PHILIPS LPC2103FBD48 Single-chip 16-bit/32-bit microcontrollers; 8 kb/16 kb/32 kb flash with isp/iap, fast ports and 10-bit adc Datasheet

LPC2101/2102/2103
Single-chip 16-bit/32-bit microcontrollers; 8 kB/16 kB/32 kB
flash with ISP/IAP, fast ports and 10-bit ADC
Rev. 01 — 18 January 2006
Preliminary data sheet
1. General description
The LPC2101/2102/2103 microcontrollers are based on a 16-bit/32-bit ARM7TDMI-S
CPU with real-time emulation that combines the microcontroller with 8 kB, 16 kB or 32 kB
of embedded high-speed flash memory. A 128-bit wide memory interface and a unique
accelerator architecture enable 32-bit code execution at the maximum clock rate. For
critical performance in interrupt service routines and DSP algorithms, this increases
performance up to 30 % over Thumb mode. For critical code size applications, the
alternative 16-bit Thumb mode reduces code by more than 30 % with minimal
performance penalty.
Due to their tiny size and low power consumption, the LPC2101/2102/2103 are ideal for
applications where miniaturization is a key requirement. A blend of serial communications
interfaces ranging from multiple UARTs, SPI to SSP and two I2C-buses, combined with
on-chip SRAM of 2 kB/4 kB/8 kB, make these devices very well suited for communication
gateways and protocol converters. The superior performance also makes these devices
suitable for use as math coprocessors. Various 32-bit and 16-bit timers, an improved
10-bit ADC, PWM features through output match on all timers, and 32 fast GPIO lines with
up to nine edge or level sensitive external interrupt pins make these microcontrollers
particularly suitable for industrial control and medical systems.
2. Features
2.1 Key features
■ 16-bit/32-bit ARM7TDMI-S microcontroller in a tiny LQFP48 package.
■ 2 kB/4 kB/8 kB of on-chip static RAM and 8 kB/16 kB/32 kB of on-chip flash program
memory. 128-bit wide interface/accelerator enables high-speed 70 MHz operation.
■ ISP/IAP via on-chip bootloader software. Single flash sector or full chip erase in
100 ms and programming of 256 bytes in 1 ms.
■ EmbeddedICE RT offers real-time debugging with the on-chip RealMonitor software.
■ The 10-bit A/D converter provides eight analog inputs, with conversion times as low as
2.44 µs per channel and dedicated result registers to minimize interrupt overhead.
■ Two 32-bit timers/external event counters with combined seven capture and seven
compare channels.
■ Two 16-bit timers/external event counters with combined three capture and seven
compare channels.
■ Low power Real-Time Clock (RTC) with independent power and dedicated 32 kHz
clock input.
■ Multiple serial interfaces including two UARTs (16C550), two Fast I2C-buses
(400 kbit/s), SPI and SSP with buffering and variable data length capabilities.
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
■
■
■
■
■
■
■
■
Vectored interrupt controller with configurable priorities and vector addresses.
Up to thirty-two 5 V tolerant fast general purpose I/O pins.
Up to 13 edge or level sensitive external interrupt pins available.
70 MHz maximum CPU clock available from programmable on-chip PLL with a
possible input frequency of 10 MHz to 25 MHz and a settling time of 100 µs.
On-chip integrated oscillator operates with an external crystal in the range from 1 MHz
to 25 MHz.
Power saving modes include Idle mode, Power-down mode with RTC active, and
Power-down mode.
Individual enable/disable of peripheral functions as well as peripheral clock scaling for
additional power optimization.
Processor wake-up from Power-down mode via external interrupt or RTC.
3. Ordering information
Table 1:
Ordering information
Type number
Package
Name
Description
Version
LPC2101FBD48
LQFP48
plastic low profile quad flat package; 48 leads;
body 7 × 7 × 1.4 mm
SOT313-2
LPC2102FBD48
LQFP48
plastic low profile quad flat package; 48 leads;
body 7 × 7 × 1.4 mm
SOT313-2
LPC2103FBD48
LQFP48
plastic low profile quad flat package; 48 leads;
body 7 × 7 × 1.4 mm
SOT313-2
LPC2103FA44
PLCC44
plastic leaded chip carrier; 44 leads
SOT187-2
3.1 Ordering options
Table 2:
Ordering options
Type number
Flash
memory
RAM
ADC
Temperature
range (°C)
LPC2101FBD48
8 kB
2 kB
8 inputs
−40 to +85
LPC2102FBD48
16 kB
4 kB
8 inputs
−40 to +85
LPC2103FBD48
32 kB
8 kB
8 inputs
−40 to +85
LPC2103FA44
32 kB
8 kB
8 inputs
−40 to +85
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
2 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
4. Block diagram
TMS
TRST
LPC2101/2102/2103
P0[31:0]
HIGH SPEED
GENERAL
PURPOSE I/O
8 kB
BOOT ROM
TDI
TCK
XTAL2 VDD(3V3) VDD(1V8)
XTAL1
TDO
RST
VSS
TEST/DEBUG
INTERFACE
PLL
ARM7TDMI-S
AHB BRIDGE
system
clock
ARM7 local bus
SYSTEM
FUNCTIONS
VECTORED
INTERRUPT
CONTROLLER
AMBA AHB
(Advanced High-performance Bus)
INTERNAL
SRAM
CONTROLLER
MEMORY
ACCELERATOR
2 kB/4 kB/
8 kB SRAM
8 kB/16 kB/
32 kB FLASH
AHB TO APB
BRIDGE
APB (ARM
peripheral bus)
EINT2 to
EINT0(1)
3 × CAP0(1)
4 × CAP1(1)
3 × CAP2(1)
3 × MAT0(1)
4 × MAT1(1)
3 × MAT2(1)
4 × MAT3(1)
EXTERNAL
INTERRUPTS
I2C-BUS SERIAL
INTERFACES 0 AND 1
CAPTURE/COMPARE
EXTERNAL COUNTER
TIMER 0/TIMER 1/
TIMER 2/TIMER 3
SPI AND SSP
SERIAL INTERFACES
SDA0, SDA1(1)
SCK0, SCK1(1)
MOSI0, MOSI1(1)
MISO0, MISO1(1)
SSEL0, SSEL1(1)
TXD0, TXD1(1)
AD0[7:0]
P0[31:0]
SCL0, SCL1(1)
ADC
UART0/UART1
GENERAL
PURPOSE I/O
REAL-TIME CLOCK
WATCHDOG
TIMER
SYSTEM CONTROL
RXD0, RXD1(1)
DSR1, CTS1,
RTS1, DTR1
DCD1, RI1
RTXC1
RTXC2
VBAT
002aab814
(1) Pins shared with GPIO.
Fig 1. Block diagram
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
3 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
5. Pinning information
37 P0.12/DSR1/MAT1.0/AD0.5
38 P0.25/AD0.6
39 P0.26/AD0.7
40 VDD(3V3)
41 P0.13/DTR1/MAT1.1
42 VDDA
43 VSS
44 P0.14/DCD1/SCK1/EINT1
45 P0.15/RI1/EINT2
46 P0.16/EINT0/MAT0.2
47 P0.17/CAP1.2/SCL1
48 P0.18/CAP1.3/SDA1
5.1 Pinning
P0.19/MAT1.2/MISO1
1
36 P0.11/CTS1/CAP1.1/AD0.4
P0.20/MAT1.3/MOSI1
2
35 P0.10/RTS1/CAP1.0/AD0.3
P0.21/SSEL1/MAT3.0
3
34 P0.24/AD0.2
VBAT
4
33 P0.23/AD0.1
VDD(1V8)
5
32 P0.22/AD0.0
RST
6
VSS
7
P0.27/TRST/CAP2.0
8
29 P0.8/TXD1/MAT2.1
P0.28/TMS/CAP2.1
9
28 P0.7/SSEL0/MAT2.0
31 VSSA
LPC2101/2102/2103
30 P0.9/RXD1/MAT2.2
P0.29/TCK/CAP2.2 10
27 DBGSEL
P0.6/MOSI0/CAP0.2 24
P0.5/MISO0/MAT0.1 23
P0.4/SCK0/CAP0.1 22
P0.3/SDA0/MAT0.0 21
VSS 19
RTXC1 20
VDD(3V3) 17
P0.2/SCL0/CAP0.0 18
P0.31/TDO 16
P0.30/TDI/MAT3.3 15
25 RTXC2
P0.1/RXD0/MAT3.2 14
26 RTCK
X2 12
P0.0/TXD0/MAT3.1 13
X1 11
002aab821
Fig 2. LQFP48 pin configuration
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
4 of 32
LPC2101/2102/2103
Philips Semiconductors
VSS
1
40 P0.12/DSR1/MAT1.0/AD0.5
P0.14/DCD1/SCK1/EINT1
2
41 P0.25/AD0.6
P0.15/RI1/EINT2
3
42 VDD(3V3)
P0.16/EINT0/MAT0.2
4
43 P0.13/DTR1/MAT1.1
P0.17/CAP1.2/SCL1
5
44 VDDA
P0.18/CAP1.3/SDA1
6
Single-chip 16-bit/32-bit microcontrollers
P0.19/MAT1.2/MISO1
7
39 P0.11/CTS1/CAP1.1/AD0.4
P0.20/MAT1.3/MOSI1
8
38 P0.10/RTS1/CAP1.0/AD0.3
P0.21/SSEL1/MAT3.0
9
37 P0.24/AD0.2
VDD(1V8) 10
36 P0.23/AD0.1
RST 11
35 P0.22/AD0.0
LPC2101/2102/2103
VSS 12
P0.27/TRST/CAP2.0 13
34 VSSA
33 P0.9/RXD1/MAT2.2
P0.28/TMS/CAP2.1 14
32 P0.8/TXD1/MAT2.1
P0.29/TCK/CAP2.2 15
31 P0.7/SSEL0/MAT2.0
P0.6/MOSI0/CAP0.2 28
P0.5/MISO0/MAT0.1 27
P0.4/SCK0/CAP0.1 26
P0.3/SDA0/MAT0.0 25
RTXC1 24
VSS 23
P0.2/SCL0/CAP0.0 22
P0.31/TDO 21
P0.30/TDI/MAT3.3 20
29 RTXC2
P0.0/TXD0/MAT3.1 18
30 DBGSEL
X2 17
P0.1/RXD0/MAT3.2 19
X1 16
002aab920
Fig 3. PLCC44 pin configuration
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
5 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
5.2 Pin description
Table 3:
Pin description
Symbol
LQFP48
PLCC44
P0.0 to P0.31
P0.0/TXD0/
MAT3.1
13 [1]
P0.1/RXD0/
MAT3.2
14 [2]
P0.2/SCL0/
CAP0.0
18 [3]
P0.3/SDA0/
MAT0.0
21 [3]
P0.4/SCK0/
CAP0.1
22 [4]
P0.5/MISO0/
MAT0.1
23 [4]
P0.6/MOSI0/
CAP0.2
24 [4]
P0.7/SSEL0/
MAT2.0
28 [2]
P0.8/TXD1/
MAT2.1
29 [4]
P0.9/RXD1/
MAT2.2
30 [2]
18 [1]
19 [2]
22 [3]
25 [3]
26 [4]
27 [4]
28 [4]
31 [2]
32 [4]
33 [2]
Type
Description
I/O
Port 0: Port 0 is a 32-bit I/O port with individual direction
controls for each bit. A total of 31 pins of the Port 0 can be
used as general purpose bidirectional digital I/Os while P0.31
is an output only pin. The operation of port 0 pins depends
upon the pin function selected via the pin connect block.
I/O
P0.0 — General purpose Input/output digital pin (GPIO).
O
TXD0 — Transmitter output for UART0.
O
MAT3.1 — PWM output 1 for Timer 3.
I/O
P0.1 — General purpose Input/output digital pin (GPIO).
I
RXD0 — Receiver input for UART0.
O
MAT3.2 — PWM output 2 for Timer 3.
I/O
P0.2 — General purpose Input/output digital pin (GPIO).
I/O
SCL0 — I2C0 clock Input/output. Open-drain output (for
I2C-bus compliance).
I
CAP0.0 — Capture input for Timer 0, channel 0.
I/O
P0.3 — General purpose Input/output digital pin (GPIO).
I/O
SDA0 — I2C0 data input/output. Open-drain output (for
I2C-bus compliance).
O
MAT0.0 — PWM output for Timer 0, channel 0.
I/O
P0.4 — General purpose Input/output digital pin (GPIO).
I/O
SCK0 — Serial clock for SPI0. SPI clock output from master
or input to slave.
I
CAP0.1 — Capture input for Timer 0, channel 1.
I/O
P0.5 — General purpose Input/output digital pin (GPIO).
I/O
MISO0 — Master In Slave OUT for SPI0. Data input to SPI
master or data output from SPI slave.
O
MAT0.1 — PWM output for Timer 0, channel 1.
I/O
P0.6 — General purpose Input/output digital pin (GPIO).
I/O
MOSI0 — Master Out Slave In for SPI0. Data output from SPI
master or data input to SPI slave.
I
CAP0.2 — Capture input for Timer 0, channel 2.
I/O
P0.7 — General purpose Input/output digital pin (GPIO).
I
SSEL0 — Slave Select for SPI0. Selects the SPI interface as
a slave.
O
MAT2.0 — PWM output for Timer 2, channel 0.
I/O
P0.8 — General purpose Input/output digital pin (GPIO).
O
TXD1 — Transmitter output for UART1.
O
MAT2.1 — PWM output for Timer 2, channel 1.
I/O
P0.9 — General purpose Input/output digital pin (GPIO).
I
RXD1 — Receiver input for UART1.
O
MAT2.2 — PWM output for Timer 2, channel 2.
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
6 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 3:
Pin description …continued
Symbol
LQFP48
PLCC44
Type
Description
P0.10/RTS1/
CAP1.0/AD0.3
35 [4]
38 [4]
I/O
P0.10 — General purpose Input/output digital pin (GPIO).
O
RTS1 — Request to Send output for UART1.
I
CAP1.0 — Capture input for Timer 1, channel 0.
I
AD0.3 — ADC 0, input 3.
I/O
P0.11 — General purpose Input/output digital pin (GPIO).
I
CTS1 — Clear to Send input for UART1.
I
CAP1.1 — Capture input for Timer 1, channel 1.
I
AD0.4 — ADC 0, input 4.
I/O
P0.12 — General purpose Input/output digital pin (GPIO).
I
DSR1 — Data Set Ready input for UART1.
O
MAT1.0 — PWM output for Timer 1, channel 0.
I
AD0.5 — ADC 0, input 5.
I/O
P0.13 — General purpose Input/output digital pin (GPIO).
O
DTR1 — Data Terminal Ready output for UART1.
O
MAT1.1 — PWM output for Timer 1, channel 1.
P0.11/CTS1/
CAP1.1/AD0.4
P0.12/DSR1/
MAT1.0/AD0.5
36 [3]
37 [4]
P0.13/DTR1/
MAT1.1
41 [4]
P0.14/DCD1/
SCK1/EINT1
44 [3]
P0.15/RI1/
EINT2
45 [4]
P0.16/EINT0/
MAT0.2
46 [2]
P0.17/CAP1.2/
SCL1
47 [1]
P0.18/CAP1.3/
SDA1
P0.19/MAT1.2/
MISO1
P0.20/MAT1.3/
MOSI1
48 [1]
1 [1]
2 [2]
39 [3]
40 [4]
43 [4]
2 [3]
3 [4]
4 [2]
5 [1]
6 [1]
7 [1]
8 [2]
I/O
P0.14 — General purpose Input/output digital pin (GPIO).
I
DCD1 — Data Carrier Detect input for UART1.
I/O
SCK1 — Serial Clock for SPI1. SPI clock output from master
or input to slave.
I
EINT1 — External interrupt 1 input.
I/O
P0.15 — General purpose Input/output digital pin (GPIO).
I
RI1 — Ring Indicator input for UART1.
I
EINT2 — External interrupt 2 input.
I/O
P0.16 — General purpose Input/output digital pin (GPIO).
I
EINT0 — External interrupt 0 input.
O
MAT0.2 — PWM output for Timer 0, channel 2.
I/O
P0.17 — General purpose Input/output digital pin (GPIO).
I
CAP1.2 — Capture input for Timer 1, channel 2.
I/O
SCL1 — I2C1 clock Input/output. Open-drain output (for
I2C-bus compliance).
I/O
P0.18 — General purpose Input/output digital pin (GPIO).
I
CAP1.3 — Capture input for Timer 1, channel 3.
I/O
SDA1 — I2C1 data Input/output. Open-drain output (for
I2C-bus compliance).
I/O
P0.19 — General purpose Input/output digital pin (GPIO).
O
MAT1.2 — PWM output for Timer 1, channel 2.
I/O
MISO1 — Master In Slave Out for SSP. Data input to SPI
master or data output from SSP slave.
I/O
P0.20 — General purpose Input/output digital pin (GPIO).
O
MAT1.3 — PWM output for Timer 1, channel 3.
I/O
MOSI1 — Master Out Slave for SSP. Data output from SSP
master or data input to SSP slave.
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
7 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 3:
Pin description …continued
Symbol
LQFP48
PLCC44
Type
Description
P0.21/SSEL1/
MAT3.0
3 [4]
9 [4]
I/O
P0.21 — General purpose Input/output digital pin (GPIO).
I
SSEL1 — Slave Select for SPI1. Selects the SPI interface as
a slave.
O
MAT3.0 — PWM output for Timer 3, channel 0.
P0.22/AD0.0
32 [4]
35 [4]
I/O
P0.22 — General purpose Input/output digital pin (GPIO).
I
AD0.0 — ADC 0, input 0.
P0.23/AD0.1
33 [1]
36 [1]
I/O
P0.23 — General purpose Input/output digital pin (GPIO).
I
AD0.1 — ADC 0, input 1.
P0.24/AD0.2
34 [1]
37 [1]
I/O
P0.24 — General purpose Input/output digital pin (GPIO).
I
AD0.2 — ADC 0, input 2.
P0.25/AD0.6
38 [1]
41 [1]
I/O
P0.25 — General purpose Input/output digital pin (GPIO).
I
AD0.6 — ADC 0, input 6.
P0.26/AD0.7
39 [1]
n.c.
I/O
P0.26 — General purpose Input/output digital pin (GPIO).
I
AD0.7 — ADC 0, input 7.
P0.27/TRST/
CAP2.0
8 [4]
13 [4]
I/O
P0.27 — General purpose Input/output digital pin (GPIO).
14 [4]
I
TRST — Test Reset for JTAG interface.
I
CAP2.0 — Capture input for Timer 2, channel 0.
I/O
P0.28 — General purpose Input/output digital pin (GPIO).
I
TMS — Test Mode Select for JTAG interface.
I
CAP2.1 — Capture input for Timer 2, channel 1.
I/O
P0.29 — General purpose Input/output digital pin (GPIO).
I
TCK — Test Clock for JTAG interface.
I
CAP2.2 — Capture input for Timer 2, channel 2.
P0.28/TMS/
CAP2.1
9 [4]
P0.29/TCK/
CAP2.2
10 [4]
P0.30/TDI/
MAT3.3
15 [4]
P0.31/TDO
16 [4]
21 [4]
O
TDO — Test Data Out for JTAG interface.
RTXC1
20 [5]
24 [5]
I
Input to the RTC oscillator circuit.
RTXC2
25 [5]
29 [5]
O
Output from the RTC oscillator circuit.
RTCK
26 [5]
n.c.
I/O
Returned test clock output: Extra signal added to the JTAG
port. Assists debugger synchronization when processor
frequency varies. Bidirectional pin with internal pull-up.
X1
11
16
I
Input to the oscillator circuit and internal clock generator
circuits.
X2
12
17
O
Output from the oscillator amplifier.
DBGSEL
27
30
I
Debug select: When LOW, the part operates normally. When
HIGH, debug mode is entered. Input with internal pull-down.
RST
6
11
I
External reset input: A LOW on this pin resets the device,
causing I/O ports and peripherals to take on their default
states and processor execution to begin at address 0. TTL
with hysteresis, 5 V tolerant.
VSS
7, 19, 43
1, 12, 23
I
Ground: 0 V reference.
15 [4]
20 [4]
I/O
P0.30 — General purpose Input/output digital pin (GPIO).
I
TDI — Test Data In for JTAG interface.
O
MAT3.3 — PWM output 3 for Timer 3.
O
P0.31 — General purpose output only digital pin (GPIO).
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
8 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 3:
Pin description …continued
Symbol
LQFP48
PLCC44
Type
Description
VSSA
31
34
I
Analog ground: 0 V reference. This should be nominally the
same voltage as VSS but should be isolated to minimize noise
and error.
VDDA
42
44
I
Analog 3.3 V power supply: This should be nominally the
same voltage as VDD(3V3) but should be isolated to minimize
noise and error. This voltage is used to power the on-chip
PLL. This pin also provides a voltage reference level for the
ADC.
VDD(1V8)
5
10
I
1.8 V core power supply: This is the power supply voltage for
internal circuitry.
VDD(3V3)
17, 40
42
I
3.3 V pad power supply: This is the power supply voltage for
the I/O ports.
VBAT
4
n.c.
I
RTC power supply: 3.3 V on this pin supplies the power to
the RTC.
[1]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
[2]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. If configured for an input
function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns.
[3]
Open-drain 5 V tolerant digital I/O I2C-bus 400 kHz specification compatible pad. It requires external pull-up to provide an output
functionality.
[4]
5 V tolerant pad providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog input function. If configured
for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. When configured as an ADC input, digital
section of the pad is disabled.
[5]
Pad provides special analog functionality.
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
9 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
6. Functional description
6.1 Architectural overview
The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high
performance and very low power consumption. The ARM architecture is based on
Reduced Instruction Set Computer (RISC) principles, and the instruction set and related
decode mechanism are much simpler than those of microprogrammed Complex
Instruction Set Computers (CISC). This simplicity results in a high instruction throughput
and impressive real-time interrupt response from a small and cost-effective processor
core.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM7TDMI-S processor also employs a unique architectural strategy known as
Thumb, which makes it ideally suited to high-volume applications with memory
restrictions, or applications where code density is an issue.
The key idea behind Thumb is that of a super-reduced instruction set. Essentially, the
ARM7TDMI-S processor has two instruction sets:
• The standard 32-bit ARM set.
• A 16-bit Thumb set.
The Thumb set’s 16-bit instruction length allows it to approach twice the density of
standard ARM code while retaining most of the ARM’s performance advantage over a
traditional 16-bit processor using 16-bit registers. This is possible because Thumb code
operates on the same 32-bit register set as ARM code.
Thumb code is able to provide up to 65 % of the code size of ARM, and 160 % of the
performance of an equivalent ARM processor connected to a 16-bit memory system.
The particular flash implementation in the LPC2101/2102/2103 allows for full speed
execution also in ARM mode. It is recommended to program performance critical and
short code sections in ARM mode. The impact on the overall code size will be minimal but
the speed can be increased by 30 % over Thumb mode.
6.2 On-chip flash program memory
The LPC2101/2102/2103 incorporate a 8 kB, 16 kB or 32 kB flash memory system
respectively. This memory may be used for both code and data storage. Programming of
the flash memory may be accomplished in several ways. It may be programmed In
System via the serial port. The application program may also erase and/or program the
flash while the application is running, allowing a great degree of flexibility for data storage
field firmware upgrades, etc. The entire flash memory is available for user code as the
bootloader resides in a separate memory.
The LPC2101/2102/2103 flash memory provides a minimum of 100,000 erase/write
cycles and 20 years of data-retention memory.
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6.3 On-chip static RAM
On-chip static RAM may be used for code and/or data storage. The SRAM may be
accessed as 8-bits, 16-bits, and 32-bits. The LPC2101/2102/2103 provide 2 kB, 4 kB or
8 kB of static RAM.
6.4 Memory map
The LPC2101/2102/2103 memory map incorporates several distinct regions, as shown in
Figure 4.
In addition, the CPU interrupt vectors may be re-mapped to allow them to reside in either
flash memory (the default) or on-chip static RAM. This is described in Section 6.17
“System control”.
4.0 GB
0xFFFF FFFF
AHB PERIPHERALS
0xF000 0000
3.75 GB
APB PERIPHERALS
3.5 GB
0xE000 0000
3.0 GB
0xC000 0000
RESERVED ADDRESS SPACE
2.0 GB
BOOT BLOCK
0x8000 0000
0x7FFF FFFF
0x7FFF E000
0x7FFF DFFF
RESERVED ADDRESS SPACE
0x4000 2000
0x4000 1FFF
8 kB ON-CHIP STATIC RAM (LPC2103)
4 kB ON-CHIP STATIC RAM (LPC2102)
2 kB ON-CHIP STATIC RAM (LPC2101)
0x4000 0800
0x4000 07FF
0x4000 0000
1.0 GB
RESERVED ADDRESS SPACE
32 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2103)
16 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2102)
0.0 GB
0x4000 1000
0x4000 0FFF
8 kB ON-CHIP NON-VOLATILE MEMORY
(LPC2101)
0x0000 8000
0x0000 7FFF
0x0000 4000
0x0000 3FFF
0x0000 2000
0x0000 1FFF
0x0000 0000
002aab822
Fig 4. LPC2101/2102/2103 memory map
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6.5 Interrupt controller
The VIC accepts all of the interrupt request inputs and categorizes them as FIQ, vectored
IRQ, and non-vectored IRQ as defined by programmable settings. The programmable
assignment scheme means that priorities of interrupts from the various peripherals can be
dynamically assigned and adjusted.
FIQ has the highest priority. If more than one request is assigned to FIQ, the VIC
combines the requests to produce the FIQ signal to the ARM processor. The fastest
possible FIQ latency is achieved when only one request is classified as FIQ, because then
the FIQ service routine does not need to branch into the interrupt service routine but can
run from the interrupt vector location. If more than one request is assigned to the FIQ
class, the FIQ service routine will read a word from the VIC that identifies which FIQ
source(s) is (are) requesting an interrupt.
Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned
to this category. Any of the interrupt requests can be assigned to any of the 16 vectored
IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest.
Non-vectored IRQs have the lowest priority.
The VIC combines the requests from all the vectored and non-vectored IRQs to produce
the IRQ signal to the ARM processor. The IRQ service routine can start by reading a
register from the VIC and jumping there. If any of the vectored IRQs are pending, the VIC
provides the address of the highest-priority requesting IRQs service routine, otherwise it
provides the address of a default routine that is shared by all the non-vectored IRQs. The
default routine can read another VIC register to see what IRQs are active.
6.5.1 Interrupt sources
Each peripheral device has one interrupt line connected to the Vectored Interrupt
Controller, but may have several internal interrupt flags. Individual interrupt flags may also
represent more than one interrupt source.
6.6 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on chip peripherals. Peripherals should be connected to the appropriate pins
prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any
enabled peripheral function that is not mapped to a related pin should be considered
undefined.
The Pin Control Module with its pin select registers defines the functionality of the
microcontroller in a given hardware environment.
After reset all pins of Port 0 are configured as input with the following exceptions: If debug
is enabled, the JTAG pins will assume their JTAG functionality. The pins associated with
the I2C0 interface are open-drain.
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6.7 Fast general purpose parallel I/O
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back, as well as the current state of the port pins.
LPC2101/2102/2103 introduce accelerated GPIO functions over prior LPC2000 devices:
• GPIO registers are relocated to the ARM local bus for the fastest possible I/O timing.
• Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
• All GPIO registers are byte addressable.
• Entire port value can be written in one instruction.
6.7.1 Features
• Bit-level set and clear registers allow a single instruction set or clear of any number of
bits in one port.
• Direction control of individual bits.
• Separate control of output set and clear.
• All I/O default to inputs after reset.
6.8 10-bit A/D converter
The LPC2101/2102/2103 contain one analog to digital converter. It is a single 10-bit
successive approximation analog to digital converter with eight channels.
6.8.1 Features
•
•
•
•
•
Measurement range of 0 V to 3.3 V.
Each converter capable of performing more than 400,000 10-bit samples per second.
Burst conversion mode for single or multiple inputs.
Optional conversion on transition on input pin or Timer Match signal.
Every analog input has a dedicated result register to reduce interrupt overhead.
6.9 UARTs
The LPC2101/2102/2103 each contain two UARTs. In addition to standard transmit and
receive data lines, UART1 also provides a full modem control handshake interface.
Compared to previous LPC2000 microcontrollers, UARTs in LPC2101/2102/2103 include
a fractional baud rate generator for both UARTs. Standard baud rates such as 115200 can
be achieved with any crystal frequency above 2 MHz.
6.9.1 Features
• 16 byte Receive and Transmit FIFOs.
• Register locations conform to ‘550 industry standard.
• Receiver FIFO trigger points at 1, 4, 8, and 14 bytes
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• Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Transmission FIFO control enables implementation of software (XON/XOFF) flow
control on both UARTs.
• UART1 is equipped with standard modem interface signals. This module also
provides full support for hardware flow control (auto-CTS/RTS).
6.10 I2C-bus serial I/O controllers
The LPC2101/2102/2103 each contain two I2C-bus controllers.
The I2C-bus is bidirectional, for inter-IC control using only two wires: a Serial Clock Line
(SCL), and a Serial Data Line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., LCD driver) or a transmitter with the
capability to both receive and send information such as serial memory. Transmitters
and/or receivers can operate in either master or slave mode, depending on whether the
chip has to initiate a data transfer or is only addressed. The I2C-bus is a multi-master bus,
it can be controlled by more than one bus master connected to it.
The I2C-bus implemented in LPC2101/2102/2103 supports bit rates up to 400 kbit/s (Fast
I2C).
6.10.1 Features
•
•
•
•
•
•
Compliant with standard I2C-bus interface.
Easy to configure as Master, Slave, or Master/Slave.
Programmable clocks allow versatile rate control.
Bidirectional data transfer between masters and slaves.
Multi-master bus (no central master).
Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can also be used for test and diagnostic purposes.
6.11 SPI serial I/O controller
The LPC2101/2102/2103 each contain one SPI controller. The SPI is a full duplex serial
interface, designed to handle multiple masters and slaves connected to a given bus. Only
a single master and a single slave can communicate on the interface during a given data
transfer. During a data transfer the master always sends 8 bits to 16 bits of data to the
slave, and the slave always sends 8 bits to 16 bits of data to the master.
6.11.1 Features
• Compliant with SPI specification.
• Synchronous, Serial, Full Duplex, Communication.
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• Combined SPI master and slave.
• Maximum data bit rate of one eighth of the input clock rate.
6.12 SSP serial I/O controller
The LPC2101/2102/2103 each contain one SSP. The SSP controller is capable of
operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and
slaves on the bus. However, only a single master and a single slave can communicate on
the bus during a given data transfer. The SSP supports full duplex transfers, with data
frames of 4 bits to 16 bits flowing from the master to the slave and from the slave to the
master. Often only one of these data streams carries meaningful data.
6.12.1 Features
• Compatible with Motorola SPI, 4-wire TI’s SSI and National Semiconductor’s
Microwire buses.
•
•
•
•
Synchronous Serial Communication.
Master or slave operation.
8-frame FIFOs for both transmit and receive.
Four bits to 16 bits per frame.
6.13 General purpose 32-bit timers/external event counters
The Timer/Counter is designed to count cycles of the peripheral clock (PCLK) or an
externally supplied clock and optionally generate interrupts or perform other actions at
specified timer values, based on four match registers. It also includes four capture inputs
to trap the timer value when an input signal transitions, optionally generating an interrupt.
Multiple pins can be selected to perform a single capture or match function, providing an
application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them.
The LPC2101/2102/2103 can count external events on one of the capture inputs if the
minimum external pulse is equal or longer than a period of the PCLK. In this configuration,
unused capture lines can be selected as regular timer capture inputs or used as external
interrupts.
6.13.1 Features
• A 32-bit timer/counter with a programmable 32-bit prescaler.
• External event counter or timer operation.
• Four 32-bit capture channels per timer/counter that can take a snapshot of the timer
value when an input signal transitions. A capture event may also optionally generate
an interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Four external outputs per timer/counter corresponding to match registers, with the
following capabilities:
– Set LOW on match.
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– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
6.14 General purpose 16-bit timers/external event counters
The Timer/Counter is designed to count cycles of the peripheral clock (PCLK) or an
externally supplied clock and optionally generate interrupts or perform other actions at
specified timer values, based on four match registers. It also includes three capture inputs
to trap the timer value when an input signal transitions, optionally generating an interrupt.
Multiple pins can be selected to perform a single capture or match function, providing an
application with ‘or’ and ‘and’, as well as ‘broadcast’ functions among them.
The LPC2101/2102/2103 can count external events on one of the capture inputs if the
minimum external pulse is equal or longer than a period of the PCLK. In this configuration,
unused capture lines can be selected as regular timer capture inputs or used as external
interrupts.
6.14.1 Features
• Two 16-bit timer/counters with a programmable 16-bit prescaler.
• External event counter or timer operation.
• Three 16-bit capture channels that can take a snapshot of the timer value when an
input signal transitions. A capture event may also optionally generate an interrupt.
• Four 16-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Four external outputs per timer/counter corresponding to match registers, with the
following capabilities:
– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
6.15 Watchdog timer
The purpose of the watchdog is to reset the microcontroller within a reasonable amount of
time if it enters an erroneous state. When enabled, the watchdog will generate a system
reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined
amount of time.
6.15.1 Features
• Internally resets chip if not periodically reloaded.
• Debug mode.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
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•
•
•
•
Incorrect/Incomplete feed sequence causes reset/interrupt if enabled.
Flag to indicate watchdog reset.
Programmable 32-bit timer with internal pre-scaler.
Selectable time period from (TPCLK × 256 × 4) to (TPCLK × 232 × 4) in multiples of
TPCLK × 4.
6.16 Real-time clock
The Real-Time Clock (RTC) is designed to provide a set of counters to measure time
when normal or idle operating mode is selected. The RTC has been designed to use little
power, making it suitable for battery powered systems where the CPU is not running
continuously (Idle mode).
6.16.1 Features
• Measures the passage of time to maintain a calendar and clock.
• Ultra-low power design to support battery powered systems.
• Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and Day
of Year.
• Can use either the RTC dedicated 32 kHz oscillator input or clock derived from the
external crystal/oscillator input at XTAL1. Programmable Reference Clock Divider
allows fine adjustment of the RTC.
• Dedicated power supply pin can be connected to a battery or the main 3.3 V.
6.17 System control
6.17.1 Crystal oscillator
On-chip integrated oscillator operates with external crystal in range of 1 MHz to 25 MHz.
The oscillator output frequency is called fosc and the ARM processor clock frequency is
referred to as CCLK for purposes of rate equations, etc. fosc and CCLK are the same value
unless the PLL is running and connected. Refer to Section 6.17.2 “PLL” for additional
information.
6.17.2 PLL
The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input
frequency is multiplied up into the range of 10 MHz to 70 MHz with a Current Controlled
Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the
multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper
frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so
there is an additional divider in the loop to keep the CCO within its frequency range while
the PLL is providing the desired output frequency. The output divider may be set to divide
by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2,
it is insured that the PLL output has a 50 % duty cycle. The PLL is turned off and
bypassed following a chip reset and may be enabled by software. The program must
configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a
clock source. The PLL settling time is 100 µs.
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6.17.3 Reset and wake-up timer
Reset has two sources on the LPC2101/2102/2103: the RESET pin and watchdog reset.
The RESET pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of
chip reset by any source starts the wake-up timer (see wake-up timer description below),
causing the internal chip reset to remain asserted until the external reset is de-asserted,
the oscillator is running, a fixed number of clocks have passed, and the on-chip flash
controller has completed its initialization.
When the internal reset is removed, the processor begins executing at address 0, which is
the reset vector. At that point, all of the processor and peripheral registers have been
initialized to predetermined reset values.
The wake-up timer ensures that the oscillator and other analog functions required for chip
operation are fully functional before the processor is allowed to execute instructions. This
is important at power on, all types of reset, and whenever any of the aforementioned
functions are turned off for any reason. Since the oscillator and other functions are turned
off during Power-down mode, any wake-up of the processor from Power-down mode
makes use of the wake-up timer.
The wake-up timer monitors the crystal oscillator as the means of checking whether it is
safe to begin code execution. When power is applied to the chip, or some event caused
the chip to exit Power-down mode, some time is required for the oscillator to produce a
signal of sufficient amplitude to drive the clock logic. The amount of time depends on
many factors, including the rate of VDD ramp (in the case of power on), the type of crystal
and its electrical characteristics (if a quartz crystal is used), as well as any other external
circuitry (e.g., capacitors), and the characteristics of the oscillator itself under the existing
ambient conditions.
6.17.4 Code security
This feature of the LPC2101/2102/2103 allow an application to control whether it can be
debugged or protected from observation.
If after reset on-chip bootloader detects a valid checksum in flash and reads 0x8765 4321
from address 0x1FC in flash, debugging will be disabled and thus the code in flash will be
protected from observation. Once debugging is disabled, it can only be enabled by
performing a full chip erase using the ISP.
6.17.5 External interrupt inputs
The LPC2101/2102/2103 include up to three edge or level sensitive External Interrupt
Inputs as selectable pin functions. When the pins are combined, external events can be
processed as three independent interrupt signals. The External Interrupt Inputs can
optionally be used to wake-up the processor from Power-down mode.
Additionally all 10 capture input pins can also be used as external interrupts without the
option to wake the device up from Power-down mode.
6.17.6 Memory mapping control
The Memory Mapping Control alters the mapping of the interrupt vectors that appear
beginning at address 0x0000 0000. Vectors may be mapped to the bottom of the on-chip
flash memory, or to the on-chip static RAM. This allows code running in different memory
spaces to have control of the interrupts.
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6.17.7 Power control
The LPC2101/2102/2103 supports two reduced power modes: Idle mode and
Power-down mode.
In Idle mode, execution of instructions is suspended until either a reset or interrupt occurs.
Peripheral functions continue operation during Idle mode and may generate interrupts to
cause the processor to resume execution. Idle mode eliminates power used by the
processor itself, memory systems and related controllers, and internal buses.
In Power-down mode, the oscillator is shut down and the chip receives no internal clocks.
The processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Power-down mode and the logic levels of chip output pins remain
static. The Power-down mode can be terminated and normal operation resumed by either
a reset or certain specific interrupts that are able to function without clocks. Since all
dynamic operation of the chip is suspended, Power-down mode reduces chip power
consumption to nearly zero.
Selecting an external 32 kHz clock instead of the PCLK as a clock-source for the on-chip
RTC will enable the microcontroller to have the RTC active during Power-down mode.
Power-down current is increased with RTC active. However, it is significantly lower than in
Idle mode.
A Power Control for Peripherals feature allows individual peripherals to be turned off if
they are not needed in the application, resulting in additional power savings during active
and Idle mode.
6.17.8 APB bus
The APB divider determines the relationship between the processor clock (CCLK) and the
clock used by peripheral devices (PCLK). The APB divider serves two purposes. The first
is to provide peripherals with the desired PCLK via APB bus so that they can operate at
the speed chosen for the ARM processor. In order to achieve this, the APB bus may be
slowed down to 1⁄2 to 1⁄4 of the processor clock rate. Because the APB bus must work
properly at power-up (and its timing cannot be altered if it does not work since the APB
divider control registers reside on the APB bus), the default condition at reset is for the
APB bus to run at 1⁄4 of the processor clock rate. The second purpose of the APB divider
is to allow power savings when an application does not require any peripherals to run at
the full processor rate. Because the APB divider is connected to the PLL output, the PLL
remains active (if it was running) during Idle mode.
6.18 Emulation and debugging
The LPC2101/2102/2103 support emulation and debugging via a JTAG serial port.
6.18.1 EmbeddedICE
Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of
the target system requires a host computer running the debugger software and an
EmbeddedICE protocol convertor. EmbeddedICE protocol convertor converts the Remote
Debug Protocol commands to the JTAG data needed to access the ARM core.
The ARM core has a Debug Communication Channel function built-in. The debug
communication channel allows a program running on the target to communicate with the
host debugger or another separate host without stopping the program flow or even
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entering the debug state. The debug communication channel is accessed as a
co-processor 14 by the program running on the ARM7TDMI-S core. The debug
communication channel allows the JTAG port to be used for sending and receiving data
without affecting the normal program flow. The debug communication channel data and
control registers are mapped in to addresses in the EmbeddedICE logic.
6.18.2 RealMonitor
RealMonitor is a configurable software module, developed by ARM Inc., which enables
real time debug. It is a lightweight debug monitor that runs in the background while users
debug their foreground application. It communicates with the host using the DCC, which is
present in the EmbeddedICE logic. The LPC2101/2102/2103 contain a specific
configuration of RealMonitor software programmed into the on-chip boot ROM memory.
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7. Limiting values
Table 4:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). [1]
Symbol
Min
Max
Unit
supply voltage (1.8 V)
[2]
−0.5
+2.5
V
VDD(3V3)
supply voltage (3.3 V)
[3]
−0.5
+3.6
V
VDDA
analog 3.3 V pad supply voltage
−0.5
4.6
V
Vi(VBAT)
input voltage on pin VBAT
VDD(1V8)
Parameter
Conditions
−0.5
4.6
V
[4]
−0.5
5.1
V
[5] [6]
−0.5
6.0
V
[5]
−0.5
VDD + 0.5 [7] V
supply current
[8]
-
100 [9]
ISS
ground current
[10]
-
100 [9]
mA
Tstg
storage temperature
[11]
−40
125
°C
Ptot(pack)
total power dissipation (per package)
-
1.5
W
for the RTC
analog input voltage
VIA
input voltage
VI
5 V tolerant I/O
pins
other I/O pins
IDD
based on package
heat transfer, not
device power
consumption
mA
[1]
The following applies to the Limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Core and internal rail.
[3]
External rail.
[4]
On ADC related pins.
[5]
Including voltage on outputs in 3-state mode.
[6]
Only valid when the VDD(3V3) supply voltage is present.
[7]
Not to exceed 4.6 V.
[8]
Per supply pin.
[9]
The peak current is limited to 25 times the corresponding maximum current.
[10] Per ground pin.
[11] Dependent on package type.
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8. Static characteristics
Table 5:
Static characteristics
Ta = −40 °C to +85 °C for commercial applications, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ [1]
Max
Unit
1.65
1.8
1.95
V
supply voltage (1.8 V)
[2]
VDD(3V3)
supply voltage (3.3 V)
[3]
3.0
3.3
3.6
V
VDDA
analog 3.3 V pad supply
voltage
3.0
3.3
3.6
V
Vi(VBAT)
input voltage on pin VBAT
2.0 [4]
3.3
3.6
V
VDD(1V8)
Standard port pins, RESET, RTCK
IIL
LOW-state input current
VI = 0 V; no pull-up
-
-
3
µA
IIH
HIGH-state input current
VI = VDD(3V3); no pull-down
-
-
3
µA
IOZ
OFF-state output current
VO = 0 V, VO = VDD(3V3); no
pull-up/down
-
-
3
µA
Ilatch
I/O latch-up current
−(0.5VDD(3V3)) < V <
(1.5VDD(3V3))
-
-
100
mA
VI
input voltage
0
-
5.5
V
0
-
VDD(3V3)
V
Tj < 125 °C
VO
output voltage
pin configured to provide a
digital function
[5] [6]
[7]
output active
VIH
HIGH-state input voltage
2.0
-
-
V
VIL
LOW-state input voltage
-
-
0.8
V
Vhys
hysteresis voltage
VOH
VOL
IOH
IOL
-
0.4
-
V
HIGH-state output voltage IOH = −4 mA
[8]
VDD(3V3) −
0.4
-
-
V
LOW-state output voltage
IOL = −4 mA
[8]
-
-
0.4
V
HIGH-state output current
VOH = VDD(3V3) − 0.4 V
[8]
−4
-
-
mA
VOL = 0.4 V
[8]
4
-
-
mA
-
-
−45
mA
-
-
50
mA
LOW-state output current
IOHS
HIGH-state short-circuit
output current
VOH = 0 V
[9]
IOLS
LOW-state short-circuit
output current
VOL = VDDA
[9]
Ipd
pull-down current
VI = 5 V [10]
Ipu
pull-up current
VI = 0 V
10
50
150
µA
−15
−50
−85
µA
0
0
0
µA
<tbd>
7
<tbd>
mA
CCLK = 70 MHz
(other parameters as above)
<tbd>
41
<tbd>
mA
VDD(1V8) = 1.8 V, Ta = +25 °C
<tbd>
7
<tbd>
µA
VDD(1V8) = 1.8 V, Ta = +85 °C
<tbd>
<tbd>
<tbd>
µA
[11]
VDD(3V3) < VI < 5
IDD(act)
active mode supply
current
V [10]
VDD(1V8) = 1.8 V, Ta = 25 °C,
code
while(1){}
executed from flash, no active
peripherals
CCLK = 10 MHz
IDD(pd)
Power-down mode supply
current
LPC2101_02_03_1
Preliminary data sheet
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Rev. 01 — 18 January 2006
22 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 5:
Static characteristics …continued
Ta = −40 °C to +85 °C for commercial applications, unless otherwise specified.
Min
Typ [1]
Max
Unit
VDD(1V8) = 1.8 V, VBAT = 2.5 V
-
7
<tbd>
µA
VDD(1V8) = 1.8 V, VBAT = 3.0 V
-
8
<tbd>
µA
<tbd>
<tbd>
<tbd>
µA
V
Symbol
Parameter
Conditions
IBATpd
Power-down mode battery RTC clock = 32 kHz
supply current [12]
(from RTXC pins), Ta = +25 °C
active mode battery
supply current [12]
IBATact
CCLK = 70 MHz,
PCLK = 17.5 MHz,
PCLK enabled to RTCK,
RTC clock = 32 kHz
(from RTXC pins), Ta = +25 °C
VDD(1V8) = 1.8 V, VBAT = 3.0 V
I2C-bus
pins
VIH
HIGH-state input voltage
0.7VDD(3V3) -
-
VIL
LOW-state input voltage
-
-
0.3VDD(3V3) V
Vhys
hysteresis voltage
-
0.5VDD(3V3) -
V
-
-
0.4
V
VI = VDD(3V3)
-
2
4
µA
VI = 5 V
-
10
22
µA
LOW-state output voltage
VOL
input leakage
ILI
current [13]
IOLS = 3 mA
[8]
Oscillator pins
Vi(XTAL1)
input voltage on pin XTAL1
0
-
1.8
V
Vo(XTAL2)
output voltage on pin
XTAL2
0
-
1.8
V
Vi(RTXC1)
input voltage on pin
RTXC1
0
-
1.8
V
0
-
1.8
V
Vo(RTXC2) output voltage on pin
RTXC2
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (+25 ˚C), nominal supply voltages.
[2]
Core and internal rail.
[3]
External rail.
[4]
The RTC typically fails when VBAT drops below 1.6 V.
[5]
Including voltage on outputs in 3-state mode.
[6]
VDD(3V3) supply voltages must be present.
[7]
3-state outputs go into 3-state mode when VDD(3V3) is grounded.
[8]
Accounts for 100 mV voltage drop in all supply lines.
[9]
Only allowed for a short time period.
[10] Minimum condition for VI = 4.5 V, maximum condition for VI = 5.5 V.
[11] Applies to P1.25:16.
[12] On pin VBAT.
[13] To VSS.
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
23 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
Table 6:
ADC static characteristics
VDDA = 2.5 V to 3.6 V; Ta = −40 °C to +85 °C unless otherwise specified. ADC frequency 4.5 MHz.
Symbol
Parameter
Conditions
VIA
analog input voltage
0
Cia
analog input capacitance
[1] [2] [3]
-
integral non-linearity
[1] [4]
EO
offset error
[1] [5]
EG
gain error
[1] [6]
absolute error
[1] [7]
differential linearity error
ED
EL(adj)
ET
Min
Typ
Max
Unit
-
VDDA
V
-
1
pF
-
±1
LSB
-
-
±2
LSB
-
-
±3
LSB
-
-
±0.5
%
-
-
±4
LSB
[1]
Conditions: VSSA = 0 V, VDDA = 3.3 V.
[2]
The A/D is monotonic, there are no missing codes.
[3]
The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 5.
[4]
The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 5.
[5]
The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 5.
[6]
The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 5.
[7]
The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated A/D
and the ideal transfer curve. See Figure 5.
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
24 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
offset
error
EO
gain
error
EG
1023
1022
1021
1020
1019
1018
(2)
7
code
out
(1)
6
5
(5)
4
(4)
3
(3)
2
1 LSB
(ideal)
1
0
1
2
3
4
5
offset error
EO
6
7
1018
1019
1020
1021
1022
1023
1024
VIA (LSBideal)
1 LSB =
VDDA − VSSA
1024
002aac046
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 5. A/D conversion characteristics
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
25 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
9. Dynamic characteristics
Table 7:
Dynamic characteristics
Ta = 0 °C to +70 °C for commercial applications, −40 °C to +85 °C for industrial applications, VDD(1V8), VDD(3V3) over specified
ranges [1]
Symbol
Parameter
Conditions
Min
Typ [2]
Max
Unit
External clock
fosc
oscillator frequency
10
-
25
MHz
Tcy(clk)
clock cycle time
40
-
100
ns
tCHCX
clock HIGH time
Tcy(clk) × 0.4
-
-
ns
tCLCX
clock LOW time
Tcy(clk) × 0.4
-
-
ns
tCLCH
clock rise time
-
-
5
ns
tCHCL
clock fall time
-
-
5
ns
Port pins (except P0.2 and P0.3)
tr(o)
output rise time
-
10
-
ns
tf(o)
output fall time
-
10
-
ns
-
ns
I2C-bus
pins (P0.2 and P0.3)
output fall time
tf(o)
VIH to VIL
20 + 0.1 × Cb [3] -
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (+25 ˚C), nominal supply voltages.
[3]
Bus capacitance Cb in pF, from 10 pF to 400 pF.
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
26 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
10. Package outline
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
c
y
X
36
25
A
37
24
ZE
e
E HE
A A2
(A 3)
A1
w M
θ
bp
pin 1 index
Lp
L
13
48
1
detail X
12
ZD
e
v M A
w M
bp
D
B
HD
v M B
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HD
HE
L
Lp
v
w
y
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
7.1
6.9
7.1
6.9
0.5
9.15
8.85
9.15
8.85
1
0.75
0.45
0.2
0.12
0.1
Z D (1) Z E (1)
θ
0.95
0.55
7
o
0
0.95
0.55
o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT313-2
136E05
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
03-02-25
Fig 6. Package outline SOT313-2 (LQFP48)
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
27 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
PLCC44: plastic leaded chip carrier; 44 leads
SOT187-2
eD
eE
y
X
39
A
29
28
40
bp
ZE
b1
w M
44
1
E
HE
pin 1 index
A
A4 A1
e
(A 3)
6
β
18
Lp
k
7
detail X
17
e
v M A
ZD
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm dimensions are derived from the original inch dimensions)
A4
A1
e
UNIT A
A3
D(1) E(1)
eD
eE
HD
bp b1
max.
min.
4.57
4.19
inches
0.81
0.66
k
16.66 16.66
16.00 16.00 17.65 17.65 1.22
1.27
16.51 16.51
14.99 14.99 17.40 17.40 1.07
0.51
0.25
3.05
0.53
0.33
0.180
0.02
0.165
0.01
0.12
0.021 0.032 0.656 0.656
0.05
0.013 0.026 0.650 0.650
mm
HE
0.63
0.59
0.63
0.59
Lp
v
w
y
1.44
1.02
0.18
0.18
0.1
ZD(1) ZE(1)
max. max.
2.16
β
2.16
45 o
0.695 0.695 0.048 0.057
0.007 0.007 0.004 0.085 0.085
0.685 0.685 0.042 0.040
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT187-2
112E10
MS-018
EDR-7319
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
01-11-14
Fig 7. Package outline SOT187-2 (PLCC44)
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
28 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
11. Abbreviations
Table 8:
Acronym list
Acronym
Description
ADC
Analog-to-Digital Converter
APB
Advanced Peripheral Bus
DCC
Debug Communications Channel
DSP
Digital Signal Processor
FIFO
First In, First Out
FIQ
Fast Interrupt Request
GPIO
General Purpose Input/Output
IAP
In-Application Programming
IRQ
Interrupt Request
ISP
In-System Programming
PLL
Phase-Locked Loop
PWM
Pulse Width Modulator
SPI
Serial Peripheral Interface
SRAM
Static Random Access Memory
SSP
Serial Synchronous Port
UART
Universal Asynchronous Receiver/Transmitter
VIC
Vectored Interrupt Controller
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
29 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
12. Revision history
Table 9:
Revision history
Document ID
Release
date
Data sheet status
Change
notice
Doc. number
Supersedes
LPC2101_2102_2103_1
20060118
Preliminary data
sheet
-
-
-
LPC2101_02_03_1
Preliminary data sheet
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Rev. 01 — 18 January 2006
30 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
13. Data sheet status
Level
Data sheet status [1]
Product status [2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
14. Definitions
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
makes no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
16. Trademarks
Notice — All referenced brands, product names, service names and
trademarks are the property of their respective owners.
I2C-bus — logo is a trademark of Koninklijke Philips Electronics N.V.
15. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
17. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: [email protected]
LPC2101_02_03_1
Preliminary data sheet
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Rev. 01 — 18 January 2006
31 of 32
LPC2101/2102/2103
Philips Semiconductors
Single-chip 16-bit/32-bit microcontrollers
18. Contents
1
2
2.1
3
3.1
4
5
5.1
5.2
6
6.1
6.2
6.3
6.4
6.5
6.5.1
6.6
6.7
6.7.1
6.8
6.8.1
6.9
6.9.1
6.10
6.10.1
6.11
6.11.1
6.12
6.12.1
6.13
6.13.1
6.14
6.14.1
6.15
6.15.1
6.16
6.16.1
6.17
6.17.1
6.17.2
6.17.3
6.17.4
6.17.5
6.17.6
6.17.7
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . 10
Architectural overview. . . . . . . . . . . . . . . . . . . 10
On-chip flash program memory . . . . . . . . . . . 10
On-chip static RAM. . . . . . . . . . . . . . . . . . . . . 11
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 11
Interrupt controller . . . . . . . . . . . . . . . . . . . . . 12
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 12
Pin connect block . . . . . . . . . . . . . . . . . . . . . . 12
Fast general purpose parallel I/O . . . . . . . . . . 13
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
10-bit A/D converter . . . . . . . . . . . . . . . . . . . . 13
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
I2C-bus serial I/O controllers. . . . . . . . . . . . . . 14
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
SPI serial I/O controller. . . . . . . . . . . . . . . . . . 14
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
SSP serial I/O controller . . . . . . . . . . . . . . . . . 15
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
General purpose 32-bit timers/external event
counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
General purpose 16-bit timers/external event
counters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . 16
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Real-time clock . . . . . . . . . . . . . . . . . . . . . . . . 17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
System control . . . . . . . . . . . . . . . . . . . . . . . . 17
Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . 17
PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Reset and wake-up timer . . . . . . . . . . . . . . . . 18
Code security . . . . . . . . . . . . . . . . . . . . . . . . . 18
External interrupt inputs . . . . . . . . . . . . . . . . . 18
Memory mapping control . . . . . . . . . . . . . . . . 18
Power control . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.17.8
6.18
6.18.1
6.18.2
7
8
9
10
11
12
13
14
15
16
17
APB bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Emulation and debugging. . . . . . . . . . . . . . . .
EmbeddedICE . . . . . . . . . . . . . . . . . . . . . . . .
RealMonitor . . . . . . . . . . . . . . . . . . . . . . . . . .
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
Static characteristics . . . . . . . . . . . . . . . . . . .
Dynamic characteristics . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . .
Data sheet status. . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
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© Koninklijke Philips Electronics N.V. 2006
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 18 January 2006
Document number: LPC2101_02_03_1
Published in the Netherlands