NL17SG08 Single 2-Input AND Gate The NL17SG08 MiniGatet is an advanced high−speed CMOS 2−input AND gate in ultra−small footprint. The NL17SG08 input structures provides protection when voltages up to 4.6 V are applied. http://onsemi.com Features MARKING DIAGRAMS High Speed: tPD = 2.5 ns (Typ) at VCC = 3.0 V, CL = 15 pF Low Power Dissipation: ICC = 0.5 mA (Max) at TA = 25°C SOT−953 CASE 527AE 4.6 V Overvoltage Tolerant (OVT) Input Pins 1 Ultra−Small Packages NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These are Pb−Free and Halide−Free Devices IN A 1 2 IN B 3 5 4 IN B VCC 1 IN A 2 OUT Y GND 3 5 4 VCC UDFN6 1.0 x 1.0 CASE 517BX UDFN6 1.45 x 1.0 CASE 517AQ SC−88A DF SUFFIX CASE 419A M G OUT Y M M AT M G G M GND YM L • Wide Operating VCC Range: 0.9 V to 3.6 V L • • • • • • = Date Code* = Pb−Free Package (Note: Microdot may be in either location) Figure 1. SOT−953 (Top Thru View) Figure 1. SC−88A (Top View) *Date Code orientation and/or position may vary depending upon manufacturing location. PIN ASSIGNMENT IN B IN A GND 6 1 5 2 4 3 VCC VC OUT Y Figure 1. UDFN6 (Top View) IN A IN B PIN SOT−953 SC−88A UDFN6 1 IN A IN B IN B 2 GND IN A IN A 3 IN B GND GND 4 OUT Y OUT Y OUT Y 5 VCC VCC VC 6 − − VCC FUNCTION TABLE Inputs & OUT Y Figure 2. Logic Symbol Output A B Y L L H H L H L H L L L H ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2014 November, 2014 − Rev. 6 1 Publication Order Number: NL17SG08/D NL17SG08 MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VIN DC Input Voltage VOUT DC Output Voltage IIK DC Input Diode Current Value Unit −0.5 to +5.5 V −0.5 to +4.6 V −0.5 to VCC +0.5 −0.5 to +4.6 V VIN < GND −20 mA VOUT < GND Output at High or Low State Power−Down Mode (VCC = 0 V) IOK DC Output Diode Current −20 mA IOUT DC Output Source/Sink Current ±20 mA ICC DC Supply Current per Supply Pin ±20 mA IGND DC Ground Current per Ground Pin ±20 mA TSTG Storage Temperature Range −65 to +150 °C 260 °C +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias MSL Moisture Sensitivity FR Flammability Rating VESD Level 1 Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) >2000 >100 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. RECOMMENDED OPERATING CONDITIONS Symbol Min Max Unit VCC Positive DC Supply Voltage 0.9 3.6 V VIN Digital Input Voltage 0.0 3.6 V 0.0 0.0 VCC 3.6 V −55 +125 °C 0 10 ns/V VOUT TA Dt / DV Characteristics Output Voltage Output at High or Low State Power−Down Mode (VCC = 0 V) Operating Temperature Range VCC = 3.3 V ± 0.3 V Input Transition Rise or Fail Rate Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. http://onsemi.com 2 NL17SG08 DC ELECTRICAL CHARACTERISTICS TA = 255C Symbol Parameter VIH High-Level Input Voltage VIL VOH VOL Conditions Low-Level Input Voltage High-Level Output Voltage Low-Level Output Voltage VIN = VIH or VIL VIN = VIH or VIL Min VCC (V) Max TA = -555C to +1255C Min 0.9 VCC VCC 1.1 to 1.3 0.7xVCC 0.7xVCC 1.4 to 1.6 0.65xVCC 0.65xVCC 1.65 to 1.95 0.65xVCC 0.65xVCC 2.3 to 2.7 1.7 1.7 3.0 to 3.6 2.0 2.0 Max V 0.9 GND GND 1.1 to 1.3 0.3xVCC 0.3xVCC 1.4 to 1.6 0.35xVCC 0.35xVCC 1.65 to 1.95 0.35xVCC 0.35xVCC 2.3 to 2.7 0.7 0.7 3.0 to 3.6 0.8 0.8 IOH = −20 mA 0.9 0.75 0.75 IOH = -0.3 mA 1.1 to 1.3 0.75xVCC 0.75xVCC IOH = -1.7 mA 1.4 to 1.6 0.75xVCC 0.75xVCC IOH = -3.0 mA 1.65 to 1.95 Vcc-0.45 Vcc-0.45 IOH = -4.0 mA 2.3 to 2.7 2.0 2.0 IOH = -8.0 mA 3.0 to 3.6 2.48 2.48 Unit V V IOL = 20 mA 0.9 0.1 0.1 IOL = 1.1 mA 1.1 to 1.3 0.25xVCC 0.25xVCC IOL = 1.7 mA 1.4 to 1.6 0.25xVCC 0.25xVCC IOL = 3.0 mA 1.65 to 1.95 0.45 0.45 IOL = 4.0 mA 2.3 to 2.7 0.4 0.4 IOL = 8.0 mA 3.0 to 3.6 0.4 0.4 V IIN Input Leakage Current 0 ≤ VIN ≤ 3.6 V 0 to 3.6 $0.1 $1.0 mA ICC Quiescent Supply Current VIN = VCC or GND 3.6 0.5 10.0 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. http://onsemi.com 3 NL17SG08 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns) Symbol tPLH, tPHL Parameter Propagation Delay, A or B to Y Test Condition CL = 10 pF, RL = 1 MW CL = 15 pF, RL = 1 MW CL = 30 pF, RL = 1 MW CIN Input Capacitance CPD Power Dissipation Capacitance (Note 4) Min Typ Max Min Max Unit 0.9 - 10.0 12.4 - 14.8 ns 1.1 to 1.3 - 8.0 10.7 - 13.6 1.4 to 1.6 - 5.9 9.6 - 11.3 1.65 to 1.95 - 4.5 7.0 - 7.5 2.3 to 2.7 - 2.9 4.4 - 4.9 3.0 to 3.6 - 2.2 3.5 - 4.1 0.9 - 11.7 13.5 - 15.0 1.1 to 1.3 - 8.8 10.2 - 13.7 ns 1.4 to 1.6 - 6.5 9.5 - 12.6 1.65 to 1.95 - 5.0 7.7 - 8.0 2.3 to 2.7 - 3.2 4.9 - 5.6 3.0 to 3.6 - 2.5 3.8 - 4.4 0.9 - 13.0 16.0 - 19.0 1.1 to 1.3 - 10.0 12.4 - 17.2 1.4 to 1.6 - 8.9 11.8 - 14.9 1.65 to 1.95 - 6.9 10.3 - 10.8 2.3 to 2.7 - 4.4 6.4 - 6.8 3.0 to 3.6 - 3.5 4.9 - 5.4 3 - - - pF 4 - - - pF 0 to 3.6 f = 10 MHz TA = -555C to +1255C TA = 255 C VCC (V) 0.9 to 3.6 - ns Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 4 NL17SG08 Input A or B 50% 50% VCC GND tPLH tPHL VOH Output Y 50% VCC VOL Figure 2. Switching Waveforms VCC OUTPUT INPUT CL* *Includes all probe and jig capacitance. A 1−MHz square input wave is recommended for propagation delay tests. Figure 3. Test Circuit ORDERING INFORMATION Package Shipping† NL17SG08P5T5G SOT−953 (Pb−Free) 8000 / Tape & Reel NL17SG08DFT2G SC−88A (Pb−Free) 3000 / Tape & Reel NLV17SG08DFT2G* SC−88A (Pb−Free) 3000 / Tape & Reel NL17SG08AMUTCG UDFN6 1.45x1 mm (Pb−Free) 3000 / Tape & Reel NL17SG08CMUTCG (In Development) UDFN6 1x1 mm (Pb−Free) 3000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. http://onsemi.com 5 NL17SG08 PACKAGE DIMENSIONS SOT−953 CASE 527AE ISSUE E X D NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A Y 5 4 PIN ONE INDICATOR HE E 1 2 3 DIM A b C D E e HE L L2 L3 C TOP VIEW SIDE VIEW e L 5X 5X L3 MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.95 1.00 1.05 0.175 REF 0.05 0.10 0.15 −−− −−− 0.15 SOLDERING FOOTPRINT* 5X 0.35 5X 0.20 5X L2 5X BOTTOM VIEW b PACKAGE OUTLINE 0.08 X Y 1.20 1 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 NL17SG08 PACKAGE DIMENSIONS UDFN6 1.0x1.0, 0.35P CASE 517BX ISSUE O PIN ONE REFERENCE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.20 MM FROM TERMINAL TIP. 4. PACKAGE DIMENSIONS EXCLUSIVE OF BURRS AND MOLD FLASH. A B D ÉÉÉ ÉÉÉ E 0.10 C 2X 2X 0.10 C DIM A A1 A3 b D E e L L1 TOP VIEW A3 0.05 C A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.13 REF 0.12 0.22 1.00 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 0.05 C SIDE VIEW A1 C RECOMMENDED SOLDERING FOOTPRINT* SEATING PLANE 5X e 5X 0.48 L 6X 0.22 3 1 L1 1.18 6 4 BOTTOM VIEW 6X b 0.10 M C A B 0.05 M C 0.53 1 PKG OUTLINE NOTE 3 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 NL17SG08 PACKAGE DIMENSIONS UDFN6 1.45x1.0, 0.5P CASE 517AQ ISSUE O A B D L L L1 PIN ONE REFERENCE 0.10 C ÉÉÉ ÉÉÉ DETAIL A E OPTIONAL CONSTRUCTIONS DETAIL B MOLD CMPD DETAIL B 0.05 C 6X DIM A A1 A2 b D E e L L1 ÉÉ ÉÉ EXPOSED Cu TOP VIEW 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. OPTIONAL CONSTRUCTIONS A MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.07 REF 0.20 0.30 1.45 BSC 1.00 BSC 0.50 BSC 0.30 0.40 −−− 0.15 MOUNTING FOOTPRINT 0.05 C A1 A2 SIDE VIEW e 6X C 6X SEATING PLANE L 1.24 3 1 DETAIL A 6X 0.53 6 0.30 PACKAGE OUTLINE 4 BOTTOM VIEW 6X 0.50 PITCH DIMENSIONS: MILLIMETERS b 0.10 C A B 0.05 C 1 NOTE 3 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 8 NL17SG08 PACKAGE DIMENSIONS SC−88A (SC−70−5/SOT−353) CASE 419A−02 ISSUE L A G 5 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A−01 OBSOLETE. NEW STANDARD 419A−02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. −B− S 1 2 DIM A B C D G H J K N S 3 D 5 PL 0.2 (0.008) B M M N INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20 J C K H SOLDER FOOTPRINT* 0.50 0.0197 0.65 0.025 0.65 0.025 0.40 0.0157 1.9 0.0748 SCALE 20:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniGate is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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