Murata NFM15CC222D1A3 This product specification is applied to chip emifil Datasheet

Chip EMIFIL®Chip 3-terminal Capacitor for General
NFM15CC222D1A3_ (0402, 2200pF, DC10V)
_: packaging code
Reference Sheet
1.Scope
This product specification is applied to Chip EMIFIL®Chip 3-terminal Capacitor used for General Electronic equipment.
2.MURATA Part NO. System
(Ex.)
NFM
15
(1)L/W
Dimensions
CC
(2)Features
222
D
(3)Nominal
Capacitance
(4)Characteristics
1A
3
(5)DC Rated
Voltage
(6)Electrode
D
(7)Packaging
Code
3. Type & Dimensions
a)Equivalent Circuit
(1)-1 L
(1)-2 W
i
j
1.0±0.1
0.5±0.2
0.35±0.1
0.15±0.1
T
e
0.4±0.1
0.17±0.1
(Unit:mm)
g
0.1 min.
4.Rated value
(3) Nominal Capacitance
Capacitance Tolerance
2200 pF
±20 %
(5)
DC Rated
Voltage
Rated
Current
(mA)
DC
Resistance
DC 10 V
1A(DC)
40mΩmax. 1000MΩmin.
Insulation
Resistance
Specifications and Test Methods
(Operating /Storage Temp. Range)
-55 to 105 °C / -55 to 105 °C
5.Package
mark
(7) Packaging
Packaging Unit
D
f180mm Reel
PAPER W8P2
10000 pcs./Reel
Product specifications in this catalog are as of Mar.7,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
NFM15CC222D1A3-01
1
■SPECIFICATIONS AND TEST METHODS
Electrical Performance
No
Item
1 Capacitance
(Cap.)
Specification
Shown in Rated value.
Test Method
Frequency : 1.0±0.1kHz
Voltage : 1V±0.2V(rms)
Voltage : Rated Voltage
Time : 2 minutes max.
2 Insulation
Resistance(I.R.)
3 DC Resistance
4 Withstanding Voltage
Measured with 100mA max.
Products shall not be damaged.
Test Voltage : Rated Voltage x 300%
Time : 1 to 5 s
Charge Current : 50 mA max.
5 Operating Temperature Shown in Rated value.
6 Storage Temperature
Includes self-heating
Standard Testing Condition
< Unless otherwise specified >
Temperature : Ordinary Temp. / 15 °C to 35 °C
Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH)
JEMCPS-02207C
2
< In case of doubt >
Temperature: 20 °C ± 2 °C
Humidity: 60 %(RH) to 70 %(RH)
Atmospheric pressure: 86 kPa to 106 kPa
■SPECIFICATIONS AND TEST METHODS
Mechanical Performance
No
Item
1 Appearance and
Dimensions
Specification
Appearance:No defects or abnormalities.
Dimensions:Within the specified dimensions.
Test Method
Appearance:Visual inspection.
Dimensions:Using calipers.
2 Solderability
Electrodes shall be at least 90% covered with
new solder coating.
Flux : Ethanol solution of rosin, 25(wt)%
Pre-heat : 150±10°C, 60 to 90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 240 ± 3°C
Immersion Time : 3±1 s
Immersion and emersion rates : 25mm / s
3 Resistance to
soldering heat
Meet Table 1.
Table 1
Flux : Ethanol solution of rosin, 25(wt)%
Pre-heat : 150±10°C, 60 to 90s
Solder : Sn-3.0Ag-0.5Cu
Solder Temperature : 270 ± 5°C
Immersion Time : 10 ± 1 s
Immersion and emersion rates : 25mm / s
Initial values :
measured after heat treatment (150+0 / -10 °C,1hour) and
exposure in the room condition for 48±4 hours.
Then measured after exposure in the room condition for 48±
4 hours.
Appearance
Cap. Change
I.R.
DC
Resistance
4 Bending Strength
No damaged
Within ±7.5%
Meet the initial rated
value.
0.05 max.
Meet Table 2.
Table 2
Appearance
Cap. Change
DC
Resistance
It shall be soldered on the glass-epoxy substrate
(100×40×0.8mm).
Deflection : 1.0 mm
Keeping Time : 5 s
Pressure jig
No damaged
Within ±7.5%
0.05max.
R340
F
Deflection
45
45
Product
(in mm)
5 Drop
Products shall be no failure after tested.
It shall be dropped on concrete or steel board.
Height : 1m
Method : Free fall
Attitude from which the product is dropped : 3 directions
The Number of Time : 3 times for each direction
(Total 9 times)
6 Bonding Strength
The electrodes shall be no failure after tested.
It shall be soldered on the glass-epoxy substrate.
Applying Force (F) : 5 N
Applying Time : 5 s
R0.5
0.3
0.25
7 Vibration
Meet Table 3.
Table 3
Appearance
Capacitance
DC
Resistance
JEMCPS-02207C
No damaged
Meet the initial rated
value.
0.05max.
3
1.6
(in mm)
It shall be soldered on the glass-epoxy substrate.
Oscillation Frequency : 10 to 2000 to 10Hz for 20 minute.
Total amplitude 3.0 mm or Acceleration amplitude 196m/s2
whichever is smaller.
Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hours)
Preconditioning : Heat treatment (150+0 / -10 °C,1hour)
■SPECIFICATIONS AND TEST METHODS
Environment Performance
It shall be soldered on the glass-epoxy substrate.
No
Item
Specification
1 Temperature Cycling Meet Table 4.
Table 4
Appearance
Cap. Change
I.R.
DC
Resistance
2 Humidity
No damaged
Within ±12.5%
Meet the initial rated
value.
0.05 max.
Meet Table 5.
Table 5
Appearance
Cap. Change
I.R.
DC
Resistance
Temperature : 40±2°C
Humidity : 90 to 95%(RH)
Time : 500+24 / -0 hours
Initial values: measured after heat treatment (150+0 / -10°C ,
1hour) and exposure in the room condition for 48±4 hours.
Then measured after exposure in the room condition for 48±4
hours.
If it ’ s doubt, the mesuring has to be done after 1 hours
curing at 150+0 / -10°C and 48±4 hours storage.
No damaged
Within ±12.5%
105M min.
0.05max.
3 Heat Life
JEMCPS-02207C
Test Method
1 Cycle
1 step : Minimum Operating Temperature
+0 / -3°C / 30+3 / -0 min
2 step : Room Temperature / within 3 min
3 step : Maximum Operating Temperature
+3 / -0°C / 30 +3 / -0 min
4 step : Room Temperature / within 3 min
Total of 10 cycles
Initial values : measured after heat treatment(150+0 / -10°C
,1hour) and exposure in the room condition for 48±4 hours.
Then measured after exposure in the room condition for 48±4
hours.
If it’s doubt, the mesuring has to be done after 1 hours
curing at 150+0 / -10°C and 48±4 hours storage.
Temperature : : Maximum Operating Temperature ± 2 °C
Test Voltage : Rated Voltage x 150%
Charge Current : 50 mA max.
Time : 1000+48 / -0 hours
Initial values: measured after heat treatment (150+0 / -10°C ,
1hour) and exposure in the room condition for 48±4 hours.
Then measured after exposure in the room condition for 48±4
hours.
If it’s doubt, the mesuring has to be done after 1 hours curing
at 150+0 / -10°C and 48±4 hours storage.
4
PACKAGING
NFM15 Type
1. Appearance and Dimensions (8mm-wide paper tape)
<Fig.1>
B
1.12±0.04
1.5±00.1
8.0±0.2
1.75±0.1
4.0±0.1
3.5±0.05
2.0±0.05 2.0±0.05
0.6tmax.
0.62±
A0.04
(in:mm)
<Fig.2>
B 0.04
1.12±
1.5±00.1
8.0±0.2
1.75±0.1
4.0±0.1
3.5±0.05
2.0±0.05 2.0±0.05
0.6tmax.
A 0.04
0.62±
(in mm)
Code
NFM15PC474/105
NFM15CC series
NFM15PC473/104/224/435
NFM15PC755
Fig.
A
B
t
Fig.1
0.65 *
1.15 *
0.6 max.
Fig.1
0.75 *
1.15 *
0.75 max.
Fig.2
0.72 *
1.29 *
0.9 max.
NFM15PC915
Fig.2
0.78 *
1.29 *
0.9 max.
*typical
2. Specification of Taping
(1) Packing quantity (standard quantity)
10,000 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the base tape and sealed by cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Base tape and Cover tape
The base tape and Cover tape have no spliced point.
(5) Cavity
There shall not be burr in the cavity.
(6) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,and are not continuous.
The specified quantity per reel is kept.
3. Pull Strength of Cover tape
5Nmin.
4. Peeling off force of Cover tape
0.1N to 0.6N (minimum value is typical)
Speed of Peeling off : 300 mm / min
5. Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape and empty tape) and trailer-tape (empty tape) as follows.
Leader
Trailer
2.0±0.5
160 min.
190 min.
Label
Empty tape
210 min.
Cover tape
f 13.0±0.2
1
f 60± 0
f 21.0±0.8
Direction of feed
9± 1
0
(in mm)
13±1.4
0
f 180± 3
JEMCPP-02230D
5
H
!
Caution
1. Mounting density
Add special attention to radiating heat of products when mounting this product near the products with heating.
The excessive heat by other products may cause deterioration of insulation resistance and excessive heat at this product,
resulting in a fire.
2. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles, trains, ships, etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
JEMCPC-02243C
6
Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
1. Flux and Solder
Flux
Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%).
Do not use water-soluble flux.
Other flux (except above) Please contact us for details, then use.
Use Sn-3.0Ag-0.5Cu solder
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
Solder
2. Note for Assembling
< Points of Attention about NFM Pattern Forms>
The loaded stresses are different to a chip depend on PCB materials and structures.
When the chip will be mounted on the metal PCB contained alumina material, PCB heat expansion/contraction
will be a cause of chip cracks because the coefficients of thermal expressions are different between metal PCB
and the chip itself. In case of mounting 1005M or smaller size of NFM on single-layered glass epoxy board,
chip cracks will be occurred because of the same reason.
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products surface is limited
to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is
limited to 100°C max.
3. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
[Products direction]
a
b
〈Poor example〉
〈Good example〉
Products shall be located in the sideways
direction (Length:a<b) to the mechanical stress.
(2) Products location on P.C.B. near seam for separation.
Seam
b
A
C
B
Products (A,B,C,D) shall be located carefully so that products are
not subject to the mechanical stress due to warping the board.
Because they may be subjected the mechanical stress in order
of A>C>B≒D.
D
Slit
Length:a b
a
4. Pre-heating Temperature
Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be
limited to 100°C max. to avoid the heat stress for the products.
Temp.
(°C)
260°C
245°C±3°C
220°C
230°C
Limit Profile
180
150
30s～60s
Standard Profile
60s max.
90s±30s
Time.(s)
Standard Profile
JEMCPC-02243C
Limit Profile
Pre-heating
150°C ~ 180°C , 90s ± 30s
Heating
above 220°C , 30s ~ 60s
above 230°C , 60s max.
Peak temperature
245°C ± 3°C
260°C , 10s
Cycle of reflow
2 times
2 times
7
0.75
0.3
0.25
5. Reflow Soldering
• Standard printing pattern of solder paste.
1) Soldering paste printing for reflow
• Standard thickness of solder paste: 100µm to 150µm.
• Use the solder paste printing pattern of the right pattern.
0.25
• For the resist and copper foil pattern, use standard land dimensions.
0.7
(in mm)
1.3
2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
Notice
6. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
• Tip temperature : 340°C max.
• Tip diameter : φ2mm max.
• Soldering time : 3(+1,-0) s
• Times : 1time only.
• Soldering iron output : 30W max.
Note : Adjust the pre-heat temperature to ⊿T＜190℃ between the component and a soldering iron.
Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the material due to the thermal shock.
7. Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Upper Limit
Recommendable
Recommendable
t
1/3T  t T(T:Chip thickness)
1/3T≤t (T:Chip Thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
8. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA))
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power
: 20W / l max.
Frequency : 28kHz to 40kHz
Time
: 5 minutes max.
(3) Cleaner
1. Cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
9. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance, such as
insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10. Resin coating
The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin
to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please
make the reliability evaluation with the product mounted in your application set.
11. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending
JEMCPC-02243C
Twisting
8
Notice
12. Component Mounting
If low bottom dead point of the pick-up nozzle is too low, chip cracks will be occurred because an extra power will be
added to the chip during mounting. Therefore, the bottom dead point of pick-up nozzle must be set on/over the upper
surface of the PCB. Adjusting is required when the bottom dead point will be set by correcting board warp.
It is recommended that using the larger pick-up nozzle than chip length for avoiding what force impact will be centered
to the middle point of components. Before assembling, please confirm its mounting accuracy under the best condition.
pick-up
nozzle
吸着ノズル
チップ搭載時の
pick-up nozzle position
吸着ノズル位置
in component placing
吸着ノズル投影線
shape
of pick-up nozzle
○
good
×
poor
longer direction of
吸着ノズル長手寸法
pick-up nozzle
吸着ノズルの設定下死点
position adjusting of
bottom dead point
13. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be
arranged according to the figure to reinforce the ground-pattern.
In case of changing the land dimentions marked by ※, a solder bridge between terminations of the chip
could occur. In this case, please contact us before change.
< Standard land dimensions for reflow >
･Side on which chips are mounted
(in mm)
14. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
・Products should be stored in the warehouse on the following conditions.
Temperature: -10 to +40°C
Humidity: 15 to 85% relative humidity
No rapid change on temperature and humidity
・Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode,
resulting in poor solderability.
・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
・Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
JEMCPC-02243C
9
!
NOTE
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2) You are requested not to use our product deviating from the agreed specifications.
(3) We consider it not appropriate to include any terms and conditions with regard to the business transaction in the
product specifications, drawings or other technical documents. Therefore, if your technical documents as above
include such terms and conditions such as warranty clause, product liability clause, or intellectual property infringement
liability clause, they will be deemed to be invalid.
JEMCPC-02243C
10