Material Content Data Sheet Sales Product Name IPB200N25N3 G MA# MA000812202 Package PG-TO263-3-2 Issued 29. August 2013 Weight* 1470.38 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus tin silver lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-31-5 7440-22-4 7439-92-1 17.562 1.19 0.853 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.19 11944 11944 580 0.256 0.02 851.691 57.93 58.01 579231 174 579983 11.752 0.80 0.80 7992 7992 8.549 0.58 5814 94.042 6.40 467.360 31.78 38.76 317848 387620 9.657 0.66 0.66 6567 6567 0.220 0.01 0.023 0.00 0.168 0.01 0.211 0.01 8.043 0.55 63957 150 0.01 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 165 143 0.57 Important Remarks: 1. 15 115 5470 5728 1000000