Freescale MC10XS3435 Quad high side switch (dual 10 mohm, dual 35 mohm) Datasheet

Freescale Semiconductor
Advance Information
Document Number: MC10XS3435
Rev. 8.0, 10/2009
Quad High Side Switch
(Dual 10 mOhm, Dual 35 mOhm)
10XS3435
The 10XS3435 is one in a family of devices designed for low-voltage
automotive lighting applications. Its four low RDS(ON) MOSFETs (dual
10 mOhm/dual 35 mOhm) can control four separate 55 W / 28 W
bulbs, and/or Xenon modules, and/or LEDs.
Programming, control and diagnostics are accomplished using a
16-bit SPI interface. Its output with selectable slew-rate improves
electromagnetic compatibility (EMC) behavior. Additionally, each
output has its own parallel input or SPI control for pulse-width
modulation (PWM) control if desired. The 10XS3435 allows the user to
program via the SPI the fault current trip levels and duration of
acceptable lamp inrush. The device has fail-safe mode to provide failsafe functionality of the outputs in case of MCU damaged.
HIGH SIDE SWITCH
Features
• Four protected 10 mΩ and 35 mΩ high side switches (at 25°C)
• Operating voltage range of 6.0 V to 20 V with sleep current <
5.0 μA, extended mode from 4.0 V to 28 V
• 8.0 MHz 16-bit 3.3 V and 5.0 V SPI control and status reporting
with daisy chain capability
• PWM module using external clock or calibratable internal
oscillator with programmable outputs delay management
• Smart over-current shutdown, severe short-circuit, overtemperature protections with time limited autoretry, and fail-safe
mode in case of MCU damage
• Output OFF or ON open-load detection compliant to bulbs or leds
and short to battery detection. analog current feedback with
selectable ratio and board temperature feedback.
• Pb-free packaging designated by suffix code DPNA
VDD
VDD
VPWR
PNA SUFFIX
98ARL10596D
24-PIN PQFN
ORDERING INFORMATION
Device
MC10XS3435BPNA
MC10XS3435DPNA
VDD
Temperature
Range (TA)
Package
- 40°C to 125°C
24 PQFN
VPWR
10XS3435
VDD
I/O
SCLK
CS
SI
I/O
MCU SO
I/O
I/O
I/O
I/O
A/D
VPWR
HS0
WAKE
FS
SCLK
CS
SO
RST
SI
IN0
IN1
IN2
IN3
CSNS
FSI
GND
LOAD
HS1
LOAD
HS2
LOAD
HS3
LOAD
GND
Figure 1. 10XS3435 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2008. All rights reserved.
DEVICE VARIATIONS
DEVICE VARIATIONS
Table 1. Device Variations
Characteristic
Symbol
Min
Typ
Max
10XS3435B
18
25
32
10XS3435D
20
27
35
10XS3435B
-
5.0
20
10XS3435D
-
5.0
10
10XS3435B
-
7.0
30
10XS3435D
-
7.0
20
Wake Input Clamp Voltage , ICL(WAKE) < 2.5 mA
VCL(WAKE)
Fault Detection Blanking Time
Peak Package Reflow Temperature During Reflow ,
2.
μs
μs
tDETECT
(1) (2)
1.
V
tFAULT
Output Shutdown Delay Time
TPPRT
Unit
Note 2
°C
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and
enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
10XS3435
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VDD
IUP
VPWR
Vdd Failure
Detection
Internal
Regulator
POR
Over/Under-voltage
Protections
VPWR
Voltage Clamp
Charge
Pump
VREG
CS
SCLK
Selectable Slew Rate
Gate Driver
IDWN
Selectable Over-current
Detection
SO
SI
RST
WAKE
FS
IN0
HS0
Severe Short-circuit
Detection
Logic
Short to VPWR
Detection
Over-temperature
Detection
IN1
IN2
Open-Load
Detections
IN3
HS0
RDWN IDWN
RDWN
HS1
Calibratable
Oscillator
HS1
PWM
Module
HS2
VREG
HS2
HS3
FSI
HS3
Programmable
Watchdog
Selectable Output
Current Recopy
Temperature
Feedback
Over-temperature
Prewarning
Analog MUX
VDD
GND
CSNS
Figure 2. 10XS3435 Simplified Internal Block Diagram
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PIN CONNECTIONS
PIN CONNECTIONS
SO
16
GND
17
HS3
WAKE
FS
IN3
IN2
NC
IN1
IN0
CSNS
13 12 11 10
RST
CS
SCLK
SI
VDD
Transparent Top View of Package
9
8
7
6
5
4
3
2
1
14
GND
24
FSI
23
GND
22
18
HS2
15
VPWR
19
20
21
HS1
NC
HS0
Figure 3. 10XS3435 Pin Connections
Table 2. 10XS3435 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on page 24.
Pin
Number
Pin Name
Pin
Function
1
CSNS
2
3
5
6
Formal Name
Definition
Output
Output Current
Monitoring
This pin reports an analog value proportional to the designated HS[0:3] output
current or the temperature of the GND flag (pin 14). It is used externally to
generate a ground-referenced voltage for the microcontroller (MCU) . Current
recopy and temperature feedback is SPI programmable.
IN0
IN1
IN2
IN3
Input
Direct Inputs
Each direct input controls the device mode. The IN[0 : 3] high side input pins
are used to directly control HS0 : HS3 high side output pins.
7
FS
Output
Fault Status
(Active Low)
8
WAKE
Input
Wake
This input pin controls the device mode.
9
RST
Input
Reset
This input pin is used to initialize the device configuration and fault registers,
as well as place the device in a low-current sleep mode.
10
CS
Input
Chip Select
(Active Low)
This input pin is connected to a chip select output of a master microcontroller
(MCU).
11
SCLK
Input
Serial Clock
This input pin is connected to the MCU providing the required bit shift clock for
SPI communication.
12
SI
Input
Serial Input
This pin is a command data input pin connected to the SPI Serial Data Output
of the MCU or to the SO pin of the previous device of a daisy-chain of devices.
13
VDD
Power
Digital Drain Voltage
This pin is an external voltage input pin used to supply power interfaces to the
SPI bus.
The PWM frequency can be generated from IN0 pin to PWM module in case
of external clock is set.
This pin is an open drain configured output requiring an external pull-up
resistor to VDD for fault reporting.
10XS3435
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Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
Table 2. 10XS3435 Pin Definitions (continued)
A functional description of each pin can be found in the Functional Pin Description section beginning on page 24.
Pin
Number
Pin Name
Pin
Function
Formal Name
Definition
14, 17, 23
GND
Ground
Ground
These pins, internally shorted, are the ground for the logic and analog circuitry
of the device. These ground pins must be also shorted in the board.
15
VPWR
Power
16
SO
Output
Serial Output
18
19
21
22
HS3
HS1
HS0
HS2
Output
High Side Outputs
4, 20
NC
N/A
No Connect
24
FSI
Input
Fail-safe Input
Positive Power Supply This pin connects to the positive power supply and is the source of operational
power for the device.
This output pin is connected to the SPI Serial Data Input pin of the MCU or to
the SI pin of the next device of a daisy-chain of devices.
Protected 10 mΩ (HS0 and HS1) 35 mΩ (HS2 and HS3) high side power
output pins to the load.
These pins may not be connected.
This input enables the watchdog timeout feature.
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
VPWR Supply Voltage Range
VPWR(SS)
Load Dump at 25°C (400 ms)
V
41
Maximum Operating Voltage
28
Reverse Battery
-18
VDD Supply Voltage Range
VDD
-0.3 to 5.5
V
(6)
-0.3 to VDD + 0.3
V
WAKE Input Clamp Current
ICL(WAKE)
2.5
mA
CSNS Input Clamp Current
ICL(CSNS)
2.5
mA
Input / Output Voltage
HS [0:3] Voltage
VHS[0:3]
V
Positive
41
Negative
-24
Output
Current(3)
HS[0,1] Output Clamp Energy using single pulse
IHS[0:3]
6.0
A
method(4)
ECL [0:1]
100
mJ
(4)
ECL [2:3]
35
mJ
HS[2,3] Output Clamp Energy using single pulse method
ESD
Voltage(5)
V
Human Body Model (HBM) for HS[0:3], VPWR and GND
VESD1
± 8000
Human Body Model (HBM) for other pins
VESD2
± 2000
VESD3
± 750
VESD4
± 500
Ambient
TA
- 40 to 125
Junction
TJ
- 40 to 150
TSTG
- 55 to 150
Charge Device Model (CDM)
Corner Pins (1, 13, 19, 21)
All Other Pins (2-12, 14-18, 20, 22-24)
THERMAL RATINGS
Operating Temperature
Storage Temperature
°C
°C
Notes
3. Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output
current using package thermal resistance is required.
4. Active clamp energy using single-pulse method (L = 2.0 mH, RL = 0 Ω, VPWR = 14 V, TJ = 150°C initial).
5.
ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), the Machine Model (MM)
(CZAP = 200 pF, RZAP = 0 Ω), and the Charge Device Model (CDM), Robotic (CZAP = 4.0 pF).
6.
Input / Output pins are: IN[0:3], RSTB, FSI, CSNS, SI, SCLK, CSB, SO, FSB
10XS3435
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Junction to Case
RθJC
<1.0
Junction to Ambient
RθJA
30
TPPRT
Note 9
Unit
THERMAL RESISTANCE
Thermal Resistance(7)
Peak Package Reflow Temperature During Reflow(8), (9)
°C/ W
°C
Notes
7. Device mounted on a 2s2p test board per JEDEC JESD51-2. 15 °C/W of RθJA can be reached in a real application case (4 layers board).
8. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
9. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless
otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
POWER INPUTS
Battery Supply Voltage Range
VPWR
V
Fully Operational
6.0
–
20
Extended mode(10)
4.0
–
28
41
47
53
–
6.5
20
Battery Clamp Voltage
(11)
VPWR Operating Supply Current
VPWR(CLAMP)
IPWR(ON)
Outputs commanded ON, HS[0 : 3] open,
IN[0:3] > VIH
VPWR Supply Current
Sleep State Supply Current
mA
IPWR(SBY)
Outputs commanded OFF, OFF Open-load Detection Disabled, HS[0 : 3]
shorted to the ground with VDD= 5.5 V
WAKE > VIH or RST > VIH and IN[0:3] < VIL
V
mA
–
6.5
7.5
μA
IPWR(SLEEP)
VPWR = 12V, RST = WAKE = IN[0:3] < VIL, HS[0 : 3] shorted to the ground
TA = 25°C
TA = 85°C
–
1.0
5.0
–
–
30
3.0
–
5.5
No SPI Communication
–
1.6
2.2
8.0 MHz SPI Communication(12)
–
5.0
–
VDD Supply Voltage
VDD(ON)
VDD Supply Current at VDD = 5.5 V
IDD(ON)
V
mA
VDD Sleep State Current at VDD = 5.5 V
IDD(SLEEP)
–
–
5.0
μA
Over-voltage Shutdown Threshold
VPWR(OV)
28
32
36
V
Over-voltage Shutdown Hysteresis
VPWR(OVHYS)
0.2
0.8
1.5
V
VPWR(UV)
3.3
3.9
4.3
V
VPWR and VDD Power on Reset Threshold
VSUPPLY(POR)
0.5
–
0.9
VPWR(UV)
Recovery Under-voltage Threshold
VPWR(UV)_UP
3.4
4.1
4.5
V
VDD(FAIL)
2.2
2.5
2.8
V
Under-voltage Shutdown Threshold(13)
VDD Supply Failure Threshold ( for VPWR > VPWR(UV) )
Notes
10. In extended mode, the functionality is guaranteed but not the electrical parameters. From 4.0 V to 6.0 V voltage range, the device is
only protected with the thermal shutdown detection.
11. Measured with the outputs open.
12. Typical value guaranteed per design.
13. Output will automatically recover with time limited autoretry to instructed state when VPWR voltage is restored to normal as long as the
VPWR degradation level did not go below the under-voltage power-ON reset threshold. This applies to all internal device logic that is
supplied by VPWR and assumes that the external VDD supply is within specification.
10XS3435
8
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless
otherwise noted.
Characteristic
Symbol
Min
Typ
Max
VPWR = 4.5 V
–
–
36
VPWR = 6.0 V
–
–
16
VPWR = 10 V
–
–
10
VPWR = 13 V
–
–
10
VPWR = 4.5 V
–
–
62
VPWR = 6.0 V
–
–
27
VPWR = 10 V
–
–
17
–
–
17
TA = 25°C
–
–
15
TA = 150°C
–
–
20
VPWR = 4.5 V
–
–
126
VPWR = 6.0 V
–
–
56
VPWR = 10 V
–
–
35
VPWR = 1.0 V
–
–
35
Unit
OUTPUTS HS0 TO HS3
HS[0,1] Output Drain-to-Source ON Resistance (IHS = 5.0 A, TA = 25°C)
HS[0,1] Output Drain-to-Source ON Resistance (IHS = 5.0 A, TA = 150°C)
RDS_01(ON)
RDS_01(ON)
VPWR = 13 V
HS[0,1] Output Source-to-Drain ON Resistance (IHS = -5.0 A, VPWR=
-18)(14)
HS[2,3] Output Drain-to-Source ON Resistance (IHS = 5.0 A, TA = 25°C)
HS[2,3] Output Drain-to-Source ON Resistance (IHS = 5.0 A, TA = 150°C)
mΩ
mΩ
RSD_01(ON)
mΩ
RDS_23(ON)
mΩ
RDS_23(ON)
mΩ
VPWR = 4.5 V
–
–
217
VPWR = 6.0 V
–
–
94.5
VPWR = 10 V
–
–
59.5
VPWR = 13 V
–
–
59.5
–
–
52.5
–
–
70
HS[2,3] Output Source-to-Drain ON Resistance (IHS = -5.0 A, VPWR= -18) (14)
RSD_23(ON)
TA = 25°C
TA = 150°C
HS[0,1] Maximum Severe Short-Circuit Impedance
mΩ
Detection(15)
RSHORT_01
28
64
100
mΩ
(15)
RSHORT_23
70
160
200
mΩ
HS[2,3] Maximum Severe Short-Circuit Impedance Detection
Notes
14. Source-Drain ON Resistance (Reverse Drain-to-Source ON Resistance) with negative polarity VPWR.
15.
Short-circuit impedance calculated from HS[0:3] to GND pins. Value guaranteed per design.
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless
otherwise noted.
Characteristic
Symbol
Min
Typ
Max
OCHI1_0
78
94.0
110
OCHI2_0
50
60.0
70
OC1_0
44.1
52.5
60.9
OC2_0
37.8
45.0
52.2
OC3_0
31.5
37.5
43.5
OC4_0
25.2
30.0
34.8
OCLO4_0
18.9
22.5
26.1
OCLO3_0
12.6
15.0
17.4
OCLO2_0
10.0
12.0
14.0
OCLO1_0
6.4
8.0
9.6
OCHI1_1
39
47.0
55
OCHI2_1
25
30.0
35
OC1_1
22.0
26.2
30.5
OC2_1
18.9
22.5
26.1
OC3_1
15.7
18.7
21.8
OC4_1
12.6
15.0
17.4
OCLO4_1
4.5
6.0
7.5
OCLO3_1
4.5
6.0
7.5
OCLO2_1
4.5
6.0
7.5
OCLO1_1
3.0
4.0
5.0
Unit
OUTPUTS HS0 TO HS3 (CONTINUED)
HS[0,1] Output Over-current Detection Levels (6.0 V < VHS[0:3] < 20 V)
28 W bit = 0
28 W bit = 1
HS[0,1] Current Sense Ratio (6.0 V < HS[0:3] < 20 V, CSNS < 5.0
A
V)(16)
–
28 W bit = 0
CSNS_ratio bit = 0
CSNS_ratio bit = 1
28 W bit = 1
CSNS_ratio bit = 0
CSNS_ratio bit = 1
HS[0,1] Current Sense Ratio (CSR0) Accuracy (6.0 V < VHS[0:3] < 20 V)
with 28W bit=0
Output Current
12.5 A
5.0 A
3.0 A
1.5 A
CSR0_0
–
1/8900
–
CSR1_0
–
1/53000
–
CSR0_1
–
1/4450
–
CSR1_1
–
1/26500
–
CSR0_0_ACC
%
-12
–
12
-13
–
13
-16
–
16
-20
–
20
Notes
16. Current sense ratio = ICSNS / IHS[0:3]
10XS3435
10
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless
otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
OUTPUTS HS0 TO HS3 (CONTINUED)
HS[0,1] Current Sense Ratio (CSR0) Accuracy (6.0 V < VHS < 20 V)
with 28 W bit=1
CSR0_1_ACC
%
Output Current
3.0 A
-16
–
16
1.5 A
-20
–
20
-5.0
–
5.0
HS[0,1] Current Recopy Accuracy with one calibration point (6.0 V < VHS[0:3] <
20 V)(17)
CSR0_0_ACC(
%
CAL)
Output Current
5.0 A
HS[0,1] CSR0 Current Recopy Temperature Drift (6.0 V < VHS[0:3] < 20 V)
with 28 W bit=0(18)
Δ(CSR0_0)/
Δ(T)
%/°C
Output Current
0.04
5.0 A
HS[0,1] Current Sense Ratio (CSR1) Accuracy (6.0 V < VHS[0:3] < 20 V)
with 28 W bit=0
CSR1_0_ACC
Output Current
12.5 A
75 A
Current Sense Clamp Voltage
%
-17
–
+17
-12
–
+12
VCL(CSNS)
CSNS Open; IHS[0:3] = 5.0 A with CSR0 ratio
V
VDD+0.2
5
–
VDD+1.0
IOLD(OFF)
30
–
100
μA
OFF Open-Load Fault Detection Voltage Threshold
VOLD(THRES)
2.0
3.0
4.0
V
ON Open-Load Fault Detection Current Threshold
IOLD(ON)
100
300
600
mA
2.5
5.0
10
OFF Open-Load Detection Source Current(19)
ON Open-Load Fault Detection Current Threshold with LED
IOLD(ON_LED)
VHS[0:3] = VPWR - 0.75 V
Output Short to VPWR Detection Voltage Threshold
VOSD(THRES)
Output programmed OFF
Output Negative Clamp Voltage
V
VPWR1.2
VPWR-0.8
VPWR-0.4
- 22
–
-16
155
175
195
VCL
0.5 A < IHS[0:3] < 5.0 A, Output programmed OFF
Output Over-temperature Shutdown for 4.5 V < VPWR < 28 V
mA
TSD
V
°C
Notes
17. Based on statistical analysis. It is not production tested.
18. Based on statistical data: delta(CSR0)/delta(T)={(measured ICSNS at T1 - measured ICSNS at T2) / measured ICSNS at room} / {T1-T2}.
No production tested.
19. Output OFF Open-Load Detection Current is the current required to flow through the load for the purpose of detecting the existence
of an open-load condition when the specific output is commanded OFF. Pull-up current is measured for VHS=VOLD(THRES)
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless
otherwise noted.
Characteristic
Symbol
Min
Typ
Max
OCHI1_1
39.5
47.0
54.5
OCHI2_1
25.2
30.0
34.8
OC1_1
22.0
26.2
30.5
OC2_1
18.9
22.5
26.1
OC3_1
15.7
18.7
21.7
OC4_1
12.6
15.0
17.4
OCLO4_1
9.4
11.2
13.0
OCLO3_1
6.3
7.5
8.7
OCLO2_1
5.0
6.0
7.0
OCLO1_1
3.2
4.0
4.8
Unit
OUTPUTS HS0 TO HS3 (CONTINUED)
HS[2,3] Output Over-current Detection Levels (6.0 V < VHS[0:3] < 20 V)
HS[2,3] Current Sense Ratio (6.0 V < HS[0:3] < 20 V, CSNS < 5.0 V)
A
(20)
–
CSNS_ratio bit = 0
CSR0_1
–
1/4350
–
CSNS_ratio bit = 1
CSR1_1
–
1/25500
–
HS[2,3] Current Sense Ratio (CSR0) Accuracy (6.0 V < VHS[0:3] < 20 V)
CSR0_0_ACC
%
Output Current
6.25 A
-12
–
12
2.5 A
-13
–
13
1.5 A
-16
–
16
-20
–
20
-5.0
–
5.0
0.75 A
HS[2,3] Current Recopy Accuracy with one calibration point (6.0 V < VHS[0:3] <
20 V)(21)
CSR0_0_ACC(
%
CAL)
Output Current
2.5 A
Notes
20. Current sense ratio = ICSNS / IHS[0:3]
21.
Based on statistical analysis. It is not production tested.
10XS3435
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless
otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
VIH
2.0
–
VDD+0.3
V
VIL
-0.3
–
0.8
V
IDWN
5.0
–
20
μA
IUP
5.0
–
20
μA
CSO
–
–
20
pF
RDWN
125
250
500
kΩ
CIN
–
4.0
12
pF
10XS3435B
18
25
32
10XS3435D
20
27
35
CONTROL INTERFACE
Input Logic High Voltage(22)
Input Logic Low
Voltage(22)
(25)
Input Logic Pull-down Current (SCLK, SI)
Input Logic Pull-up Current (CS)
SO, FS Tri-State
(26)
Capacitance(23)
Input Logic Pull-down Resistor (RST, WAKE and IN[0:3])
Input Capacitance
(23)
Wake Input Clamp Voltage
(24)
, ICL(WAKE) < 2.5 mA
VCL(WAKE)
Wake Input Forward Voltage
VF(WAKE)
ICL(WAKE) = -2.5 mA
V
- 2.0
SO High-state Output Voltage
–
- 0.3
VSOH
IOH = 1.0 mA
SO and FS Low-state Output Voltage
V
VDD-0.4
–
–
–
–
0.4
- 2.0
0
2.0
–
0
1.0
10
Infinite
–
VSOL
IOL = -1.0 mA
SO, CSNS and FS Tri-state Leakage Current
V
V
μA
ISO(LEAK)
CS = VIH and 0 V < VSO < VDD, or FS = 5.5 V, or CSNS=0.0 V
FSI External Pull-down Resistance(27)
Watchdog Disabled
Watchdog Enabled
kΩ
RFS
Notes
22. Upper and lower logic threshold voltage range applies to SI, CS, SCLK, RST, IN[0:3] and WAKE input signals. The WAKE and RST
signals may be supplied by a derived voltage referenced to VPWR.
23.
24.
25.
Input capacitance of SI, CS, SCLK, RST, IN[0:3] and WAKE. This parameter is guaranteed by process monitoring but is not production
tested.
The current must be limited by a series resistance when using voltages > 7.0 V.
Pull-down current is with VSI > 1.0 V and VSCLK > 1.0 V.
26.
Pull-up current is with VCS < 2.0 V. CS has an active internal pull-up to VDD.
27.
In Fail-Safe HS[0:3] depends respectively on ON[0:3]. FSI has an active internal pull-up to VREG ~ 3.0 V.
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless
otherwise noted.
Characteristic
Symbol
Min
Typ
Max
0.15
0.3
0.6
0.07
0.15
0.3
0.3
0.6
1.2
Unit
POWER OUTPUT TIMING HS0 TO HS3
Output Rising Medium Slew Rate (medium speed slew rate / SR[1:0]=00)(28)
SRR_00
VPWR = 14 V
Output Rising Slow Slew Rate (low speed slew rate / SR[1:0]=01)(28)
SRR_01
VPWR = 14 V
Output Falling Fast Slew Rate (high speed slew rate / SR[1:0]=10)(28)
Output Falling Slow Slew Rate (low speed slew rate / SR[1:0]=01)
VPWR = 14 V, f PWM = 240 Hz, PWM duty cycle = 50%, @ 25°C for medium
speed slew rate (SR[1:0]=00)
0.15
0.3
0.3
0.6
1.2
35
60
85
45
70
95
0.8
1.0
1.2
V/μs
V/μs
μs
μs
Δ t RF_01
VPWR = 14 V, f PWM = 240 Hz, PWM duty cycle = 50%, @ 25°C for medium
speed slew rate (SR[1:0]=00)
HS[2:3] Driver Output Matching Time (t DLY(ON) - t DLY(OFF))
0.07
Δ SR
VPWR = 14 V @ 25°C and for medium speed slew rate (SR[1:0]=00)
HS[0:1] Driver Output Matching Time (t DLY(ON) - t DLY(OFF))
0.6
t DLY_12
VPWR = 14 V for medium speed slew rate (SR[1:0]=00)
Driver Output Matching Slew Rate (SRR /SRF)
0.3
t DLY_23
VPWR = 14 V for medium speed slew rate (SR[1:0]=00)
HS[0:1] Outputs Turn-ON and OFF Delay Times(29)(30)
0.15
SRF_10
VPWR = 14 V
HS[2:3] Outputs Turn-ON and OFF Delay Times(29)(30)
V/μs
SRF_01
VPWR = 14 V
Output Rising Fast Slew Rate (high speed slew rate / SR[1:0]=10)(28)
V/μs
SRF_00
VPWR = 14 V
(28)
V/μs
SRR_10
VPWR = 14 V
Output Falling Medium Slew Rate (medium speed slew rate / SR[1:0]=00)(28)
V/μs
μs
-25
0
25
-20
5
30
Δ t RF_23
μs
Notes
28. Rise and Fall Slew Rates measured across a 5.0 Ω resistive load at high side output = 30% to 70% (see Figure 4, page 21).
29. Turn-ON delay time measured from rising edge of any signal (IN[0 : 3] and CS) that would turn the output ON to VHS[0 : 3] = VPWR / 2 with
RL = 5.0 Ω resistive load.
30.
Turn-OFF delay time measured from falling edge of any signal (IN[0 : 3] and CS) that would turn the output OFF to VHS[0 : 3] =VPWR / 2
with RL = 5.0 Ω resistive load.
10XS3435
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless
otherwise noted.
Characteristic
Symbol
Min
Typ
Max
10XS3435B
-
5.0
20
10XS3435D
-
5.0
10
Unit
POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED)
Fault Detection Blanking Time(31)
tFAULT
(32)
Output Shutdown Delay Time
CSNS Valid Time
Watchdog
(33)
Time-out(34)
ON Open-Load Fault Cyclic Detection Time with LED
μs
μs
tDETECT
10XS3435B
-
7.0
30
10XS3435D
-
7.0
20
t CNSVAL
-
70
100
μs
t WDTO
217
310
400
ms
-
fIN0 / 128
-
ms
Notes
31. Time necessary to report the fault to FS pin.
32. Time necessary to switch-off the output in case of OT or OC or SC or UV fault detection (from negative edge of FS pin to HS voltage =
50% of VPWR
33.
Time necessary for CSNS to be within ±5% of the targeted value (from HS voltage = 50% of VPWR to ±5% of the targeted CSNS value).
34.
For FSI open, the Watchdog timeout delay measured from the rising edge of RST, to HS[0,2] output state depend on the corresponding
input command.
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless
otherwise noted.
Characteristic
Symbol
Min
Typ
Max
tOC1_00
4.40
6.30
8.02
tOC2_00
1.62
2.32
3.00
tOC3_00
2.10
3.00
3.90
tOC4_00
2.88
4.12
5.36
tOC5_00
4.58
6.56
8.54
tOC6_00
10.16
14.52
18.88
tOC7_00
73.2
104.6
134.0
tOC1_01
1.10
1.57
2.00
tOC2_01
0.40
0.58
0.75
tOC3_01
0.52
0.75
0.98
tOC4_01
0.72
1.03
1.34
tOC5_01
1.14
1.64
2.13
tOC6_01
2.54
3.63
4.72
tOC7_01
18.2
26.1
34.0
tOC1_10
2.20
3.15
4.01
tOC2_10
0.81
1.16
1.50
tOC3_10
1.05
1.50
1.95
tOC4_10
1.44
2.06
2.68
tOC5_10
2.29
3.28
4.27
tOC6_10
5.08
7.26
9.44
tOC7_10
36.6
52.3
68.0
tOC1_11
8.8
12.6
16.4
tOC2_11
3.2
4.6
21.4
tOC3_11
4.2
6.0
7.8
tOC4_11
5.7
8.2
10.7
tOC5_11
9.1
13.1
17.0
tOC6_11
20.3
29.0
37.7
tOC7_11
146.4
209.2
272.0
Unit
POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED)
HS[0,1] Output Over-current Time Step for 28 W bit = 0
OC[1:0]=00 (slow by default)
OC[1:0]=01 (fast)
OC[1:0]=10 (medium)
OC[1:0]=11 (very slow)
ms
10XS3435
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless
otherwise noted.
Characteristic
Symbol
Min
Typ
Max
tOC1_00
3.4
4.9
6.4
tOC2_00
1.1
1.6
2.1
tOC3_00
1.4
2.1
2.8
tOC4_00
2.0
2.9
3.8
tOC5_00
3.4
4.9
6.4
tOC6_00
8.5
12.2
15.9
tOC7_00
62.4
89.2
116.0
tOC1_01
0.86
1.24
1.61
tOC2_01
0.28
0.40
0.52
tOC3_01
0.36
0.52
0.68
tOC4_01
0.51
0.74
0.96
tOC5_01
0.78
1.12
1.46
tOC6_01
2.14
3.06
3.98
tOC7_01
20.2
22.2
28.9
tOC1_10
1.7
2.5
3.3
tOC2_10
0.5
0.8
1.0
tOC3_10
0.7
1.0
1.3
tOC4_10
1.0
1.5
2.0
tOC5_10
1.7
2.5
3.3
tOC6_10
4.2
6.1
6.0
tOC7_10
31.2
44.6
58.0
tOC1_11
6.8
9.8
12.8
tOC2_11
2.2
3.2
16.7
tOC3_11
2.9
4.2
5.5
tOC4_11
4.0
5.8
7.6
tOC5_11
6.8
9.8
12.8
tOC6_11
17.0
24.4
31.8
tOC7_11
124.8
178.4
232.0
Unit
POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED)
HS[0,1] Output Over-current Time Step for 28 W bit = 1
HS[2,3] Output Over-current Time Step
OC[1:0]=00 (slow by default)
OC[1:0]=01 (fast)
OC[1:0]=10 (medium)
OC[1:0]=11 (very slow)
ms
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless
otherwise noted.
Characteristic
Symbol
Min
Typ
Max
tBC1_00
242
347
452
tBC2_00
126
181
236
tBC3_00
140
200
260
tBC4_00
158
226
294
tBC5_00
181
259
337
tBC6_00
211
302
393
tBC1_01
121
173
226
tBC2_01
63
90
118
tBC3_01
70
100
130
tBC4_01
79
113
147
tBC5_01
90
129
169
tBC6_01
105
151
197
tBC1_10
484
694
1904
tBC2_10
252
362
472
tBC3_10
280
400
520
tBC4_10
316
452
588
tBC5_10
362
518
674
tBC6_10
422
604
786
tBC1_00
291
417
542
tBC2_00
156
224
292
tBC3_00
178
255
332
tBC4_00
208
298
388
tBC5_00
251
359
467
tBC6_00
314
449
584
tBC1_01
146
209
272
tBC2_01
78
112
146
tBC3_01
88
127
166
tBC4_01
101
145
189
tBC5_01
126
180
234
tBC6_01
226
324
422
tBC1_10
583
834
1085
tBC2_10
312
448
582
tBC3_10
357
510
665
tBC4_10
417
596
775
tBC5_10
501
717
933
tBC6_10
628
898
1170
Unit
POWER OUTPUT TIMING HS0 TO HS3 (CONTINUED)
HS[0,1] Bulb Cooling Time Step for 28 W bit = 0
CB[1:0]=00 or 11 (medium)
CB[1:0]=01 (fast)
ms
CB[1:0]=10 (slow)
HS[0,1] for 28 W bit = 1 or for HS2-HS3
CB[1:0]=00 or 11 (medium)
CB[1:0]=01 (fast)
CB[1:0]=10 (slow)
10XS3435
18
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless
otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
PWM MODULE TIMING
Input PWM Clock Range on IN0
fIN0
7.68
–
30.72
kHz
Input PWM Clock Low Frequency Detection Range on IN0(36)
fIN0(LOW)
1.0
2.0
4.0
kHz
Input PWM Clock High Frequency Detection Range on IN0(36)
fIN0(HIGH)
100
–
400
kHz
fPWM
–
–
1.0
Hz
AFPWM(CAL)
-10
–
+10
%
Output PWM Frequency Range using external clock on IN0
Output PWM Frequency Accuracy using Calibrated Oscillator
Default Output PWM Frequency using Internal Oscillator
fPWM(0)
84
120
156
Hz
CS Calibration Low Minimum Time Detection Range
t CSB(MIN)
14
20
26
μs
CS Calibration Low Maximum Tine Detection Range
200
260
μs
t CSB(MAX)
140
Output PWM Duty-Cycle Range for fpwm = 1.0 kHz for high speed slew rate(36) RPWM_1k
10
94
%
Output PWM Duty-Cycle Range for fpwm = 400 Hz(36)
RPWM_400
6.0
98
%
Output PWM Duty-Cycle Range for fpwm = 200 Hz(36)
RPWM_200
5.0
98
%
tIN
175
250
325
ms
tAUTO
105
150
195
ms
INPUT TIMING
Direct Input Toggle Time-out
AUTORETRY TIMING
Autoretry Period
TEMPERATURE ON THE GND FLAG
Thermal Prewarning Detection(37)
TOTWAR
110
125
140
°C
Analog Temperature Feedback at TA = 25°C with RCSNS=2.5 kΩ
TFEED
1.15
1.20
1.25
V
Analog Temperature Feedback Derating with RCSNS=2.5 kΩ(38)
DTFEED
-3.5
-3.7
-3.9
mV/°C
Notes
35. Clock Fail detector available for PWM_en bit is set to logic [1] and CLOCK_sel is set to logic [0].
36. The PWM ratio is measured at VHS = 50% of VPWR and for the default SR value. It is possible to put the device fully-on (PWM duty-cycle
100%) and fully-off (duty-cycle 0%). For values outside this range, a calibration is needed between the PWM duty-cycle programming
and the PWM on the output with RL = 5.0 Ω resistive load.
37.
38.
Typical value guaranteed per design.
Value guaranteed per statistical analysis.
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 6.0 V ≤ VPWR ≤ 20 V, 3.0 V ≤ VDD ≤ 5.5 V, - 40°C ≤ TA ≤ 125°C, GND = 0 V unless
otherwise noted. Typical values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless
otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
f SPI
–
–
8.0
MHz
t WRST
10
–
–
μs
t CS
–
–
1.0
μs
t ENBL
–
–
5.0
μs
SPI INTERFACE CHARACTERISTICS(39)
Maximum Frequency of SPI Operation
Required Low State Duration for
RST(40)
Rising Edge of CS to Falling Edge of CS (Required Setup Time)
(41)
Rising Edge of RST to Falling Edge of CS (Required Setup Time)
Falling Edge of CS to Rising Edge of SCLK (Required Setup
Time)(41)
t LEAD
–
–
500
ns
(41)
t WSCLKh
–
–
50
ns
(41)
t WSCLKl
–
–
50
ns
t LAG
–
–
60
ns
t SI (SU)
–
–
37
ns
t SI (HOLD)
–
–
49
ns
–
–
13
Required High State Duration of SCLK (Required Setup Time)
Required Low State Duration of SCLK (Required Setup Time)
Falling Edge of SCLK to Rising Edge of CS (Required Setup
SI to Falling Edge of SCLK (Required Setup Time)
Falling Edge of SCLK to SI (Required Setup
(42)
Time)(42)
SO Rise Time
(41)
Time)(41)
t RSO
CL = 80 pF
SO Fall Time
t FSO
CL = 80 pF
SI, CS, SCLK, Incoming Signal Rise
SI, CS, SCLK, Incoming Signal Fall
Time(42)
Time(42)
Notes
39.
40.
41.
42.
43.
44.
ns
–
–
13
t RSI
–
–
13
ns
t FSI
–
–
13
ns
(43)
t SO(EN)
–
–
60
ns
High-impedance(44)
t SO(DIS)
–
–
60
ns
Time from Falling Edge of CS to SO Low-impedance
Time from Rising Edge of CS to SO
ns
Parameters guaranteed by design.
RST low duration measured with outputs enabled and going to OFF or disabled condition.
Maximum setup time required for the 10XS3435 is the minimum guaranteed time needed from the microcontroller.
Rise and Fall time of incoming SI, CS, and SCLK signals suggested for design consideration to prevent the occurrence of double pulsing.
Time required for output status data to be available for use at SO. 1.0 kΩ on pull-up on CS.
Time required for output status data to be terminated at SO. 1.0 kΩ on pull-up on CS.
10XS3435
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
IN[0:3]
High logic level
Low logic level
Time
or
CS
High logic level
Low logic level
Time
VHS[0:3]
VPWR
RPWM
50%VPWR
Time
t DLY(ON)
VHS[0:3]
70% VPWR
t DLY(OFF)
SR F
SR R
30% VPWR
Time
Figure 4. Output Slew Rate and Time Delays
IOCH1
IOCH2
Load
Current
IOC1
IOC2
IOC3
IOC4
IOCLO4
IOCLO3
IOCLO2
IOCLO1
Time
t OC1
t OC2
t OC3
t OC4
t OC5
t OC6
t OC7
Figure 5. Over-current Shutdown Protection
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
IOCH1
IOCH2
IOC1
IOC2
IOC3
IOC4
IOCLO4
IOCLO3
IOCLO2
IOCLO1
t BC3
tB C1
t BC2
t BC4
tB C5
Previous OFF duration
(toff)
tB C6
Figure 6. Bulb Cooling Management
VIH
VIH
RSTB
RST
10%
0.2
VDDVDD
tWRST
TwRSTB
tENBL
VIL
VIL
tTCSB
CS
TENBL
VIH
VIH
90%
VDD
0.7VDD
CS
CSB
10%
VDD
0.7VDD
t WSCLKH
TwSCLKh
tTlead
LEAD
VIL
VIL
t RSI
TrSI
t LAG Tlag
90%
VDD
0.7VDD
SCLK
SCLK
VIH
VIH
10% VDD
0.2VDD
t TSIsu
SI(SU)
VIL
VIL
t WSCLKl
TwSCLKl
t SI(HOLD)
TSI(hold)
SI
SI
Don’t Care
90%
VDD
0.7 VDD
0.2VDD
10%
VDD
Valid
tTfSI
FSI
Don’t Care
Valid
Don’t Care
VIH
VIH
VIH
VIL
Figure 7. Input Timing Switching Characteristics
10XS3435
22
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
tFSI
tRSI
TrSI
TfSI
VOH
VOH
90%
VDD
3.5V
50%
SCLK
SCLK
1.0V VDD
10%
VOL
VOL
t SO(EN)
TdlyLH
SO
SO
90%
VDD
0.7 VDD
0.210%
VDDVDD
Low-to-High
Low
to High
TrSO
t RSO
VOH
VOH
VOL
VOL
VALID
tTVALID
SO
TfSO
t FSO
SO
VOH
VOH
VDD
VDD
High to Low 0.790%
High-to-Low
0.2VDD
10% VDD
TdlyHL
VOL
VOL
t SO(DIS)
Figure 8. SCLK Waveform and Valid SO Data Delay Time
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 10XS3435 is one in a family of devices designed for
low-voltage automotive lighting applications. Its four low
RDS(ON) MOSFETs (dual 10 mΩ, dual 35 mΩ) can control
four separate 55 W / 28 W bulbs and/or Xenon modules.
Programming, control and diagnostics are accomplished
using a 16-bit SPI interface. Its output with selectable slewrate improves electromagnetic compatibility (EMC) behavior.
Additionally, each output has its own parallel input or SPI
control for pulse-width modulation (PWM) control if desired.
The 10XS3435 allows the user to program via the SPI the
fault current trip levels and duration of acceptable lamp
inrush. The device has fail-safe mode to provide fail-safe
functionality of the outputs in case of MCU damaged.
FUNCTIONAL PIN DESCRIPTION
OUTPUT CURRENT MONITORING (CSNS)
The Current Sense pin provides a current proportional to
the designated HS0 : HS3 output or a voltage proportional to
the temperature on the GND flag. That current is fed into a
ground-referenced resistor (2.5 kΩ typical) and its voltage is
monitored by an MCU's A/D. The output type is selected via
the SPI. This pin can be tri-stated through the SPI.
DIRECT INPUTS (IN0, IN1, IN2, IN3)
Each IN input wakes the device. The IN0 : IN3 high side
input pins are also used to directly control HS0 : HS3 high side
output pins. In case of the outputs are controlled by PWM
module, the external PWM clock is applied to IN0 pin. These
pins are to be driven with CMOS levels, and they have a
passive internal pull-down, RDWN.
FAULT STATUS (FS)
This pin is an open drain configured output requiring an
external pull-up resistor to VDD for fault reporting. If a device
fault condition is detected, this pin is active LOW. Specific
device diagnostics and faults are reported via the SPI SO pin.
WAKE
The wake input wakes the device. An internal clamp
protects this pin from high damaging voltages with a series
resistor (10 kΩ typ). This input has a passive internal pulldown, RDWN.
RESET (RST)
The reset input wakes the device. This is used to initialize
the device configuration and fault registers, as well as place
the device in a low-current sleep mode. The pin also starts
the watchdog timer when transitioning from logic [0] to
logic [1]. This pin has a passive internal pull-down, RDWN.
CHIP SELECT (CS)
The CS pin enables communication with the master
microcontroller (MCU). When this pin is in a logic [0] state,
the device is capable of transferring information to, and
receiving information from, the MCU. The 10XS3435 latches
in data from the Input Shift registers to the addressed
registers on the rising edge of CS. The device transfers status
information from the power output to the Shift register on the
falling edge of CS. The SO output driver is enabled when CS
is logic [0]. CS should transition from a logic [1] to a logic [0]
state only when SCLK is a logic [0]. CS has an active internal
pull-up from VDD, IUP.
SERIAL CLOCK (SCLK)
The SCLK pin clocks the internal shift registers of the
10XS3435 device. The serial input (SI) pin accepts data into
the input shift register on the falling edge of the SCLK signal
while the serial output (SO) pin shifts data information out of
the SO line driver on the rising edge of the SCLK signal. It is
important the SCLK pin be in a logic low state whenever CS
makes any transition. For this reason, it is recommended the
SCLK pin be in a logic [0] whenever the device is not
accessed (CS logic [1] state). SCLK has an active internal
pull-down. When CS is logic [1], signals at the SCLK and SI
pins are ignored and SO is tri-stated (high-impedance) (see
Figure 10, page 27). SCLK input has an active internal pulldown, IDWN.
SERIAL INPUT (SI)
This is a serial interface (SI) command data input pin.
Each SI bit is read on the falling edge of SCLK. A 16-bit
stream of serial data is required on the SI pin, starting with
D15 (MSB) to D0 (LSB). The internal registers of the
10XS3435 are configured and controlled using a 5-bit
addressing scheme described in Table 10, page 35. Register
addressing and configuration are described in Table 11,
page 35. SI input has an active internal pull-down, IDWN.
DIGITAL DRAIN VOLTAGE (VDD)
This pin is an external voltage input pin used to supply
power to the SPI circuit. In the event VDD is lost (VDD Failure),
the device goes to Fail-safe mode.
10XS3435
24
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
GROUND (GND)
These pins are the ground for the device.
POSITIVE POWER SUPPLY (VPWR)
This pin connects to the positive power supply and is the
source of operational power for the device. The VPWR
contact is the backside surface mount tab of the package.
SERIAL OUTPUT (SO)
The SO data pin is a tri-stateable output from the shift
register. The SO pin remains in a high-impedance state until
the CS pin is put into a logic [0] state. The SO data is capable
of reporting the status of the output, the device configuration,
the state of the key inputs, etc. The SO pin changes state on
the rising edge of SCLK and reads out on the falling edge of
SCLK. SO reporting descriptions are provided in Table 23,
page 39.
HIGH SIDE OUTPUTS (HS3, HS1, HS0, HS2)
Protected 10 mΩ and 12 mΩ high side power outputs to
the load.
FAIL-SAFE INPUT (FSI)
This pin incorporates an active internal pull-up current
source from internal supply (VREG). This enables the
watchdog time-out feature.
When the FSI pin is opened, the Watchdog circuit is
enabled. After a watchdog timeout occurs, the output states
depends on IN[0:3].
When the FSI pin is connected to GND, the watchdog
circuit is disabled. The output states depends on IN[0:3] in
case of VDD Failure condition, in case VDD failure detection
is activated (VDD_FAIL_en bit sets to logic [1]).
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
25
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
MC10XS3435 - Functional Block Diagram
Power Supply
MCU Interface & Output Control
SPI Interface
Parallel Control Inputs
MCU
Interface
Self-Protected
High-Side
Switches
HS0-HS3
PWM Controller
Supply
MCU Interface & Output Control
Self-Protected High-Side Switches
Figure 9. Functional Block Diagram
POWER SUPPLY
loads demanding multiple switching, an external
recirculation device must be used to maintain the device in its
The 10XS3412B is designed to operate from 4.0 V to 28 V
Safe Operating Area.
on the VPWR pin. Characteristics are provided from 6.0 V to
20 V for the device. The VPWR pin supplies power to internal
MCU INTERFACE AND OUTPUT CONTROL
regulator, analog, and logic circuit blocks. The VDD supply is
used for Serial Peripheral Interface (SPI) communication in
In Normal mode, each bulb is controlled directly from the
order to configure and diagnose the device. This IC
MCU through SPI. A pulse width modulation control module
architecture provides a low quiescent current sleep mode.
allows improvement of lamp lifetime with bulb power
Applying VPWR and VDD to the device will place the device in
regulation (PWM frequency range from 100 to 400 Hz) and
the Normal mode. The device will transit to Fail-safe mode in
addressing the dimming application (day running light). An
case of failures on the SPI or/and on VDD voltage.
analog feedback output provides a current proportional to the
load current or the temperature of the board. The SPI is used
HIGH SIDE SWITCHES: HS0–HS3
to configure and to read the diagnostic status (faults) of high
side outputs. The reported fault conditions are: open-load,
These pins are the high side outputs controlling
short-circuit to battery, short-circuit to ground (over-current
automotive lamps located for the front of vehicle, such as
and severe short-circuit), thermal shut-down, and under/
65 W/55 W bulbs and Xenon-HID modules. Those N-channel
over-voltage. Thanks to accurate and configurable overMOSFETs with 10 mΩ & 35 mΩ RDS(ON) are self-protected
current detection circuitry and wire-harness optimization, the
and present extended diagnostics in order to detect bulb
vehicle is lighter.
outage and short-circuit fault condition. The HS output is
In Fail-safe mode, each lamp is controlled with dedicated
actively clamped during turn off of inductive loads and
parallel input pins. The device is configured in default mode.
inductive battery line. When driving DC motor or Solenoid
10XS3435
26
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
FUNCTIONAL DEVICE OPERATION
SPI PROTOCOL DESCRIPTION
The SI / SO pins of the 10XS3435 follow a first-in first-out
(D15 to D0) protocol, with both input and output words
transferring the most significant bit (MSB) first. All inputs are
compatible with 5.0 V or 3.3 V CMOS logic levels.
The SPI interface has a full duplex, three-wire
synchronous data transfer with four I/O lines associated with
it: Serial Input (SI), Serial Output (SO), Serial Clock (SCLK),
and Chip Select (CS).
CSB
CS
CS
SCLK
SI
SO
D15
D14
D13
D12
D11
D10
D9
OD15 OD14 OD13 OD12 OD11 OD10 OD9
D8
OD8
D7
OD7
D6
OD6
D5
OD5
D4
OD4
D3
OD3
D2
OD2
D1
D0
OD1 OD0
Notes 1. RST is a logic [1] state during the above operation.
D15is: D0
to the
most
ordered entry of data into the device.
NOTES: 1. 2.RSTB
in arelate
logic H state
during
therecent
above operation.
OD15
: OD0
relate
thetofirst
16 bits
ofordered
ordered
fault
and status
data
out IC
of the device.
device.
2. 3.DO,
D1, D2,
... , and
D15to
relate
the most
recent
entry
of program
data into
the LUX
Figure 10. Single 16-Bit Word SPI Communication
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
27
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
OPERATIONAL MODES
The 10XS3435 has four operating modes: Sleep, Normal,
Fail-Safe and Fault. Table 6 and Figure 12 summarize details
contained in succeeding paragraphs.
Table 6. 10XS3435 Operating Modes
The Figure 11 describes an internal signal called IN_ON[x]
depending on IN[x] input.
tIN
IN[x]
IN_ON[x]
Mode
wake-up
fail fault
Sleep
0
x
x
Device is in Sleep mode. All
outputs are OFF.
Normal
1
0
0
Device is currently in Normal
mode. Watchdog is active if
enabled.
Fail-Safe
1
1
0
Device is currently in Fail-safe
mode due to Watchdog timeout or VDD Failure conditions.
The output states are defined
with the RFS resistor
connected to FSI.
Fault
1
X
1
Device is currently in fault
mode. The faulted output(s) is
(are) OFF. The safe autoretry
circuitry is active to turn-on
again the output(s).
Figure 11. IN_ON[x] internal signal
The 10XS3435 transits to operating modes according to
the following signals:
• wake-up = RST or WAKE or IN_ON[0] or IN_ON[1] or
IN_ON[2] or IN_ON[3],
• fail = (VDD Failure and VDD_FAIL_en) or (Watchdog
time-out and FSI input not shorted to ground),
• fault = OC[0:3] or OT[0:3] or SC[0:3] or UV or (OV and
OV_dis).
x = Don’t care.
(wake-up=1) and
(fail=1)
and (fault=0)
(wake-up=1)
and (fault=1)
(wake-up=0)
(fail=1) and
(wake-up=1)
and (fault=1)
Fail-Safe
(fail=0) and (wake-up=1) and (fault=0)
Sleep
(wake-up=0)
Fault
(fail=1) and
(wake-up=1)
and (fault=0)
Comments
(wake-up=0)
(fail=0) and
(wake-up=1)
and (fault=1)
Normal
(fail=0) and
(wake-up=1)
and (fault=0)
(fail=0) and (wake-up=1) and (fault=0)
(fail=1) and (wake-up=1) and (fault=0)
Figure 12. Operating Modes
10XS3435
28
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
SLEEP MODE
The 10XS3435 is in Sleep mode when:
• VPWR and VDD are within the normal voltage range,
• wake-up = 0,
• fail = X,
• fault = X.
The timing includes seven programmable PWM switching
delay (number of PWM clock rising edges) to improve overall
EMC behavior of the light module (Table 8).
Table 8. Output PWM Switching Delay
This is the Default mode of the device after first applying
battery voltage (VPWR) prior to any I/O transitions. This is
also the state of the device when the WAKE and RST and
IN_ON[0:3] are logic [0]. In the Sleep mode, the output and
all unused internal circuitry, such as the internal regulator, are
off to minimize draw current. In addition, all SPI-configurable
features of the device are as if set to logic [0].
NORMAL MODE
The 10XS3435 is in Normal mode when:
• VPWR and VDD are within the normal voltage range,
• wake-up = 1,
• fail = 0,
• fault = 0.
In this mode, the NM bit is set to lfault_contrologic [1] and
the outputs HS[0:3] are under control, as defined by hson
signal:
hson[x] = ( ( (IN[x] and DIR_dis[x]) or On bit[x] ) and PWM_en
) or (On bit [x] and Duty_cycle[x] and PWM_en).
In this mode and also in Fail-safe, the fault condition reset
depends on fault_control signal, as defined below:
fault_control[x] = ( (IN_ON[x] and DIR_dis[x]) and PWM_en )
or (On bit [x]).
Programmable PWM module
The outputs HS[0:3] are controlled by the programmable
PWM module if PWM_en and On bits are set to logic [1].
The clock frequency from IN0 input pin or from internal
clock is the factor 27 (128) of the output PWM frequency
(CLOCK_sel bit). The outputs HS[0:3] can be controlled in
the range of 5% to 98% with a resolution of 7 bits of duty cycle
(Table 7). The state of other IN pin is ignored.
Delay bits
Output delay
000
no delay
001
16 PWM clock periods
010
32 PWM clock periods
011
48 PWM clock periods
100
64 PWM clock periods
101
80 PWM clock periods
110
96 PWM clock periods
111
112 PWM clock periods
The clock frequency from IN0 is permanently monitored in
order to report a clock failure in case of the frequency is out
a specified frequency range (from fIN0(LOW) to fIN0(HIGH)). In
case of clock failure, no PWM feature is provided, the On bit
defines the outputs state and the CLOCK_fail bit reports [1].
Calibratable internal clock
The internal clock can vary as much as +/-30 percent
corresponding to typical fPWM(0) output switching period.
Using the existing SPI inputs and the precision timing
reference already available to the MCU, the 10XS3435
allows clock period setting within +/-10 percent of accuracy.
Calibrating the internal clock is initiated by defined word to
CALR register. The calibration pulse is provided by the MCU.
The pulse is sent on the CS pin after the SPI word is
launched. At the moment, the CS pin transitions from logic [1]
to [0] until from logic [0] to [1] determine the period of internal
clock with a multiplicative factor of 128.
CS
Table 7. Output PWM Resolution
On bit
Duty cycle
Output state
0
X
OFF
1
0000000
PWM (1/128 duty cycle)
1
0000001
PWM (2/128 duty cycle)
1
0000010
PWM (3/128 duty cycle)
1
n
PWM ((n+1)/128 duty cycle)
1
1111111
fully ON
SI
CALR
SI command
ignored
Internal
clock duration
In case of negative CS pulse is outside a predefined time
range (from t CSB(MIN) to t CSB(MAX)), the calibration event will
be ignored and the internal clock will be unaltered or reset to
default value (fPWM(0)) if this was not calibrated before.
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
29
FUNCTIONAL DEVICE OPERATION
OPERATIONAL MODES
The calibratable clock is used, instead of the clock from
IN0 input, when CLOCK_sel is set to [1].
NORMAL & FAIL-SAFE MODE TRANSITIONS
FAIL-SAFE MODE
To leave the Fail-safe mode, VDD must be in nominal
voltage and the microcontroller has to send a SPI command
with WDIN bit set to logic [1] ; the other bits are not
considered. The previous latched faults are reset by the
transition into Normal mode (autoretry included).
The 10XS3435 is in Fail-safe mode when:
• VPWR is within the normal voltage range,
• wake-up = 1,
• fail = 1,
• fault = 0.
Watchdog
If the FSI input is not grounded, the watchdog timeout
detection is active when either the WAKE or IN_ON[0:3] or
RST input pin transitions from logic [0] to logic [1]. The WAKE
input is capable of being pulled up to VPWR with a series of
limiting resistance limiting the internal clamp current
according to the specification.
The watchdog timeout is a multiple of an internal oscillator.
As long as the WD bit (D15) of an incoming SPI message is
toggled within the minimum watchdog timeout period
(WDTO), the device will operate normally.
Fail-Safe conditions
If an internal watchdog time-out occurs before the WD bit
for FSI open (Table 9) or in case of VDD failure condition
(VDD< VDD(FAIL))) for VDD_FAIL_en bit is set to logic [1], the
device will revert to a Fail-safe mode until the WD bit is written
to logic [1] (see fail-safe to normal mode transition paragraph)
and VDD is within the normal voltage range.
Table 9. SPI Watchdog Activation
Typical RFSI (Ω)
Watchdog
0 (shorted to ground)
Disabled
(open)
Enable
During the Fail-safe mode, the outputs will depend on the
corresponding input. The SPI register content is reset to their
default value (except POR bit) and fault protections are fully
operational.
The Fail-safe mode can be detected by monitoring the NM
bit is set to [0].
Transition Fail-safe to Normal mode
Moreover, the device can be brought out of the Fail-safe
mode due to watchdog timeout issue by forcing the FSI pin to
logic [0].
Transition Normal to Fail-Safe mode
To leave the Normal mode, a fail-safe condition must
occurred (fail=1). The previous latched faults are reset by the
transition into Fail-safe mode (autoretry included).
FAULT MODE
The 10XS3435 is in Fault mode when:
• VPWR and VDD are within the normal voltage range,
• wake-up = 1,
• fail = X,
• fault=1.
This device indicates the faults below as they occur by
driving the FS pin to logic [0] for RST input is pulled up:
•Over-temperature fault,
•Over-current fault,
•Severe short-circuit fault,
•Output(s) shorted to VPWR fault in OFF state,
•Open-load fault in OFF state,
•Over-voltage fault (enabled by default),
•Under-voltage fault.
The FS pin will automatically return to logic [1] when the
fault condition is removed, except for over-current, severe
short-circuit, over-temperature and under-voltage which will
be reset by a new turn-on command (each fault_control
signal to be toggled).
Fault information is retained in the SPI fault register and is
available (and reset) via the SO pin during the first valid SPI
communication.
The Open load fault in ON state is only reported through
SPI register without effect on the corresponding output state
(HS[x]) and the FS pin.
10XS3435
30
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSTIC FEATURES
START-UP SEQUENCE
The 10XS3435 enters in Normal mode after start-up if
following sequence is provided:
•VPWR and VDD power supplies must be above their
under-voltage thresholds,
•generate wake-up event (wake-up=1) from 0 to 1 on
RSTB. The device switches to normal mode with SPI
register content is reset (as defined in Table 11 and
Table 23). All features of the 10XS3435 will be available
after 50 μs typical, and all SPI registers are set to
default values (set to logic [0]).
•toggle WD bit from 0 to 1.
And, in case of the PWM module is used (PWM_en bit is
set to logic [1]) with an external reference clock:
•apply PWM clock on IN0 input pin after maximum 200 μs
(min. 50 μs).
If the correct start-up sequence is not provided, the PWM
function is not guaranteed.
PROTECTION AND DIAGNOSTIC FEATURES
PROTECTIONS
Over-temperature Fault
The 10XS3435 incorporates over-temperature detection
and shutdown circuitry for each output structure.
Two cases need to be considered when the output
temperature is higher than TSD:
•If the output command is ON: the corresponding output is
latched OFF. FS will be also latched to logic [0]. To
delatch the fault and be able to turn ON again the
outputs, the failure condition must disappear and the
autoretry circuitry must be active or the corresponding
output must be commanded OFF and then ON (toggling
fault_control signal of corresponding output) or
VSUPPLY(POR) condition if VDD = 0.
•If the output command is OFF: FS will go to logic [0] till
the corresponding output temperature will be below
TSD.
For both cases, the fault register OT[0:3] bit into the status
register will be set to [1]. The fault bits will be cleared in the
status register after a SPI read command.
Over-current Fault
The 10XS3435 incorporates output shutdown in order to
protect each output structure against resistive short-circuit
condition. This protection is composed by eight predefined
current levels (time dependent) to fit Xenon-HID manners by
default or, 55 W or 28 W bulb profiles, selectable separately
by Xenon bit and 28 W bits (as illustrated Figure 14, page
37).
In the first turn-on, the lamp filament is cold and the current
will be huge. fault_control signal transition from logic [0] to [1]
or an autoretry define this event. In this case, the over-current
protection will be fitted to inrush current, as shown in
Figure 5. This over-current protection is programmable:
OC[1:0] bits select over-current slope speed and OCHI1
current step can be removed in case of OCHI bit is set to [1].
Over-current thresholds
fault_control
hson
signal
hson
PWM
In steady state, the wire harness will be protected by
OCLO2 current level by default. Three other DC over-current
levels are available: OCLO1 or OCLO3 or OCLO4 based on
the state of the OCLO[1,0] bits.
If the load current level ever reaches the over-current
detection level, the corresponding output will latch the output
OFF and FS will be also latched to logic [0]. To delatch the
fault and be able to turn ON again the corresponding output,
the failure condition must disappear and the autoretry
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
31
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSTIC FEATURES
circuitry must be active or the corresponding output must be
commanded OFF and then ON (toggling fault_control signal
of corresponding output) or VSUPPLY(POR) condition if VDD =
0.
The SPI fault report (OC[0:3] bits) is removed after a read
operation.
In Normal mode using internal PWM module, the
10XS3435 incorporates also a cooling bulb filament
management if OC_mode and Xenon are set to logic [1]. In
this case, the 1st step of multi-step over-current protection will
depend to the previous OFF duration, as illustrated in
Figure 6. The following figure illustrates the current level will
be used in function to the duration of previous OFF state
(toff). The slope of cooling bulb emulator is configurable with
OCOFFCB[1:0] bits.
Over-voltage Fault (Enabled by default)
By default, the over-voltage protection is enabled. The
10XS3435 shuts down all outputs and FS will go to logic [0]
during an over-voltage fault condition on the VPWR pin
(VPWR > VPWR(OV)). The outputs remain in the OFF state until
the over-voltage condition is removed (VPWR < VPWR(OV) VPWR(OVHYS)). When experiencing this fault, the OVF fault bit
is set to logic [1] and cleared after either a valid SPI read.
The over-voltage protection can be disabled through SPI
(OV_dis bit is disabled set to logic [1]). The fault register
reflects any over-voltage condition (VPWR > VPWR(OV)). This
over-voltage diagnosis, as a warning, is removed after a read
operation, if the fault condition disappears. The HS[0:3]
outputs are not commanded in RDS(ON) above the OV
threshold.
Under-voltage Fault
Depending on toff
depending to toff
Over-current thresholds
Cooling
toff
fault_control
hson
signal
hson
PWM
Severe Short-Circuit Fault
The 10XS3435 provides output shutdown in order to
protect each output in case of severe short-circuit during of
the output switching.
If the short-circuit impedance is below RSHORT, the device
will latch the output OFF, FS will go to logic [0] and the fault
register SC[0:3] bit will be set to [1]. To delatch the fault and
be able to turn ON again the outputs, the failure condition
must disappear and the corresponding output must be
commanded OFF and then ON (toggling fault_control signal
of corresponding output) or VSUPPLY(POR) condition if VDD =
0.
The SPI fault report (SC[0:3] bits) is removed after a read
operation.
The output(s) will latch off at some battery voltage below
VPWR(UV). As long as the VDD level stays within the normal
specified range, the internal logic states within the device will
remain (configuration and reporting).
In the case where battery voltage drops below the undervoltage threshold (VPWR < VPWR(UV)), the outputs will turn off,
FS will go to logic [0], and the fault register UV bit will be set
to [1].
Two cases need to be considered when the battery level
recovers (VPWR > VPWR(UV)_UP):
•
If outputs command are low, FS will go to logic [1] but
the UV bit will remain set to 1 until the next read
operation (warning report).
• If the output command is ON, FS will remain at logic [0].
To delatch the fault and be able to turn ON again the
outputs, the failure condition must disappear and the
autoretry circuitry must be active or the corresponding
output must be commanded OFF and then ON
(toggling fault_control signal of corresponding output)
or VSUPPLY(POR) condition if VDD = 0.
In extended mode, the output is protected by overtemperature shutdown circuitry. All previous latched faults,
occurred when VPWR was within the normal voltage range,
are guaranteed if VDD is within the operational voltage range
or until VSUPPLY(POR) if VDD = 0. Any new OT fault is
detected (VDD failure included) and reported through SPI
above VPWR(UV). The output state is not changed as long as
the VPWR voltage does not drop any lower than 3.5 V typical.
All latched faults (over-temperature, over-current, severe
short-circuit, over and under-voltage) are reset if:
• VDD < VDD(FAIL) with VPWR in nominal voltage range,
•VDD and VPWR supplies is below VSUPPLY(POR) voltage
value.
10XS3435
32
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSTIC FEATURES
(fault_control=0)
(OpenloadOFF=1
or ShortVpwr=1
or OV=1)
(fault_control=1 and OV=0)
OFF
if hson=0
(SC=1)
ON
(fault_control=0 or OV=1)
(OpenloadOFF=1
or ShortVpwr=1
or OV=1)
(OpenloadON=1)
if hson=1
OFF
(Retry=1)
(fault_control=0)
Latched
(count=16)
(SC=1)
(OpenloadON=1)
(after Retry Period and OV=0)
Autoretry
(OV=1)
OFF
Autoretry
ON
if hson=1
(Retry=1)
=> count=count+1
(OpenloadOFF=1
or ShortVpwr=1
or OV=1)
(fault_control=0)
Figure 13. Auto-retry State Machine
AUTO-RETRY
The auto-retry circuitry is used to reactivate the output(s)
automatically in case of over-current or over-temperature or
under-voltage failure conditions to provide a high availability
of the load.
status register after the internal gate voltage is pulled low
enough to turn OFF the output. The OS[0:3] and
OL_OFF[0:3] fault bits are set in the status register and FS
pin reports in real time the fault. If the output shorted to
VPWR fault is removed, the status register will be cleared
after reading the register.
Auto-retry feature is available in Fault mode. It is activated
in case of internal retry signal is set to logic [1]:
The open output shorted to VPWR protection can be
disabled through SPI (OS_DIS[0:3] bit).
retry[x] = OC[x] or OT[x] or UV.
Open-Load Faults
The feature retries to switch-on the output(s) after one
auto-retry period (tAUTO) with a limitation in term of number of
occurrence (16 for each output). The counter of retry
occurrences is reset in case of Fail-safe to Normal or Normal
to Fail-safe mode transitions. At each auto-retry, the overcurrent detection will be set to default values in order to
sustain the inrush current.
The 10XS3435 incorporates three dedicated open-load
detection circuitries on the output to detect in OFF and in ON
state.
The Figure 13 describes the auto-retry state machine.
DIAGNOSTIC
Output Shorted to VPWR Fault
The 10XS3435 incorporates output shorted to VPWR
detection circuitry in OFF state. Output shorted to VPWR fault
is detected if output voltage is higher than VOSD(THRES) and
reported as a fault condition when the output is disabled
(OFF). The output shorted to VPWR fault is latched into the
Open-load Detection In Off State
The OFF output open-load fault is detected when the
output voltage is higher than VOLD(THRES) pulled up with
internal current source (IOLD(OFF)) and reported as a fault
condition when the output is disabled (OFF). The OFF Output
open-load fault is latched into the status register or when the
internal gate voltage is pulled low enough to turn OFF the
output. The OL_OFF[0:3] fault bit is set in the status register.
If the open load fault is removed (FS output pin goes to high),
the status register will be cleared after reading the register.
The OFF output open-load protection can be disabled
through SPI (OLOFF_DIS[0:3] bit).
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
33
FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSTIC FEATURES
Open-load Detection In On State
REVERSE BATTERY ON VPWR
The ON output open-load current thresholds can be
chosen by SPI to detect a standard bulbs or LEDs
(OLLED[0:3] bit set to logic [1]). In the case where load
current drops below the defined current threshold OLON bit
is set to logic [1], the output stays ON and FS is not disturbed.
The output survives the application of reverse voltage as
low as -18 V. Under these conditions, the ON resistance of
the output is 2 times higher than typical ohmic value in
forward mode. No additional passive components are
required except on VDD current path.
Open-load Detection In On State For Led
GROUND DISCONNECT PROTECTION
Open load for LEDs only (OLLED[0:3] set to logic [1]) is
detected periodically each t OLLED (fully-on, D[6:0]=7F). To
detect OLLED in fully-on state, the output must be ON at least
t OLLED.
To delatch the diagnosis, the condition should be removed
and SPI read operation is needed (OL_ON[0:3] bit). The ON
output open-load protection can be disabled through SPI
(OLON_DIS[0:3] bit).
In the event the 10XS3435 ground is disconnected from
load ground, the device protects itself and safely turns OFF
the output regardless of the state of the output at the time of
disconnection (maximum VPWR = 16 V). A 10 kΩ resistor
needs to be added between the MCU and each digital input
pin in order to ensure that the device turns off in case of
ground disconnect and to prevent this pin from exceeding
maximum ratings.
Analog Current Recopy and Temperature Feedbacks
LOSS OF SUPPLY LINES
The CSNS pin is an analog output reporting a current
proportional to the designed output current or a voltage
proportional to the temperature of the GND flag (pin #14).
The routing is SPI programmable (TEMP_en, CSNS_en,
CSNS_s[1,0] and CSNS_ratio_s bits).
In case the current recopy is active, the CSNS output
delivers current only during ON time of the output switch
without overshoot. The maximum current is 2.0 mA typical.
The typical value of external CSNS resistor connected to the
ground is 2.5 kΩ.
The current recopy is not active in Fail-safe mode.
Temperature Prewarning Detection
In Normal mode, the 10XS3435 provides a temperature
prewarning reported via SPI in case of the temperature of the
GND flag is higher than TOTWAR. This diagnosis (OTW bit set
to [1]) is latched in the SPI DIAGR0 register. To delatch, a
read SPI command is needed.
ACTIVE CLAMP ON VPWR
The device provides an active gate clamp circuit in order
to limit the maximum transient VPWR voltage at
VPWR(CLAMP). In case of overload on an output the
corresponding output is turned off which leads to high voltage
at VPWR with an inductive VPWR line. When VPWR voltage
exceeds VPWR(CLAMP) threshold, the turn-off on the
corresponding output is deactivated and all HS[0:3] outputs
are switched ON automatically to demagnetize the inductive
Battery line.
For a long battery line between the battery and the device
(> 20 meters), the smart high side switch output may exceed
the energy capability in case of a short-circuit. It is
recommended to implement a voltage transient suppressor
to drain the battery line energy.
Loss of VDD
If the external VDD supply is disconnected (or not within
specification: VDD < VDD(FAIL)) with VDD_FAIL_en bit is set
to logic [1]), all SPI register content is reset.
The outputs can still be driven by the direct inputs IN[0 : 3]
if VPWR is within specified voltage range. The 10XS3435
uses the battery input to power the output MOSFET-related
current sense circuitry and any other internal logic providing
Fail-safe device operation with no VDD supplied. In this state,
the over-temperature, over-current, severe short-circuit,
short to VPWR and OFF open-load circuitry are fully
operational with default values corresponding to all SPI bits
are set to logic [0]. No current is conducted from VPWR to
VDD.
Loss of VPWR
If the external VPWR supply is disconnected (or not within
specification), the SPI configuration, reporting, and daisy
chain features are provided for RST to set to logic [1] under
VDD in nominal conditions. This fault condition can be
diagnosed with UV fault in SPI STATR_s registers. The SPI
pull-up and pull-down current sources are not operational.
The previous device configuration is maintained. No current
is conducted from VDD to VPWR.
Loss of VPWR and VDD
If the external VPWR and VDD supplies are disconnected
(or not within specification: (VDD and VPWR) <
VSUPPLY(POR)), all SPI register contents are reset with default
values corresponding to all SPI bits are set to logic [0] and all
latched faults are also reset.
10XS3435
34
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
EMC PERFORMANCES
The device is protected in case of positive and negative
transients on the VPWR line (per ISO 7637-2).
All following tests are performed on Freescale evaluation
board in accordance with the typical application schematic.
The 10XS3435 successfully meets the Class 5 of the
CISPR25 emission standard and 200 V/m or BCI 200 mA
injection level for immunity tests.
LOGIC COMMANDS AND REGISTERS
SERIAL INPUT COMMUNICATION
remaining nine bits, D8 : D0, are used to configure and control
the outputs and their protection features.
SPI communication is accomplished using 16-bit
messages. A message is transmitted by the MCU starting
with the MSB D15 and ending with the LSB, D0 (Table 10).
Each incoming command message on the SI pin can be
interpreted using the following bit assignments: the MSB,
D15, is the watchdog bit (WDIN). In some cases, output
selection is done with bits D14 : D13. The next three bits,
D12: D10, are used to select the command register. The
Multiple messages can be transmitted in succession to
accommodate those applications where daisy-chaining is
desirable, or to confirm transmitted data, as long as the
messages are all multiples of 16 bits. Any attempt made to
latch in a message that is not 16 bits will be ignored.
The 10XS3435 has defined registers, which are used to
configure the device and to control the state of the outputs.
Table 11 summarizes the SI registers.
Table 10. SI Message Bit Assignment
Bit Sig
SI Msg Bit
MSB
D15
Message Bit Description
Watchdog in: toggled to satisfy watchdog requirements.
D14 : D13
Register address bits used in some cases for output selection (Table 12).
D12 : D10
Register address bits.
D9
LSB
Not used (set to logic [0]).
D8:D0
Used to configure the inputs, outputs, and the device protection features and SO status content.
Table 11. Serial Input Address and Configuration Bit Map
SI Data
SI Register
D15
D14 D13 D12 D11 D10 D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
STATR_s
WDIN
X
X
0
0
0
0
0
0
0
0
SOA4
SOA3
SOA2
SOA1
SOA0
PWMR_s
WDIN
A1
A0
0
0
1
0
28W_s
ON_s
PWM6_s
PWM5_s
PWM4_s
PWM3_s
PWM2_s
PWM1_s
PWM0_s
CONFR0_s WDIN
A1
A0
0
1
0
0
0
0
0
DIR_dis_s
SR1_s
SR0_s
DELAY2_s
DELAY1_s
DELAY0_s
CONFR1_s WDIN
A1
A0
0
1
1
0
0
0
Retry_
unlimited_s
Retry_dis_s
OS_dis_s
OLON_dis_s
OLOFF_dis_s OLLED_en_s CSNS_ratio_s
OCR_s
WDIN
A1
A0
1
0
0
0
Xenon_s
BC1_s
BC0_s
OC1_s
OC0_s
OCHI_s
OLCO1_s
OLCO0_s
OC_mode_s
GCR
WDIN
0
0
1
0
1
0
VDD_FAI
L_en
PWM_en
CLOCK_sel
TEMP_en
CSNS_en
CSNS1
CSNS0
X
OV_dis
CALR
WDIN
0
0
1
1
1
0
1
0
1
0
1
1
0
1
1
Register
state after
RST=0 or
VDD(FAIL) or
VSUPPLY(PO
R) condition
0
0
0
X
X
X
0
0
0
0
0
0
0
0
0
0
x = Don’t care.
s = Output selection with the bits A1A0 as defined in Table 12.
DEVICE REGISTER ADDRESSING
The following section describes the possible register
addresses (D[14:10]) and their impact on device operation.
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
35
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
ADDRESS XX000 — STATUS REGISTER
(STATR_S)
default value [00] corresponds to the medium speed slew rate
(Table 13).
The STATR register is used to read the device status and
the various configuration register contents without disrupting
the device operation or the register contents. The register bits
D[4:0] determine the content of the first sixteen bits of SO
data. In addition to the device status, this feature provides the
ability to read the content of the PWMR_s, CONFR0_s,
CONFR1_s, OCR_s, GCR and CALR registers (Refer to the
section entitled Serial Output Communication (Device Status
Return Data) on page 38.
Table 13. Slew Rate Speed Selection
ADDRESS A1A0001— OUTPUT PWM CONTROL
REGISTER (PWMR_S)
The PWMR_s register allows the MCU to control the state
of corresponding output through the SPI. Each output “s” is
independently selected for configuration based on the state
of the D14 : D13 bits (Table 12).
Table 12. Output Selection
A1 (D14)
A0 (D13)
HS Selection
0
0
HS0 (default)
0
1
HS1
1
0
HS2
1
1
HS3
A logic [1] on bit D8 (28 W_s) selects the 28 W overcurrent protection profile: the over-current thresholds are
divided by 2 and, the inrush and cooling responses are
dedicated to 28 W lamps for HS[0,1] outputs. This bit it not
taken into account for HS[2,3] outputs.
Bit D7 sets the output state. A logic [1] enables the
corresponding output switch and a logic [0] turns it OFF (if IN
input is also pulled down). Bits D6:D0 set the output PWM
duty-cycle to one of 128 levels for PWM_en is set to logic [1],
as shown Table 7, page 29.
ADDRESS A1A0010— OUTPUT CONFIGURATION
REGISTER (CONFR0_S)
The CONFR0_s register allows the MCU to configure
corresponding output switching through the SPI. Each output
“s” is independently selected for configuration based on the
state of the D14 : D13 bits (Table 12).
For the selected output, a logic [0] on bit D5 (DIR_DIS_s)
will enable the output for direct control. A logic [1] on bit D5
will disable the output from direct control (in this case, the
output is only controlled by On bit).
D4:D3 bits (SR1_s and SR0_s) are used to select the high
or medium or low speed slew rate for the selected output, the
SR1_s (D4)
SR0_s (D3)
Slew Rate Speed
0
0
medium (default)
0
1
low
1
0
high
1
1
Not used
Incoming message bits D2 : D0 reflect the desired output
that will be delayed of predefined PWM clock rising edges
number, as shown Table 8, page 29 (only available for
PWM_en bit is set to logic [1]).
ADDRESS A1A0011 — OUTPUT CONFIGURATION
REGISTER (CONFR1_S)
The CONFR1_s register allows the MCU to configure
corresponding output fault management through the SPI.
Each output “s” is independently selected for configuration
based on the state of the D14 : D13 bits (Table 12).
A logic [1] on bit D6 (RETRY_unlimited_s) disables the
autoretry counter for the selected output, the default value [1]
corresponds to enable auto-retry feature without time
limitation.
A logic [1] on bit D5 (RETRY_dis_s) disables the auto-retry
for the selected output, the default value [0] corresponds to
enable this feature.
A logic [1] on bit D4 (OS_dis_s) disables the output hard
shorted to VPWR protection for the selected output, the
default value [0] corresponds to enable this feature.
A logic [1] on bit D3 (OLON_dis_s) disables the ON output
open-load detection for the selected output, the default value
[0] corresponds to enable this feature (Table 14).
A logic [1] on bit D2 (OLOFF_dis_s) disables the OFF
output open-load detection for the selected output, the
default value [0] corresponds to enable this feature.
A logic [1] on bit D1 (OLLED_en_s) enables the ON output
open-load detection for LEDs for the selected output, the
default value [0] corresponds to ON output open-load
detection is set for bulbs (Table 14).
Table 14. ON Open-load Selection
OLON_dis_s (D3) OLLED_en_s (D1) ON OpenLoad detection
0
0
enable with bulb threshold
(default)
0
1
enable with LED threshold
1
X
disable
10XS3435
36
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
A logic [1] on bit D0 (CSNS_ratio_s) selects the high ratio
on the CSNS pin for the corresponding output. The default
value [0] is the low ratio (Table 15).
Table 15. Current Sense Ratio Selection
D[7:6] bits allow to MCU to programmable bulb cooling
curve and D[5:4] bits inrush curve for selected output, as
shown Table 16 and Table 17.
Table 16. Cooling Curve Selection
CSNS_high_s (D0)
Current Sense Ratio
BC1_s (D7)
BC0_s (D6)
Profile Curves Speed
0
CRS0 (default)
0
0
medium (default)
1
CRS1
0
1
slow
1
0
fast
1
1
medium
ADDRESS A1A0100 — OUTPUT OVER-CURRENT
REGISTER (OCR)
The OCR_s register allows the MCU to configure
corresponding output over-current protection through the
SPI. Each output “s” is independently selected for
configuration based on the state of the D14 : D13 bits
(Table 12).
Table 17. Inrush Curve Selection
OC1_s (D5)
OC0_s (D4)
Profile Curves Speed
0
0
slow (default)
0
1
fast
1
0
medium
1
1
very slow
A logic [1] on bit D8 (Xenon_s) disables enables the
Xenon 55 W or 28 W bulb over-current profile, as described
Figure 14.
Xenon bit set to logic [0]:
A logic [1] on bit D3 (OCHI_s bit) the OCHI1 level is
replaced by OCHI2 during tOC1, as shown Figure 15.
IOCH1
IOCH2
IOC1
IOC2
IOCH1
IOCLO4
IOCLO3
IOCLO2
IOCLO1
t OC1
t OC3 t OC4 t OC5
t OC2
IOCH2
t OC6
t OC7
Time
t OC1 t OC3 t OC4 t OC5
t OC2
Xenon bit set to logic [1]:
t OC6
Time
t OC7
Figure 15. Over-current Profile with OCHI Bit Set to ‘1’
The wire harness is protected by one of four possible
current levels in steady state, as defined in Table 18.
IOCH1
IOCH2
IOC1
IOC2
IOC3
IOC4
IOC
L4
IOCL3
IOCL2
IOCL1
t OC1 t OC3 t OC4 t OC5
t OC2
IOC1
IOC2
IOC3
IOC4
IOC
L4
IOCL3
IOCL2
IOCL1
Table 18. Output Steady State Selection
OCLO1 (D2) OCLO0 (D1)
t OC6
t OC7
Time
Figure 14. Over-current Profile Depending on Xenon Bit
Steady State Current
0
0
OCLO2 (default)
0
1
OCLO3
1
0
OCLO4
1
1
OCLO1
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
37
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
Bit D0 (OC_mode_sel) allows to select the over-current
mode, as described Table 19.
Table 19. Over-current Mode Selection
OC_mode_s (D0)
Over-current Mode
0
only inrush current management (default)
1
inrush current and bulb cooling
management
ADDRESS 00101 — GLOBAL CONFIGURATION
REGISTER (GCR)
The GCR register allows the MCU to configure the device
through the SPI.
Bit D8 allows the MCU to enable or disable the VDD failure
detector. A logic [1] on VDD_FAIL_en bit allows switch of the
outputs HS[0:3] with PWMR register device in Fail-safe mode
in case of VDD < VDD(FAIL).
Bit D7 allows the MCU to enable or disable the PWM
module. A logic [1] on PWM_en bit allows control of the
outputs HS[0:3] with PWMR register (the direct input states
are ignored).
Bit D6 (CLOCK_sel) allows to select the clock used as
reference by PWM module, as described in the following
Table 20.
Table 20. PWM Module Selection
PWM_en (D7) CLOCK_sel (D6)
PWM module
0
X
PWM module disabled
(default)
1
0
PWM module enabled with
external clock from IN0
1
1
PWM module enabled with
internal calibrated clock
Bits D5:D4 allow the MCU to select one of two analog
feedback on CSNS output pin, as shown in Table 21.
Table 21. CSNS Reporting Selection
TEMP_en CSNS_en
(D5)
(D4)
CSNS reporting
0
0
CSNS tri-stated (default)
X
1
current recopy of selected output (D3:2] bits)
1
0
temperature on GND flag
Table 22. Output Current Recopy Selection
CSNS1 (D3) CSNS0 (D2)
CSNS reporting
0
0
HS0 (default)
0
1
HS1
1
0
HS2
1
1
HS3
The GCR register disables the over-voltage protection
(D0). When this bits is [0], the over-voltage is enabled (default
value).
ADDRESS 00111 — CALIBRATION REGISTER
(CALR)
The CALR register allows the MCU to calibrate internal
clock, as explained in Figure 13.
SERIAL OUTPUT COMMUNICATION (DEVICE
STATUS RETURN DATA)
When the CS pin is pulled low, the output register is
loaded. Meanwhile, the data is clocked out MSB- (OD15-)
first as the new message data is clocked into the SI pin. The
first sixteen bits of data clocking out of the SO, and following
a CS transition, is dependent upon the previously written SPI
word.
Any bits clocked out of the Serial Output (SO) pin after the
first 16 bits will be representative of the initial message bits
clocked into the SI pin since the CS pin first transitioned to a
logic [0]. This feature is useful for daisy-chaining devices as
well as message verification.
A valid message length is determined following a CS
transition of [0] to [1]. If there is a valid message length, the
data is latched into the appropriate registers. A valid
message length is a multiple of 16 bits. At this time, the SO
pin is tri-stated and the fault status register is now able to
accept new fault status information.
SO data will represent information ranging from fault
status to register contents, user selected by writing to the
STATR bits OD4, OD3, OD2, OD1, and OD0. The value of
the previous bits SOA4 and SOA3 will determine which
output the SO information applies to for the registers which
are output specific; viz., Fault, PWMR, CONFR0, CONFR1
and OCR registers.
Note that the SO data will continue to reflect the
information for each output (depending on the previous
SOA4, SOA3 state) that was selected during the most recent
STATR write until changed with an updated STATR write.
The output status register correctly reflects the status of
the STATR-selected register data at the time that the CS is
pulled to a logic [0] during SPI communication, and/or for the
period of time since the last valid SPI communication, with
the following exception:
10XS3435
38
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
•The previous SPI communication was determined to be
invalid. In this case, the status will be reported as
though the invalid SPI communication never occurred.
•The VPWR voltage is below 4.0 V, the status must be
ignored by the MCU.
paragraphs. Table 23, summarizes SO returned data for bits
OD15 : OD0.
• Bit OD15 is the MSB; it reflects the state of the
Watchdog bit from the previously clocked-in message.
• Bits OD14:OD10 reflect the state of the bits
SOA4 : SOA0 from the previously clocked in message.
• Bit OD9 is set to logic [1] in Normal mode (NM).
• The contents of bits OD8 : OD0 depend on bits D4 : D0
from the most recent STATR command SOA4 : SOA0
as explained in the paragraphs following Table 23.
SERIAL OUTPUT BIT ASSIGNMENT
The 16 bits of serial output data depend on the previous
serial input message, as explained in the following
Table 23. Serial Output Bit Map Description
Previous STATR
SO SO SO SO SO
A4 A3 A2 A1 A0
SO Returned Data
OD
15
OD
14
OD
13
OD
12
OD
11
OD
OD9 OD8
10
OD6
OD5
OD4
OD3
OD2
OD1
OD0
UV
OV
OLON_s
OLOFF_
s
OS_s
OT_s
SC_s
OC_s
PWM3_s
PWM2_s
PWM1_s
PWM0_s
SR0_s
DELAY2_s
DELAY1_s
DELAY0_s
OLON_dis_s
OLOFF_dis_s
OCHI_s
OCLO1_s
OCLO0_s
OC_mode_s
CSNS1
CSNS0
X
OV_dis
STATR_s A1 A0
0
0
0 WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
PWMR_s A1 A0
0
0
1 WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM 28W_s ON_s PWM6_s PWM5_s PWM4_s
CONFR0
A1 A0
_s
0
1
0 WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
X
X
CONFR1
A1 A0
_s
0
1
1 WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
X
X
A1 A0
1
0
0 WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
GCR
0
0
1
0
1 WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM VDD_F PWM_ CLOCK_ TEMP_e CSNS_e
AIL_en en
sel
n
n
DIAGR0
0
0
1
1
1 WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
X
X
X
X
X
X
CLOCK_fail
CAL_fail
OTW
DIAGR1
0
1
1
1
1 WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
X
X
X
X
IN3
IN2
IN1
IN0
WD_en
DIAGR2
1
0
1
1
1 WDIN SOA4 SOA3 SOA2 SOA1 SOA0 NM
X
X
X
X
X
X
0
1
1
X
0
0
0
0
0
0
0
0
OCR_s
Register N/A N/A N/A N/A N/A
state
after
RST=0 or
VDD(FAIL)
or
VSUPPLY(
0
0
0
0
0
0
0
POR
OD7
Xenon
BC1_s
_s
X
DIR_dis_ SR1_s
s
Retry_ Retry_dis OS_dis_
_s
s
unlimited
_s
BC0_s
OC1_s
OC0_s
OLLED_en_ CSNS_ratio_
s
s
POR)
conditio
n
s = Output selection with the bits A1A0 as defined in Table 12
PREVIOUS ADDRESS SOA4 : SOA0 = A1A0000
(STATR_S)
The returned data OD8 reports logic [1] in case of previous
Power ON Reset condition (VSUPPLY(POR)). This bit is only
reset by a read operation.
Bits OD7: OD0 reflect the current state of the Fault register
(FLTR) corresponding to the output previously selected with
the bits SOA4:SOA3 = A1A0 (Table 23).
• OC_s: over-current fault detection for a selected output,
• SC_s: severe short-circuit fault detection for a selected
output,
• OS_s: output shorted to VPWR fault detection for a
selected output,
• OLOFF_s: open-load in OFF state fault detection for a
selected output,
• OLON_s: openload in ON state fault detection (depending
on current level threshold: bulb or LED) for a selected
output,
• OV: over-voltage fault detection,
• UV: under-voltage fault detection
• POR: power on reset detection.
The FS pin reports all faults. For latched faults, this pin is
reset by a new Switch OFF command (toggling fault_control
signal).
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
39
FUNCTIONAL DEVICE OPERATION
LOGIC COMMANDS AND REGISTERS
PREVIOUS ADDRESS SOA4 : SOA0 = A1A0001
(PWMR_S)
PREVIOUS ADDRESS SOA4 : SOA0 = 01111
(DIAGR1)
The returned data contains the programmed values in the
PWMR register for the output selected with A1A0.
The returned data OD4: OD1 report in real time the state
of the direct input IN[3:0].
PREVIOUS ADDRESS SOA4 : SOA0 = A1A0010
(CONFR0_S)
The OD0 indicates if the watchdog is enabled (set to logic
[1]) or not (set to logic [0]). OD4:OD1 report the output state
in case of Fail-safe state due to watchdog time-out as
explained in the following Table 24.
The returned data contains the programmed values in the
CONFR0 register for the output selected with A1A0.
PREVIOUS ADDRESS SOA4 : SOA0 = A1A0011
(CONFR1_S)
The returned data contains the programmed values in the
CONFR1 register for the output selected with A1A0.
Table 24. Watchdog Activation Report
WD_en (OD0)
SPI Watchdog
0
disabled
1
enabled
PREVIOUS ADDRESS SOA4 : SOA0 = A1A0100
(OCR_S)
PREVIOUS ADDRESS SOA4 : SOA0 = 10111
(DIAGR2)
The returned data contains the programmed values in the
OCR register for the output selected with A1A0.
The returned data is the product ID. Bits OD2:OD0 are set
to 011 for Protected Dual 10 mΩ and 35 mΩ high side
Switches.
PREVIOUS ADDRESS SOA4 : SOA0 = 00101 (GCR)
The returned data contains the programmed values in the
GCR register.
PREVIOUS ADDRESS SOA4 : SOA0 = 00111
(DIAGR0)
The returned data OD2 reports logic [1] in case of PWM
clock on IN0 pin is out of specified frequency range.
The returned data OD1 reports logic [1] in case of
calibration failure.
The returned data OD0 reports logic [1] in case of overtemperature prewarning (temperature of GND flag is above
TOTWAR).
DEFAULT DEVICE CONFIGURATION
The default device configuration is explained below:
• HS output is commanded by corresponding IN input or On
bit through SPI. The medium slew-rate is used,
• HS output is fully protected by the Xenon over-current
profile by default, the severe short-circuit protection, the
under-voltage and the over-temperature protection. The
auto-retry feature is enabled,
• Open-load in ON and OFF state and HS shorted to VPWR
detections are available,
• No current recopy and no analog temperature feedback
active,
• Over-voltage protection is enabled,
• SO reporting fault status from HS0,
• VDD failure detection is disabled.
10XS3435
40
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
TYPICAL APPLICATION
TYPICAL APPLICATION
The following figure shows a typical automotive lighting
application (only one vehicle corner) using an external PWM
clock from the main MCU. A redundancy circuitry has been
VPWR
implemented to substitute light control (from MCU to
watchdog) in case of a Fail-safe condition.
It is recommended to locate a 22 nF decoupling capacitor
to the module connector.
VDD
Voltage regulator
100nF
10µF
100nF
VDD
10µF
VPWR
ignition
switch
VDD
10k
VPWR
VDD
VPWR
VDD
10k
100nF
100nF
100nF
VDD
WAKE
I/O
FS
IN0
IN1
IN2
IN3
10k
I/O
MCU
SCLK
CS
I/O
SO
SI
10k
10k
10k
10k
A/D
HS0
10XS3435
SCLK
CS
RST
SI
SO
CSNS
FSI
10k
22nF
22nF
LOAD 0
HS1
22nF
LOAD 1
HS2
22nF
LOAD 2
HS3
GND
22nF
LOAD 3
2.5k
VPWR
Watchdog
direct light commands (pedal, comodo, ...)
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
41
PACKAGING
SOLDERING INFORMATION
PACKAGING
SOLDERING INFORMATION
The 10XS3435 is packaged in a surface mount power
package intended to be soldered directly on the printed circuit
board.
The CPNA code was qualified in accordance with JEDEC
standards J-STD-020C Sn-Pb reflow profile. The maximum
peak temperature during the soldering process should not
exceed 245 for 10 seconds maximum duration.
The DPNA code was qualified in accordance with JEDEC
standards J-STD-020C Pb-free reflow profile. The maximum
peak temperature during the soldering process should not
exceed 260 for 40 seconds maximum duration.
The AN2469 provides guidelines for Printed Circuit Board
design and assembly.
PACKAGE DIMENSIONS
For the most current package revision, visit www.freescale.com and perform a keyword search using the 98ARL10596D listed below.
PNA SUFFIX
24-PIN PQFN
NONLEADED PACKAGE
98ARL10596D
REV. D
10XS3435
42
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
PACKAGE DIMENSIONS
PNA SUFFIX
24-PIN PQFN
NONLEADED PACKAGE
98ARL10596D
REV. D
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
43
PACKAGING
PACKAGE DIMENSIONS
PNA SUFFIX
24-PIN PQFN
NONLEADED PACKAGE
98ARL10596D
REV. D
10XS3435
44
Analog Integrated Circuit Device Data
Freescale Semiconductor
PACKAGING
PACKAGE DIMENSIONS
PNA SUFFIX
24-PIN PQFN
NONLEADED PACKAGE
98ARL10596D
REV. D
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
45
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
ADDITIONAL DOCUMENTATION
10XS3435PNA
THERMAL ADDENDUM (REV 1.0)
Introduction
This thermal addendum is provided as a supplement to the 10XS3435
technical data sheet. The addendum provides thermal performance
information that may be critical in the design and development of system
applications. All electrical, application and packaging information is
provided in the data sheet.
24-PIN
PQFN
Package and Thermal Considerations
This 10XS3435 is a dual die package. There are two heat sources in the
package independently heating with P1 and P2. This results in two junction
temperatures, TJ1 and TJ2, and a thermal resistance matrix with RθJAmn.
For m, n = 1, RθJA11 is the thermal resistance from Junction 1 to the
reference temperature while only heat source 1 is heating with P1.
For m = 1, n = 2, RθJA12 is the thermal resistance from Junction 1 to the
reference temperature while heat source 2 is heating with P2. This applies
to RθJ21 and RθJ22, respectively.
TJ1
TJ2
=
RθJA11 RθJA12
RθJA21 RθJA22
.
P1
P2
PNA SUFFIX
98ARL10596D
24-PIN PQFN (12 x 12)
Note For package dimensions, refer to
the 10XS3435 data sheet.
The stated values are solely for a thermal performance comparison of
one package to another in a standardized environment. This methodology is not meant to and will not predict the performance
of a package in an application-specific environment. Stated values were obtained by measurement and simulation according to
the standards listed below.
Standards
Table 25. Thermal Performance Comparison
Thermal
Resistance
1 = Power Chip, 2 = Logic Chip [°C/W]
m = 1,
n=1
m = 1, n = 2
m = 2, n = 1
m = 2,
n=2
RθJAmn (1)(2)
27.13
18.31
35.53
RθJBmn (2)(3)
14.31
6.54
23.61
RθJAmn (1)(4)
47.77
36.90
54.35
RθJCmn (5)
1.38
0.00
0.91
Notes:
1. Per JEDEC JESD51-2 at natural convection, still air
condition.
2. 2s2p thermal test board per JEDEC JESD51-7and
JESD51-5.
3. Per JEDEC JESD51-8, with the board temperature on the
center trace near the power outputs.
4. Single layer thermal test board per JEDEC JESD51-3 and
JESD51-5.
5. Thermal resistance between the die junction and the
exposed pad, “infinite” heat sink attached to exposed pad.
0.2mm
0.2mm
0.5mm dia.
Figure 16. Detail of Copper Traces Under Device with
Thermal Vias
10XS3435
46
Analog Integrated Circuit Device Data
Freescale Semiconductor
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
76.2mm
114.3mm
114.3mm
76.2mm
SO
16
GND
17
HS3
WAKE
FS
IN3
IN2
NC
IN1
IN0
CSNS
13 12 11 10
RST
CS
SCLK
VDD
Transparent Top View
SI
Figure 18. 2s2p JDEC Thermal Test Board
(Red - Top Layer, Yellow - Two Buried Layers)
Figure 17. 1s JEDEC Thermal Test Board Layout
9
8
7
6
5
4
3
2
1
14
GND
24
FSI
23
GND
22
18
HS2
15
VPWR
MC10XS3435 Pin Connections
24-PIN PQFN (12 x 12)
0.9 mm Pitch
12.0mm 12.0mm Body
19
20
21
HS1
NC
HS0
Figure 19. Pin Connections
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
47
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
Device on Thermal Test Board
Material:
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
Cu buried traces thickness 0.035mm
Outline:
76.2 mm x 114.3 mm board area,
including edge connector for thermal
testing, 74 mm x 74 mm buried
layers area
Area A:
Cu heat-spreading areas on board
surface
Ambient Conditions:
Natural convection, still air
Table 26. Thermal Resistance Performance
Thermal
Resistance
RθJAmn
Area A
(mm2)
1 = Power Chip, 2 = Logic Chip (°C/W)
m = 1,
n=1
m = 1, n = 2
m = 2, n = 1
m = 2,
n=2
0
47.77
36.90
54.35
150
42.90
33.21
51.07
300
40.95
31.78
49.63
450
39.85
30.89
48.61
600
38.96
30.21
47.90
RθJA is the thermal resistance between die junction and
ambient air.
This device is a dual die package. Index m indicates the
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
Thermal resistance [K/W]
65.00
60.00
55.00
50.00
45.00
40.00
35.00
30.00
25.00
0
100
200
300
400
500
600
Heat spreading area [sqmm]
RJA11
RJA12=RJA21
RJA22
Figure 20. Steady State Thermal Resistance in Dependence on Heat Spreading Area;
1s JEDEC Thermal Test Board with Spreading Areas
10XS3435
48
Analog Integrated Circuit Device Data
Freescale Semiconductor
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 1.0)
Thermal Resistance [K/W]
100
10
1
0.1
0.00001
0.001
0.1
10
1000
Time[s]
Figure 21. Transient Thermal 1W Step Response; Device on
1s JEDEC Standard Thermal Test Board with Heat Spreading Areas 600 Sq. mm
Thermal resistance [K/W]
100
10
1
0.1
0.00001
0.001
0.1
10
1000
Time [s]
Figure 22. Transient Thermal 1W Step Response;
Device on 2s2p JEDEC Standard Thermal Test Board
10XS3435
Analog Integrated Circuit Device Data
Freescale Semiconductor
49
REVISION HISTORY
REVISION HISTORY
REVISION
DATE
DESCRIPTION OF CHANGES
4.0
9/2008
•
Initial release
5.0
10/2008
•
•
•
•
Revised wording of VPWR Supply Voltage Range in Maximum Rating Table on page 5.
Changed parameters for VPWR and VDD Power on Reset Threshold in Static Electrical Characteristics
Table on page 7.
Changed Maximum rating for Output Source-to-Drain ON Resistance in Static Electrical Characteristics
Table on page 8.
Changed Typical rating for HS[0,1] Current Sense Ratio (6.0 V < HS[0:3] < 20V, CSNS < 5.0V) in Static
Electrical Characteristics Table on page 9.
Further defined Output Over-Temperature Shutdown parameter in Static Electrical Characteristics
Table on page 10.
Changed Typical parameter for HS[2,3] Current Sense Ratio (6.0V < HS[0:3] < 20V, CSNS < 5.0V) in
Static Electrical Characteristics Table on page 11.
Changed parameters for Wake Input Clamp Voltage in Static Electrical Characteristics Table on page
12.
Added explanation for recovering to Normal Mode on page 28.
Added HS[2:3] Driver Output Matching Time (t DLY(ON) - t DLY(OFF))
•
•
•
•
•
6.0
12/2008
•
Changed Orderable Part Number from PC10XS3435BPNA to MC10XS3435BPNA on Page 1.
7.0
7/2009
•
Added MC10XS3435DPNA part number. The “D” version has different soldering limits.
8.0
10/2009
•
•
Corrected minor formatting
Separated definitions for the 10XS3435B and 10XS3435D in the Static and Dynamic Tables
10XS3435
50
Analog Integrated Circuit Device Data
Freescale Semiconductor
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10XS3435
Rev. 8.0
10/2009