TECHNICAL DATA IN74AC74 Dual D Flip-Flop with Set and Reset High-Speed Silicon-Gate CMOS The IN74AC74 is identical in pinout to the LS/ALS74, HC/HCT74. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LS/ALS outputs. This device consists of two D flip-flops with individual Set, Reset, and Clock inputs. Information at a D-input is transferred to the corresponding Q output on the next positive going edge of the clock input. Both Q and Q outputs are available from each flip-flop. The Set and Reset inputs are asynchronous. • Outputs Directly Interface to CMOS, NMOS, and TTL • Operating Voltage Range: 2.0 to 6.0 V • Low Input Current: 1.0 μA; 0.1 μA @ 25°C • High Noise Immunity Characteristic of CMOS Devices • Outputs Source/Sink 24 mA ORDERING INFORMATION IN74AC74N Plastic IN74AC74D SOIC TA = -40° to 85° C for all packages PIN ASSIGNMENT LOGIC DIAGRAM FUNCTION TABLE Inputs PIN 14 =VCC PIN 7 = GND Outputs Set Reset Clock Data Q Q L H X X H L H L X X L H L L H X * H* X H H H H L H H L L H H H L X No Change H H H X No Change H H X No Change *Both outputs will remain high as long as Set and Reset are low, but the output states are unpredictable if Set and Reset go high simultaneously. X = don’t care Rev. 00 IN74AC74 MAXIMUM RATINGS* Symbol Parameter Value Unit -0.5 to +7.0 V VCC DC Supply Voltage (Referenced to GND) VIN DC Input Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Output Voltage (Referenced to GND) -0.5 to VCC +0.5 V DC Input Current, per Pin ±20 mA IOUT DC Output Sink/Source Current, per Pin ±50 mA ICC DC Supply Current, VCC and GND Pins ±50 mA PD Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ 750 500 mW -65 to +150 °C 260 °C VOUT IIN Tstg TL Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP or SOIC Package) * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. +Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C SOIC Package: : - 7 mW/°C from 65° to 125°C RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN, VOUT DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND) TJ Junction Temperature (PDIP) TA Operating Temperature, All Package Types IOH Output Current - High IOL Output Current - Low tr, tf * Parameter Input Rise and Fall Time (except Schmitt Inputs) * Min Max Unit 2.0 6.0 V 0 VCC V 140 °C +85 °C -24 mA 24 mA 150 40 25 ns/V -40 VCC =3.0 V VCC =4.5 V VCC =5.5 V 0 0 0 VIN from 30% to 70% VCC This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range GND≤(VIN or VOUT)≤VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open. Rev. 00 IN74AC74 DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Test Conditions Guaranteed Limits V 25 °C -40°C to 85°C Unit VIH Minimum HighLevel Input Voltage VOUT=0.1 V or VCC-0.1 V 3.0 4.5 5.5 2.1 3.15 3.85 2.1 3.15 3.85 V VIL Maximum Low Level Input Voltage VOUT=0.1 V or VCC-0.1 V 3.0 4.5 5.5 0.9 1.35 1.65 0.9 1.35 1.65 V VOH Minimum HighLevel Output Voltage IOUT ≤ -50 μA 3.0 4.5 5.5 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.1 0.1 0.1 0.1 0.1 0.1 VIN=VIH or VIL IOL=12 mA IOL=24 mA IOL=24 mA 3.0 4.5 5.5 0.36 0.36 0.36 0.44 0.44 0.44 Maximum Input Leakage Current VIN=VCC or GND 5.5 ±0.1 ±1.0 μA IOLD +Minimum Dynamic Output Current VOLD=1.65 V Max 5.5 75 mA IOHD +Minimum Dynamic Output Current VOHD=3.85 V Min 5.5 -75 mA ICC Maximum Quiescent Supply Current (per Package) VIN=VCC or GND 5.5 40 μA * VIN=VIH or VIL IOH=-12 mA IOH=-24 mA IOH=-24 mA VOL Maximum LowLevel Output Voltage IOUT ≤ 50 μA V * IIN 4.0 * All outputs loaded; thresholds on input associated with output under test. +Maximum test duration 2.0 ms, one output loaded at a time. Note: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC Rev. 00 IN74AC74 AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=3.0 ns) VCC* Symbol Parameter Guaranteed Limits 25 °C V Min Unit -40°C to 85°C Max Min Max fmax Clock Frequency (Figure 1) 3.3 5.0 100 140 95 125 tPLH Propagation Delay, Clock to Q or Q (Figure 1) 3.3 5.0 4.5 3.5 13.5 10.0 4.0 3.0 16.0 10.5 ns tPHL Propagation Delay, Clock to Q or Q (Figure 1) 3.3 5.0 3.5 2.5 14.0 10.0 3.5 2.5 14.5 10.5 ns tPLH Propagation Delay, Set or Reset to Q or Q (Figure 2) 3.3 5.0 5.0 3.5 12.5 9.0 4.0 3.0 13.0 10.0 ns tPHL Propagation Delay, Set or Reset to Q or Q (Figure 2) 3.3 5.0 4.0 3.0 12.0 9.5 3.5 2.5 13.5 10.5 ns CIN Maximum Input Capacitance 5.0 4.5 MHz 4.5 pF Typical @25°C,VCC=5.0 V CPD Power Dissipation Capacitance 35 pF Voltage Range 3.3 V is 3.3 V ±0.3 V Voltage Range 5.0 V is 5.0 V ±0.5 V * TIMING REQUIREMENTS (CL=50pF,Input tr=tf=3.0 ns) VCC* Symbol Parameter Guaranteed Limits V 25 °C -40°C to 85°C Unit tsu Minimum Setup Time, Data to Clock (Figure 3) 3.3 5.0 4.0 3.0 4.5 3.0 ns th Minimum Hold Time, Clock to Data (Figure 3) 3.3 5.0 0.5 0.5 0.5 0.5 ns tw Minimum Pulse Width, Clock, Set or Reset (Figures 1,2) 3.3 5.0 5.5 4.5 7.0 5.0 ns trec Minimum Recovery Time, Set or Reset to Clock (Figure 2) 3.3 5.0 0 0 0 0 ns Voltage Range 3.3 V is 3.3 V ±0.3 V Voltage Range 5.0 V is 5.0 V ±0.5 V * Rev. 00 IN74AC74 Figure 1. Switching Waveform Figure 2. Switching Waveform Figure 3. Switching Waveform EXPANDED LOGIC DIAGRAM Rev. 00 IN74AC74 N SUFFIX PLASTIC DIP (MS - 001AA) A Dimension, mm 8 14 B 7 1 Symbol MIN MAX A 18.67 19.69 B 6.1 7.11 5.33 C F L C -T- SEATING PLANE N G M K J H D 0.25 (0.010) M T NOTES: 1. Dimensions “A”, “B” do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.010) per side. D 0.36 0.56 F 1.14 1.78 G 2.54 H 7.62 J 0° 10° K 2.92 3.81 L 7.62 8.26 M 0.2 0.36 N 0.38 D SUFFIX SOIC (MS - 012AB) Dimension, mm A 14 8 H B 1 G P 7 R x 45 C -TK D SEATING PLANE J 0.25 (0.010) M T C M NOTES: 1. Dimensions A and B do not include mold flash or protrusion. 2. Maximum mold flash or protrusion 0.15 mm (0.006) per side for A; for B ‑ 0.25 mm (0.010) per side. F M Symbol MIN MAX A 8.55 8.75 B 3.8 4 C 1.35 1.75 D 0.33 0.51 F 0.4 1.27 G 1.27 H 5.27 J 0° 8° K 0.1 0.25 M 0.19 0.25 P 5.8 6.2 R 0.25 0.5 Rev. 00