LMV331-Q1 SINGLE, LMV393-Q1 DUAL SLOS468D – MAY 2005 – REVISED AUGUST 2011 www.ti.com GENERAL-PURPOSE LOW-VOLTAGE COMPARATORS Check for Samples: LMV331-Q1 SINGLE, LMV393-Q1 DUAL FEATURES 1 • • • LMV393...D PACKAGE (TOP VIEW) Qualified for Automotive Applications 2.7-V and 5-V Performance Low Supply Current – LMV331 . . . 60 μA Typ – LMV393 . . . 100 μA Typ Input Common-Mode Voltage Range Includes Ground Low Output Saturation Voltage . . . 200 mV Typ Open-Collector Output for Maximum Flexibility • • • 1OUT 1IN– 1IN+ GND 1 8 2 7 3 6 4 5 VCC+ 2OUT 2IN– 2IN+ LMV331...DBV PACKAGE (TOP VIEW) IN+ 1 GND 2 IN– 3 5 VCC+ 4 OUT DESCRIPTION/ORDERING INFORMATION The LMV393-Q1 device is a low-voltage (2.7 V to 5.5 V) version of the dual and quad comparators, LM393 and LM339, which operate from 5 V to 30 V. The LMV331-Q1 is the single-comparator version. The LMV331-Q1 and LMV393-Q1 are the most cost-effective solutions for applications where low-voltage operation, low power, space saving, and price are the primary specifications in circuit design for portable consumer products. These devices offer specifications that meet or exceed the familiar LM339 and LM393 devices at a fraction of the supply current. ORDERING INFORMATION (1) TA –40°C to 125°C (1) (2) (3) PACKAGE Single Dual (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (3) SOT23-5 – DBV Reel of 3000 LMV331QDBVRQ1 LADQ SOIC – D Reel of 2500 LMV393QDRQ1 V393Q1 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV: The actual top-side marking has one additional character that designates the wafer fab/assembly site. Figure 1. SYMBOL (EACH COMPARATOR) IN− − IN+ + OUT 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2011, Texas Instruments Incorporated LMV331-Q1 SINGLE, LMV393-Q1 DUAL SLOS468D – MAY 2005 – REVISED AUGUST 2011 www.ti.com Figure 2. SIMPLIFIED SCHEMATIC VCC+ Q6 Q7 M IN+ Q1 Q2 Q3 Q4 OUT Q5 IN− R1 R2 R3 GND 2 Copyright © 2005–2011, Texas Instruments Incorporated LMV331-Q1 SINGLE, LMV393-Q1 DUAL SLOS468D – MAY 2005 – REVISED AUGUST 2011 www.ti.com Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN (2) VCC+ Supply voltage VID Differential input voltage (3) VI Input voltage range (either input) 0 D (8-pin) package Package thermal impedance (4) θJA (5) Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) (5) UNIT 5.5 V ±5.5 V 5.5 V 97 D (14-pin) package 86 DBV package TJ MAX °C/W 206 –65 150 °C 150 °C Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values (except differential voltages and VCC+ specified for the measurement of IOS) are with respect to the network GND. Differential voltages are at IN+ with respect to IN–. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Selecting the maximum of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions VCC+ Supply voltage (single-supply operation) VOUT Output voltage TA Operating free-air temperature Copyright © 2005–2011, Texas Instruments Incorporated MIN MAX 2.7 5.5 –40 UNIT V VCC+ + 0.3 V 125 °C 3 LMV331-Q1 SINGLE, LMV393-Q1 DUAL SLOS468D – MAY 2005 – REVISED AUGUST 2011 www.ti.com Electrical Characteristics at specified free-air temperature, VCC+ = 2.7 V, GND = 0 V (unless otherwise noted) PARAMETER TEST CONDITIONS VIO Input offset voltage αVIO Average temperature coefficient of input offset voltage IIB Input bias current IIO Input offset current IO Output current (sinking) TA MIN 25°C MAX 1.7 7 –40°C to 125°C 5 25°C 10 –40°C to 125°C 25°C 5 VO ≤ 1.5 V 25°C 25°C Common-mode input voltage range VSAT Saturation voltage IO ≤ 1 mA 23 –0.1 to 2 25°C 200 Supply current LMV393 (both comparators) 25°C LMV339 (all four comparators) mV nA nA mA 1 25°C LMV331 50 0.003 –40°C to 125°C VICR 250 150 5 UNIT μV/°C 400 –40°C to 125°C Output leakage current ICC TYP μA V mV 40 100 70 140 140 200 μA Switching Characteristics TA = 25°C, VCC+ = 2.7 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted) PARAMETER tPHL Propagation delay, high- to low-level output switching tPLH Propagation delay, low- to high-level output switching 4 TEST CONDITIONS TYP Input overdrive = 10 mV 1000 Input overdrive = 100 mV 350 Input overdrive = 10 mV 500 Input overdrive = 100 mV 400 UNIT ns ns Copyright © 2005–2011, Texas Instruments Incorporated LMV331-Q1 SINGLE, LMV393-Q1 DUAL SLOS468D – MAY 2005 – REVISED AUGUST 2011 www.ti.com Electrical Characteristics at specified free-air temperature, VCC+ = 5 V, GND = 0 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA 25°C VIO Input offset voltage αVIO Average temperature coefficient of input offset voltage IIB Input bias current IIO Input offset current IO Output current (sinking) TYP MAX 1.7 7 –40°C to 125°C 9 25°C 5 25°C 25 –40°C to 125°C 2 –40°C to 125°C VO ≤ 1.5 V 25°C 10 Common-mode input voltage range 25°C AVD Large-signal differential voltage gain 25°C VSAT Saturation voltage 25°C IO ≤ 4 mA 84 Supply current –0.1 to 4.2 20 25°C –40°C to 125°C 25°C LMV393 (both comparators) 25°C –40°C to 125°C μA 400 mV 120 150 100 –40°C to 125°C LMV339 (all four comparators) nA V/mV 700 60 nA V 50 200 mV mA 1 –40°C to 125°C LMV331 50 0.003 –40°C to 125°C VICR 250 150 25°C UNIT μV/°C 400 25°C Output leakage current ICC MIN 200 250 170 μA 300 350 Switching Characteristics TA = 25°C, VCC+ = 5 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted) PARAMETER tPHL Propagation delay, high- to low-level output switching tPLH Propagation delay, low- to high-level output switching Copyright © 2005–2011, Texas Instruments Incorporated TEST CONDITIONS TYP Input overdrive = 10 mV 600 Input overdrive = 100 mV 200 Input overdrive = 10 mV 450 Input overdrive = 100 mV 300 UNIT ns ns 5 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LMV331QDBVRQ1 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LADQ LMV393QDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 V393Q1 LMV393QDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 V393Q1 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. 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Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 OTHER QUALIFIED VERSIONS OF LMV331-Q1, LMV393-Q1 : • Catalog: LMV331, LMV393 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device LMV331QDBVRQ1 Package Package Pins Type Drawing SPQ SOT-23 3000 DBV 5 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 179.0 8.4 Pack Materials-Page 1 3.2 B0 (mm) K0 (mm) P1 (mm) 3.2 1.4 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMV331QDBVRQ1 SOT-23 DBV 5 3000 203.0 203.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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