Data Sheet, V2.0, April 2009 BGF124 SIM Card Interface Filter and USB Interface with ESD Protection Small Signal Discretes Edition 2009-04-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2009. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. BGF124 SIM Card Interface Filter and USB Interface with ESD Protection BGF124 Revision History: 2009-04-01, V2.0 Previous Version: 2008-05-27, V1.0 Page Subjects (major changes since last revision) all target status removed 5, 6 Figure 2 and Figure 3 updated 7 Figure 5 added Data Sheet 3 V2.0, 2009-04-01 BGF124 SIM Card Interface Filter and USB Interface with ESD Protection BGF124 BGF124 Features • ESD protection circuit and interface filter for SIM cards • Reduced line capacitance of 12 pF maximum • ESD protection according to IEC61000-4-2 for ±15 kV contact discharge on external IOs • Wafer level package with SnAgCu solder balls • 400 µm solder ball pitch • RoHS and WEEE compliant package WLP-11-4-N Description BGF124 is an ESD protection and filtering circuit for SIM card and USB interfaces. All external IOs are protected against ESD pulses of ±15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green lead-free and halogen-free package with a size of only 1.15 mm x 1.55 mm and a total height of 0.6 mm D1 D2 D3 Ext . IOs A1 R1, 100Ω A3 B1 R2, 47Ω B3 C1 R3, 100Ω C3 GND, A2, C2 BGF124 _schematic.vsd Figure 1 Schematic Type Package Marking Chip BGF124 WLP-11-4 24 N0744 Table 1 Maximum Ratings Parameter Voltage at all pins to GND Operating temperature range Storage temperature range Summed up input power for all pins Symbol VP TOP TSTG Pin Values Unit Note / Test Condition Min. Typ. Max. 0 – 5 V – -40 – +85 °C – -65 – +150 °C – – – 60 mW TS < 70 °C -2 – 2 kV – -15 – 15 kV – Electrostatic Discharge According to IEC61000-4-2 Contact discharge at internal pins A1, B1, C1 VESD Contact discharge at external pins A3, B3, C3, VESD D1, D2, D3 Data Sheet 4 V2.0, 2009-04-01 BGF124 SIM Card Interface Filter and USB Interface with ESD Protection BGF124 Electrical Characteristics1) Table 2 Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. 80 100 120 Ω – 37.6 47 56.4 Ω – Leakage current of ESD protection diodes R1,3 R2 IL – – 1 2 100 200 nA nA Breakdown voltage of ESD diodes2) V(BR) – 18.5 -12.5 – V Line capacitance Capacitance of all lines to GND 1) at TA = 25 °C CT 8 10 12 pF V=3V V=5V I(BR) = 1 mA I(BR) = -1 mA V=0V Resistors R1, R3 Resistor R2 2) after snap-back BGF124 insertion loss 0 B1-B3 -10 A1-A3 dB -20 -30 -40 -50 -60 1 10 100 1000 10000 MHz Figure 2 Data Sheet Insertion Loss 5 V2.0, 2009-04-01 BGF124 SIM Card Interface Filter and USB Interface with ESD Protection BGF124 BGF124 cross talk 0 -20 D1-D2 D1-C1 dB -40 C1-B3 -60 -80 -100 1 10 100 1000 10000 MHz Figure 3 Typical Cross Talk Package Outlines Solder balls face up 1.15 ±0.05 (0.175 ±0.05) D3 D2 D1 C3 C2 C1 A3 B1 A2 A1 C 2 x 0.4 = 0.8 0.08 C 11x COPLANARITY 11x ø0.05 M A B 0.25 ±0.04 1) (0.175 ±0.05) B3 A 1.55 ±0.05 (0.175 ±0.05) 0.4 0.1 C 3 x 0.4 = 1.2 SEATING PLANE 3) 0.2 ±0.05 STANDOFF Pin 1 Corner Index Area 2) B 0.4 0.6 ±0.05 (0.175 ±0.05) Solder balls face down 1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C 2) Identified by marking 3) Primary datum C and seating plane are defined by the domed crowns of the balls WLP-11-4-N-PO V01 Figure 4 Data Sheet WLP-11-4 (Wafer Level Package) 6 V2.0, 2009-04-01 BGF124 SIM Card Interface Filter and USB Interface with ESD Protection BGF124 Footprint 0.8 0.4 1.2 0.4 0.25 WLP-11-4-N-FP V01 Figure 5 Recommended PCB pad design for reflow soldering Tape 4 1.78 Pin 1 Corner Index Area Figure 6 1.32 8 0.25 0.75 WLP-11-4-N-TP V01 Tape for BGF124 / WLP-11-4 You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Data Sheet 7 V2.0, 2009-04-01