EtronTech EM584161 256K x 16 Low Power SRAM Rev 2.0 Features Pin Configuration • Single power supply voltage of 1.65V to 1.95V • Power down features using CE1# and CE2 48-Ball BGA (CSP), Top View 1 2 3 4 5 6 • Low power dissipation • Data retention supply voltage: 0.9V to 1.95V A LB# OE# A0 A1 A2 CE2 • Direct TTL compatibility for all input and output B DQ8 UB# A3 A4 CE1# DQ0 C DQ9 DQ10 A5 A6 DQ1 DQ2 D GND DQ11 A17 A7 DQ3 VDD E VDD DQ12 NC A16 DQ4 GN D F DQ14 DQ13 A14 A15 DQ5 DQ6 G DQ15 NC A12 A13 WE# DQ7 H NC A8 A9 A10 A11 NC • Wide operating temperature range: -40°C to 85°C • Standby current @ VDD = 1.95 V 11/2003 ISB Maximum EM584161BA/BC-70/85 8 µA EM584161BA-70E/85E 80 µA Ordering Information Part Number Speed ISB Package EM584161BC-70 70 ns 8 µA 6x8 BGA EM584161BA-70 70 ns 8 µA 8x10 BGA EM584161BA-70E 70 ns 80 µA 8x10 BGA EM584161BC-85 85 ns 8 µA 6x8 BGA EM584161BA-85 85 ns 8 µA 8x10 BGA Symbol Function 8x10 BGA A0 - A17 DQ0 - DQ15 CE1#, CE2 OE# WE# LB#, UB# GND VDD NC Address Inputs Data Inputs / Outputs Chip Enable Inputs Output Enable Read / Write Control Input Data Byte Control Inputs Ground Power Supply No Connection EM584161BA-85E 85 ns 80 µA Overview Pin Description The EM584161 is a 4,194,304-bit SRAM organized as 262,144 words by 16 bits. It is designed with advanced CMOS technology. This Device operates from a single 1.65V to 1.95V power supply. Advanced circuit technology provides both high speed and low power. It is automatically placed in low-power mode when chip enable (CE1#) is asserted high or (CE2) is asserted low. There are three control inputs. CE1# and CE2 are used to select the device and for data retention control, and output enable (OE#) provides fast memory access. Data byte control pin (LB#,UB#) provides lower and upper byte access. This device is well suited to various microprocessor system applications where high speed, low power and battery backup are required. And, with a guaranteed operating range from -40°C to 85°C, the EM584161 can be used in environments exhibiting extreme temperature conditions. Etron Technology, Inc. No. 6, Technology Rd. V, Science-Based Industrial Park, Hsinchu, Taiwan 30077, R.O.C. TEL: (886)-3-5782345 FAX: (886)-3-5778671 Etron Technology, Inc., reserves the right to make changes to its products and specifications without notice. EtronTech EM584161 Block Diagram A0 VDD MEMORY CELL ARRAY 2,048X128X16 (4,194,304) GND A17 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 SENSE AMP DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 COLUMN ADDRESS DECODER WE# UB# LB# OE# CE1# CE2 POWER DOWN CIRCUIT 2 Rev 2.0 Nov. 2003 EtronTech EM584161 Operating Mode Mode CE1# Read L Write L CE2 OE# H H WE# L X H L LB# UB# DQ0~DQ7 DQ8~DQ15 L L DOUT DOUT H L High-Z DOUT L H DOUT High-Z L L DIN DIN H L High-Z DIN L H DIN High-Z High-Z High-Z High-Z High-Z L H H H X X L H X X H H H X X X X X X L X X X X Output Deselect Standby Note: X = don't care. H=logic high. L=logic low. Absolute Maximum Ratings Supply voltage, VDD -0.5 to +2.5V Input voltages, VIN -0.5 to +2.5V Input and output voltages, VI/O -0.5 to VDD +0.5V Operating temperature, TOPR -40 to +85°C Storage temperature, TSTRG -65 to +150°C Soldering Temperature (10s), TSOLDER 240°C Power dissipation, PD 0.6 W DC Recommended Operating Conditions (Ta=-40°C to 85°C) Symbol Parameter Min. Typ. Max. VDD Power Supply Voltage 1.65 1.8 1.95 VIH VIL Input High Voltage Input Low Voltage VDR Data Retention Supply Voltage Note: (1) Overshoot : 2.7V if pulse width ≤ 20ns Unit V (1) − VDD+0.2 V - 0.2 − 0.4 V 0.9 − 1.95 V 1.4 (2) (2) Undershoot : -1.0V if pulse width ≤ 20ns 3 Rev 2.0 Nov. 2003 EtronTech EM584161 DC Characteristics (Ta = -40°C to 85°C, VDD = 1.65V to 1.95V) Symbol Parameter Test Conditions Min. Typ. Max. Unit IDD1 Operating current @ min cycle time CE1# = VIL and CE2 = VIH and IOUT = 0mA − − 15 mA IDD2 Operating current @ max cycle time (1µs) Other Input = VIH / VIL − − 2 mA ISB Standby current CE1# ≥ VDD -0.2V, or CE2 ≤ 0.2V, Others inputs ≤ 0.2V or ≥ VDD -0.2V − − 8 µA VOH Output HIGH Voltage IOH = -100 µA VDD – 0.2V − − V VOL Output LOW Voltage IOL = 100 µA − − 0.3 V Notes: * Typical value are measured at Ta = 25°C. ** In standby mode with CE1# ≥ VDD - 0.2V, these limits are assured for the condition CE2 ≥ VDD - 0.2V or CE2 ≤ 0.2V. Capacitance (Ta = 25°C; f = 1 MHz) Parameter Input capacitance Symbol Min Typ Max Unit Test Conditions CIN − − 10 pF VIN = GND COUT 10 pF VOUT = GND − − Notes: This parameter is periodically sampled and is not 100% tested. Output capacitance 4 Rev 2.0 Nov. 2003 EtronTech EM584161 AC Characteristics and Operating Conditions(Ta = -40°C to 85°C, VDD = 1.65V to 1.95V) Read Cycle EM584161 Symbol -85 Parameter -70 Unit Min Max Min Max tRC Read cycle time 85 − 70 − tAA Address access time − 85 − 70 tCO1 Chip Enable (CE1#) Access Time − 85 − 70 tCO2 Chip Enable (CE2) Access Time − 85 − 70 tOE Output enable access time − 45 − 35 tBA Data Byte Control Access Time − 45 − 35 tLZ Chip Enable Low to Output in Low-Z 10 − 10 − tOLZ Output enable Low to Output in Low-Z 3 − 3 − tBLZ Data Byte Control Low to Output in Low-Z 5 − 5 − tHZ Chip Enable High to Output in High-Z − 35 − 25 tOHZ Output Enable High to Output in High-Z − 35 − 25 tBHZ Data Byte Control High to Output in High-Z − 35 − 25 tOH Output Data Hold Time 10 − 10 − ns Write Cycle EM584161 Symbol -85 Parameter -70 Unit Min Max Min Max tWC Write cycle time 85 − 70 − tWP Write pulse width 55 − 55 − tCW Chip Enable to end of write 70 − 60 − tBW Data Byte Control to end of Write 70 − 60 − tAS Address setup time 0 − 0 − tWR Write Recovery time 0 − 0 − tWHZ WE# Low to Output in High-Z − 35 − 30 tOW WE# High to Output in Low-Z 5 − 5 − tDS Data Setup Time 35 − 30 − tDH Data Hold Time 0 − 0 − ns AC Test Condition • Output load : 30pF + one TTL gate • Input pulse level : 0.2V, VDD-0.2V • Timing measurements : 0.5 x VDD • tR, tF : 5ns 5 Rev 2.0 Nov. 2003 EtronTech EM584161 Read Cycle (See Note 1) t RC Addr ess t OH t AA t CO1 CE 1# t CO2 CE2 t HZ t OE O E# t OH Z t BA UB# , LB# t BLZ t BHZ t OLZ t LZ D O UT VALID DATA OU T 6 Rev 2.0 Nov. 2003 EtronTech EM584161 Write Cycle1 (WE# Controlled)(See Note 4) tWC Address t AS tWP tW R W E# t CW CE1# CE2 t CW t BW UB# , LB# t W HZ D OUT t OW (See Note2) (See Note3) t DS D IN (See Note 5) t DH VALID DATA IN 7 Rev 2.0 (See Note 5) Nov. 2003 EtronTech EM584161 Write Cycle 2 (CE1# Controlled)(See Note 4) tW C Addres s t AS tWP tW R W E# t CW CE1# CE2 t CW t BW UB# , LB# t BLZ t W HZ DOUT t LZ t DS DIN (See Note 5) t DH VALID DATA IN 8 Rev 2.0 Nov. 2003 EtronTech EM584161 Write Cycle 3 (CE2 Controlled)(See Note 4) tW C Addres s t AS tWP tW R W E# t CW CE1# CE2 t CW t W HZ DO UT t LZ t DS DIN (See Note 5) t DH VALID DATA IN 9 Rev 2.0 Nov. 2003 EtronTech EM584161 Write Cycle4 (UB#, LB# Controlled)(See Note 4) tW C Addres s t AS tWP tW R W E# t CW CE1# CE2 t CW t BW UB# , LB# t BLZ t W HZ DO UT t LZ t DS DIN (See Note 5) t DH VALID DATA IN Note: 1. WE# remains HIGH for the read cycle. 2. If CE1# goes LOW (or CE2 goes HIGH) with or after WE# goes LOW, the outputs will remain at high impedance. 3. If CE1# goes HIGH (or CE2 goes LOW) coincident with or before WE# goes HIGH, the outputs will remain at high impedance. 4. If OE# is HIGH during the write cycle, the outputs will remain at high impedance. 5. Because I/O signals may be in the output state at this time, input signals of reverse polarity must not be applied. 10 Rev 2.0 Nov. 2003 EtronTech EM584161 Data Retention Characteristics (Ta = -40°C to 85°C) Symbol Parameter VDR Data Retention Supply Voltage IDR Data Retention Current CE1# ≥ VDD - 0.2V, CE2 ≤ 0.2V, VIN ≥ VDD - 0.2V or VIN ≤ 0.2V VDD = 0.9V, CE1# ≥ VDD - 0.2V, CE2 ≤ 0.2V, VIN ≥ VDD - 0.2V or VIN ≤ 0.2V tSDR Chip Deselect to Data Retention Mode Time tRDR Recovery Time Min Typ Max Unit 0.9 − 1.95 V − − 4.0 µA 0 − − ns tRC − − ns CE1# Controlled Data Retention Mode t SDR Data Retention Mode t RDR V DD 1.65V 1.4V V DR Note 1 CE1#, LB#/UB# GND CE2 Controlled Data Retention Mode Data Reten tion Mode V DD 1.6 5V CE2 t RD R t SDR VD R 0.4 V Note 2 GND Note: 1. CE1# ≥ VDD – 0.2V or UB# = LB# ≥ VDD – 0.2V 2. CE2 ≤ 0.2V 11 Rev 2.0 Nov. 2003 EtronTech EM584161 Package Diagrams 48-Ball (6mm x 8mm) BGA Units in mm BOTTOM VIEW TOP VIEW 2 C PIN 1 CORNER 0.25 S C A 0.30 PIN 1 CORNER 1 0.10 S 3 4 5 6 6 5 4 B 0.05(48X) 3 2 1 -B0.75 3.75 -A0.20(4X) 0.10 -C- SEATING PLANE 12 Rev 2.0 Nov. 2003 EtronTech EM584161 Package Diagrams 48-Ball (8mm x 10mm) BGA Units in mm BO TT OM VIEW TOP VIEW 2 C 0.25 S C 0.30 PIN 1 CO RNE R 1 0.10 S 3 4 5 6 6 5 4 PIN 1 CO RNE R A B 0.05(48X) 3 2 1 A B B C C D D 0.1 5.25 A F E F 0.75 10 .0 E G G H H -B0.75 3.75 8.0 D 0.10 0.20(4X) D 0.25 0.52 0.05 0.02 -A - 0.10 0.02 0.05 SEATIN G PLANE 0.36 1.20 MAX -C - 13 Rev 2.0 Nov. 2003