AG603-89G InGaP HBT Gain Block Applications • • • • Mobile Infrastructure CATV / FTTX W-LAN / ISM WCDMA / LTE 3G 60 AG SOT-89 Package Product Features • • • • • • • Functional Block Diagram DC – 3000 MHz +19.5 dBm P1dB at 900 MHz +33 dBm OIP3 at 900 MHz 18.5 dB Gain at 900 MHz Single Voltage Supply SOT-89 package Internally matched to 50 Ω Backside Paddle - GND General Description 1 2 RF IN GND 3 RF OUT / VCC Pin Configuration The AG603-89G is a general-purpose buffer amplifier that offers high dynamic range in a low-cost, surfacemount package. At 900 MHz, the AG603-89 typically provides 14 dB of gain, +33 dBm OIP3, and +18.5 dBm P1dB. This amplifier combines dependable performance with consistent quality to maintain an MTTF exceeding 1000 years at mounting temperatures of +85 °C. Pin No. 1 2 3 Backside Paddle Label RF IN GND RF OUT / VCC GND The AG603-89G consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GSM, CDMA, W-CDMA and LTE. In addition, the AG603-89 will work for other various applications within the DC to 3.5 GHz frequency range such as CATV. The AG603-89G is housed in a lead-free/green/RoHScompliant SOT-89 industry-standard SMT package. Ordering Information Part No. AG603-89G AG603-89PCB Description InGaP/GaAs HBT Gain Block 0.7-2.4 GHz Evaluation Board Standard T/R size = 3000 pieces on a 13” reel Datasheet: Rev B 6/26/14 © 2014 TriQuint - 1 of 9 - Disclaimer: Subject to change without notice www.triquint.com AG603-89G InGaP HBT Gain Block Absolute Maximum Ratings Recommended Operating Conditions Parameter Parameter Storage Temperature RF Input Power, CW, 50 Ω, T=25 °C Device Voltage (VCC) Rating −55 to 150 °C +10 dBm +7 V Operation of this device outside the parameter ranges given above may cause permanent damage. TCASE Tj for >106 hours MTTF Min −40 Typ Max Units +85 +177 °C °C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications Test conditions unless otherwise noted: VSUPPLY=+6 V, RBIAS=11.2 Ω, ICC =75 mA (typ.), TCASE= +25 °C, 50 Ω system Parameter Operational Frequency Range Conditions Min DC f=900 MHz f=1900 MHz Gain 15.5 Input Return Loss Output Return Loss Output P1dB Output IP3 Output IP2 Noise Figure Device Voltage (VCC) Device Current (ICC) Thermal Resistance, (θjc) Pout=+2 dBm/tone, Δf= 10 MHz f=900 MHz f=1900 MHz f=900 MHz f=1900 MHz Junction to case(1) Typ 18.5 16.5 18 14 +19.3 +18.7 +33.2 +33.0 +45 3.9 5.16 75 154 Max 3500 17.5 Units MHz dB dB dB dB dBm dBm dBm dBm dBm dB V mA °C/W Notes: 1. Thermal path is from the device junction to the backside ground paddle. Datasheet: Rev B 6/26/14 © 2014 TriQuint - 2 of 9 - Disclaimer: Subject to change without notice www.triquint.com AG603-89G InGaP HBT Gain Block S-Parameters Test Conditions: VCC=+5.16 V (typ.), ICC=75 mA (typ.), TCASE=+25 °C, 50 Ω system, calibrated to device leads Freq (MHz) S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 50 250 500 750 1000 1250 1500 1750 2000 2250 2500 2750 3000 3250 3500 3750 4000 4250 4500 4750 5000 5250 5500 5750 6000 -17.44 -17.55 -16.33 -16.49 -17.80 -18.70 -20.48 -22.81 -24.74 -21.87 -22.77 -23.12 -22.25 -20.31 -17.65 -15.03 -13.12 -12.12 -11.59 -11.70 -12.17 -13.17 -14.11 -14.62 -13.49 -179.21 169.85 155.63 144.00 130.88 119.59 106.91 88.42 60.37 29.86 18.29 18.81 26.15 42.35 52.62 53.03 55.09 53.85 53.30 51.75 48.19 43.40 36.29 22.26 5.63 19.75 19.62 19.38 19.03 18.59 18.16 17.63 17.10 16.56 16.12 15.76 15.31 14.81 14.34 13.78 13.17 12.59 12.02 11.51 11.11 10.84 10.56 10.29 10.11 9.76 176.96 165.49 151.11 137.34 124.33 111.75 100.07 88.76 77.95 68.02 60.37 49.71 39.30 29.43 19.36 9.56 0.02 -8.87 -17.30 -26.46 -35.22 -44.04 -53.54 -63.62 -74.55 -22.08 -22.50 -22.67 -22.45 -22.66 -22.40 -22.23 -22.08 -21.89 -21.72 -21.93 -21.11 -21.00 -20.82 -20.84 -20.59 -20.50 -20.30 -20.17 -20.05 -19.48 -19.40 -19.03 -18.72 -18.78 -0.65 0.12 -5.41 -5.63 -13.12 -12.10 -14.79 -16.04 -20.42 -22.87 -29.82 -31.74 -31.75 -38.05 -43.03 -49.28 -52.56 -58.22 -63.33 -68.23 -72.90 -78.82 -84.21 -91.82 -102.14 -30.21 -25.52 -18.87 -16.22 -14.49 -12.89 -12.04 -11.36 -10.95 -10.69 -10.61 -10.58 -10.22 -9.59 -8.43 -7.32 -6.47 -5.78 -5.49 -5.33 -5.48 -5.82 -6.08 -6.19 -5.94 -157.09 -140.18 -152.26 -154.81 -160.35 -164.96 -169.44 -174.80 179.74 -176.50 173.91 159.59 143.79 125.14 108.91 95.17 84.81 76.60 68.35 62.23 56.23 48.68 40.56 29.58 16.34 Datasheet: Rev B 6/26/14 © 2014 TriQuint - 3 of 9 - Disclaimer: Subject to change without notice www.triquint.com AG603-89G InGaP HBT Gain Block AG603-89PCB Evaluation Board J3 VCC J4 R4 J4 GND C4 R4 J3 C3 C1 L1 C3 U1 C2 L1 J1 C1 C2 1 RF Input U1 J2 3 RF Output 2, Backside Paddle Notes: 1. See Evaluation Board PCB Information section for material and stack-up. 2. All components are of 0603 size unless otherwise stated. Bill of Material − AG603-89PCB Reference Des. U1 L1 C1, C2 C3 C4 R4 Value n/a 39 nH 56 pF 0.018 uF DNP 11.2 Ω Description InGaP HBT Gain Block Inductor, 0603, 5%, CS Series Cap, Chip, 0603, 50V, NPO, 5% Cap, Chip, 0603, 16V, X7R, 10% Do not populate Res, Chip, 0805, 1/10W, 1% Manuf. TriQuint Coilcraft various various Part Number AG603-89G 0603CS-39NXJL various Recommended Component Values for Specific Frequencies Frequency (MHz) L1 C1, C2 50 820 nH .018 uF 500 220 nH 1000 pF 900 68 nH 100 pF 1900 27 nH 68 pF 2200 22 nH 68 pF 2500 18 nH 56 pF 3500 15 nH 39 pF Bias Resistor Values for Various Supply Voltages VSUPPLY (V) R1 Component Size 6 11.2 Ω 0805 7 24.5 Ω 1210 8 38 Ω 1210 9 51 Ω 2010 10 65 Ω 2010 12 91 Ω 2512 The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. A minimum supply voltage of +6 V is required. A 1% tolerance resistor is recommended. Datasheet: Rev B 6/26/14 © 2014 TriQuint - 4 of 9 - Disclaimer: Subject to change without notice www.triquint.com AG603-89G InGaP HBT Gain Block Typical Performance − AG603-89PCB Test conditions unless otherwise noted: VSUPPLY =+6 V, R1 = 11.2 Ω, ICC = 75 mA (typ.), TCASE = +25 °C Parameter Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3(1) Noise Figure 100 19.4 18 29 +19.3 +33.7 3.8 500 19.1 16 18 +19.3 +33.6 3.8 Typical Value 900 18.5 18 14 +19.3 +33.2 3.9 1900 16.5 24 11 +18.7 +33.0 4.1 2140 16.0 21 11 +18.6 +33.0 4.1 2400 15.5 22 10 +18.6 +32.8 4.2 3500 13.5 17 8 +17.0 Units 5800 9.7 14 6 MHz dB dB dB dBm dBm dB Notes: 1. OIP3 measured with two tones at an output power of +2 dBm / tone separated by 10 MHz. 2. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. Performance Plots − AG603-89PCB Test conditions unless otherwise noted: VSUPPLY =+6 V, R1 = 11.2 Ω, ICC = 75 mA (typ.), TCASE = +25 °C Gain vs. Frequency 25 Return Loss vs. Frequency 0 I-V Curve ICC vs. VCC 125 Temp.=+25°C +85°C |S11|, |S22| (dB) 10 1 2 -40 4 Output IP3 vs. Frequency Pout=+2 dBm/tone Δf= 10 MHz +85°C 0 2 3 Frequency (GHz) 0 4 Output IP2 vs. Frequency OIP2 (dBm) 50 −40°C 45 1 1.5 Frequency (GHz) 2 2.5 3 P1dB vs. Frequency 25 0 200 400 600 800 Frequency (MHz) Freq.=900 MHz 24 Gain (dB) 0.5 1 1.5 2 2.5 Frequency (GHz) Datasheet: Rev B 6/26/14 © 2014 TriQuint 3 3.5 4 16 16 Output Power 14 10 5.2 5.4 5.6 +25°C −40°C 12 -12 -8 0 -4 0 Input Power (dBm) - 5 of 9 - 4 0.5 1 1.5 Frequency (GHz) 8 2 2.5 3 Output Power / Gain vs. Input Power 18 24 Temp.=+25° 16 20 12 0 5.0 +85°C Freq.=2000 MHz Gain 10 4.8 Noise Figure vs. Frequency Temp.=+25°C 18 15 4.6 4 1 1000 Output Power / Gain vs. Input Power 20 −40°C 20 4.4 Device Voltage (V) 2 +85°C +25°C 4.2 3 Gain (dB) 0.5 4.0 5 +25°C 40 0 3.8 7 +85°C 35 3.6 6 −40°C 25 P1dB (dBm) 1 55 30 5 50 25 60 +25°C 35 OIP3 (dBm) 3 Frequency (GHz) Optimal operating point (typ.) 75 NF (dB) 0 40 20 |S11| -30 5 0 -20 Output Power (dBm) Gain (dB) 15 100 |S22| -10 −40°C 20 Gain 14 16 12 12 Output Power 8 10 4 8 Output Power (dBm) +25°C Device Current (mA) 20 8 -12 -8 -4 0 Input Power (dBm) 4 8 4 Disclaimer: Subject to change without notice www.triquint.com AG603-89G InGaP HBT Gain Block Performance Plots − AG603-89PCB Test conditions unless otherwise noted: VSUPPLY =+6 V, R1 = 11.2 Ω, ICC = 75 mA (typ.), TCASE = +25 °C Gain vs. Frequency 25 Output IP3 vs. Frequency 40 Pout=+2 dBm/tone Δf= 10 MHz +85°C 20 +25°C 35 +25°C 30 25 5 0 +85°C OIP2 (dBm) OIP3 (dBm) Gain (dB) 10 50 −40°C −40°C 15 0 1 2 Frequency (GHz) 3 20 4 +25°C 48 −40°C 46 44 0 1 0.5 1.5 Frequency (GHz) P1dB vs. Frequency 25 Output IP2 vs. Frequency 52 +85°C 2 2.5 42 3 0 200 400 600 Frequency (MHz) 800 1000 Noise Figure vs. Frequency 7 +85°C +25°C +25°C −40°C 5 NF (dB) P1dB (dBm) +85°C 6 −40°C 20 15 4 3 10 2 5 Datasheet: Rev B 6/26/14 © 2014 TriQuint 0 0.5 1 1.5 2 2.5 Frequency (GHz) 3 3.5 4 1 - 6 of 9 - 0 0.5 1 1.5 Frequency (GHz) 2 2.5 3 Disclaimer: Subject to change without notice www.triquint.com AG603-89G InGaP HBT Gain Block Pin Configuration and Description Backside Paddle - GND Pin No. Label 2, Backside Paddle GND 3 RF OUT / VCC 1 RF IN 1 2 RF IN GND 3 RF OUT / VCC Description RF input, matched to 50 ohms. External DC Block is required. RF/DC ground. Use recommended via pattern to minimize inductance and thermal resistance. See PCB Mounting Pattern for suggested footprint. RF output / DC supply, matched to 50 ohms. External DC Block, bias choke, and dropping resistor are required. Evaluation Board PCB Information TriQuint PCB 1075825 Material and Stack-up 0.014" 0.062" ± 0.006" Finished Board Thickness 0.014" Nelco N-4000-13 1 oz. Cu top layer 1 oz. Cu inner layer Core Nelco N-4000-13 1 oz. Cu inner layer 1 oz. Cu bottom layer 50 Ohm Line Dimensions: Width=0.028" Spacing=0.028" Datasheet: Rev B 6/26/14 © 2014 TriQuint - 7 of 9 - Disclaimer: Subject to change without notice www.triquint.com AG603-89G InGaP HBT Gain Block Package Marking and Dimensions D A D1 Package Marking A603G YXXX Product Identifier: A603G Date/Assembly Code: YXXX D1 HALF ETCHING DEPTH 0.001" D1 E1 E H L 2X B1 B Alternate Backside Patterns - Reflow Compatible (Part may be supplied with either pattern) C e e1 SYMBOL A B 7° B1 C D D1 MIN 1.40 (.055) .44 (.017) .36 (.014) .35 (.014) 4.40 (.173) 1.62 (.064) TYP 1.50 (.059) .50 (.020) .42 (.0165) .40 (.016) 4.50 (.177) 1.73 (.068) MAX 1.60 (.063) .56 (.022) .48 (.019) .44 (.017) 4.60 (.181) 1.83 (.072) SYMBOL E E1 MIN 2.29 (.090) 2.13 (.084) e e1 H L 3.94 (.155) .89 (.035) TYP 2.50 (.098) 2.20 (.087) 1.50 BSC (.059) 3.00 BSC (.118) 4.10 (.161) 1.10 (.043) MAX 2.60 (.102) 2.29 (.090) 4.25 (.167) 1.20 (.047) Notes: 1. All dimensions are in millimeters (inches). Angles are in degrees. 2. Dimension and tolerance formats conform to ASME Y14.4M-1994. 3. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012. 4. Contact plating: NiPdAu PCB Mounting Pattern Package Marking: Part number – AG603G Lot code – XXXX-X 7.62 (0.300) 0.76 (0.030) 5 26X Ø0.25 (0.010) 0.38 (0.015) 1.80 (0.071) 0.76 (0.030) 2.48 (0.098) Package Outline 3.48 (0.137) 1.27 (0.050) 2.54 (0.100) 5.33 (0.210) 0.58 (0.023) 1.27 (0.050) 0.86 (0.034) 0.64 (0.025) 3.86 (0.152) 2.11 (0.083) Notes: 1. All dimensions are in millimeters (inches). Angles are in degrees. 2. Use 1 oz. copper minimum for top and bottom layer metal. Notes: 3. Vias are required the backside paddle of this for proper RF/DC grounding and thermal dissipation. 5. All dimensions are under in millimeters (inches). Angles aredevice in degrees. 4. Do not remove or minimize via hole structure in the PCB. Thermal 6. Dimension and tolerance formats conform to ASME Y14.4M-1994. and RF grounding is critical. 5. We terminal recommend a 0.35mm diameterconform bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”). 7. The #1 identifier and(#80/.0135") terminal numbering to JESD 95-1 SPP-012. 6. Ensure good package backside paddle solder attach for reliable operation and best electrical performance. 8. Contact plating: NiPdAu Datasheet: Rev B 6/26/14 © 2014 TriQuint - 8 of 9 - Disclaimer: Subject to change without notice www.triquint.com AG603-89G InGaP HBT Gain Block Product Compliance Information ESD Sensitivity Ratings Solderability Compatible with both lead-free (260°C maximum reflow temperature) and tin/lead (245°C maximum reflow temperature) soldering processes. Caution! ESD-Sensitive Device Contact plating: NiPdAu ESD Rating: Value: Test: Standard: Class 1C ≥ 1000 V and < 2000 V Human Body Model (HBM) ESDA / JEDEC Standard JS-001-2012 ESD Rating: Value: Test: Standard: Class C3 Passes ≥ 1000 V Charged Device Model (CDM) JEDEC Standard JESD22-C101F RoHs Compliance This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: • Lead Free • Halogen Free (Chlorine, Bromine) • Antimony Free • TBBP-A (C15H12Br402) Free • PFOS Free • SVHC Free MSL Rating MSL Rating: Level 3 Test: 260°C convection reflow Standard: JEDEC Standard IPC/JEDEC J-STD-020 Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Email: [email protected] Tel: Fax: +1.503.615.9000 +1.503.615.8902 For technical questions and application information: Email: [email protected] Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Datasheet: Rev B 6/26/14 © 2014 TriQuint - 9 of 9 - Disclaimer: Subject to change without notice www.triquint.com