 CS3 E28 CS4 F26 CS5 F27 CS6 F28 CS7 G25 CS8 D29 CS9 E29 CS10/BCTL1 F29 CS11/AP0 G28 BADDR27 T5 BADDR28 U1 ALE T2 BCTL0 A27 PWE0/PSDDQM0/PBS0 C25 PWE1/PSDDQM1/PBS1 E24 PWE2/PSDDQM2/PBS2 D24 PWE3/PSDDQM3/PBS3 C24 PWE4/PSDDQM4/PBS4 B26 PWE5/PSDDQM5/PBS5 A26 PWE6/PSDDQM6/PBS6 B25 PWE7/PSDDQM7/PBS7 A25 PSDA10/PGPL0 E23 PSDWE/PGPL1 B24 POE/PSDRAS/PGPL2 A24 PSDCAS/PGPL3 B23 PGTA/PUPMWAIT/PGPL4/PPBS A23 PSDAMUX/PGPL5 D22 MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 38 Freescale Semiconductor Pinout Table 20. Pinout List (continued) Pin Name Ball LWE0/LSDDQM0/LBS0/PCI_CFG0(1) H28 LWE1/LSDDQM1/LBS1/PCI_CFG11 H27 LWE2/LSDDQM2/LBS2/PCI_CFG21 H26 LWE3/LSDDQM3/LBS3/PCI_CFG31 G29 LSDA10/LGPL0/PCI_MODCKH01 D27 1 C28 LSDWE/LGPL1/PCI_MODCKH1 LOE/LSDRAS/LGPL2/PCI_MODCKH21 E26 LSDCAS/LGPL3/PCI_MODCKH31 D25 LGTA/LUPMWAIT/LGPL4/LPBS C26 LGPL5/LSDAMUX/PCI_MODCK1 B27 LWR D28 L_A14/PAR1 N27 L_A15/FRAME1/SMI T29 L_A16/TRDY 1 R27 L_A17/IRDY1/CKSTP_OUT R26 L_A18/STOP1 R29 L_A19/DEVSEL1 R28 1 L_A20/IDSEL W29 L_A21/PERR1 P28 L_A22/SERR1 N26 L_A23/REQ01 L_A24/REQ11 AA27 /HSEJSW 1 P29 L_A25/GNT01 AA26 L_A26/GNT11/HSLED 1 N25 L_A27/GNT2 1/HSENUM1 AA25 L_A28/RST1 AB29 L_A29/INTA1 AB28 L_A30/REQ21 P25 L_A31/DLLOUT1 AB27 LCL_D0/AD01 H29 /CORE_SRESET 1 LCL_D1/AD1 J29 LCL_D2/AD21 J28 LCL_D3/AD31 J27 LCL_D4/AD41 J26 LCL_D5/AD51 J25 MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 39 Pinout Table 20. Pinout List (continued) Pin Name Ball LCL_D6/AD61 K25 LCL_D7/AD71 L29 LCL_D8/AD81 L27 LCL_D9/AD91 L26 LCL_D10/AD10 1 L25 1 M29 LCL_D12/AD12 1 M28 LCL_D13/AD13 1 M27 LCL_D14/AD14 1 M26 LCL_D15/AD15 1 N29 LCL_D16/AD16 1 T25 LCL_D17/AD17 1 U27 LCL_D18/AD18 1 U26 LCL_D19/AD19 1 U25 LCL_D20/AD20 1 V29 LCL_D21/AD21 1 V28 LCL_D22/AD22 1 V27 1 V26 LCL_D11/AD11 LCL_D23/AD23 LCL_D24/AD24 1 W27 LCL_D25/AD25 1 W26 LCL_D26/AD26 1 W25 LCL_D27/AD27 1 Y29 LCL_D28/AD28 1 Y28 LCL_D29/AD29 1 Y25 1 AA29 LCL_D31/AD31 1 AA28 LCL_DP0/C01/BE01 L28 LCL_DP1/C11/BE11 N28 LCL_DP2/C21 T28 LCL_D30/AD30 /BE2 1 LCL_DP3/C31/BE31 W28 IRQ0/NMI_OUT T1 IRQ7/INT_OUT/APE D1 TRST AH3 TCK AG5 TMS AJ3 MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 40 Freescale Semiconductor Pinout Table 20. Pinout List (continued) Pin Name Ball TDI AE6 TDO AF5 TRIS AB4 PORESET AG6 HRESET AH5 SRESET AF6 QREQ AA3 RSTCONF AJ4 MODCK1/AP1/TC0/BNKSEL0 W2 MODCK2/AP2/TC1/BNKSEL1 W3 MODCK3/AP3/TC2/BNKSEL2 W4 XFC AB2 CLKIN1 AH4 PA0/RESTART1/DREQ3/FCC2_UTM_TXADDR2 AC29(2) PA1/REJECT1/FCC2_UTM_TXADDR1/DONE3 AC252 PA2/CLK20/FCC2_UTM_TXADDR0/DACK3 AE282 PA3/CLK19/FCC2_UTM_RXADDR0/DACK4/L1RXD1A2 AG292 PA4/REJECT2/FCC2_UTM_RXADDR1/DONE4 AG282 PA5/RESTART2/DREQ4/FCC2_UTM_RXADDR2 AG262 PA6/L1RSYNCA1 AE242 PA7/SMSYN2/L1TSYNCA1/L1GNTA1 AH25 2 PA8/SMRXD2/L1RXD0A1/L1RXDA1 AF232 PA9/SMTXD2/L1TXD0A1 AH23 2 PA10/FCC1_UT8_RXD0/FCC1_UT16_RXD8/MSNUM5 AE222 PA11/FCC1_UT8_RXD1/FCC1_UT16_RXD9/MSNUM4 AH22 2 PA12/FCC1_UT8_RXD2/FCC1_UT16_RXD10/MSNUM3 AJ212 PA13/FCC1_UT8_RXD3/FCC1_UT16_RXD11/MSNUM2 AH20 2 PA14/FCC1_UT8_RXD4/FCC1_UT16_RXD12/FCC1_RXD3 AG192 PA15/FCC1_UT8_RXD5/FCC1_UT16_RXD13/FCC1_RXD2 AF182 PA16/FCC1_UT8_RXD6/FCC1_UT16_RXD14/FCC1_RXD1 AF172 PA17/FCC1_UT8_RXD7/FCC1_UT16_RXD15/FCC1_RXD0/FCC1_RXD AE162 PA18/FCC1_UT8_TXD7/FCC1_UT16_TXD15/FCC1_TXD0/FCC1_TXD AJ162 PA19/FCC1_UT8_TXD6/FCC1_UT16_TXD14/FCC1_TXD1 AG152 PA20/FCC1_UT8_TXD5/FCC1_UT16_TXD13/FCC1_TXD2 AJ132 PA21/FCC1_UT8_TXD4/FCC1_UT16_TXD12/FCC1_TXD3 AE132 MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 41 Pinout Table 20. Pinout List (continued) Pin Name Ball PA22/FCC1_UT8_TXD3/FCC1_UT16_TXD11 AF122 PA23/FCC1_UT8_TXD2/FCC1_UT16_TXD10 AG112 PA24/FCC1_UT8_TXD1/FCC1_UT16_TXD9/MSNUM1 AH92 PA25/FCC1_UT8_TXD0/FCC1_UT16_TXD8/MSNUM0 AJ82 PA26/FCC1_UTM_RXCLAV/FCC1_UTS_RXCLAV/FCC1_MII_RX_ER AH72 PA27/FCC1_UT_RXSOC/FCC1_MII_RX_DV AF72 PA28/FCC1_UTM_RXENB/FCC1_UTS_RXENB/FCC1_MII_TX_EN AD52 PA29/FCC1_UT_TXSOC/FCC1_MII_TX_ER AF12 PA30/FCC1_UTM_TXCLAV/FCC1_UTS_TXCLAV/FCC1_MII_CRS/ FCC1_RTS AD32 PA31/FCC1_UTM_TXENB/FCC1_UTS_TXENB/FCC1_MII_COL AB52 PB4/FCC3_TXD3/FCC2_UT8_RXD0/L1RSYNCA2/FCC3_RTS AD28 2 PB5/FCC3_TXD2/FCC2_UT8_RXD1/L1TSYNCA2/L1GNTA2 AD26 2 PB6/FCC3_TXD1/FCC2_UT8_RXD2/L1RXDA2/L1RXD0A2 AD25 2 PB7/FCC3_TXD0/FCC3_TXD/FCC2_UT8_RXD3/L1TXDA2/L1TXD0A2 AE262 PB8/FCC2_UT8_TXD3/FCC3_RXD0/FCC3_RXD/TXD3/L1RSYNCD1 AH27 2 PB9/FCC2_UT8_TXD2/FCC3_RXD1/L1TXD2A2/L1TSYNCD1/L1GNTD1 AG242 PB10/FCC2_UT8_TXD1/FCC3_RXD2/L1RXDD1 AH24 2 PB11/FCC3_RXD3/FCC2_UT8_TXD0/L1TXDD1 AJ242 PB12/FCC3_MII_CRS/L1CLKOB1/L1RSYNCC1/TXD2 AG222 PB13/FCC3_MII_COL/L1RQB1/L1TSYNCC1/L1GNTC1/L1TXD1A2 AH21 2 PB14/FCC3_MII_TX_EN/RXD3/L1RXDC1 AG202 PB15/FCC3_MII_TX_ER/RXD2/L1TXDC1 AF192 PB16/FCC3_MII_RX_ER/L1CLKOA1/CLK18 AJ182 PB17/FCC3_MII_RX_DV/L1RQA1/CLK17 AJ172 PB18/FCC2_UT8_RXD4/FCC2_RXD3/L1CLKOD2/L1RXD2A2 AE142 PB19/FCC2_UT8_RXD5/FCC2_RXD2/L1RQD2/L1RXD3A2 AF132 PB20/FCC2_UT8_RXD6/FCC2_RXD1/L1RSYNCD2/L1TXD1A1 AG122 PB21/FCC2_UT8_RXD7/FCC2_RXD0/FCC2_RXD/L1TSYNCD2/L1GNTD2/ AH11 2 L1TXD2A1 PB22/FCC2_UT8_TXD7/FCC2_TXD0/FCC2_TXD/L1RXD1A1/L1RXDD2 AH16 2 PB23/FCC2_UT8_TXD6/FCC2_TXD1/L1RXD2A1/L1TXDD2 AE152 PB24/FCC2_UT8_TXD5/FCC2_TXD2/L1RXD3A1/L1RSYNCC2 AJ92 PB25/FCC2_UT8_TXD4/FCC2_TXD3/L1TSYNCC2/L1GNTC2/L1TXD3A1 AE92 PB26/FCC2_MII_CRS/FCC2_UT8_TXD1/L1RXDC2 AJ72 MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 42 Freescale Semiconductor Pinout Table 20. Pinout List (continued) Pin Name Ball PB27/FCC2_MII_COL/FCC2_UT8_TXD0/L1TXDC2 AH62 PB28/FCC2_MII_RX_ER/FCC2_RTS/L1TSYNCB2/L1GNTB2/TXD1 AE32 PB29/FCC2_UTM_RXCLAV/FCC2_UTS_RXCLAV/L1RSYNCB2/ FCC2_MII_TX_EN AE22 PB30/FCC2_MII_RX_DV/FCC2_UT_TXSOC/L1RXDB2 AC52 PB31/FCC2_MII_TX_ER/FCC2_UT_RXSOC/L1TXDB2 AC42 PC0/DREQ1/BRGO7/SMSYN2/L1CLKOA2 AB262 PC1/DREQ2/BRGO6/L1RQA2 AD29 2 PC2/FCC3_CD/FCC2_UT8_TXD3/DONE2 AE292 PC3/FCC3_CTS/FCC2_UT8_TXD2/DACK2/CTS4 AE272 PC4/FCC2_UTM_RXENB/FCC2_UTS_RXENB/SI2_L1ST4/FCC2_CD AF272 PC5/FCC2_UTM_TXCLAV/FCC2_UTS_TXCLAV/SI2_L1ST3/FCC2_CTS AF242 PC6/FCC1_CD/L1CLKOC1/FCC1_UTM_RXADDR2/FCC1_UTS_RXADDR/ AJ262 FCC1_UTM_RXCLAV1 PC7/FCC1_CTS/L1RQC1/FCC1_UTM_TXADDR2/FCC1_UTS_TXADDR2/ FCC1_UTM_TXCLAV1 AJ252 PC8/CD4/RENA4/FCC1_UT16_TXD0/SI2_L1ST2/CTS3 AF222 PC9/CTS4/CLSN4/FCC1_UT16_TXD1/SI2_L1ST1/L1TSYNCA2/L1GNTA2 AE212 PC10/CD3/RENA3/FCC1_UT16_TXD2/SI1_L1ST4/FCC2_UT8_RXD3 AF202 PC11/CTS3/CLSN3/L1CLKOD1/L1TXD3A2/FCC2_UT8_RXD2 AE192 PC12/CD2/RENA2/SI1_L1ST3/FCC1_UTM_RXADDR1/ FCC1_UTS_RXADDR1 AE182 PC13/CTS2/CLSN2/L1RQD1/FCC1_UTM_TXADDR1/ FCC1_UTS_TXADDR1 AH18 2 PC14/CD1/RENA1/FCC1_UTM_RXADDR0/FCC1_UTS_RXADDR0 AH17 2 PC15/CTS1/CLSN1/SMTXD2/FCC1_UTM_TXADDR0/ FCC1_UTS_TXADDR0 AG162 PC16/CLK16/TIN4 AF152 PC17/CLK15/TIN3/BRGO8 AJ152 PC18/CLK14/TGATE2 AH14 2 PC19/CLK13/BRGO7/SPICLK AG132 PC20/CLK12/TGATE1 AH12 2 PC21/CLK11/BRGO6 AJ112 PC22/CLK10/DONE1 AG102 PC23/CLK9/BRGO5/DACK1 AE102 PC24/FCC2_UT8_TXD3/CLK8/TOUT4 AF92 PC25/FCC2_UT8_TXD2/CLK7/BRGO4 AE82 MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 43 Pinout Table 20. Pinout List (continued) Pin Name Ball PC26/CLK6/TOUT3/TMCLK AJ62 PC27/FCC3_TXD/FCC3_TXD0/CLK5/BRGO3 AG22 PC28/CLK4/TIN1/TOUT2/CTS2/CLSN2 AF32 PC29/CLK3/TIN2/BRGO2/CTS1/CLSN1 AF22 PC30/FCC2_UT8_TXD3/CLK2/TOUT1 AE12 PC31/CLK1/BRGO1 AD12 PD4/BRGO8/L1TSYNCD1/L1GNTD1/FCC3_RTS/SMRXD2 AC282 PD5/FCC1_UT16_TXD3/DONE1 AD27 2 PD6/FCC1_UT16_TXD4/DACK1 AF292 PD7/SMSYN1/FCC1_UTM_TXADDR3/FCC1_UTS_TXADDR3/ FCC2_UTM_TXADDR4/FCC1_TXCLAV2 AF282 PD8/SMRXD1/FCC2_UT_TXPRTY/BRGO5 AG252 PD9/SMTXD1/FCC2_UT_RXPRTY/BRGO3 AH26 2 PD10/L1CLKOB2/FCC2_UT8_RXD1/L1RSYNCB1/BRGO4 AJ272 PD11/L1RQB2/FCC2_UT8_RXD0/L1TSYNCB1/L1GNTB1 AJ232 PD12/SI1_L1ST2/L1RXDB1 AG232 PD13/SI1_L1ST1/L1TXDB1 AJ222 PD14/FCC1_UT16_RXD0/L1CLKOC2/I2CSCL AE202 PD15/FCC1_UT16_RXD1/L1RQC2/I2CSDA AJ202 PD16/FCC1_UT_TXPRTY/L1TSYNCC1/L1GNTC1/SPIMISO AG182 PD17/FCC1_UT_RXPRTY/BRGO2/SPIMOSI AG172 PD18/FCC1_UTM_RXADDR4/FCC1_UTS_RXADDR4/ FCC1_UTM_RXCLAV3/FCC2_UTM_RXADDR3/SPICLK AF162 PD19/FCC1_UTM_TXADDR4/FCC1_UTS_TXADDR4/ FCC1_UTM_TXCLAV3/FCC2_UTM_TXADDR3/SPISEL/BRGO1 AH15 2 PD20/RTS4/TENA4/FCC1_UT16_RXD2/L1RSYNCA2 AJ142 PD21/TXD4/FCC1_UT16_RXD3/L1RXD0A2/L1RXDA2 AH13 2 PD22/RXD4/FCC1_UT16_TXD5/L1TXD0A2/L1TXDA2 AJ122 PD23/RTS3/TENA3/FCC1_UT16_RXD4/L1RSYNCD1 AE122 PD24/TXD3/FCC1_UT16_RXD5/L1RXDD1 AF102 PD25/RXD3/FCC1_UT16_TXD6/L1TXDD1 AG92 PD26/RTS2/TENA2/FCC1_UT16_RXD6/L1RSYNCC1 AH82 PD27/TXD2/FCC1_UT16_RXD7/L1RXDC1 AG72 PD28/RXD2/FCC1_UT16_TXD7/L1TXDC1 AE42 PD29/RTS1/TENA1/FCC1_UTM_RXADDR3/FCC1_UTS_RXADDR3/ FCC1_UTM_RXCLAV2/FCC2_UTM_RXADDR4 AG12 MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 44 Freescale Semiconductor Pinout Table 20. Pinout List (continued) Pin Name Ball PD30/FCC2_UTM_TXENB/FCC2_UTS_TXENB/TXD1 AD42 PD31/RXD1 AD22 VCCSYN AB3 VCCSYN1 B9 GNDSYN AB1 CLKIN21,(3) AE11 SPARE4(4) U5 PCI_MODE1,(5) AF25 SPARE64 V4 THERMAL0(6) AA1 THERMAL16 AG4 I/O power AG21, AG14, AG8, AJ1, AJ2, AH1, AH2, AG3, AF4, AE5, AC27, Y27, T27, P27, K26, G27, AE25, AF26, AG27, AH28, AH29, AJ28, AJ29, C7, C14, C16, C20, C23, E10, A28, A29, B28, B29, C27, D26, E25, H3, M4, T3, AA4, A1, A2, B1, B2, C3, D4, E5 Core Power U28, U29, K28, K29, A9, A19, B19, M1, M2, Y1, Y2, AC1, AC2, AH19, AJ19, AH10, AJ10, AJ5 Ground AA5, AF21, AF14, AF8, AE7, AF11, AE17, AE23, AC26, AB25, Y26, V25, T26, R25, P26, M25, K27, H25, G26, D7, D10, D14, D16, D20, D23, C9, E11, E13, E15, E19, E22, B3, G5, H4, K5, M3, P5, T4, Y5, AA2, AC3 Notes: 1. MPC8265 and MPC8266 only. 2. The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs. 3. On PCI devices (MPC8265 and MPC8266) this pin should be used as CLKIN2. On non-PCI devices (MPC8260A and MPC8264) this is a spare pin that must be pulled down or left floating. 4. Must be pulled down or left floating. 5. On PCI devices (MPC8265 and MPC8266) this pin should be asserted if the PCI function is desired or pulled up or left floating if PCI is not desired. On non-PCI devices (MPC8260A and MPC8264) this is a spare pin that must be pulled up or left floating. 6. For information on how to use this pin, refer to MPC8260 PowerQUICC II Thermal Resistor Guide available at www.freescale.com. MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 45 Package Description Symbols used in Table 20 are described in Table 21. Table 21. Symbol Legend Symbol 5 Meaning OVERBAR Signals with overbars, such as TA, are active low. UTM Indicates that a signal is part of the UTOPIA master interface. UTS Indicates that a signal is part of the UTOPIA slave interface. UT8 Indicates that a signal is part of the 8-bit UTOPIA interface. UT16 Indicates that a signal is part of the 16-bit UTOPIA interface. MII Indicates that a signal is part of the media independent interface. Package Description The following sections provide the package parameters and mechanical dimensions for the MPC826xA. 5.1 Package Parameters Package parameters are provided in Table 22. The package type is a 37.5 x 37.5 mm, 480-lead TBGA. Table 22. Package Parameters Parameter Value Package Outline 37.5 x 37.5 mm Interconnects 480 (29 x 29 ball array) Pitch 1.27 mm Nominal unmounted package height 1.55 mm MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 46 Freescale Semiconductor Package Description 5.2 Mechanical Dimensions Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package. Notes: 1. Dimensions and Tolerancing per ASME Y14.5M-1994. 2. Dimensions in millimeters. 3. Dimension b is measured at the Millimeters Dim Min Max A 1.45 1.65 A1 0.60 0.70 A2 0.85 0.95 A3 0.25 — b 0.65 0.85 D 37.50 BSC D1 35.56 REF e 1.27 BSC E 37.50 BSC E1 35 56 REF Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 47 Ordering Information 6 Ordering Information Figure 16 provides an example of the Freescale part numbering nomenclature for the MPC826xA. In addition to the processor frequency, the part numbering scheme also consists of a part modifier that indicates any enhancement(s) in the part from the original production design. Each part number also contains a revision code that refers to the die mask revision number and is specified in the part numbering scheme for identification purposes only. For more information, contact your local Freescale sales office. MPC 826X A C ZU XXX X Product Code Die Revision Level Device Number Process Technology (None = 0.29 micron A = 0.25 micron) Processor Frequency (CPU/CPM/Bus) Temperature Range (Blank = 0 to 105 °C C = -40 to 105 °C Package ZU = 480 TBGA VR = 516 PBGA Figure 16. Freescale Part Number Key 7 Document Revision History Table 23 lists significant changes in each revision of this document. Table 23. Document Revision History Revision Date Substantive Changes 0 — 0.1 8/2001 • Table 8: Change to sp20/sp21. 0.2 11/2001 • • • • Initial version Revision of Table 5, “Power Dissipation” Modifications to Figure 9, Table 2,Table 10, Table 11, and Table 18 Modification to pinout diagram, Figure 13 Additional revisions to text and figures throughout MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 48 Freescale Semiconductor Document Revision History Table 23. Document Revision History (continued) Revision Date Substantive Changes 0.3 11/2001 • Table 1: note 3 • Section 2.1: Removal of “Warning” recommending use of bootstrap diodes. They are not needed. • Table 9: Change to sp12. • Table 10: Change to sp32. • Note 2 for Table 16 and Table 17 • Addition of note at beginning of Section 3.2 • Note 1 for Table 18 and Table 19 • Table 20: Additions to B27, C28, D25, D27, E26, G29, H26–28, N25, P29, AF25, AA25, AB27 0.4 2/2002 • Note 2 for Table 2 (changes in italics): “...greater than or equal to 266 MHz, 200 MHz CPM...” • Table 19: Core and bus frequency values for the following ranges of MODCK_HMODCK: 0011_000 to 0011_100 and 1011_000 to 1011_1000 • Table 20: Notes added to pins at AE11, AF25, U5, and V4. 0.5 3/2002 • Table 20: Modified notes to pins AE11 and AF25. • Table 20: Addition of note to pins AA1 and AG4 (Therm0 and Therm1). 0.6 3/2002 • Table 20: Modified notes to pins AE11 and AF25. 0.7 5/2002 • • • • Section 1, “Features”: minimum supported core frequency of 150 MHz Section 1, “Features”: updated performance values (under “Dual-issue integer core”) Table 2: Note 2 (changes in italics): “...less than or equal to 233 MHz, 166 MHz CPM...” Table 2: Addition of note 3. 0.8 1/2003 • • • • • • Table 2: Modification to supply voltage ranges reflected in notes 2, 3, and 4. Table 4: Addition of θJB and θJC. Table 7, Figure 8: Addition of sp42a/sp43a. Figure 3, Figure 4: Addition of note for FCC output. Figure 5, Figure 6, Figure 7: Addition of notes. Table 14, Table 17, and Table 19: Removal of PLL bypass mode from clock tables. 0.9 8/2003 • Note: In revision 0.3, sp30 (Table 10) was changed. This change was not previously recorded in this “Document Revision History” Table. • Removal of “HiP4 PowerQUICC II Documentation” table. These supplemental specifications have been replaced by revision 1 of the MPC8260 PowerQUICC II™ Family Reference Manual. • Figure 1 and Section 1, “Features”: Addition of MPC8255 notes • Addition of Figure 2 • Addition of VCCSYN to “Note: Core, PLL, and I/O Supply Voltages” following Table 2 • Addition of note 1 to Table 3 • Table 4: Changes to θJA and θJB and θJC. • Addition of notes or modifications to Figure 6, Figure 7, and Figure 8 • Table 9: Change of sp10. • Addition of Table 15. • Addition of note 2 to Table 20 • Table 20: Addition of FCC2 Rx and Tx [3,4] to CPM pins PD7, PD18, PD19, and PD29. Also, the addition of SPICLK to PC19. They are documented correctly in the parallel I/O ports chapter in the MPC8260 PowerQUICC II™ Family Reference Manual but had previously been omitted from Table 20. 1.0 9/2005 • Document template update 1.1 03/2006 • Addition of Table 12. MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 49 Document Revision History THIS PAGE INTENTIONALLY LEFT BLANK MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 50 Freescale Semiconductor Document Revision History THIS PAGE INTENTIONALLY LEFT BLANK MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1 Freescale Semiconductor 51 How to Reach Us: Home Page: www.freescale.com email: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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