plerowTM ALN1733 Internally Matched LNA Module Features Description · S21 = 27.6 dB @ 1710 MHz = 27.4 dB @ 1755 MHz · NF of 0.60 dB over Frequency · Unconditionally Stable · Single 5V Supply · High OIP3 @ Low Current The plerowTM ALN-series is the compactly designed surface-mount module for the use of the LNA with or without the following gain blocks in the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS, PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals, CATV and so on. It has an exceptional performance of low noise figure, high gain, high OIP3, and low bias current. The stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. The surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. Specifications (in Production) Typ. @ T = 25C, Vs = 5 V, Freq. = 1732.5 MHz, Zo.sys = 50 ohm Parameter Unit Frequency Range Min MHz 1710 Gain dB 26.5 Gain Flatness dB Noise Figure Typ dBm S11 / S22 dB Output P1dB dBm Max 1755 27.5 dB Output IP3 36.5 0.1 0.2 0.60 0.65 Website: www.asb.co.kr E-mail: [email protected] Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 -18 / -18 20 21 sec - mA 170 Supply Voltage V 5 Impedance 50 mm Surface Mount Type, 13Wx13Lx3.8H Package Type & Size More Information 38 Supply Current Switching Time (3) 2-stage Single Type Specifications 190 Operating temperature is -40C to +85C. 1) OIP3 is measured with two tones at an output power of 7 dBm / tone separated by 1 MHz. 2) S11/S22 (max) is the worst value within the frequency band. 3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS. Outline Drawing (Unit: mm) plerow ALN1733 ASB Inc. (Top View) (Bottom View) Pin Number Function 3 RF In 8 RF Out 10 Vs Others Ground Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. Solder Stencil Area (Side View) Ø 0.4 plated thru holes to ground plane (Recommended Footprint) 1/4 www.asb.co.kr August 2017 plerowTM ALN1733 Internally Matched LNA Module S-parameters Typical Performance (Measured) 1710~1755 MHz +5 V Noise Figure S-parameters & K Factor OIP3 2/4 P1dB www.asb.co.kr August 2017 plerowTM ALN1733 Internally Matched LNA Module RF Performance with Voltage Change 1. S-parameter 1710 MHz 1732.5 MHz 1755 MHz S21 (dB) S11 (dB) S22 (dB) S21 (dB) G/F (dB) S11 (dB) S22 (dB) S21 (dB) S11 (dB) S22 (dB) 4.50 V 28.00 -21.20 -22.38 27.92 0.19 -21.65 -22.50 27.81 -22.45 -22.22 4.75 V 28.07 -21.59 -21.98 27.99 0.19 -22.03 -22.27 27.88 -23.08 -22.19 5.00 V 28.08 -21.74 -21.55 28.01 0.18 -22.40 -22.03 27.90 -23.64 -22.10 5.25 V 28.16 -21.81 -21.11 28.07 0.20 -22.64 -21.72 27.96 -24.08 -21.90 5.50 V 28.17 -21.99 -20.90 28.08 0.20 -22.96 -21.50 27.97 -24.35 -21.77 2. OIP3, P1dB & NF 1710 MHz 1732.5 MHz 1755 MHz OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) 4.50 V 36.98 20.29 0.538 37.02 20.31 0.528 36.59 20.34 0.527 4.75 V 37.81 20.83 0.539 37.84 20.81 0.529 37.20 20.79 0.527 5.00 V 38.47 21.28 0.548 38.44 21.27 0.535 38.13 21.28 0.537 5.25 V 39.10 21.69 0.578 39.11 21.69 0.574 38.64 21.70 0.559 5.50 V 39.95 22.11 0.599 39.77 22.08 0.589 39.43 22.37 0.581 Note: tested at room temperature. RF Performance with Operating Temperature 1. S-parameter 1710 MHz 1732.5 MHz 1755 MHz S21 (dB) S11 (dB) S22 (dB) S21 (dB) G/F (dB) S11 (dB) S22 (dB) S21 (dB) S11 (dB) S22 (dB) -45 C 28.95 -18.25 -17.44 28.84 0.18 -19.77 -18.97 28.77 -20.92 -19.21 -10 C 28.86 -19.50 -19.76 28.74 0.19 -20.90 -21.39 28.67 -22.06 -20.87 25 C 28.51 -20.85 -21.80 28.40 0.20 -21.92 -23.18 28.31 -23.04 -22.25 60 C 28.39 -21.55 -22.95 28.27 0.20 -22.61 -24.19 28.19 -23.41 -22.48 85 C 28.08 -22.12 -24.24 27.95 0.20 -23.01 -23.01 27.88 -23.67 -22.88 2. OIP3, P1dB & NF 1710 MHz 1732.5 MHz 1755 MHz OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) OIP3 (dBm) P1dB (dBm) NF (dB) -45 C 39.30 21.32 0.276 39.50 21.30 0.286 39.70 22.01 0.322 -10 C 39.25 21.27 0.399 38.85 21.28 0.419 39.25 21.92 0.432 25 C 38.50 21.33 0.545 38.70 21.26 0.525 38.75 21.86 0.542 60 C 38.80 21.25 0.754 38.20 21.12 0.771 38.55 21.75 0.788 85 C 38.30 21.19 0.918 38.45 21.05 0.920 38.30 21.50 1.045 Note: tested at Vs= 5V. 3/4 www.asb.co.kr August 2017 plerowTM ALN1733 Internally Matched LNA Module Application Circuit VS + - Tantal or MLC (Multi Layer Ceramic) Capacitor C1 C2 ALN IN OUT 1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for the best electrical performance. 2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency. Recommended Soldering Reflow Process Evaluation Board Layout Vs 20~40 sec 260C Ramp-up (3˚C/sec) 200C Ramp-down (6C/sec) OUT IN 150C Size 25x25mm (for ALN Series – 13x13mm) 60~180 sec Copyright 2009-2017 ASB Inc. All rights reserved. Datasheet subject to change without notice. ASB assumes no responsibility for any errors which may appear in this datasheet. No part of the datasheet may be copied or reproduced in any form or by any means without the prior written consent of ASB. 4/4 www.asb.co.kr August 2017