HLMP-AM70/AM71, HLMP-AB70/AB71 Green and Blue 5 mm Mini Oval LEDs Data Sheet Description Features The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. The package epoxy contains both UV inhibitors to reduce the effects of long term exposure to direct sunlight. x Well defined spatial radiation pattern Applications x Superior resistance to moisture x Mono color signs x Standoff and non stand-off Package Package Dimensions x Typical viewing angle 30° x 70° x High brightness material x Available in green and blue color. x Green InGaN 525nm x Blue InGaN 470nm x Tinted and diffused A: No Standoff 0.8 max. 0.032 8.70 ±0.20 0.342 ±0.008 0.70 max. 0.028 3.80 ±0.200 0.150 ±0.008 0.50 ±0.10 sq. typ. 0.020 ±0.004 5.20 ±0.200 0.205 ±0.008 cathode lead 24.00 min. 0.945 1.00 min. 0.038 2.54 ±0.3 0.100 ±0.012 B: Standoff d 1.50 ±0.15 0.0591 ±0.006 0.70 max. 0.028 0.50 ±0.10 sq. typ. 0.020 ±0.004 3.80 ±0.200 0.150 ±0.008 5.20 ±0.20 0.205 ±0.008 cathode lead 8.70 ±0.20 0.342 ±0.008 0.8 max. 0.032 24.00 min. 0.945 1.00 min. 0.038 2.54 ±0.3 0.100 ±0.012 Notes: 1. All dimensions in millimeters (inches). 2. Dimension d = 11.59 mm. 3. Tolerance is ± 0.20 mm unless otherwise specified. CAUTION: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Device Selection Guide Luminous Intensity Iv (mcd) at 20 mA [1,2,4] Part Number Color and Dominant Wavelength Od (nm) Typ [3] Min. Max. Stand-off Package Drawing HLMP-AB70-TWBDD Blue 470 800 1660 No A HLMP-AB70-TWCDD Blue 470 800 1660 No A HLMP-AB71-TWBDD Blue 470 800 1660 Yes B HLMP-AB71-TWCDD Blue 470 800 1660 Yes B HLMP-AM70-24BDD Green 525 3500 6050 No A HLMP-AM70-24CDD Green 525 3500 6050 No A HLMP-AM71-24BDD Green 525 3500 6050 Yes B HLMP-AM71-24CDD Green 525 3500 6050 Yes B Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. Tolerance for each bin limit is ± 15% Part Numbering System HLMP – A x xx – x x x xx Packaging Option DD: Ammopack Color Bin Selection B : Color bin 2 and 3 C : Color bin 3 and 4 Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Standoff / Non Standoff 70 : Without Standoff 71 : With Standoff Color B : Blue M : Green Package A : 5 mm Mini Oval 30° x 70° Note: Please refer to AB 5337 for complete information about part numbering system. 2 Absolute Maximum Ratings TA = 25° C Parameter Blue and Green Unit DC Forward Current [1] 30 mA Peak Forward Current 100 [2] mA Power Dissipation 110 mW LED Junction Temperature 110 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +100 °C Notes: 1. Derate linearly as shown in Figure 4. 2. Duty Factor 10%, frequency 1 KHz. Electrical / Optical Characteristics TA = 25° C Parameter Symbol Min. Typ. Max. Units Test Conditions Forward Voltage Green & blue VF 2.8 3.1 3.6 V IF = 20 mA Reverse Voltage [1] Green & blue VR 5 V IR = 10 PA nm IF = 20 mA nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Dominant Wavelength [2] Green Blue Peak Wavelength Green Blue 520 460 525 470 OPEAK 540 480 517 461 Thermal resistance RTJ-PIN Luminous Efficacy [3] Green Blue Kv 240 475 68 °C/W LED Junction-to pin lm/W Emitted Luminous Power/ Emitted Radiant Power Notes: 1. Indicates product final testing condition, long term reverse bias is not recommended. 2. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp. 3. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / KV where Iv is the luminous intensity in candela and KV is the luminous efficacy in lumens/ watt. 3 30 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 380 25 Blue 430 FORWARD CURRENT - mA RELATIVE INTENSITY InGaN Blue and Green Green 480 530 WAVELENGTH - nm 580 1.2 30 IF max. - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 0 35 1 0.8 0.6 0.4 0.2 5 10 15 20 25 DC FORWARD CURRENT - mA 30 NORMALIZED INTENSITY 10 8 Green 4 Blue 2 0 -2 0 5 10 15 20 FORWARD CURRENT - mA Figure 5. Relative dominant wavelength vs Forward Current 2 FORWARD VOLTAGE - V 3 4 20 15 10 5 0 20 40 60 80 TA - AMBIENT TEMPERATURE - °C 100 Figure 4. Maximum Forward Current vs Ambient Temperature 12 6 1 25 0 35 Figure 3. Relative Intensity vs Forward Current RELATIVE DOMINANT WAVELENGTH - nm 5 1.4 0 4 10 Figure 2. Forward Current vs Forward Voltage 0 -4 15 0 630 Figure 1. Relative Intensity vs Wavelength 20 25 30 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 6. Radiation pattern-Minor Axis 90 RELATIVE LIGHT OUTPUT (NORMALZIED @ TJ = 25° C) NORMALIZED INTENSITY 10 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 Figure 7. Radiation pattern-Major Axis BLUE GREEN 0.2 0.1 0 -0.1 -0.2 -0.3 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE Figure 9. Forward Voltage Shift vs Junction Temperature -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE Figure 8. Relative Light Output vs Junction Temperature 0.3 FORWARD VOLTAGE SHIFT - V 1 0.1 -90 5 BLUE GREEN 100 120 100 120 Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio) Intensity (mcd) at 20 mA Bin Min Max T 800 960 U 960 1150 V 1150 1380 W 1380 1660 X 1660 1990 Y 1990 2400 Z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 4 5040 6050 Tolerance for each bin limit is ± 15% Green Color Bin Table Bin Min Dom Max Dom 1 520.0 524.0 2 524.0 528.0 3 528.0 532.0 4 5 532.0 536.0 536.0 540.0 Xmin Ymin Xmax Ymax 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 Tolerance for each bin limit is ± 0.5 nm Blue Color Bin Table Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 2 464.0 468.0 3 468.0 472.0 4 472.0 476.0 5 476.0 480.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 Tolerance for each bin limit is ± 0.5 nm Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information. 6 Precautions: Lead Forming: x The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. x For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. x If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies’ AllnGaP high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260° C and the solder contact time does not exceeding 5 sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED configuration Soldering and Handling: x Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. x LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED. 1.59mm x ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. x Recommended soldering condition: Wave Soldering [1, 2] Manual Solder Dipping Pre-heat temperature 105° C Max. – Preheat time 60 sec Max – Peak temperature 260° C Max. 260° C Max. Dwell time 5 sec Max. 5 sec Max Note: 1. Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. x Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions. 7 CATHODE ANODE AlInGaP Device InGaN Device x Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. x At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. x If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. x Recommended PC board plated through holes (PTH) size for LED component leads. LED component lead size Diagonal Plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) x Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED. Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED 260°C Max TEMPERATURE (°C) Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) 105°C Max Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) 60 sec Max Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. TIME (sec) Ammopack Drawing 6.35 ± 1.30 0.250 ± 0.051 12.70 ± 1.00 0.500 ± 0.039 CATHODE 20.5 ± 1.00 0.8070 ± 0.0394 18.00 ± 0.50 0.7085 ± 0.0195 9.125 ± 0.625 0.3595 ± 0.0245 12.70 ± 0.30 0.500 ± 0.012 4.00 ± 0.20 TYP. 0.1575 ± 0.0075 0.70 ± 0.20 0.276 ± 0.0075 VIEW A - A Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff 8 Packaging Box for Ammopack Note: The dimension for ammo pack is applicable for the device with standoff and without standoff. Packaging Label: (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number STANDARD LABEL LS0002 RoHS Compliant e3 max temp 260C (1T) Lot: Lot Number (Q) QTY: Quantity LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (P) Customer Item: 9 (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin (ii) Avago Baby Label (Only available on bulk packaging) Lamps Baby Label (1P) PART #: Part Number RoHS Compliant e3 max temp 260C (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity C/O: Country of Origin Customer P/N: CAT: Intensity Bin Supplier Code: BIN: Refer to below information DATECODE: Date Code Acronyms and Definition: BIN: Example: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) (i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin “VB” only) (ii) Color bin incorporate with VF Bin OR (ii) Color bin incorporated with VF Bin BIN: 2VB VB: VF bin “VB” (Applicable for part number that have both color bin and VF bin) 2: Color bin 2 only DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. AV02-3682N - June 27, 2012