AIC1747 300mA Linear Regulator With Bypass Pin FEATURES DESCRIPTION AIC1747 is optimized for low ESR ceramic capacitor operation with 300mA continuous current. The AIC1747 is designed for portable RF and wireless applications with demanding performance and space requirements. Guarantee 300mA Output Current. Fast Response in Line/Load Transient Wide Operating Voltage Ranges: 2.0V to 5.5V. 0.01μA Shutdown Standby Current Low Quiescent Current：80µA. The AIC1747 offers high precision output voltage of ±2% tolerance. Output Voltage is available within 1.1~4.2V. There are version of 1.1, 1.2, 1.3, 1.5, 1.8, 2.5, 2.7, 2.8, 2.85, 3.0, 3.3, 3.5, 3.7, and 3.8 for a fixed output voltage. A noise bypass pin is available for further reduction of output noise. At 300mA load current, a 270mV dropout can be performed. The quality of low quiescent current and low dropout voltage makes the device ideal for battery power applications. The high ripple rejection and low noise of the AIC1747 provide enhanced performances for critical applications such as cellular phones, and PDAs. Output Voltage is available within 1.1~4.2V Low Dropout：270mV at 300mA PSRR：60dB at 1kHz. Active High Shutdown Control. Fixed: 1.1, 1.2, 1.3, 1.5, 1.8, 2.5, 2.7, 2.8, 2.85, 3.0, 3.3, 3.5, 3.7, 3.8 Output Voltage. Current Limit and Thermal Protection. Available in ±2% Output Tolerance. Available in 3 & 5 lead of SOT-23, TSOT23, SC70, & SOT-89 & DFN 6L 2x2 Package. APPLICATIONS In addition, a logic-level shutdown input is included, which reduce supply current to less than 0.01μA (typ.) in shutdown mode with fast turn-on & off time less than 50 μ s & 30 μ s. The AIC1747’s current limit and thermal protection provide protection against any overload condition that would cause excessive junction temperatures. Cellular Phones. PCMCIA Cards Laptop, Palmtops, Notebook Computers Personal Communication Equipment. PDAs. Digital Still Cameras. Portable Consumer Equipments. TYPICAL APPLICATION CIRCUIT VIN VIN VOUT CIN VOUT COUT 1µF 1µF GND BP EN CBP AIC1747 0.1nF Ultra LDO Regulator Analog Integrations Corporation Si-Soft Research Center DS-1747G-02 100808 3A1, No.1, Li-Hsin Rd. I , Science Park , Hsinchu 300, Taiwan , R.O.C. TEL: 886-3-5772500 FAX: 886-3-5772510 www.analog.com.tw 1 AIC1747 ORDERING INFORMATION 3 pin: AIC1747-XXXXX XX 3 PIN CONFIGURATION PACKING TYPE TR: TAPE & REEL BG: BAG PACKAGE TYPE U3: SOT-23 X3A: SOT-89 X3T: SOT-89 K3: TSOT23 J3: SC70 P: Lead Free Commercial G: Green Package (SC70 is only available on Green Package) SOT-23/TSOT23 TOP VIEW 1: GND 2: VOUT 3: VIN 1 2 SOT-89 (X3A) TOP VIEW 1: GND 2. VIN 3. VOUT 1 SOT-89 (X3T) TOP VIEW 1: VOUT 2. GND 3. VIN OUTPUT VOLTAGE 11: 1.1V 12: 1.2V SC70 13: 1.3V TOP VIEW 15: 1.5V 1: GND 18: 1.8V 2: VOUT 20: 2.0V 3: VIN 25: 2.5V 27: 2.7V 285: 2.85V 30: 3.0V 33: 3.3V 35: 3.5V 37: 3.7V 38: 3.8V (Of a unit of 0.1V within 1.1~4.2V, additional voltage versions are available on demand) Example: 3 2 1 3 2 3 3 1 2 AIC1747-18PX3ATR 1.8V Version, in SOT-89 Lead Free Package & Tape & Reel Packing Type 2 AIC1747 5 pin: AIC1747-XXXXX XX 5 PIN CONFIGURATION PACKING TYPE TR: TAPE & REEL BG: BAG PACKAGE TYPE V5 : SOT-23-5 V5N : SOT-23-5 X5 : SOT-89-5 K5 : TSOT23-5 K5N : TSOT23-5 J5 : SC70-5 DA : DFN 6L 2x2 P: Lead Free Commercial G: Green Package (SC-70 and DFN are only available on Green Package) OUTPUT VOLTAGE 11: 1.1V 12: 1.2V 13: 1.3V 15: 1.5V 18: 1.8V 20: 2.0V 25: 2.5V 27: 2.7V 285: 2.85V 30: 3.0V 33: 3.3V 35: 3.5V 37: 3.7V 38: 3.8V (Of a unit of 0.1V within 1.1~4.2V, additional voltage versions are available on demand) SOT-23-5/TSOT23-5(V5/K5) TOP VIEW 1: VIN 2: GND 3: EN 4: BP 5: VOUT SOT-23-5/TSOT23-5(V5N/K5N) TOP VIEW 1: VIN 2: GND 3: EN 4: NC 5: VOUT SOT89-5(X5) TOP VIEW 1: VIN 2: GND 3: EN 4: NC 5: VOUT DFN 6L 2x2 TOP VIEW 1: EN 2: GND 3: VIN 4: VOUT 5: NC 6.BP SC70-5 TOP VIEW 1: VIN 2: GND 3: EN 4: BP 5: VOUT Example: AIC1747-18PV5TR 1.8V Version, in SOT-23-5 Lead Free Package & Tape & Reel Packing Type 3 AIC1747 Marking Part No Package Type Marking Part No Package Type Marking AIC1747-xxGJ3 SC70-3 Axx AIC1747-285GJ3 SC70-3 A2J AIC1747-xxGJ5 SC70-5 Bxx AIC1747-285GJ5 SC70-5 B2J AIC1747-xxGDA DFN 6L 2x2 FAxxG AIC1747-285GDA DFN 6L 2x2 FA2JG AIC1747-xxPK3 TSOT-23 FCxxP AIC1747-285PK3 TSOT-23 FC2JP AIC1747-xxGK3 TSOT-23 FCxxG AIC1747-285GK3 TSOT-23 FC2JG AIC1747-xxPK5 TSOT-25 FDxxP AIC1747-285PK5 TSOT-25 FD2JP AIC1747-xxGK5 TSOT-25 FDxxG AIC1747-285GK5 TSOT-25 FD2JG AIC1747-xxPK5N TSOT-25 FZxxP AIC1747-285PK5N TSOT-25 FZ2JP AIC1747-xxGK5N TSOT-25 FZxxG AIC1747-285GK5N TSOT-25 FZ2JG AIC1747-xxPU3 SOT-23 FExxP AIC1747-285PU3 SOT-23 FE2JP AIC1747-xxGU3 SOT-23 FExxG AIC1747-285GU3 SOT-23 FE2JG AIC1747-xxPV5 SOT-25 FFxxP AIC1747-285PV5 SOT-25 FF2JP AIC1747-xxGV5 SOT-25 FFxxG AIC1747-285GV5 SOT-25 FF2JG AIC1747-xxPV5N SOT-25 FVxxP AIC1747-285PV5N SOT-25 FV2JP AIC1747-xxGV5N SOT-25 FVxxG AIC1747-285GV5N SOT-25 FV2JG AIC1747-xxPX3A SOT-89-3 FGxxP AIC1747-285PX3A SOT-89-3 FG2JP AIC1747-xxGX3A SOT-89-3 FGxxG AIC1747-285GX3A SOT-89-3 FG2JG AIC1747-xxPX3T SOT-89-3 FHxxP AIC1747-285PX3T SOT-89-3 FH2JP AIC1747-xxGX3T SOT-89-3 FHxxG AIC1747-285GX3T SOT-89-3 FH2JG AIC1747-xxPX5 SOT-89-5 FIxxP AIC1747-285PX5 SOT-89-5 FI2JP xx represents output voltage. (11=1.1V, 12=1.2V, ….…, 42=4.2V) 4 AIC1747 ABSOLUTE MAXIMUM RATINGS Input Voltage ........................................................................................................................................ 7V EN Pin Voltage ..................................................................................................................................... 7V Noise Bypass Terminal Voltage ........................................................................................................... 7V Power Dissipation, PD @ TA = 25ºC SOT23-5 ................................................................................................................................... 400mW TSOT23-5 ................................................................................................................................. 400mW SOT-89-5 .................................................................................................................................. 625mW SC70-5...................................................................................................................................... 300mW DFN 6L 2x2 .............................................................................................................................. 606mW Maximum Junction Temperature.................................................................................................... 150ºC Operating Temperature Range ............................................................................................. -40ºC~85ºC Storage Temperature Range .............................................................................................. -65ºC~150ºC Lead Temperature (Soldering, 10 sec) .......................................................................................... 260ºC Thermal Resistance - Junction to Case, Rθ JC SOT-23-5 ..............................................................................................................................115°C /W TSOT23-5 ..............................................................................................................................115°C /W SOT-89-5 .................................................................................................................................45°C /W DFN 6L 2x2 .............................................................................................................................30°C /W Thermal Resistance - Junction to Ambient, Rθ JA SOT-23-5 ...............................................................................................................................250°C /W TSOT23-5 ..............................................................................................................................250°C /W SOT-89-5 ...............................................................................................................................160°C /W SC70-5...................................................................................................................................333°C /W DFN 6L 2x2 ...........................................................................................................................165°C /W (Assume no ambient airflow, no heatsink) Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. TEST CIRCUIT Refer to the TYPICAL APPLICATION CIRCUIT. 5 AIC1747 ELECTRICAL CHARACTERISTICS (CIN = Cout = 1µF, CBP = 0.1nF, VIN = VOUT + 1V, TJ=25°C, unless otherwise specified) (Note 1) PARAMETER TEST CONDITIONS Input Voltage (Note 2) Output Voltage Tolerance VIN=5.5V, IOUT = 1mA Continuous Output Current SYMBOL MIN. VIN TYP. MAX. UNIT 2.0 5.5 V VOUT -2 2 % IOUT 300 mA µA Quiescent Current VEN ≧1.2V, IOUT = 0 mA IQ 80 GND Pin Current IOUT = 300mA IGND 80 Standby Current VEN= 0 ISTBY 0.01 0.5 µA Output Current Limit VIN=5V, RLOAD = 1Ω IIL 450 600 mA 750 1000 450 670 270 440 330 IOUT = 300 mA, VOUT=1.2V Dropout Voltage IOUT = 300 mA, VOUT=1.8V VDROP IOUT = 300 mA, VOUT=3.3V 110 µA mV Line Regulation VIN = VOUT + 1V to 5.5V ∆VLIR 3 10 mV Load Regulation IOUT = 1mA to 300mA ∆VLOR 5 20 mV f=1KHz, Ripple=0.5Vp-p, PSRR -60 Ripple Rejection f=10KHz, Ripple=0.5Vp-p, Temperature Coefficient Thermal Shutdown Temperature VIN = VOUT + 1V Thermal Shutdown Hysteresis dB -55 TC 50 ppm/℃ TSD 150 ℃ ∆TSD 20 ℃ Shutdown Pin SPECIFICATIONS Shutdown Pin Current VEN = VIN or GND IEN 0 Shutdown Exit Delay Time IOUT = 30mA ∆t 50 Max Output Discharge Resistance to GND during Shutdown RDSON_ CLMP VENH Output OFF, VIN = 2.2V to 5.5V VENL Ω µS 30 Output ON, VIN = 2.2V to 5.5V nA µS 700 Shutdown Time Shutdown Input Threshold 100 1.2 0.4 V Note 1. Specifications are production tested at T =25°C. Specifications over the -40°C to 85°C operating A temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC). Note 2. Vin(min) is the higher value of Vout + Dropout Voltage or 2.0V. 6 AIC1747 TYPICAL PERFORMANCE CHARACTERISTICS Fig. 1 Quiescent Current VS Input Voltage Fig. 2 Ground Current VS Loading Current 1.00 VIN = VOUT + 1V 0.75 Output Voltage (%) 0.50 0.25 0.00 VOUT = 3.3V -0.25 -0.50 VOUT = 1.8V VOUT = 1.2V -0.75 -1.00 -40 -20 0 20 40 60 80 o Temperature ( C) Fig. 3 Quiescent Current VS Temperature Fig.5 Dropout Voltage VS Loading Current (1.8V) Fig. 4 Output Voltage VS Temperature Fig.6 Dropout Voltage VS Loading Current (3.3V) 7 AIC1747 Fig. 7 Output Voltage VS Input Voltage (1.2V) Fig.9 Output Voltage VS Input Voltage (1.8V) Fig.11 Output Voltage VS Input Voltage (3.3V) Fig. 8 Output Voltage VS Loading Current (1.2V) Fig.10 Output Voltage VS Loading Current (1.8V) Fig.12 Output Voltage VS Loading Current (3.3V) 8 AIC1747 Iout=1mA to 300mA Vin Vin = 2.2V to 3.2V Iload = 100mA Vout Ripple Iout Vout Ripple Fig. 13 Load Transient Response (1.2V) Fig. 14 Line Transient Response (1.2V) Iout=1mA to 300mA Vin Vin = 2.8V to 3.8V Iload = 100mA Vout Ripple Iout Vout Ripple Fig. 15 Load Transient Response (1.8V) Fig. 16 Line Transient Response (1.8V) Iout=1mA to 300mA Vin Vin = 4.3V to 5.3V Iload = 100mA Vout Ripple Iout Vout Ripple Fig. 17 Load Transient Response (3.3V) Fig. 18 Line Transient Response (3.3V) 9 AIC1747 CBP=0 F Enable CBP=0.1n F Enable Vout Vout Fig. 19 Start-up Waveform Fig. 20 Start-up Waveform Enable Vout Fig. 21 Shutdown Waveform 10 AIC1747 BLOCK DIAGRAM PIN DESCRIPTION VIN - Power supply input pin. Bypass with a 1µF capacitor to GND GND - Ground. EN - Active High Shutdown Input. VOUT - Regulator Output pin. Sources up to 300 mA. BP - Bypass pin. It should be connected to external 0.1nF capacitor to GND to reduce output noise. 11 AIC1747 DETAILED DESCRIPTION OF TECHNICAL TERMS effects, it is a pulsed measurement with the input DROPOUT VOLTAGE (VDROP) The dropout voltage is defined as the difference between input voltage and output voltage at which point the regulator starts to fall out of regulation. Below this value, the output voltage will fall while the input voltage is reduced. It depends on the load current and junction temperature. The dropout voltage is specified at which the output voltage drops 100mV below the voltage set to VIN = VOUT + 1 V. The load regulation is specified under the output current step of 0.1mA to 300mA. CURRENT LIMIT (IIL) The AIC1747 includes a current limiting, which monitors and controls the maximum output current if the output is shorted to ground. This can protect the device from being damaged. value measured with 1V difference. THERMAL PROTECTION LINE REGULATION The thermal sensor protects the device when the Line regulation is the ability of the regulator to maintain a constant output voltage as the input voltage changes. The line regulation is specified as the input voltage is changed from VIN = VOUT + 1 V to 5.5 V and IOUT = 1mA. maintain a constant output voltage as the load To transistor and allowing the IC to cool. Thermal protection is designed to protect the device in the of fault conditions. For continuous operation do not exceed the absolute maximum Load regulation is the ability of the regulator to changes. signals, the shutdown logic, turning off the pass event LOAD REGULATION current junction temperature exceeds TJ= +150ºC. It minimize junction-temperature rating of TJ= 150ºC, or damage the device. temperature 12 AIC1747 APPLICATION INFORMATION INPUT-OUTPUT CAPACITORS Linear regulators require input and output capacitors to maintain stability. Input capacitor at 1µF with 1uF output capacitor is recommended. POWER DISSIPATION The AIC1747 obtains thermal-limiting circuitry, which is designed to protect the device against overload condition. For continuous load condition, maximum rating of junction temperature must not be exceeded. It is important to pay more attention in thermal resistance. It includes junction to case, junction to ambient. The maximum power dissipation of AIC1747 depends on the thermal resistance of its case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The rate of temperature rise is greatly affected by the mounting pad configuration on the PCB, the board material, and the ambient temperature. When the IC mounting with good thermal conductivity is used, the junction temperature will be low even when large power dissipation applies. The power dissipation across the device is P = IOUT (VIN-VOUT). The maximum power dissipation is: PMAX = (TJ-max - TA ) Rθ JA Where TJ-max is the maximum allowable junction temperature (150°C), and TA is the ambient temperature suitable in application. As a general rule, the lower temperature is, the better reliability of the device is. So the PCB mounting pad should provide maximum thermal conductivity to maintain low device temperature. GND pin performs a dual function for providing an electrical connection to ground and channeling heat away. Therefore, connecting the GND pin to ground with a large pad or ground plane would increase the power dissipation and reduce the device temperature. 13 AIC1747 PHYSICAL DIMENSIONS SOT-89 PACKAGE OUTLINE DRAWING D A C L H E D1 e e1 S Y M B O L B1 B SOT-89 MILLIMETERS MIN. MAX. A 1.40 1.60 B 0.44 0.56 B1 0.36 0.48 C 0.35 0.44 D 4.40 4.60 D1 1.50 1.83 E 2.29 2.60 e 1.50 BSC e1 3.00 BSC H 3.94 4.25 L 0.89 1.20 Note: 1. Refer to JEDEC TO-243AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 14 AIC1747 SOT-89- 5PIN PACKAGE OUTLINE DRAWING D A C L E H D1 e e1 S Y M B O L B SOT-89-5 MILLIMETERS MIN. MAX. A 1.40 1.60 B 0.36 0.56 C 0.35 0.44 D 4.40 4.60 D1 1.50 1.83 E 2.29 2.60 e 1.50 BSC e1 3.00 BSC H 3.94 4.25 L 0.80 1.20 Note: 1. Refer to JEDEC TO-243AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. 15 AIC1747 TSOT23 PACKAGE OUTLINE DRAWING D A A E E1 e e1 SEE VIEW B WITH PLATING c A A2 b BASE METAL A1 SECTION A-A L2 S Y M B O L GAUGE PLANE SEATING PLANE L1 VIEW B θ L Note : 1. Refer to JEDEC MO-193C. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. TSOT-23 MILLIMETERS MIN. MAX. A - 1.00 A1 0 0.10 A2 0.70 0.90 b 0.30 0.50 c 0.08 0.22 D 2.80 3.00 E 2.60 3.00 E1 1.50 1.70 e 0.95 BSC e1 1.90 BSC L 0.60 REF 0.25 BSC L2 θ 0.60 0.30 L1 0° 8° 16 AIC1747 TSOT23- 5PIN PACKAGE OUTLINE DRAWING A A E E1 D e e1 SEE VIEW B WITH PLATING c A A2 b SECTION A-A A1 BASE METAL 0.25 S Y M B O L L1 θ L MIN. MAX. - 1.00 A1 0 0.10 A2 0.70 0.90 b 0.30 0.50 c 0.08 0.22 D 2.80 3.00 E 2.60 3.00 E1 1.50 1.70 A GAUGE PLANE SEATING PLANE VIEW B TSOT-23-5 MILLIMETERS e 0.95 BSC e1 Note : 1. Refer to JEDEC MO-193AB. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. L 1.90 BSC L1 θ 0.60 0.30 0.60 REF 0° 8° 17 AIC1747 SOT-23 PACKAGE OUTLINE DRAWING D A A E E1 e e1 SEE VIEW B WITH PLATING c A A2 b BASE METAL 0.25 A1 SECTION A-A GAUGE PLANE SEATING PLANE L1 VIEW B θ L Note: 1. Refer to JEDEC MO-178. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. S Y M B O L SOT-23 MILLIMETERS MIN. MAX. A 0.95 1.45 A1 0.05 0.15 A2 0.90 1.30 b 0.30 0.50 c 0.08 0.22 D 2.80 3.00 E 2.60 3.00 E1 1.50 1.70 e 0.95 BSC e1 1.90 BSC L L1 θ 0.60 0.30 0.60 REF 0° 8° 18 AIC1747 SOT-23- 5PIN PACKAGE OUTLINE DRAWING A A E E1 D e e1 SEE VIEW B WITH PLATING c A A2 b SECTION A-A 0.25 A1 BASE METAL GAUGE PLANE SEATING PLANE L1 θ L VIEW B S Y M B O L MIN. MAX. A 0.95 1.45 A1 0.05 0.15 A2 0.90 1.30 b 0.30 0.50 c 0.08 0.22 D 2.80 3.00 E 2.60 3.00 E1 1.50 1.70 e 0.95 BSC e1 1.90 BSC L Note : 1. Refer to JEDEC MO-178AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. SOT-23-5 MILLIMETERS 0.30 L1 q 0.60 0.60 REF 0° 8° 19 AIC1747 SC70-3PIN PACKAGE OUTLINE DRAWING D A A E E1 e e1 SEE VIEW B WITH PLATING c A A2 b BASE METAL 0.15 A1 SECTION A-A L GAUGE PLANE SEATING PLANE L1 VIEW B Note: 1. Refer to JEDEC M O-203. 2. Dim ension "D" does not include m old flash, protrusions or gate burrs. M old flash, protrusion or gate burrs shall not exceed 6 m il per side. 3. Dim ension "E1" does not include inter-lead flash or protrusions. 4. Controlling dim ension is m illim eter, converted inch dim ensions are not necessarily exact. S Y M B O L A SC70-3L MILLIMETERS MIN. MAX. - 1.10 A1 0 0.10 A2 0.70 1.00 b 0.15 0.40 c 0.08 0.25 D 1.85 2.15 E 1.80 2.40 E1 1.10 1.40 e 0.65 BSC e1 1.30 BSC L L1 0.46 0.26 0.42 REF 20 AIC1747 SC70 - 5PIN PACKAGE OUTLINE DRAWING A A E E1 D e e1 SEE VIEW B WITH PLATING c A A2 b SECTION A-A A1 BASE METAL 0.15 S Y M B O L GAUGE PLANE SEATING PLANE A SC70-5L MILLIMETERS MIN. MAX. - 1.10 A1 0 0.10 A2 0.70 1.00 b 0.15 0.30 L1 c 0.08 0.25 VIEW B D 1.85 2.15 E 1.80 2.40 E1 1.10 1.40 L Note: 1. Refer to JEDEC MO-203AA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. 4. Controlling dimension is millimeter, converted inch dimensions are not necessarily exact. e 0.65 BSC e1 1.30 BSC L L1 0.46 0.26 0.42 REF 21 AIC1747 DFN 6L 2x2 PACKAGE OUTLINE DRAWING D2 D 6 E E2 L 4 3 1 e PIN#1 BOTTOM VIEW TOP VIEW A S Y M B O L A3 A DFN 6L-2x2x0.75-0.65mm MILLIMETERS MIN. 0.70 A3 b SEATING PLANE SIDE VIEW b 0.25 2.00 BSC 1.45 2.00 BSC 0.55 0.65 0.65 BSC e L 0.35 1.35 E E2 0.80 0.20 BSC D D2 MAX. 0.25 0.35 Note : 1. DIMENSION AND TOLERANCING CONFORM TO ASME Y14.5M-1994. 2.CONTROLLING DIMENSIONS：MILLIMETER，CONVERTED INCH DIMENSION ARE NOT NECESSARILY EXACT. 3.DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.10 AND 0.25 mm FROM TERMINAL TIP. 22