Material Content Data Sheet Sales Product Name TLE7183F Issued MA# MA000792844 Package PG-VQFN-48-14 28. August 2013 Weight* 214.76 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7.778 3.62 0.032 0.01 0.127 0.06 591 2.537 1.18 11812 103.000 47.96 49.21 479599 492150 2.663 1.24 1.24 12400 12400 0.457 0.21 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 3.62 36217 36217 148 2128 14.167 6.60 76.775 35.75 42.56 357489 425582 4.336 2.02 2.02 20191 20191 0.663 0.31 0.31 3086 3086 0.356 0.17 1.871 0.87 65965 1660 1.04 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 8714 10374 1000000