® GBU6005 thru GBU610 Pb Free Plating Product Pb GBU6005 thru GBU610 6.0 AMPERE GLASS PASSIVATED FLAT BRIDGE RECTIFIERS GBU Features • Plastic material has Underwriters Laboratory Flammability Classification 94V-0 • Ideal for printed circuit boards • Glass passivated chip junction • Reliable low cost construction utilizing molded plastic technique Unit: inch (mm) .310(7.90) .290(7.40) .880(22.3) .860(21.8) Mechanical Data .740(18.8) .720(18.3) .140(3.56) .130(3.30) .710(18.0) .690(17.5) .075(1.90)R .085(2.16) .065(1.65) .080(2.03) .060(1.52) .160(4.1) .140(3.5) .040(1.02) .030(0.76) .030(0.75) .017(0.45) .100(2.54) .085(2.16) • Case: Molded plastic GBU • Terminals: leads solderable per MIL-STD-202 Method 208 guaranteed • Mounting Position: Any .080(2.03) .065(1.65) .190(4.83) .210(5.33) .050(1.27) .040(1.02) Absolute Maximum Ratings and Characteristics Rating at 25℃ ambient temperature unless otherwise specified. Single-phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%. Symbols GBU 6005 GBU 601 GBU 602 GBU 604 GBU 606 GBU 608 GBU 610 Units Maximum recurrent peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V Maximum average forward rectified current at TC = 100℃ (Note 1)， (Note 2) IF(AV) 6 A Peak forward surge current，8.3ms single half-sine-wave superimposed on rated load (JEDEC Method) IFSM 175 A VF 1 V Maximum reverse current at TA = 25℃ at rated DC blocking voltage TA = 125℃ IR 5 500 µA Typical junction capacitance (Note 3) CJ Maximum forward voltage at 3.0A DC and 25℃ 211 94 pF Typical thermal resistance (Note 1),(Note 2) RθJA 7.4 ℃/W Typical thermal resistance (Note 1),(Note 2) RθJC 2.2 ℃/W TJ ,TS -55 to +150 ℃ Operating and storage temperature range Notes: (1). Units case mounted on 2.6x1.4x0.06” thick (6.5x3.5x0.15 cm) AI. plate heatsink.. (2). Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with #6 screws. (3). Measured at 1MHz and applied reverse voltage of 4.0 VDC. Rev.05 © 2006 Thinki Semiconductor Co., Ltd. Page 1/2 http://www.thinkisemi.com/ ® GBU6005 thru GBU610 Heatsink Mounting. 2.6*1.4*0.06" Thk (6.5*3.5*0.15cm) AL. Plate 4.0 2.0 0 60Hz Resistive or Inductive Load 50 0 100 150 Fig.2 Maximum Non-Repetitive Peak Forward Surge Current Per Leg 175 Single Sine-Wave (JEDEC Method) TJ=150°C 150 125 100 75 50 1.0 Cycle 25 1 10 10 TJ=25°C Pulse Width = 300 s 1% Duty Cycle 1 0.1 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1000 Fig.5 Typical Junction Capacitance Per Leg TJ=25°C f=1.0MHz Vsig=50mVp-p 100 10 50 - 400V 600 - 1000V 0.1 1 10 Reverse Voltage (A) Rev.05 © 2006 Thinki Semiconductor Co., Ltd. 100 Instantaneous Reverse Current ( A) Fig.3 Typical Forward Characteristics Per Leg 100 100 Number of Cycles at 60Hz Case Temperature (°C) Instantaneous Forward Voltage (V) Junction Capacitance, pF Peak Forward Surge Current (A) 6.0 Fig.1 Derating Curve Output Rectified Current Transient Thermal Impedance (°C/W) Instantaneous Forward Current (A) Average Forward Output Current (A) RATINGS AND CHARACTERISTIC CURVES Fig.4 Typical Reverse Leakage Characteristics Per Leg 500 50 - 400V 600 - 1000V 100 TJ=125°C 10 1 0.1 0.01 TJ=25°C 0 40 20 60 80 100 Percent of Rated Peak Reverse Voltage (%) 100 Fig.6 Typical Transient Thermal Impedance 10 1 0.1 0.01 0.1 1 10 100 t,Heating Time (sec.) Page 2/2 http://www.thinkisemi.com/