Material Content Data Sheet Sales Product Name BFR 380F H6327 MA# MA000895444 Package PG-TSFP-3-1 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal < 10% tin gold silicon silicon titanium chromium copper gold carbon black epoxy resin silicondioxide tin silver 7440-31-5 7440-57-5 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 Weight [mg] 1.43 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.000 0.03 324 0.002 0.13 1258 0.016 1.10 0.000 0.01 0.001 0.04 400 0.002 0.12 1199 0.570 39.78 39.95 397838 399517 0.004 0.28 0.28 2768 2768 0.008 0.54 0.168 11.71 0.605 42.18 54.43 421940 544440 0.033 2.34 2.34 23351 23351 0.025 1.74 1.74 17373 1.26 10969 2. 3. 5445 117055 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 12551 80 Important Remarks: 1. Sum [ppm] 17373 1000000