ES2ABF THRU ES2JBF Surface Mount Superfast Recovery Rectifier Reverse Voltage – 50 to 600 V PINNING Forward Current –2 A PIN DESCRIPTION 1 Cathode FEATURES 2 Anode • For surface mounted applications • Low profile package • Glass Passivated Chip Junction • Superfast reverse recovery time • Lead free in comply with EU RoHS 2011/65/EU directives 1 2 Simplified outline SMBF and symbol MECHANICAL DATA • Case: SMBF • Terminals: Solderable per MIL-STD-750, Method 2026 • A pprox. Weight: 57mg / 0.002oz Absolute Maximum Ratings and Characteristics Ratings at 25 °C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. Symbols ES2ABF ES2BBF ES2CBF ES2DBF ES2EBF ES2GBF ES2JBF Units Maximum Repetitive Peak Reverse Voltage V RRM 50 100 150 200 300 400 600 V Maximum RMS voltage V RMS 35 70 105 140 210 280 420 V Maximum DC Blocking Voltage V DC 50 100 150 200 300 400 600 V Maximum Average Forward Rectified Current at T L = 100 °C I F(AV) 2 A Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) I FSM 50 A Maximum Forward Voltage at 2A VF Parameter Maximum DC Reverse Current at Rated DC Blocking Voltage Ta = 25 °C Ta =125 °C 1.25 1 1.65 V IR 5 100 μA Typical Junction Capacitance at V R =4V, f=1MHz Cj 45 pF Maximum Reverse Recovery Time at I F =0.5A, I R =1A, I rr =0.25A t rr 35 ns RθJA 65 °C/W T j , T stg -55 ~ +150 °C Typical Thermal Resistance 2） Operating and Storage Temperature Range 1）Measured with I F = 0.5 A, I R = 1 A, I rr = 0.25 A 2）P.C.B. mounted with 0.5 X 0.5" (12.7 X 12.7 mm) copper pad areas. ES2ABF THRU ES2JBF Fig.1 Reverse Recovery Time Characteristic And Test Circuit Diagram 50 ohm Noninductive 10 ohm Noninductive t rr +0.5 D.U.T + PULSE GENERATOR Note 2 25Vdc approx - 0 -0.25 1 ohm OSCILLOSCOPE Note 1 NonInductive -1.0 Note：1.Rise Time = 7ns, max. Input Impedance = 1megohm,22pF. 2. Ries Time =10ns, max. Source Impedance = 50 ohms. 10ns/div Set time Base for 10ns/div Fig.3 Typical Reverse Characteristics 2.4 300 2.0 100 I R - Reverse Current ( μ A) Average Forward Current (A) Fig.2 Maximum Average Forward Current Rating 1.6 1.2 0.8 Single phase half wave resistive or inductive P.C.B mounted on 0.5×0.5"(12.7×12.7mm ) pad areas. 0.4 T J =125°C 10 T J =75°C 1.0 T J =25°C 0.1 0.0 25 50 75 100 125 150 175 0 Lead Temperature (°C) 80 100 70 10 T J =25°C Junction Capacitance ( pF) Instaneous Forward Current (A) 60 Fig.5 Typical Junction Capacitance 1.0 ES2ABF~ES2DBF ES2EBF/WS2GBF 0.1 ES2JBF 0.01 0.001 0 0.5 1.5 1.0 2.0 2.5 Instaneous Forward Voltage (V) 60 50 40 30 20 8.3 ms Single Half Sine Wave (JEDEC Method) 10 1 10 Number of Cycles 60 50 40 30 T J =25°C f = 1.0MHz V sig = 50mV p-p 20 10 0.1 1 10 Reverse Voltage (V) Fig.6 Maximum Non-Repetitive Peak Forward Surage Current Peak Forward Surage Current (A) 40 % of PIV.VOLTS Fig.4 Typical Forward Characteristics 00 20 100 100 ES2ABF THRU ES2JBF PACKAGE OUTLINE Plastic surface mounted package; 2 leads SMBF ∠ALL ROUND C A ∠ALL ROUND D E A V M g Top View mil Bottom View A C D E HE e max 1.3 0.26 4.4 3.7 5.5 2.2 min 1.1 0.18 4.2 3.5 5.1 1.9 max 51 10 173 146 216 86 min 43 7 165 138 200 75 UNIT mm 1.8(71) 2.54(100) 3.0(118) g ∠ 1.0 9° 40 Marking The recommended mounting pad size 1.8(71) g pad e E A pad HE Unit：mm(mil) Type number Marking code ES2ABF E2AB ES2BBF E2BB ES2CBF E2CB ES2DBF E2DB ES2EBF E2EB ES2GBF E2GB ES2JBF E2JB