Spec. No. : C099FP Issued Date : 2016.01.20 Revised Date : Page No. : 1/10 CYStech Electronics Corp. N-Channel Enhancement Mode Power MOSFET MTN6N65BFP BVDSS ID @ VGS=10V, TC=25°C 650V RDSON(TYP) @ VGS=10V, ID=3A 6A 1.02Ω Description The MTN6N65BFP is a N-channel enhancement-mode MOSFET, providing the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost effectiveness. The TO-220FP package is universally preferred for all commercial-industrial applications Features • Low On Resistance • Simple Drive Requirement • Low Gate Charge • Fast Switching Characteristic • Insulating package, front/back side insulating voltage=2500V(AC) • RoHS compliant package Applications • Switching Mode Power Supply • LCD Panel Power • Adapter • E-bike Charger Ordering Information Device MTN6N65BFP-0-UB-S Package TO-220FP (RoHS compliant package) Shipping 50 pcs/tube, 20 tubes/box, 4 boxes / carton Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, UB : 50 pcs / tube, 20 tubes/box Product rank, zero for no rank products Product name MTN6N65BFP CYStek Product Specification CYStech Electronics Corp. Symbol Spec. No. : C099FP Issued Date : 2016.01.20 Revised Date : Page No. : 2/10 Outline MTN6N65BFP TO-220FP G：Gate D：Drain S：Source G D S Absolute Maximum Ratings (TC=25°C) Parameter Symbol Limits Drain-Source Voltage Gate-Source Voltage Continuous Drain Current @VGS=10V, TC=25°C Continuous Drain Current @VGS=10V, TC=100°C Pulsed Drain Current @ VGS=10V (Note 1) Single Pulse Avalanche Current @L=7mH (Note 2) Single Pulse Avalanche Energy (Note 2) Repetitive Avalanche Energy (Note 1) Maximum Temperature for Soldering @ Lead at 0.125 in(0.318mm) from case for 10 seconds Maximum Temperature for Soldering @ Package Body for 10 seconds Total Power Dissipation (TC=25℃) Linear Derating Factor Operating Junction and Storage Temperature VDS VGS IDM IAS EAS EAR 650 ±30 6* 3.8* 24* 6 126 5.2 TL 300 TPKG 260 PD 52 0.42 -55~+150 ID Tj, Tstg Unit V A mJ °C W W/°C °C *Drain current limited by maximum junction temperature Note : 1.Pulse width limited by maximum junction temperature. 2. IAS=6A, VDD=50V, L=7mH, VG=10V, starting TJ=+25℃. 100% tested by conditions of L=7mH, IAS=3A, VGS=10V, VDD=50V MTN6N65BFP CYStek Product Specification Spec. No. : C099FP Issued Date : 2016.01.20 Revised Date : Page No. : 3/10 CYStech Electronics Corp. Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max Symbol RƟJC RƟJA Value 2.4 62.5 Unit °C/W Characteristics (TC=25°C, unless otherwise specified) Symbol Static BVDSS ∆BVDSS/∆Tj VGS(th) *GFS IGSS IDSS Min. Typ. Max. Unit Test Conditions 650 2.0 - 0.7 7.8 1.02 4.0 ±100 1 10 1.3 V V/°C V S nA Ω VGS=0V, ID=250μA, Tj=25℃ Reference to 25°C, ID=250μA VDS = VGS, ID=250μA VDS =15V, ID=3A VGS=±30V VDS =650V, VGS =0V VDS =520V, VGS =0V, Tj=125°C VGS =10V, ID=3A 27.3 5 11.6 14.2 55.4 65.2 67.6 877 91 25 - nC VDD=325V, ID=6A, VGS=10V ns VDD=325V, ID=6A, VGS=10V, RG=25Ω pF VGS=0V, VDS=25V, f=1MHz 0.83 376 2.2 1.2 6 24 - V IS=6A, VGS=0V *RDS(ON) Dynamic *Qg *Qgs *Qgd *td(ON) *tr *td(OFF) *tf Ciss Coss Crss Source-Drain Diode *VSD *IS *ISM *trr *Qrr - μA A ns μC VGS=0V, IF=6A, dIF/dt=100A/μs *Pulse Test : Pulse Width ≤300μs, Duty Cycle≤2% MTN6N65BFP CYStek Product Specification Spec. No. : C099FP Issued Date : 2016.01.20 Revised Date : Page No. : 4/10 CYStech Electronics Corp. Typical Characteristics Brekdown Voltage vs Ambient Temperature Typical Output Characteristics 1.4 20 BVDSS, Normalized Drain-Source Breakdown Voltage 10V,9V,8V,7V ID, Drain Current(A) 16 6V 12 8 5.5V 4 1.2 1.0 0.8 ID=250μA, VGS=0V VGS=5V 0.6 0 0 10 20 30 VDS, Drain-Source Voltage(V) 40 -75 50 -50 -25 50 75 100 125 150 175 Drain Current vs Gate-Source Voltage 20 1500 Ta=25°C VGS=10V 1200 ID, Drain Current(A) R DS(ON) , Static Drain-Source OnState Resistance(mΩ) 25 TA, Ambient Temperature(°C) Static Drain-Source On-State resistance vs Drain Current 900 600 VDS=30V 15 VDS=10V 10 5 300 0 0 0.01 0.1 1 ID, Drain Current(A) 0 10 2 4 6 8 VGS, Gate-Source Voltage(V) 10 Forward Drain Current vs Source-Drain Voltage Static Drain-Source On-State Resistance vs Gate-Source Voltage 100 2000 1800 1600 IF, Forward Current(A) RDS(ON), Static Drain-Source On-State Resistance(mΩ) 0 1400 1200 1000 800 600 VGS=0V 10 1 Ta=150°C Ta=25°C 0.1 0.01 400 ID=3A 200 Ta=25°C 0.001 0 0 2 4 6 VGS, Gate-Source Voltage(V) MTN6N65BFP 8 10 0 0.2 0.4 0.6 0.8 1 1.2 1.4 VSD, Source Drain Voltage(V) CYStek Product Specification Spec. No. : C099FP Issued Date : 2016.01.20 Revised Date : Page No. : 5/10 CYStech Electronics Corp. Typical Characteristics(Cont.) Capacitance vs Reverse Voltage Static Drain-Source On-resistance vs Ambient Temperature 10000 RDS(ON), Normalized Static Drain-Source On-state Resistance 3.0 Capacitance(pF) Ciss 1000 Coss 100 f=1MHz Crss 10 ID=3A, VGS=10V 2.5 2.0 1.5 1.0 0.5 RDS(ON) @Tj=25°C:1.02Ω typ. 0.0 0 5 10 15 20 25 VDS, Drain-to-Source Voltage(V) 30 -75 -50 -25 0 25 50 75 100 125 150 175 TA, Ambient Temperature(°C) Gate Charge Characteristics Maximum Safe Operating Area 100 10 RDS(ON) Limited 10 VDS=130V VGS, Gate-Source Voltage(V) ID, Drain Current(A) 10 μs 100μs 1ms 10ms 1 100ms DC TC=25°C, Tj(max)=150°C VGS=10V, RθJC=2.4°C/W Single pulse 0.1 VDS=325V 6 VDS=520V 4 2 ID=6A 0 0.01 1 10 100 0 1000 5 10 15 20 25 VDS, Drain-Source Voltage(V) Qg, Total Gate Charge(nC) Maximum Drain Current vs Case Temperature Threshold Voltage vs Junction Tempearture VGS(th), Normalized Threshold Voltage 8 ID, Maximum Drain Current(A) 8 6 4 2 VGS=10V, RθJC=2.4°C/W 30 1.4 1.2 ID=1mA 1 0.8 0.6 ID=250μA 0.4 0.2 0 25 50 75 100 125 TC, Case Temperature(°C) MTN6N65BFP 150 175 -75 -50 -25 0 25 50 75 100 125 150 175 Tj, Junction Temperature(°C) CYStek Product Specification CYStech Electronics Corp. Spec. No. : C099FP Issued Date : 2016.01.20 Revised Date : Page No. : 6/10 Typical Characteristics(Cont.) Forward Transfer Admittance vs Drain Current Single Pulse Power Rating, Junction to Case GFS , Forward Transfer Admittance(S) 100 2000 1800 TJ(MAX) =150°C TC=25°C RθJC=2.4°C/W 1600 10 Power (W) 1400 1 VDS=15V 0.1 0.01 0.1 1 ID, Drain Current(A) 1000 800 600 Ta=25°C Pulsed 0.01 0.001 1200 400 200 10 0 0.0001 0.001 0.01 0.1 Pulse Width(s) 1 10 Transient Thermal Response Curves 1 r(t), Normalized Effective Transient Thermal Resistance D=0.5 0.2 1.RθJC(t)=r(t)*RθJC 2.Duty Factor, D=t1/t2 3.TJM-TC=PDM*RθJC(t) 4.RθJC=2.4 ° C/W 0.1 0.1 0.05 0.02 0.01 Single Pulse 0.01 1.E-04 MTN6N65BFP 1.E-03 1.E-02 1.E-01 t1, Square Wave Pulse Duration(s) 1.E+00 1.E+01 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C099FP Issued Date : 2016.01.20 Revised Date : Page No. : 7/10 Test Circuit and Waveforms MTN6N65BFP CYStek Product Specification CYStech Electronics Corp. Spec. No. : C099FP Issued Date : 2016.01.20 Revised Date : Page No. : 8/10 Test Circuit and Waveforms(Cont.) MTN6N65BFP CYStek Product Specification CYStech Electronics Corp. Spec. No. : C099FP Issued Date : 2016.01.20 Revised Date : Page No. : 9/10 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. MTN6N65BFP CYStek Product Specification CYStech Electronics Corp. Spec. No. : C099FP Issued Date : 2016.01.20 Revised Date : Page No. : 10/10 TO-220FP Dimension Marking: Device Name Date Code 3-Lead TO-220FP Plastic Package CYStek Package Code: FP Style: Pin 1.Gate 2.Drain 3.Source *Typical Inches Min. Max. 0.171 0.183 0.051 REF 0.112 0.124 0.102 0.110 0.020 0.030 0.031 0.041 0.047 REF 0.020 0.030 0.396 0.404 0.583 0.598 0.100 * 0.106 REF DIM A A1 A2 A3 b b1 b2 c D E e F Millimeters Min. Max. 4.35 4.65 1.300 REF 2.85 3.15 2.60 2.80 0.50 0.75 0.80 1.05 1.20 REF 0.500 0.750 10.06 10.26 14.80 15.20 2.54* 2.70 REF DIM G H H1 H2 J K L L1 L2 M N Inches Min. Max. 0.246 0.258 0.138 REF 0.055 REF 0.256 0.272 0.031 REF 0.020 1.102 1.118 0.043 0.051 0.036 0.043 0.067 REF 0.012 REF Millimeters Min. Max. 6.25 6.55 3.50 REF 1.40 REF 6.50 6.90 0.80 REF 0.50 REF 28.00 28.40 1.10 1.30 0.92 1.08 1.70 REF 0.30 REF Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTN6N65BFP CYStek Product Specification