TM SPANSION Flash Memory Data Sheet September 2003 TM This document specifies SPANSION memory products that are now offered by both Advanced Micro Devices and Fujitsu. Although the document is marked with the name of the company that originally developed the specification, these products will be offered to customers of both AMD and Fujitsu. Continuity of Specifications There is no change to this datasheet as a result of offering the device as a SPANSION revisions will occur when appropriate, and changes will be noted in a revision summary. TM product. Future routine Continuity of Ordering Part Numbers AMD and Fujitsu continue to support existing part numbers beginning with "Am" and "MBM". To order these products, please use only the Ordering Part Numbers listed in this document. For More Information Please contact your local AMD or Fujitsu sales office for additional information about SPANSION solutions. TM memory FUJITSU SEMICONDUCTOR DATA SHEET DS05-20858-6E FLASH MEMORY CMOS 8M (1M × 8) BIT MBM29LV008TA-70/-90/MBM29LV008BA-70/-90 ■ GENERAL DESCRIPTION The MBM29LV008TA/BA are a 8M-bit, 3.0 V-only Flash memory organized as 1M bytes of 8 bits each. The MBM29LV008TA/BA are offered in a 40-pin TSOP(1) package. These devices are designed to be programmed in-system with the standard system 3.0 V VCC supply. 12.0 V VPP and 5.0 V VCC are not required for write or erase operations. The devices can also be reprogrammed in standard EPROM programmers. The standard MBM29LV008TA/BA offer access times 70 ns and 90 ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention the devices have separate chip enable (CE), write enable (WE), and output enable (OE) controls. (Continued) ■ PRODUCT LINE UP Part No. MBM29LV008TA/MBM29LV008BA VCC = 3.3 V +0.3 V –0.3 V -70 — VCC = 3.0 V +0.6 V –0.3 V — -90 Max Address Access Time (ns) 70 90 Max CE Access Time (ns) 70 90 Max OE Access Time (ns) 30 35 Ordering Part No. ■ PACKAGES 40-pin plastic TSOP (1) 40-pin plastic TSOP (1) Marking Side Marking Side (FPT-40P-M06) (FPT-40P-M07) MBM29LV008TA/BA-70/90 (Continued) The MBM29LV008TA/BA are pin and command set compatible with JEDEC standard E2PROMs. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine which controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the devices is similar to reading from 5.0 V and 12.0 V Flash or EPROM devices. The MBM29LV008TA/BA are programmed by executing the program command sequence. This will invoke the Embedded Program Algorithm which is an internal algorithm that automatically times the program pulse widths and verifies proper cell margin. Typically, each sector can be programmed and verified in about 0.5 seconds. Erase is accomplished by executing the erase command sequence. This will invoke the Embedded Erase Algorithm which is an internal algorithm that automatically preprograms the array if it is not already programmed before executing the erase operation. During erase, the devices automatically time the erase pulse widths and verify proper cell margin. Any individual sector is typically erased and verified in 1.0 second. (If already completely preprogrammed.) The devices also feature a sector erase architecture. The sector mode allows each sector to be erased and reprogrammed without affecting other sectors. The MBM29LV008TA/BA are erased when shipped from the factory. The devices feature single 3.0 V power supply operation for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. A low VCC detector automatically inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ7, by the Toggle Bit feature on DQ6, or the RY/BY output pin. Once the end of a program or erase cycle has been completed, the devices internally reset to the read mode. Fujitsu’s Flash technology combines years of EPROM and E2PROM experience to produce the highest levels of quality, reliability, and cost effectiveness. The MBM29LV008TA/BA memories electrically erase the entire chip or all bits within a sector simultaneously via Fowler-Nordhiem tunneling. The bytes are programmed one byte at a time using the EPROM programming mechanism of hot electron injection. 2 MBM29LV008TA/BA-70/90 ■ FEATURES • Single 3.0 V read, program, and erase Minimizes system level power requirements • Compatible with JEDEC-standard commands Uses same software commands as E2PROMs • Compatible with JEDEC-standard world-wide pinouts 40-pin TSOP(1) (Package suffix: PTN – Normal Bend Type, PTR – Reversed Bend Type) • Minimum 100,000 program/erase cycles • High performance 70 ns maximum access time • Sector erase architecture One 16K byte, two 8K bytes, one 32K byte, and fifteen 64K bytes Any combination of sectors can be concurrently erased. Also supports full chip erase • Boot Code Sector Architecture T = Top sector B = Bottom sector • Embedded EraseTM Algorithms Automatically pre-programs and erases the chip or any sector • Embedded ProgramTM Algorithms Automatically writes and verifies data at specified address • Data Polling and Toggle Bit feature for detection of program or erase cycle completion • Ready/Busy output (RY/BY) Hardware method for detection of program or erase cycle completion • Automatic sleep mode When addresses remain stable, automatically switch themselves to low power mode • Low VCC write inhibit ≤ 2.5 V • Erase Suspend/Resume Suspends the erase operation to allow a read data in another sector within the same device • Sector protection Hardware method disables any combination of sectors from program or erase operations • Sector Protection Set function by Extended sector protection command • Temporary sector unprotection Temporary sector unprotection via the RESET pin Note : Embedded EraseTM and Embedded ProgramTM are trademarks of Advanced Micro Devices, Inc. 3 MBM29LV008TA/BA-70/90 ■ PIN ASSIGNMENTS TSOP (1) A16 A15 A14 A13 A12 A11 A9 A8 WE RESET N.C. RY/BY A18 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 (Marking Side) MBM29LV008TA/MBM29LV008BA Normal Bend 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 A17 VSS N.C. A19 A10 DQ7 DQ6 DQ5 DQ4 VCC VCC N.C. DQ3 DQ2 DQ1 DQ0 OE VSS CE A0 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 A0 CE VSS OE DQ0 DQ1 DQ2 DQ3 N.C. VCC VCC DQ4 DQ5 DQ6 DQ7 A10 A19 N.C. VSS A17 (FPT-40P-M06) A1 A2 A3 A4 A5 A6 A7 A18 RY/BY N.C. RESET WE A8 A9 A11 A12 A13 A14 A15 A16 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 (Marking Side) MBM29LV008TA/MBM29LV008BA Reverse Bend (FPT-40P-M07) 4 MBM29LV008TA/BA-70/90 ■ PIN DESCRIPTION Pin A19 to A0 DQ7 to DQ0 Function Address Inputs Data Inputs/Outputs CE Chip Enable OE Output Enable WE Write Enable RY/BY Ready/Busy Output RESET Hardware Reset Pin/Temporary Sector Unprotection N.C. No Internal Connection VSS Device Ground VCC Device Power Supply 5 MBM29LV008TA/BA-70/90 ■ BLOCK DIAGRAM DQ7 to DQ0 RY/BY Buffer RY/BY VCC VSS Erase Voltage Generator Input/Output Buffers WE State Control RESET Command Register Program Voltage Generator Chip Enable Output Enable Logic CE STB Data Latch OE STB Low VCC Detector Timer for Program/Erase Address Latch A19 to A0 ■ LOGIC SYMBOL 20 A19 to A0 8 DQ7 to DQ0 CE OE WE RESET 6 RY/BY Y-Decoder Y-Gating X-Decoder Cell Matrix MBM29LV008TA/BA-70/90 ■ DEVICE BUS OPERATION MBM29LV008TA/008BA User Bus Operations CE OE WE A0 A1 A6 A9 A10 Auto-Select Manufacturer Code*1 L L H L L L VID L Code H Auto-Select Device Code*1 L L H H L L VID L Code H Read*3 L L H A0 A1 A6 A9 A10 DOUT H Standby H X X X X X X X High-Z H Output Disable L H H X X X X X High-Z H Write (Program/Erase) L H L A0 A1 A6 A9 A10 DIN H Enable Sector Protection*2, *4 L VID L H L VID X X H Verify Sector Protection*2, *4 L L H L H L VID L Code H Temporary Sector Unprotection*5 X X X X X X X X X VID Reset (Hardware)/Standby X X X X X X X X High-Z L Operation Legend: L = VIL, H = VIH, X = VIL or VIH, DQ7 to DQ0 RESET = Pulse input. See “■ DC CHARACTERISTICS” for voltage levels. *1 : Manufacturer and device codes may also be accessed via a command register write sequence. See “MBM29LV008TA/008BA Standard Command Definitions”. *2 : Refer to “Sector Protection” in ■ FUNCTIONAL DESCRIPTION. *3 : WE can be VIL if OE is VIL, OE at VIH initiates the write operations. *4 : VCC = 3.3 V ± 10% *5 : It is also used for the extended sector protection. 7 MBM29LV008TA/BA-70/90 MBM29LV008TA/008BA Standard Command Definitions Command Sequence Bus First Bus Second Bus Third Bus Fourth Fifth Bus Sixth Bus Bus Read/Write Write Cycle Write Cycle Write Write Cycle Write Cycle Write Cycle Cycle Cycles Req’d Addr. Data Addr. Data Addr. Data Addr. Data Addr. Data Addr. Data Read/Reset 1 XXXh F0h — — — — — — — — — — Read/Reset 3 555h AAh 2AAh 55h 555h F0h RA* RD* — — — — Autoselect 3 555h AAh 2AAh 55h 555h 90h IA* ID* — — — — Program 4 555h AAh 2AAh 55h 555h A0h PA PD — — — — Chip Erase 6 555h AAh 2AAh 55h 555h 80h 555h AAh 2AAh 55h 555h 10h Sector Erase 6 555h AAh 2AAh 55h 555h 80h 555h AAh 2AAh 55h SA 30h Sector Erase Suspend Erase can be suspended during sector erase with Addr. (“H” or “L”). Data (B0h) Sector Erase Resume Erase can be resumed after suspend with Addr. (“H” or “L”). Data (30h) * : The fourth bus cycle is only for read. Notes: • Address bits A19 to A11 = X = “H” or “L” for all address commands except or Program Address (PA) and Sector Address (SA) • Bus operations are defined in “MBM29LV008TA/008BA User Bus Operations”. • RA = Address of the memory location to be read IA = Autoselect read address that sets A10, A6, A1, A0. PA = Address of the memory location to be programmed Addresses are latched on the falling edge of the write pulse. SA = Address of the sector to be erased. The combination of A19, A18, A17, A16, A15, A14, and A13 will uniquely select any sector. • RD = Data read from location RA during read operation. ID = Device code / manufacture code for the address located by IA. PD = Data to be programmed at location PA. Data is latched on the rising edge of write pulse. • Both Read/Reset commands are functionally equivalent, resetting the device to the read mode. • Command combinations not described in Standard Command Definitions table are illegal. 8 MBM29LV008TA/BA-70/90 MBM29LV008TA/BA Extended Command Definitions Bus Write Cycles Req'd Command Sequence First Bus Write Cycle Second Bus Write Cycle Third Bus Write Cycle Fourth Bus Read Cycle Addr. Data Addr. Data Addr. Data Addr. Data Set to Fast Mode 3 555h AAh 2AAh 55h 555h 20h — — Fast Program*1 2 XXXh A0h PA PD — — — — Reset from Fast Mode *1 2 XXXh 90h XXXh F0h*3 — — — — Extended Sector Protect *2 4 XXXh 60h SPA 60h SPA 40h SPA SD SPA: Sector address to be protected. Set sector address (SA) and (A10, A6, A1, A0) = (0, 0, 1, 0). SD: Sector protection verify data. Output “01h” at protected sector addresses and output “00h” at unprotected sector addresses. *1: This command is valid while Fast Mode. *2: This command is valid while RESET= VID. *3: The data "00h" is also acceptable. MBM29LV008TA/008BA Sector Protection Verify Autoselect Codes A19 to A13 A10 A6 A1 A0 Code (HEX) X VIL VIL VIL VIL 04h MBM29LV008TA X VIL VIL VIL VIH 3Eh MBM29LV008BA X VIL VIL VIL VIH 37h Sector Addresses VIL VIL VIH VIL 01h* Type Manufacture’s Code Device Code Sector Protection * : Outputs “01h” at protected sector addresses and outputs “00h” at unprotected sector addresses. Extended Autoselect Code Table Code DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0 04h 0 0 0 0 0 1 0 0 MBM29LV008TA 3Eh 0 0 1 1 1 1 1 0 MBM29LV008BA 37h 0 0 1 1 0 1 1 1 01h 0 0 0 0 0 0 0 1 Type Manufacture’s Code Device Code Sector Protection 9 MBM29LV008TA/BA-70/90 ■ FLEXIBLE SECTOR-ERASE ARCHITECTURE • One 16K byte, two 8K bytes, one 32K byte, and fifteen 64K bytes • Individual-sector, multiple-sector, or bulk-erase capability • Individual or multiple-sector protection is user definable. FFFFFh 16K byte FFFFFh 64K byte FC000h 8K byte F0000h 64K byte FA000h 8K byte E0000h 64K byte F8000h 32K byte D0000h 64K byte F0000h 64K byte C0000h 64K byte E0000h 64K byte B0000h 64K byte D0000h 64K byte A0000h 64K byte C0000h 64K byte 90000h 64K byte B0000h 64K byte 80000h 64K byte A0000h 64K byte 70000h 64K byte 90000h 64K byte 60000h 64K byte 80000h 64K byte 50000h 64K byte 70000h 64K byte 40000h 64K byte 60000h 64K byte 30000h 64K byte 50000h 64K byte 20000h 64K byte 40000h 64K byte 10000h 32K byte 30000h 64K byte 08000h 8K byte 20000h 64K byte 06000h 8K byte 10000h 64K byte 00000h MBM29LV008TA Sector Architecture 10 04000h 16K byte 00000h MBM29LV008BA Sector Architecture MBM29LV008TA/BA-70/90 Sector Address Tables (MBM29LV008TA) Sector Address A19 A18 A17 A16 A15 A14 A13 Address Range SA0 0 0 0 0 X X X 00000h to 0FFFFh SA1 0 0 0 1 X X X 10000h to 1FFFFh SA2 0 0 1 0 X X X 20000h to 2FFFFh SA3 0 0 1 1 X X X 30000h to 3FFFFh SA4 0 1 0 0 X X X 40000h to 4FFFFh SA5 0 1 0 1 X X X 50000h to 5FFFFh SA6 0 1 1 0 X X X 60000h to 6FFFFh SA7 0 1 1 1 X X X 70000h to 7FFFFh SA8 1 0 0 0 X X X 80000h to 8FFFFh SA9 1 0 0 1 X X X 90000h to 9FFFFh SA10 1 0 1 0 X X X A0000h to AFFFFh SA11 1 0 1 1 X X X B0000h to BFFFFh SA12 1 1 0 0 X X X C0000h to CFFFFh SA13 1 1 0 1 X X X D0000h to DFFFFh SA14 1 1 1 0 X X X E0000h to EFFFFh SA15 1 1 1 1 0 X X F0000h to F7FFFh SA16 1 1 1 1 1 0 0 F8000h to F9FFFh SA17 1 1 1 1 1 0 1 FA000h to FBFFFh SA18 1 1 1 1 1 1 X FC000h to FFFFFh 11 MBM29LV008TA/BA-70/90 Sector Address Tables (MBM29LV008BA) 12 Sector Address A19 A18 A17 A16 A15 A14 A13 Address Range SA0 0 0 0 0 0 0 X 00000h to 03FFFh SA1 0 0 0 0 0 1 0 04000h to 05FFFh SA2 0 0 0 0 0 1 1 06000h to 07FFFh SA3 0 0 0 0 1 X X 08000h to 0FFFFh SA4 0 0 0 1 X X X 10000h to 1FFFFh SA5 0 0 1 0 X X X 20000h to 2FFFFh SA6 0 0 1 1 X X X 30000h to 3FFFFh SA7 0 1 0 0 X X X 40000h to 4FFFFh SA8 0 1 0 1 X X X 50000h to 5FFFFh SA9 0 1 1 0 X X X 60000h to 6FFFFh SA10 0 1 1 1 X X X 70000h to 7FFFFh SA11 1 0 0 0 X X X 80000h to 8FFFFh SA12 1 0 0 1 X X X 90000h to 9FFFFh SA13 1 0 1 0 X X X A0000h to AFFFFh SA14 1 0 1 1 X X X B0000h to BFFFFh SA15 1 1 0 0 X X X C0000h to CFFFFh SA16 1 1 0 1 X X X D0000h to DFFFFh SA17 1 1 1 0 X X X E0000h to EFFFFh SA18 1 1 1 1 X X X F0000h to FFFFFh MBM29LV008TA/BA-70/90 ■ FUNCTIONAL DESCRIPTION Read Mode The MBM29LV008TA/BA have two control functions which must be satisfied in order to obtain data at the outputs. CE is the power control and should be used for a device selection. OE is the output control and should be used to gate data to the output pins if a device is selected. Address access time (tACC) is equal to the delay from stable addresses to valid output data. The chip enable access time (tCE) is the delay from stable addresses and stable CE to valid data at the output pins. The output enable access time is the delay from the falling edge of OE to valid data at the output pins. (Assuming the addresses have been stable for at least tACC-tOE time.) When reading out a data without changing addresses after power-up, it is necessary to input hardware reset or change CE pin from “H” or “L”. Standby Mode There are two ways to implement the standby mode on the MBM29LV008TA/BA devices, one using both the CE and RESET pins; the other via the RESET pin only. When using both pins, a CMOS standby mode is achieved with CE and RESET inputs both held at VCC ± 0.3 V. Under this condition the current consumed is less than 5 µA. The device can be read with standard access time (tCE) from either of these standby modes. During Embedded Algorithm operation, VCC active current (ICC2) is required even CE = “H”. When using the RESET pin only, a CMOS standby mode is achieved with RESET input held at VSS ± 0.3 V (CE = “H” or “L”). Under this condition the current is consumed is less than 5 µA. Once the RESET pin is taken high, the device requires tRH of wake up time before outputs are valid for read access. In the standby mode the outputs are in the high impedance state, independent of the OE input. Automatic Sleep Mode There is a function called automatic sleep mode to restrain power consumption during read-out of MBM29LV008TA/BA data. This mode can be used effectively with an application requested low power consumption such as handy terminals. To activate this mode, MBM29LV008TA/BA automatically switch themselves to low power mode when MBM29LV008TA/BA addresses remain stably during access fine of 150 ns. It is not necessary to control CE, WE, and OE on the mode. Under the mode, the current consumed is typically 1 µA (CMOS Level). Since the data are latched during this mode, the data are read-out continuously. If the addresses are changed, the mode is canceled automatically and MBM29LV008TA/BA read-out the data for changed addresses. Output Disable With the OE input at a logic high level (VIH), output from the devices are disabled. This will cause the output pins to be in a high impedance state. Autoselect The autoselect mode allows the reading out of a binary code from the devices and will identify its manufacturer and type. This mode is intended for use by programming equipment for the purpose of automatically matching the devices to be programmed with its corresponding programming algorithm. This mode is functional over the entire temperature range of the devices. To activate this mode, the programming equipment must force VID (11.5 V to 12.5 V) on address pin A9. Two identifier bytes may then be sequenced from the devices outputs by toggling address A0 from VIL to VIH. All addresses are DON’T CARES except A0, A1, A6, and A10. (See “MBM29LV008TA/008BA Sector Protection Verify Autoselect Codes” in ■ DEVICE BUS OPERATION.) 13 MBM29LV008TA/BA-70/90 The manufacturer and device codes may also be read via the command register, for instances when the MBM29LV008TA/BA are erased or programmed in a system without access to high voltage on the A9 pin. The command sequence is illustrated in “MBM29LV008TA/008BA Standard Command Definitions” in ■ DEVICE BUS OPERATION. (Refer to “Autoselect Command”.) Byte 0 (A0 = VIL) represents the manufacturer’s code (Fujitsu = 04h) and (A0 = VIH) represents the device identifier code (MBM29LV008TA = 3Eh and MBM29LV008BA = 37h). These two bytes/words are given in “MBM29LV008TA/008BA Sector Protection Verify Autoselect Codes” and “Expanded Autoselect Code Table” in ■ DEVICE BUS OPERATION. All identifiers for manufactures and device will exhibit odd parity with DQ7 defined as the parity bit. In order to read the proper device codes when executing the autoselect, A1 must be VIL. (See “MBM29LV008TA/008BA Sector Protection Verify Autoselect Codes” and “Expanded Autoselect Code Table” in ■ DEVICE BUS OPERATION.) Write Device erasure and programming are accomplished via the command register. The contents of the register serve as inputs to the internal state machine. The state machine outputs dictate the function of the device. The command register itself does not occupy any addressable memory location. The register is a latch used to store the commands, along with the address and data information needed to execute the command. The command register is written by bringing WE to VIL, while CE is at VIL and OE is at VIH. Addresses are latched on the falling edge of WE or CE, whichever happens later; while data is latched on the rising edge of WE or CE, whichever happens first. Standard microprocessor write timings are used. Refer to “AC Waveforms for Alternate WE Controlled Program Operations” and “AC Waveforms for Alternate CE Controlled Program Operations” in ■ TIMING DIAGRAM. Sector Protection The MBM29LV008TA/BA feature hardware sector protection. This feature will disable both program and erase operations in any number of sectors (0 through 18). The sector protection feature is enabled using programming equipment at the user’s site. The devices are shipped with all sectors unprotected. Alternatively, Fujitsu may program and protect sectors in the factory prior to shiping the device. To activate this mode, the programming equipment must force VID on address pin A9 and control pin OE, (suggest VID = 11.5 V), CE = VIL, and A6 = VIL. The sector addresses (A19, A18, A17, A16, A15, A14, and A13) should be set to the sector to be protected. “Sector Address Tables (MBM29LV008TA) ” and “Sector Address Tables (MBM29LV008BA) ” in ■ FLEXIBLE SECTOR-ERASE ARCHITECTURE define the sector address for each of the nineteen (19) individual sectors. Programming of the protection circuitry begins on the falling edge of the WE pulse and is terminated with the rising edge of the same. Sector addresses must be held constant during the WE pulse. See “ (10) AC Waveforms for Sector Protection Timing Diagram” in ■ TIMING DIAGRAM and “ (5) Sector Protection Algorithm” in ■ FLOW CHART for sector protection waveforms and algorithm. To verify programming of the protection circuitry, the programming equipment must force VID on address pin A9 with CE and OE at VIL and WE at VIH. Scanning the sector addresses (A19, A18, A17, A16, A15, A14, and A13) while (A10, A6, A1, A0) = (0, 0, 1, 0) will produce a logical “1” code at device output DQ0 for a protected sector. Otherwise the devices will read 00h for unprotected sector. In this mode, the lower order addresses, except for A0, A1, A6, and A10 are DON’T CARES. Address locations with A1 = VIL are reserved for Autoselect manufacturer and device codes. It is also possible to determine if a sector is protected in the system by writing an Autoselect command. Performing a read operation at the address location XX02h, where the higher order addresses (A19, A18, A17, A16, A15, A14, and A13) are the desired sector address will produce a logical “1” at DQ0 for a protected sector. See “MBM29LV008TA/008BA Sector Protection Verify Autoselect Codes” and “Expanded Autoselect Code Table” in ■ DEVICE BUS OPERATION for Autoselect codes. 14 MBM29LV008TA/BA-70/90 Temporary Sector Unprotection This feature allows temporary unprotection of previously protected sectors of the MBM29LV008TA/BA devices in order to change data. The Sector Unprotection mode is activated by setting the RESET pin to high voltage (12 V). During this mode, formerly protected sectors can be programmed or erased by selecting the sector addresses. Once the 12 V is taken away from the RESET pin, all the previously protected sectors will be protected again. See “ (11) Temporary Sector Unprotection Timing Diagram” in ■ TIMING DIAGRAM and “ (6) Temporary Sector Unprotection Algorithm” in ■ FLOW CHART. Command Definitions Device operations are selected by writing specific address and data sequences into the command register. Writing incorrect address and data values or writing them in the improper sequence will reset the devices to the read mode. “MBM29LV008TA/008BA Standard Command Definitions” in ■ DEVICE BUS OPERATION defines the valid register command sequences. Note that the Erase Suspend (B0h) and Erase Resume (30h) commands are valid only while the Sector Erase operation is in progress. Moreover both Read/Reset commands are functionally equivalent, resetting the device to the read mode. Read/Reset Command In order to return from Autoselect mode or Exceeded Timing Limits (DQ5 = 1) to read/reset mode, the read/reset operation is initiated by writing the Read/Reset command sequence into the command register. Microprocessor read cycles retrieve array data from the memory. The devices remain enabled for reads until the command register contents are altered. The devices will automatically power-up in the read/reset state. In this case, a command sequence is not required to read data. Standard microprocessor read cycles will retrieve array data. This default value ensures that no spurious alteration of the memory content occurs during the power transition. Refer to the AC Read Characteristics and Waveforms for the specific timing parameters. Autoselect Command Flash memories are intended for use in applications where the local CPU alters memory contents. As such, manufacture and device codes must be accessible while the devices reside in the target system. PROM programmers typically access the signature codes by raising A9 to a high voltage. However, multiplexing high voltage onto the address lines is not generally desired system design practice. The device contains an Autoselect command operation to supplement traditional PROM programming methodology. The operation is initiated by writing the Autoselect command sequence into the command register. Following the command write, a read cycle from address XX00h retrieves the manufacture code of 04h. A read cycle from address XX01h returns the device code (MBM29LV008TA = 3Eh and MBM29LV008BA = 37h). (See “MBM29LV008TA/008BA Sector Protection Verify Autoselect Codes” and “Expanded Autoselect Code Table” in ■ DEVICE BUS OPERATION.) All manufacturer and device codes will exhibit odd parity with DQ7 defined as the parity bit. Sector state (protection or unprotection) will be informed by address XX02h. Scanning the sector addresses (A19, A18, A17, A16, A15, A14, and A13) while (A10, A6, A1, A0) = (0, 0, 1, 0) will produce a logical “1” at device output DQ0 for a protected sector. The programming verification should be perform margin mode on the protected sector. (See “MBM29LV008TA/008BA Sector Protection Verify Autoselect Codes” and “Expanded Autoselect Code Table” in ■ DEVICE BUS OPERATION.) To terminate the operation, it is necessary to write the Read/Reset command sequence into the register, and also to write the Autoselect command during the operation, execute it after writing Read/Reset command sequence. 15 MBM29LV008TA/BA-70/90 Byte Programming The devices are programmed on a byte-by-byte basis. Programming is a four bus cycle operation. There are two “unlock” write cycles. These are followed by the program set-up command and data write cycles. Addresses are latched on the falling edge of CE or WE, whichever happens later and the data is latched on the rising edge of CE or WE, whichever happens first. The rising edge of CE or WE (whichever happens first) begins programming. Upon executing the Embedded Program Algorithm command sequence, the system is not required to provide further controls or timings. The device will automatically provide adequate internally generated program pulses and verify the programmed cell margin. The automatic programming operation is completed when the data on DQ7 is equivalent to data written to this bit at which time the devices return to the read mode and addresses are no longer latched. (See “Hardware Sequence Flags”.) Therefore, the devices require that a valid address to the devices be supplied by the system at this particular instance of time. Hence, Data Polling must be performed at the memory location which is being programmed. Any commands written to the chip during this period will be ignored. If hardware reset occurs during the programming operation, it is impossible to guarantee the data are being written. Programming is allowed in any sequence and across sector boundaries. Beware that a data “0” cannot be programmed back to a “1”. Attempting to do so may either hang up the device or result in an apparent success according to the data polling algorithm but a read from read/reset mode will show that the data is still “0”. Only erase operations can convert “0”s to “1”s. “ (1) Embedded ProgramTM Algorithm” in ■ FLOW CHART illustrates the Embedded ProgramTM Algorithm using typical command strings and bus operations. Chip Erase Chip erase is a six bus cycle operation. There are two “unlock” write cycles. These are followed by writing the “set-up” command. Two more “unlock” write cycles are then followed by the chip erase command. Chip erase does not require the user to program the device prior to erase. Upon executing the Embedded Erase Algorithm command sequence the devices will automatically program and verify the entire memory for an all zero data pattern prior to electrical erase (Preprogram function). The system is not required to provide any controls or timings during these operations. The automatic erase begins on the rising edge of the last write pulse in the command sequence and terminates when the data on DQ7 is “1” (See “Write Operation Status”.) at which time the device returns to read the mode. Chip Erase Time : Sector Erase Time × All sectors + Chip Program Time (Preprogramming) “ (2) Embedded EraseTM Algorithm” in ■ FLOW CHART illustrates the Embedded EraseTM Algorithm using typical command strings and bus operations. Sector Erase Sector erase is a six bus cycle operation. There are two “unlock” write cycles. These are followed by writing the “set-up” command. Two more “unlock” write cycles are then followed by the Sector Erase command. The sector address (any address location within the desired sector) is latched on the falling edge of write pulse, while the command (Data=30h) is latched on the rising edge of write pulse. After time-out of 50 µs from the rising edge of the last sector erase command, the sector erase operation will begin. Multiple sectors may be erased concurrently by writing the six bus cycle operations on “MBM29LV008TA/008BA Standard Command Definitions” in ■ DEVICE BUS OPERATION. This sequence is followed with writes of the Sector Erase command to addresses in other sectors desired to be concurrently erased. The time between writes must be less than 50 µs otherwise that command will not be accepted and erasure will start. It is recommended that processor interrupts be disabled during this time to guarantee this condition. The interrupts can be re-enabled after the last Sector Erase command is written. A time-out of 50 µs from the rising edge of the last write pulse will initiate the execution of the Sector Erase command(s). If another falling edge of the write 16 MBM29LV008TA/BA-70/90 pulse occurs within the 50 µs time-out window the timer is reset. (Monitor DQ3 to determine if the sector erase timer window is still open, see “DQ3 Sector Erase Timer”.) Any command other than Sector Erase or Erase Suspend during this time-out period will reset the devices to the read mode, ignoring the previous command string. Resetting the devices once execution has begun will corrupt the data in the sector. In that case, restart the erase on those sectors and allow them to complete. (Refer to “Write Operation Status” for Sector Erase Timer operation.) Loading the sector erase buffer may be done in any sequence and with any number of sectors (18 to 0). Sector erase does not require the user to program the devices prior to erase. The devices automatically program all memory locations in the sector(s) to be erased prior to electrical erase (Preprogram function). When erasing a sector or sectors the remaining unselected sectors are not affected. The system is not required to provide any controls or timings during these operations. The automatic sector erase begins after the 50 µs time out from the rising edge of the write pulse for the last sector erase command pulse and terminates when the data on DQ7 is “1” (see “Write Operation Status”) at which time the devices return to the read mode. Data polling must be performed at an address within any of the sectors being erased. Multiple Sector Erase Time : [Sector Erase Time + Sector Program Time (Preprogramming)] × Number of Sector Erase “ (2) Embedded EraseTM Algorithm” in ■ FLOW CHART illustrates the Embedded EraseTM Algorithm using typical command strings and bus operations. Erase Suspend The Erase Suspend command allows the user to interrupt a Sector Erase operation and then perform data reads from or programs to a sector not being erased. This command is applicable ONLY during the Sector Erase operation which includes the time-out period for sector erase. The Erase Suspend command will be ignored if written during the Chip Erase operation or Embedded Program Algorithm. Writting the Erase Suspend command during the Sector Erase time-out results in immediate termination of the time-out period and suspension of the erase operation. Writing the Erase Resume command resumes the erase operation. The addresses are DON’T CARES when writing the Erase Suspend or Erase Resume command. When the Erase Suspend command is written during the Sector Erase operation, the device will take a maximum of 20 µs to suspend the erase operation. When the devices have entered the erase-suspended mode, the RY/ BY output pin and the DQ7 bit will be at logic “1”, and DQ6 will stop toggling. The user must use the address of the erasing sector for reading DQ6 and DQ7 to determine if the erase operation has been suspended. Further writes of the Erase Suspend command are ignored. When the erase operation has been suspended, the devices default to the erase-suspend-read mode. Reading data in this mode is the same as reading from the standard read mode except that the data must be read from sectors that have not been erase-suspended. Successively reading from the erase-suspended sector while the device is in the erase-suspend-read mode will cause DQ2 to toggle. (See”DQ2 Toggle Bit II”.) After entering the erase-suspend-read mode, the user can program the device by writing the appropriate command sequence for Program. This program mode is known as the erase-suspend-program mode. Again, programming in this mode is the same as programming in the regular Program mode except that the data must be programmed to sectors that are not erase-suspended. Successively reading from the erase-suspended sector while the devices are in the erase-suspend-program mode will cause DQ2 to toggle. The end of the erasesuspended Program operation is detected by the RY/BY output pin, Data polling of DQ7, or by the Toggle Bit I (DQ6) which is the same as the regular Program operation. Note that DQ7 must be read from the Program address while DQ6 can be read from any address. To resume the operation of Sector Erase, the Resume command (30h) should be written. Any further writes of the Resume command at this point will be ignored. Another Erase Suspend command can be written after the chip has resumed erasing. 17 MBM29LV008TA/BA-70/90 Extended Command (1) Fast Mode MBM29LV008TA/BA has Fast Mode function. This mode dispenses with the initial two unclock cycles required in the standard program command sequence by writing Fast Mode command into the command register. In this mode, the required bus cycle for programming is two cycles instead of four bus cycles in standard program command. (Do not write erase command in this mode.) The read operation is also executed after exiting this mode. To exit this mode, it is necessary to write Fast Mode Reset command into the command register. (Refer to “ (8) Embedded ProgramTM Algorithm for Fast Mode” in ■ FLOW CHART.) The VCC active current is required even CE = VIH during Fast Mode. (2) Fast Programming During Fast Mode, the programming can be executed with two bus cycles operation. The Embedded Program Algorithm is executed by writing program set-up command (A0h) and data write cycles (PA/PD). (Refer to to “ (8) Embedded ProgramTM Algorithm for Fast Mode” in ■ FLOW CHART.) (3) Extended Sector Protection In addition to normal sector protection, the MBM29LV008TA/BA has Extended Sector Protection as extended function. This function enable to protect sector by forcing VID on RESET pin and write a commnad sequence. Unlike conventional procedure, it is not necessary to force VID and control timing for control pins. The only RESET pin requires VID for sector protection in this mode. The extended sector protect requires VID on RESET pin. With this condition, the operation is initiated by writing the set-up command (60h) into the command register. Then, the sector addresses pins (A19, A18, A17, A16, A15, A14, and A13) and (A10, A6, A1, A0) = (0, 0, 1, 0) should be set to the sector to be protected (recommend to set VIL for the other addresses pins), and write extended sector protect command (60h). A sector is typically protected in 150 µs. To verify programming of the protection circuitry, the sector addresses pins (A19, A18, A17, A16, A15, A14, and A13) and (A10, A6, A1, A0) = (0, 0, 1, 0) should be set and write a command (40h). Following the command write, a logical “1” at device output DQ0 will produce for protected sector in the read operation. If the output data is logical “0”, please repeat to write extended sector protect command (60h) again. To terminate the operation, it is necessary to set RESET pin to VIH. Write Operation Status Hardware Sequence Flags Status Embedded Program Algorithm Embedded Erase Algorithm In Progress Erase Suspend Read (Erase Suspended Sector) Erase Erase Suspend Read Suspended (Non-Erase Suspended Sector) Mode Erase Suspend Program (Non-Erase Suspended Sector) DQ7 DQ6 DQ5 DQ3 DQ2 DQ7 Toggle 0 0 1 0 Toggle 0 1 Toggle 1 1 0 0 Toggle Data Data Data Data Data DQ7 Toggle* 1 0 0 1*2 Embedded Program Algorithm DQ7 Toggle 1 0 1 Embedded Erase Algorithm Exceeded Time Limits Erase Erase Suspend Program Suspended (Non-Erase Suspended Sector) Mode 0 Toggle 1 1 N/A DQ7 Toggle 1 0 N/A *1 : Performing successive read operations from any address will cause DQ6 to toggle. *2 : Reading the byte address being programmed while in the erase-suspend program mode will indicate logic “1” at the DQ2 bit. However, successive reads from the erase-suspended sector will cause DQ2 to toggle. Notes : • DQ0 and DQ1 are reserve pins for future use. • DQ4 is Fujitsu internal use only. 18 MBM29LV008TA/BA-70/90 DQ7 Data Polling The MBM29LV008TA/BA devices feature Data Polling as a method to indicate to the host that the Embedded Algorithms are in progress or completed. During the Embedded Program Algorithm an attempt to read the devices will produce the complement of the data last written to DQ7. Upon completion of the Embedded Program Algorithm, an attempt to read the device will produce the true data last written to DQ7. During the Embedded Erase Algorithm, an attempt to read the device will produce a “0” at the DQ7 output. Upon completion of the Embedded Erase Algorithm an attempt to read the device will produce a “1” at the DQ7 output. The flowchart for Data Polling (DQ7) is shown in “ (3) Data Polling Algorithm” in ■ FLOW CHART. For chip erase and sector erase, the Data Polling is valid after the rising edge of the sixth write pulse in the six write pulse sequence. Data Polling must be performed at sector address within any of the sectors being erased and not a protected sector. Otherwise, the status may not be valid. Once the Embedded Algorithm operation is close to being completed, the MBM29LV008TA/BA data pins (DQ7) may change asynchronously while the output enable (OE) is asserted low. This means that the devices are driving status information on DQ7 at one instant of time and then that byte’s valid data at the next instant of time. Depending on when the system samples the DQ7 output, it may read the status or valid data. Even if the device has completed the Embedded Algorithm operation and DQ7 has a valid data, the data outputs on DQ6 to DQ0 may be still invalid. The valid data on DQ7 to DQ0 will be read on the successive read attempts. The Data Polling feature is only active during the Embedded Programming Algorithm, Embedded Erase Algorithm or sector erase time-out. (See “Hardware Sequence Flags”.) See “ (6) AC Waveforms for Data Polling during Embedded Algorithm Operations” in ■ TIMING DIAGRAM for the Data Polling timing specifications and diagrams. DQ6 Toggle Bit I The MBM29LV008TA/BA also feature the “Toggle Bit I” as a method to indicate to the host system that the Embedded Algorithms are in progress or completed. During an Embedded Program or Erase Algorithm cycle, successive attempts to read (OE toggling) data from the devices will result in DQ6 toggling between one and zero. Once the Embedded Program or Erase Algorithm cycle is completed, DQ6 will stop toggling and valid data will be read on the next successive attempts. During programming, the Toggle Bit I is valid after the rising edge of the fourth write pulse in the four write pulse sequence. For chip erase and sector erase, the Toggle Bit I is valid after the rising edge of the sixth write pulse in the six write pulse sequence. The Toggle Bit I is active during the sector time out. In programming, if the sector being written to is protected, the toggle bit will toggle for about 2 µs and then stop toggling without the data having changed. In erase, the devices will erase all the selected sectors except for the ones that are protected. If all selected sectors are protected, the chip will toggle the toggle bit for about 100 µs and then drop back into read mode, having changed none of the data. Either CE or OE toggling will cause the DQ6 to toggle. In addition, an Erase Suspend/Resume command will cause the DQ6 to toggle. See “ (7) AC Waveforms for Toggle Bit I during Embedded Algorithm Operations” in ■ TIMING DIAGRAM for the Toggle Bit I timing specifications and diagrams. 19 MBM29LV008TA/BA-70/90 DQ5 Exceeded Timing Limits DQ5 will indicate if the program or erase time has exceeded the specified limits (internal pulse count). Under these conditions DQ5 will produce a “1”. This is a failure condition which indicates that the program or erase cycle was not successfully completed. Data Polling DQ7, DQ6 is the only operating function of the devices under this condition. The CE circuit will partially power down the device under these conditions (to approximately 2 mA). The OE and WE pins will control the output disable functions as described in “MBM29LV008TA/008BA User Bus Operations” in ■ DEVICE BUS OPERATION. The DQ5 failure condition may also appear if a user tries to program a non blank location without erasing. In this case the devices lock out and never complete the Embedded Algorithm operation. Hence, the system never reads a valid data on DQ7 bit and DQ6 never stops toggling. Once the devices have exceeded timing limits, the DQ5 bit will indicate a “1.” Please note that this is not a device failure condition since the devices were incorrectly used. If this occurs, reset the device with command sequence. DQ3 Sector Erase Timer After the completion of the initial sector erase command sequence the sector erase time-out will begin. DQ3 will remain low until the time-out is complete. Data Polling and Toggle Bit are valid after the initial sector erase command sequence. If Data Polling or the Toggle Bit I indicates the device has been written with a valid erase command, DQ3 may be used to determine if the sector erase timer window is still open. If DQ3 is high (“1”) the internally controlled erase cycle has begun; attempts to write subsequent commands to the device will be ignored until the erase operation is completed as indicated by Data Polling or Toggle Bit I. If DQ3 is low (“0”), the device will accept additional sector erase commands. To insure the command has been accepted, the system software should check the status of DQ3 prior to and following each subsequent Sector Erase command. If DQ3 were high on the second status check, the command may not have been accepted. Refer to “Hardware Sequence Flags”. DQ2 Toggle Bit II This Toggle bit II, along with DQ6, can be used to determine whether the devices are in the Embedded Erase Algorithm or in Erase Suspend. Successive reads from the erasing sector will cause DQ2 to toggle during the Embedded Erase Algorithm. If the devices are in the erase-suspended-read mode, successive reads from the erase-suspended sector will cause DQ2 to toggle. When the devices are in the erase-suspended-program mode, successive reads from the byte address of the non-erase suspended sector will indicate a logic “1” at the DQ2 bit. DQ6 is different from DQ2 in that DQ6 toggles only when the standard program or Erase, or Erase Suspend Program operation is in progress. The behavior of these two status bits, along with that of DQ7, is summarized as follows: For example, DQ2 and DQ6 can be used together to determine if the erase-suspend-read mode is in progress. (DQ2 toggles while DQ6 does not.) See also “Hardware Sequence Flags” and “ (12) DQ2 vs.DQ6” in ■ TIMING DIAGRAM. 20 MBM29LV008TA/BA-70/90 Furthermore, DQ2 can also be used to determine which sector is being erased. When the device is in the erase mode, DQ2 toggles if this bit is read from an erasing sector. DQ7 DQ6 DQ2 DQ7 Toggle 1 Erase 0 Toggle Toggle Erase-Suspend Read (Erase-Suspended Sector) (Note 1) 1 1 Toggle DQ7 Toggle*1 1*2 Mode Program Erase-Suspend Program *1 : Performing successive read operations from any address will cause DQ6 to toggle. *2 : Reading the byte address being programmed while in the erase-suspend program mode will indicate logic “1” at the DQ2 bit. However, successive reads from the erase-suspended sector will cause DQ2 to toggle. RY/BY Ready/Busy The MBM29LV008TA/BA provide a RY/BY open-drain output pin as a way to indicate to the host system that the Embedded Algorithms are either in progress or has been completed. If the output is low, the devices are busy with either a program or erase operation. If the output is high, the devices are ready to accept any read/write or erase operation. When the RY/BY pin is low, the devices will not accept any additional program or erase commands with the exception of the Erase Suspend command. If the MBM29LV008TA/BA are placed in an Erase Suspend mode, the RY/BY output will be high, by means of connecting with a pull-up resister to VCC. During programming, the RY/BY pin is driven low after the rising edge of the fourth write pulse. During an erase operation, the RY/BY pin is driven low after the rising edge of the sixth write pulse. The RY/BY pin will indicate a busy condition during the RESET pulse. Refer to “ (8) RY/BY Timing Diagram during Program/Erase Operations” and “ (9) RESET, RY/BY Timing Diagram” in ■ TIMING DIAGRAM for a detailed timing diagram. The RY/BY pin is pulled high in standby mode. Since this is an open-drain output, RY/BY pins can be tied together in parallel with a pull-up resistor to VCC. RESET Hardware Reset The MBM29LV008TA/BA devices may be reset by driving the RESET pin to VIL. The RESET pin has a pulse requirement and has to be kept low (VIL) for at least 500 ns in order to properly reset the internal state machine. Any operation in the process of being executed will be terminated and the internal state machine will be reset to the read mode 20 µs after the RESET pin is driven low. Furthermore, once the RESET pin goes high, the devices require an additional tRH before it will allow read access. When the RESET pin is low, the devices will be in the standby mode for the duration of the pulse and all the data output pins will be tri-stated. If a hardware reset occurs during a program or erase operation, the data at that particular location will be corrupted. Please note that the RY/BY output signal should be ignored during the RESET pulse. See “ (9) RESET, RY/BY Timing Diagram” in ■ TIMING DIAGRAM for the timing diagram. Refer to Temporary Sector Unprotection for additional functionality. If hardware reset occurs during Embedded Erase Algorithm, there is a possibility that the erasing sector(s) cannot be used. 21 MBM29LV008TA/BA-70/90 Data Protection The MBM29LV008TA/BA are designed to offer protection against accidental erasure or programming caused by spurious system level signals that may exist during power transitions. During power up the devices automatically reset the internal state machine in the Read mode. Also, with its control register architecture, alteration of the memory contents only occurs after successful completion of specific multi-bus cycle command sequences. The devices also incorporate several features to prevent inadvertent write cycles resulting form VCC power-up and power-down transitions or system noise. Low VCC Write Inhibit To avoid initiation of a write cycle during VCC power-up and power-down, a write cycle is locked out for VCC less than 2.3 V (typically 2.4 V). If VCC < VLKO, the command register is disabled and all internal program/erase circuits are disabled. Under this condition the device will reset to the read mode. Subsequent writes will be ignored until the VCC level is greater than VLKO. It is the users responsibility to ensure that the control pins are logically correct to prevent unintentional writes when VCC is above 2.3 V. If Embedded Erase Algorithm is interrupted, there is possibility that the erasing sector(s) cannot be used. Write Pulse “Glitch” Protection Noise pulses of less than 3 ns (typical) on OE, CE, or WE will not initiate a write cycle. Logical Inhibit Writing is inhibited by holding any one of OE = VIL, CE = VIH, or WE = VIH. To initiate a write cycle CE and WE must be a logical zero while OE is a logical one. Power-Up Write Inhibit Power-up of the devices with WE = CE = VIL and OE = VIH will not accept commands on the rising edge of write pulse. The internal state machine is automatically reset to the read mode on power-up. 22 MBM29LV008TA/BA-70/90 ■ ABSOLUTE MAXIMUM RATINGS Parameter Symbol Unit Min Max Tstg −55 +125 °C TA −40 +85 °C VIN, VOUT −0.5 VCC + 0.5 V VCC −0.5 +5.5 V VIN −0.5 +13.0 V Storage Temperature Ambient Temperature with Power Applied Voltage with Respect to Ground All pins except A9, OE, and RESET *1,*2 Rating Power Supply Voltage *1,*3 2 A9, OE, and RESET * *1 : Voltage is defind on the basis of VSS = GND = 0 V. *2 : Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, input or I/O pins may undershoot VSS to –2.0 V for periods of up to 20 ns. Maximum DC voltage on output and I/O pins is VCC +0.5 V. During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods of up to 20 ns. *3 : Minimum DC input voltage on A9, OE and RESET pins is –0.5 V. During voltage transitions, A9, OE and RESET pins may undershoot VSS to –2.0 V for periods of up to 20 ns. Voltage difference between input and supply voltage (VIN – VCC) does not exceed +9.0 V. Maximum DC input voltage on A9, OE and RESET pins is +13.0 V which may overshoot to +14.0 V for periods of up to 20 ns. WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. ■ RECOMMENDED OPERATING CONDITIONS Parameter Ambient Temperature Power Supply Voltage* Conditions Symbol TA MBM29LV008TA/BA-70 MBM29LV008TA/BA-90 VCC Value Unit Min Max −40 +85 °C +3.0 +3.6 V +2.7 +3.6 V * : Voltage is defind on the basis of VSS = GND = 0 V. Note : Operating ranges define those limits between which the functionality of the devices are guaranteed. WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand. 23 MBM29LV008TA/BA-70/90 ■ MAXIMUM OVERSHOOT/MAXIMUM UNDETRSHOOT +0.6 V 20 ns 20 ns –0.5 V –2.0 V 20 ns Maximum Undershoot Waveform 20 ns V CC +2.0 V V CC +0.5 V +2.0 V 20 ns 20 ns Maximum Overshoot Waveform 1 20 ns +14.0 V +13.0 V V CC +0.5 V 20 ns 20 ns Note : This waveform is applied for A9, OE, and RESET. Maximum Overshoot Waveform 2 24 MBM29LV008TA/BA-70/90 ■ DC CHARACTERISTICS Value Parameter Symbol Test Conditions Unit Min Max Input Leakage Current ILI VIN = VSS to VCC, VCC = VCC Max –1.0 +1.0 µA Output Leakage Current ILO VOUT = VSS to VCC, VCC = VCC Max –1.0 +1.0 µA A9, OE, RESET Inputs Leakage Current ILIT VCC = VCC Max, A9, OE, RESET = 12.5 V — 35 µA CE = VIL, OE = VIH, f=10 MHz — 22 mA VCC Active Current *1 ICC1 CE = VIL, OE = VIH, f=5 MHz — 12 mA VCC Active Current *2 ICC2 CE = VIL, OE = VIH — 35 mA VCC Current (Standby) ICC3 VCC = VCC Max, CE = VCC ± 0.3 V, RESET = VCC ± 0.3 V — 5 µA VCC Current (Standby, Reset) ICC4 VCC = VCC Max, RESET = VSS ± 0.3 V — 5 µA VCC Current (Automatic Sleep Mode) *3 ICC5 VCC = VCC Max, CE = VSS ± 0.3 V, RESET = VCC ± 0.3 V VIN = VCC ± 0.3 V or VSS ± 0.3 V — 5 µA Input Low Level VIL — –0.5 0.6 V Input High Level VIH — 2.0 VCC + 0.3 V Voltage for Autoselect, Sector Protection,and Temporary Sector Unprotection (A9, OE, RESET)*4 VID — 11.5 12.5 V Output Low Voltage Level VOL IOL = 4.0 mA, VCC = VCC Min — 0.45 V VOH1 IOH = –2.0 mA, VCC = VCC Min 2.4 — V VOH2 IOH = –100 µA VCC – 0.4 — V 2.3 2.5 V Output High Voltage Level Low VCC Lock-Out Voltage VLKO — *1 : The ICC current listed includes both the DC operating current and the frequency dependent component. *2 : ICC active while Embedded Algorithm (program or erase) is in progress. *3 : Automatic sleep mode enables the low power mode when address remain stable for 150 ns. *4 : (VID – VCC) do not exceed 9 V. 25 MBM29LV008TA/BA-70/90 ■ AC CHARACTERISTICS • Read Only Operations Value Symbol Test Setup Parameter JEDEC Standard Read Cycle Time tAVAV tRC Address to Output Delay tAVQV Chip Enable to Output Delay -70* -90* Min Max Min Max — 70 90 ns tACC CE = VIL OE = VIL 70 90 ns tELQV tCE OE = VIL 70 90 ns Output Enable to Output Delay tGLQV tOE — 30 35 ns Chip Enable to Output High-Z tEHQZ tDF — 25 30 ns Output Enable to Output High-Z tGHQZ tDF — 25 30 ns Output Hold Time From Addresses, CE or OE, Whichever Occurs First tAXQX tOH — 0 0 ns — tREADY — 20 20 µs RESET Pin Low to Read Mode * : Test Conditions: Output Load: 1 TTL gate and 30 pF (MBM29LV008TA/BA-70) 1 TTL gate and 100 pF (MBM29LV008TA/BA-90) Input rise and fall times: 5 ns Input pulse levels: 0.0 V or 3.0 V Timing measurement reference level Input: 1.5 V Output:1.5 V 3.3 V Diode = 1N3064 or Equivalent 2.7 kΩ Device Under Test 6.2 kΩ CL Diode = 1N3064 or Equivalent Notes: CL = 30 pF including jig capacitance (MBM29LV008TA/BA-70) CL = 100 pF including jig capacitance (MBM29LV008TA/BA-90) Test Conditions 26 Unit MBM29LV008TA/BA-70/90 • Write/Erase/Program Operations MBM29LV008TA/BA Symbol Parameter JEDEC Standard -70 -90 Unit Min Typ Max Min Typ Max Write Cycle Time tAVAV tWC 70 90 ns Address Setup Time tAVWL tAS 0 0 ns Address Hold Time tWLAX tAH 45 45 ns Data Setup Time tDVWH tDS 35 45 ns Data Hold Time tWHDX tDH 0 0 ns Output Enable Setup Time — tOES 0 0 ns Output Enable Read Hold Time Toggle and Data Polling — tOEH 0 0 ns 10 10 ns Read Recover Time Before Write tGHWL tGHWL 0 0 ns Read Recover Time Before Write tGHEL tGHEL 0 0 ns CE Setup Time tELWL tCS 0 0 ns WE Setup Time tWLEL tWS 0 0 ns CE Hold Time tWHEH tCH 0 0 ns WE Hold Time tEHWH tWH 0 0 ns Write Pulse Width tWLWH tWP 35 45 ns CE Pulse Width tELEH tCP 35 45 ns Write Pulse Width High tWHWL tWPH 25 25 ns CE Pulse Width High tEHEL tCPH 25 25 ns Byte Programming Operation tWHWH1 tWHWH1 8 8 µs Sector Erase Operation*1 tWHWH2 tWHWH2 1 1 s — tVCS 50 50 µs Rise Time to V * — tVIDR 500 500 ns Voltage Transition Time*2 — tVLHT 4 4 µs VCC Setup Time ID 2 — tWPP 100 100 µs 2 OE Setup Time to WE Active* — tOESP 4 4 µs CE Setup Time to WE Active*2 — tCSP 4 4 µs Recover Time From RY/BY — tRB 0 0 ns RESET Pulse Width — tRP 500 500 ns RESET Hold Time Before Read — tRH 200 200 ns Program/Erase Valid to RY/BY Delay — tBUSY 90 90 ns Delay Time from Embedded Output Enable — tEOE 30 35 ns Write Pulse Width*2 *1 : This does not include the preprogramming time. *2 : This timing is for Sector Protection operation. 27 MBM29LV008TA/BA-70/90 ■ ERASE AND PROGRAMMING PERFORMANCE Limit Parameter Unit Comments Min Typ Max Sector Erase Time — 1 10 s Excludes programming time prior to erasure Byte Programming Time — 8 300 µs Excludes system-level overhead Chip Programming Time — 8.4 25 s Excludes system-level overhead 100,000 — — cycle Erase/Program Cycle — ■ TSOP(1) PIN CAPACITANCE Parameter Symbol Typ Max Unit Input Capacitance CIN VIN = 0 7 10 pF Output Capacitance COUT VOUT = 0 8 10 pF Control Pin Capacitance CIN2 VIN = 0 10 12 pF Note : Test conditions TA = +25°C, f = 1.0 MHz 28 Test Setup MBM29LV008TA/BA-70/90 ■ TIMING DIAGRAM • Key to Switching Waveforms WAVEFORM INPUTS OUTPUTS Must Be Steady Will Be Steady May Change from H to L Will Be Changing from H to L May Change from L to H Will Be Changing from L to H “H” or “L” Any Change Permitted Changing State Unknown Does Not Apply Center Line is HighImpedance “Off” State (1) AC Waveforms for Read Operations tRC Address Address Stable tACC CE tOE tDF OE tOEH WE tCE Outputs High-Z Output Valid High-Z 29 MBM29LV008TA/BA-70/90 (2) AC Waveforms for Hardware Reset/Read Operations tRC Address Address Stable tACC tRH RESET tOH Outputs 30 High-Z Output Valid MBM29LV008TA/BA-70/90 (3) AC Waveforms for Alternate WE Controlled Program Operations Data Polling 3rd Bus Cycle Address 555h tWC PA tAS PA tRC tAH CE tCH tCS tCE OE tGHWL tWP tWPH tOE tWHWH1 WE tOH tDS tDH Data A0h PD DQ 7 DOUT DOUT Notes : • PA is address of the memory location to be programmed. • PD is data to be programmed at byte address. • DQ7 is the output of the complement of the data written to the device. • DOUT is the output of the data written to the device. • Figure indicates last two bus cycles out of four bus cycle sequence. 31 MBM29LV008TA/BA-70/90 (4) AC Waveforms for Alternate CE Controlled Program Operations 3rd Bus Cycle Address Data Polling PA 555h tWC tAS PA tAH WE tWS tWH OE tGHEL tCP tCPH tWHWH1 CE tDS tDH Data A0h PD DQ 7 DOUT Notes : • PA is address of the memory location to be programmed. • PD is data to be programmed at byte address. • DQ7 is the output of the complement of the data written to the device. • DOUT is the output of the data written to the device. • Figure indicates last two bus cycles out of four bus cycle sequence. 32 MBM29LV008TA/BA-70/90 (5) AC Waveforms Chip/Sector Erase Operations Address 2AAh 555h tWC tAS 555h 555h 2AAh SA* tAH CE tCS tCH OE tGHWL tWP tWPH WE tDS AAh Data tDH 55h 80h AAh 55h 10h/ 30h tVCS VCC *: SA is the sector address for Sector Erase. Addresses = 555h (Word), AAAh (Byte) for Chip Erase. 33 MBM29LV008TA/BA-70/90 (6) AC Waveforms for Data Polling during Embedded Algorithm Operations CE tCH tOE tDF OE tOEH WE tCE * DQ7 Data High-Z DQ7 = Valid Data DQ7 tWHWH1 or 2 DQ6 to DQ0 Data DQ6 to DQ0 = Output Flag High-Z DQ6 to DQ0 Valid Data tEOE *: DQ7 = Valid Data (The device has completed the Embedded operation.) (7) AC Waveforms for Toggle Bit I during Embedded Algorithm Operations CE tOEH WE tOES OE * DQ 6 Data DQ 6 = Toggle DQ 6 = Stop Toggling DQ 6 = Toggle tOE *: DQ6 stops toggling. (The device has completed the Embedded operation.) 34 Valid MBM29LV008TA/BA-70/90 (8) RY/BY Timing Diagram during Program/Erase Operations CE The rising edge of the last WE signal WE Entire programming or erase operations RY/BY tBUSY (9) RESET, RY/BY Timing Diagram WE RESET tRP tRB RY/BY tREADY 35 MBM29LV008TA/BA-70/90 (10) AC Waveforms for Sector Protection Timing Diagram A19, A18, A17 A16, A15 A14, A13 SAX SAY A0 A1 A6 12 V 3V A9 tVLHT 12 V 3V OE tVLHT tVLHT tVLHT tWPP WE tOESP tCSP CE Data 01h tVCS VCC SAX : Sector Address for initial sector SAY : Sector Address for next sector 36 tOE MBM29LV008TA/BA-70/90 (11) Temporary Sector Unprotection Timing Diagram VCC tVIDR tVCS tVLHT VID 3V 3V RESET CE WE tVLHT tVLHT Program or Erase Command Sequence RY/BY Unprotection period (12) DQ2 vs. DQ6 Enter Embedded Erasing WE Erase Suspend Erase Enter Erase Suspend Program Erase Suspend Read Erase Suspend Program Erase Resume Erase Suspend Read Erase Erase Complete DQ6 DQ2* Toggle DQ2 and DQ6 with OE or CE * : DQ2 is read from the erase-suspended sector. 37 MBM29LV008TA/BA-70/90 (13) Extended Sector Protection Timing Diagram VCC tVCS RESET tVLHT tVIDR Address SPAX SPAX SPAY A0 A1 A6 CE OE TIME-OUT WE Data 60h 60h 40h 01h tOE SPAX : Sector Address to be protected SPAY : Next Sector Address to be protected TIME-OUT : Time-Out window = 150 µs (Min) 38 60h MBM29LV008TA/BA-70/90 ■ FLOW CHART (1) Embedded ProgramTM Algorithm EMBEDDED ALGORITHMS Start Write Program Command Sequence (See below) Data Polling Device Increment Address No Last Address ? Yes Programming Completed Program Command Sequence (Address/Command): 555h/AAh 2AAh/55h 555h/A0h Program Address/Program Data 39 MBM29LV008TA/BA-70/90 (2) Embedded EraseTM Algorithm EMBEDDED ALGORITHMS Start Write Erase Command Sequece (See below) Data Polling or Toggle Bit Successfully Completed Erasure Completed Chip Erase Command Sequence (Address/Command): Individual Sector/Multiple Sector Erase Command Sequence (Address/Command): 555h/AAh 555h/AAh 2AAh/55h 2AAh/55h 555h/80h 555h/80h 555h/AAh 555h/AAh 2AAh/55h 2AAh/55h 555h/10h Sector Address/30h Sector Address/30h Sector Address/30h 40 Additional sector erase commands are optional. MBM29LV008TA/BA-70/90 (3) Data Polling Algorithm Start Read (DQ7 to DQ0) Addr. = VA DQ7 = Data? VA = Address for programming = Any of the sector addresses within the sector being erased during sector erase or multiple erases operation. = Any of the sector addresses within the sector not being protected during sector erase or multiple sector erases operation. Yes No No DQ5 = 1? Yes Read (DQ7 to DQ0) Addr. = VA DQ 7 = Data? Yes No Fail Pass Note : DQ7 is rechecked even if DQ5 = “1” because DQ7 may change simultaneously with DQ5. 41 MBM29LV008TA/BA-70/90 (4) Toggle Bit Algorithm Start Read (DQ7 to DQ0) Addr. = “H” or “L” *1 Read (DQ7 to DQ0) Addr. = “H” or “L” DQ6 = Toggle ? No Yes No DQ5 = 1? Yes *1, *2 Read (DQ7 to DQ0) Addr. = “H” or “L” *1, *2 Read (DQ7 to DQ0) Addr. = “H” or “L” DQ6 = Toggle ? No Yes Program/Erase Operation Not Complete. Write Reset Command Program/Erase Operation Complete. *1 : Read toggle bit twice to determine whether it is toggling. *2 : Recheck toggle bit because it may stop toggling as DQ5 changes to “1”. 42 MBM29LV008TA/BA-70/90 (5) Sector Protection Algorithm Start Setup Sector Addr. (A19, A18, A17, A16, A15, A14, A13) PLSCNT = 1 OE = VID, A9 = VID, A6 = CE = VIL, RESET = VIH A0 = VIL, A1 = VIH Activate WE Pulse Time out 100 µs Increment PLSCNT WE = VIH, CE = OE = VIL (A9 should remain VID) Read from Sector (Addr. = SA, A0 = VIL, A1 = VIH, A6 = VIL)* No No PLSCNT = 25? Yes Remove VID from A9 Write Reset Command Data = 01h? Yes Yes Protect Another Sector? No Device Failed Remove VID from A9 Write Reset Command Sector Protection Completed 43 MBM29LV008TA/BA-70/90 (6) Temporary Sector Unprotection Algorithm Start RESET = VID*1 Perform Erase or Program Operations RESET = VIH Temporary Sector Unprotection Completed*2 *1 : All protected sectors are unprotected. *2 : All previously protected sectors are protected once again. 44 MBM29LV008TA/BA-70/90 (7) Extended Sector Protection Algorithm FAST MODE ALGORITHM Start RESET = VID Wait to 4 µs Device is Operating in Temporary Sector Unprotection Mode No Extended Sector Protection Entry? Yes To Setup Sector Protection Write XXXh/60h PLSCNT = 1 To Sector Protection Write SPA/60h (A0 = VIL, A1 = VIH, A6 = VIL) Time Out 150 µs Increment PLSCNT To Verify Sector Protection Write SPA/40h (A0 = VIL, A1 = VIH, A6 = VIL) Setup Next Sector Address Read from Sector Address (A0 = VIL, A1 = VIH, A6 = VIL) No No PLSCNT = 25? Yes Remove VID from RESET Write Reset Command Device Failed Data = 01h? Yes Protection Other Sector ? No Yes Remove VID from RESET Write Reset Command Sector Protection Completed 45 MBM29LV008TA/BA-70/90 (8) Embedded ProgramTM Algorithm for Fast Mode FAST MODE ALGORITHM Start 555h/AAh Set Fast Mode 2AAh/55h 555h/20h XXXh/A0h Program Address/Program Data Data Polling Device Verify Byte? No In Fast Program Yes Increment Address No Last Address ? Yes Programming Completed XXXh/90h Reset Fast Mode XXXh/F0h 46 MBM29LV008TA/BA-70/90 ■ ORDERING INFORMATION Part number MBM29LV008TA-70PTN MBM29LV008TA-90PTN MBM29LV008TA-70PTR MBM29LV008TA-90PTR MBM29LV008BA-70PTN MBM29LV008BA-90PTN MBM29LV008BA-70PTR MBM29LV008BA-90PTR MBM29LV008 T A Package Access Time 40-pin plastic TSOP (1) 70 (FPT-40P-M06) 90 (Normal bend) 40-pin plastic TSOP (1) 70 (FPT-40P-M07) 90 (Reverse bend) 40-pin plastic TSOP (1) 70 (FPT-40P-M06) 90 (Normal bend) 40-pin plastic TSOP (1) 70 (FPT-40P-M07) 90 (Reverse bend) -70 Sector Configuration Remarks Top sector Bottom sector PTN PACKAGE TYPE PTN = 40-Pin Thin Small Outline Package (TSOP) Normal Bend PTR = 40-Pin Thin Small Outline Package (TSOP) Reverse Bend SPEED OPTION See Product Selector Guide Device Revision BOOT CODE SECTOR ARCHITECTURE T = Top sector B = Bottom sector DEVICE NUMBER/DESCRIPTION MBM29LV008 8Mega-bit (1M × 8-Bit) CMOS Flash Memory 3.0 V-only Read, Program, and Erase 47 MBM29LV008TA/BA-70/90 ■ PACKAGE DIMENSIONS 40-pin plastic TSOP (1) (FPT-40P-M06) LEAD No. Note 1) * : Resin protrusion. (Each side : 0.15 (.006) Max) . Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. 1 40 Details of "A" part INDEX 0.25(.010) 0~8˚ 0.60±0.15 (.024±.006) 20 21 +0.03 0.17 –0.08 0.10±0.05(.004±.002) (Stand off) +.001 .007 –.003 20.00±0.20 (.787±.008) *18.40±0.20 (.724±.008) *10.00±0.20 (.394±.008) +0.10 +.004 1.10 –0.05 .043 –.002 (Mounting height) 0.50(.020) "A" 0.10(.004) 0.22±0.05 (.009±.002) C 2003 FUJITSU LIMITED F40007S-c-3-4 0.10(.004) M Dimensions in mm (inches) . Note : The values in parentheses are reference values. (Continued) 48 MBM29LV008TA/BA-70/90 (Continued) 40-pin plastic TSOP (1) (FPT-40P-M07) LEAD No. Note 1) * : Resin protrusion. (Each side : 0.15 (.006) Max) . Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. 1 40 Details of "A" part INDEX 0.60±0.15 (.024±.006) 0~8˚ 0.25(.010) 20 21 0.22±0.05 (.009±.002) 0.10(.004) 0.10±0.05(.004±.002) (Stand off) +0.03 0.17 –0.08 0.10(.004) +.001 .007 –.003 "A" *18.40±0.20 (.724±.008) M 0.50(.020) *10.00±0.20 (.394±.008) +0.10 +.004 1.10 –0.05 .043 –.002 (Mounting height) 20.00±0.20 (.787±.008) C 2003 FUJITSU LIMITED F40008S-c-3-4 Dimensions in mm (inches) . Note : The values in parentheses are reference values. 49 MBM29LV008TA/BA-70/90 FUJITSU LIMITED All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of Fujitsu semiconductor device; Fujitsu does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. Fujitsu assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of Fujitsu or any third party or does Fujitsu warrant non-infringement of any third-party’s intellectual property right or other right by using such information. Fujitsu assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that Fujitsu will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be required for export of those products from Japan. F0305 FUJITSU LIMITED Printed in Japan